CN211199101U - Heat-conducting wave-absorbing material - Google Patents
Heat-conducting wave-absorbing material Download PDFInfo
- Publication number
- CN211199101U CN211199101U CN201920787418.XU CN201920787418U CN211199101U CN 211199101 U CN211199101 U CN 211199101U CN 201920787418 U CN201920787418 U CN 201920787418U CN 211199101 U CN211199101 U CN 211199101U
- Authority
- CN
- China
- Prior art keywords
- layer
- heat
- wave
- iron
- alloy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a heat conduction absorbing material relates to electromagnetic wave absorbing material's technical field, including compound absorbing layer and the heat-conducting layer that sets up in proper order, absorbing layer is wave-absorbing agent layer, wave-absorbing agent layer is the metal powder layer that bonds together, the heat-conducting layer is one of graphite membrane, copper foil, aluminium foil. The heat conduction layer and the wave absorption layer are compounded. The utility model provides a can conduct the heat that produces, avoid producing the accumulational heat conduction absorbing material of heat in inside.
Description
Technical Field
The utility model belongs to the technical field of the technique of electromagnetic wave absorbing material and specifically relates to a heat conduction absorbing material is related to.
Background
With the development of the times and the development of science and technology, the popularization of electronic and information devices, the problems of electromagnetic interference and electromagnetic compatibility caused by electromagnetic radiation become more and more serious, which mainly reflect in the aspects of interfering the normal operation of electronic instruments and devices, leaking important information, harming human health and the like, so that the research of electromagnetic wave absorbing materials or electromagnetic wave shielding materials is very necessary, and the electromagnetic wave absorbing materials or the electromagnetic wave shielding materials are important research subjects in the technical field of military stealth.
The working mechanism of the wave-absorbing material is that the material realizes effective absorption of electromagnetic waves, and the wave-absorbing agent is used as a main body to convert the electromagnetic waves into heat energy in modes of insulation loss, magnetic loss, impedance loss and the like so as to achieve the effect of reducing electromagnetic radiation. The wave absorbing agent in the wave absorbing material can be divided into carbon series wave absorbing materials, iron series wave absorbing materials, ceramic series wave absorbing materials and other types of wave absorbing materials according to different elements, wherein the metal iron alloy micro powder wave absorbing agent in the iron series wave absorbing materials is a more researched and more mature wave absorbing material. The wave absorbing agent mainly absorbs and attenuates electromagnetic waves in modes of magnetic hysteresis loss, eddy current loss and the like, comprises metal iron powder, iron alloy powder, carbonyl iron powder and other materials, has the advantages of high microwave permeability, good temperature stability and the like, and has the problems of high dielectric constant, poor oxidation resistance, low resistivity, poor acid and alkali resistance, high density and the like. The silica aerogel is a light porous nano material and has the characteristics of low thermal conductivity, extremely large specific surface area, incombustibility, excellent electrical loss capacity and the like. Therefore, the ferromagnetic material and the silicon dioxide aerogel can be compounded, and the advantages of the ferromagnetic material and the silicon dioxide aerogel can be comprehensively utilized.
Chinese patent publication No. CN208148679U discloses an electromagnetic shielding film with high absorption performance, which has a multilayer structure and comprises an insulating bonding layer and a chopped carbon fiber mat wave-absorbing layer, wherein any two adjacent layers of chopped carbon fiber mat wave-absorbing layers are bonded into a whole through the insulating bonding layer, and the outermost layer of chopped carbon fiber mat wave-absorbing layer adopts the insulating bonding layer as a protective film. The chopped carbon fiber felt wave-absorbing layer has lower shielding performance and excellent wave-absorbing performance. And (3) superposing the multiple layers of chopped carbon fiber felt wave-absorbing layers and the insulating bonding layer and then carrying out hot press molding.
The film in the technical scheme can play a role in shielding electromagnetic waves, but when the film is used for equipment or a device which needs to use the electromagnetic shielding film actually, a lot of equipment can generate heat, and when the shielding film is attached, heat accumulation in the equipment is easy to generate to influence the normal operation of the equipment.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a heat conduction absorbing material can conduct the heat that produces, avoids producing the heat in inside and piles up.
The above technical purpose of the present invention can be achieved by the following technical solutions: the utility model provides a heat conduction absorbing material, is including compound absorbing layer and the heat-conducting layer that sets up in proper order, absorbing layer is wave absorbent layer, wave absorbent layer is the metal powder layer that bonds together, the heat-conducting layer is one of graphite membrane, copper foil, aluminium foil.
Through adopting above-mentioned technical scheme, when the inside heat that produces of equipment, usable heat-conducting layer outwards conducts the heat to can effectively avoid piling up because of inside heat and influence the normal function of equipment, utilize the layer of absorbing the ripples simultaneously can play good electromagnetic shield effect.
The utility model discloses further set up to: the metal powder in the metal powder layer is bonded through a high polymer material, and the metal powder layer comprises but is not limited to one of nickel-zinc-iron alloy, nickel-copper-iron alloy, zinc-chromium-iron alloy, manganese-zinc-iron alloy, iron-silicon-aluminum alloy, nickel-chromium-iron alloy, niobium-zinc-iron alloy, iron-nickel alloy, iron-aluminum alloy, iron-cobalt alloy, iron-chromium alloy, iron-silicon-nickel alloy, iron-silicon-aluminum-nickel alloy, magnesium-manganese-iron alloy, cobalt-nickel alloy, lithium-manganese alloy or lithium-cadmium-iron alloy.
By adopting the technical scheme, the metal powder in the wave absorbent layer can play a role in shielding electromagnetic waves, so that the effect of protecting related equipment is achieved.
The utility model discloses further set up to: the high polymer material is resin.
Through adopting above-mentioned technical scheme, utilize resin can play the bonding effect with metal powder.
The utility model discloses further set up to: and an adhesive layer is arranged between the heat conduction layer and the wave absorption layer.
Through adopting above-mentioned technical scheme, conveniently realize compounding between heat-conducting layer and the absorbing layer to utilize the glue film also to realize certain isolation effect with heat-conducting layer and absorbing layer simultaneously, avoid the heat to conduct to absorbing layer completely.
The utility model discloses further set up to: the heat conducting layer and the wave absorbing layer are combined through hot pressing.
By adopting the technical scheme, the connection stability between the wave absorbing layer and the heat conducting layer is improved, heat can not be directly conducted to the wave absorbing layer by depending on the space between the wave absorbing layer and the heat conducting layer, and the overhigh temperature of the surface of the wave absorbing layer is avoided.
The utility model discloses further set up to: and an adhesive layer is arranged on one side surface of the heat conduction layer, which is far away from the wave absorbing layer, and a release layer is coated on the surface of the adhesive layer.
Through adopting above-mentioned technical scheme, utilize the adhesive linkage can bond the heat-conducting layer in arbitrary position that needs to use, rely on from the type layer to play the protection effect to the adhesive linkage simultaneously, guarantee the adhesive linkage's adhesive property.
The utility model discloses further set up to: the edge of the heat conduction layer is provided with a plurality of sunken heat dissipation grooves.
Through adopting above-mentioned technical scheme, rely on many radiating grooves to enlarge the heat radiating area of heat-conducting layer to promote the radiating efficiency and the radiating effect of heat-conducting layer.
To sum up, the utility model discloses following beneficial effect has: utilize the heat-conducting layer can conduct the heat to avoid the heat to deposit and influence the normal operating of equipment, can conduct heat fast when reaching the shielding electromagnetic wave effect simultaneously.
Drawings
Fig. 1 is a schematic side view of the present embodiment.
Reference numerals: 1. a wave-absorbing layer; 2. a heat conductive layer; 3. a glue layer; 4. a space; 5. an adhesive layer; 6. a release layer; 7. a heat dissipation groove.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
A heat conduction wave-absorbing material, refer to fig. 1, including wave-absorbing layer 1 and heat-conducting layer 2 that compound set up from top to bottom in proper order, utilize wave-absorbing layer 1 can play the effect of shielding the electromagnetic wave, utilize heat-conducting layer 2 can play isolated effect to the heat that produces simultaneously.
The wave absorbing layer is a wave absorbing agent layer, the wave absorbing agent layer is a bonded metal powder layer, metal powder in the metal powder layer is bonded through a high polymer material, the metal powder layer comprises metal powder bonded together through the high polymer material, the metal powder is selected from one of nickel-zinc-iron alloy, nickel-copper-iron alloy, zinc-chromium-iron alloy, manganese-zinc-iron alloy, iron-silicon-aluminum alloy, nickel-chromium-iron alloy, niobium-zinc-iron alloy, iron-nickel alloy, iron-aluminum alloy, iron-cobalt alloy, iron-chromium alloy, iron-silicon-nickel alloy, iron-silicon-aluminum-nickel alloy, magnesium-manganese-iron alloy, cobalt-nickel alloy, lithium-manganese alloy or lithium-cadmium-iron alloy, and the iron alloy is made into a flexible thin layer during molding. The high molecular material is selected from phenolic resin, urea resin, epoxy resin, acrylic resin, polyvinyl butyral resin, vinyl acetate and copolymer thereof, organic silicon glue resin, polyurethane resin, rubber resin or polymer thereof.
Graphite membrane is chooseed for use to heat-conducting layer 2, one kind in copper foil and the aluminium foil, heat-conducting layer 2 combines with absorbing layer 1 accessible hot pressing mode, also can set to undercut towards absorbing layer 1's a side surface centre with heat-conducting layer 2, and the position that is close to the edge with heat-conducting layer 2 upper surface becomes the level, then heat-conducting layer 2 is close to the position at edge and can closely laminate absorbing layer 1, and can bond by glue film 3 from top to bottom between the two, it has space 4 to utilize sunken position to make heat-conducting layer 2 upper surface and absorb between the wave layer 1, and heat-conducting layer 2's thickness reduces from its edge to its central direction gradually, then heat-conducting layer 2 is close to the thickness at edge and is greater than its central thickness, thereby make heat-conducting layer 2's peripheral lateral wall and. Meanwhile, in order to improve the heat dissipation efficiency and speed, a plurality of inwards-concave heat dissipation grooves 7 are formed in the side wall of the heat conduction layer 2 along the respective edges, so that the contact area between the heat conduction layer 2 and air is increased, and the heat conduction efficiency and the heat dissipation speed are improved.
For the convenience of use, be equipped with adhesive bonding layer 5 on the surface of heat-conducting layer 2 one side that deviates from absorbing layer 1 to in order to keep adhesive bonding layer 5 clean and tidy, it has release layer 6 to cover on adhesive bonding layer 5's surface, and release layer 6 is from type paper.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications to the present embodiment without inventive contribution as required after reading the present specification, but all of them are protected by patent laws within the scope of the claims of the present invention.
Claims (7)
1. A heat conduction wave-absorbing material is characterized in that: including absorbing layer (1) and heat-conducting layer (2) of compound setting in proper order, it is wave-absorbing agent layer to absorb wave layer (1), the metal powder layer that wave-absorbing agent layer is for bonding together, heat-conducting layer (2) are one in graphite membrane, copper foil, the aluminium foil.
2. The heat-conducting wave-absorbing material as claimed in claim 1, which is characterized in that: the metal powder in the metal powder layer is bonded through a high polymer material, and the metal powder layer comprises but is not limited to one of nickel-zinc-iron alloy, nickel-copper-iron alloy, zinc-chromium-iron alloy, manganese-zinc-iron alloy, iron-silicon-aluminum alloy, nickel-chromium-iron alloy, niobium-zinc-iron alloy, iron-nickel alloy, iron-aluminum alloy, iron-cobalt alloy, iron-chromium alloy, iron-silicon-nickel alloy, iron-silicon-aluminum-nickel alloy, magnesium-manganese-iron alloy, cobalt-nickel alloy, lithium-manganese alloy or lithium-cadmium-iron alloy.
3. The heat-conducting wave-absorbing material as claimed in claim 2, which is characterized in that: the high polymer material is resin.
4. The heat-conducting wave-absorbing material as claimed in claim 1, which is characterized in that: an adhesive layer (3) is arranged between the heat conduction layer (2) and the wave absorption layer (1).
5. The heat-conducting wave-absorbing material as claimed in claim 1, which is characterized in that: the heat conduction layer (2) is combined with the wave absorption layer (1) through hot pressing.
6. The heat-conducting wave-absorbing material as claimed in claim 1, which is characterized in that: a bonding layer (5) is arranged on one side of the heat conduction layer (2) deviating from the wave absorbing layer (1), and a release layer (6) covers the surface of the bonding layer (5).
7. The heat-conducting wave-absorbing material as claimed in claim 1, which is characterized in that: the edge of the heat conduction layer (2) is provided with a plurality of sunken heat dissipation grooves (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920787418.XU CN211199101U (en) | 2019-05-29 | 2019-05-29 | Heat-conducting wave-absorbing material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920787418.XU CN211199101U (en) | 2019-05-29 | 2019-05-29 | Heat-conducting wave-absorbing material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211199101U true CN211199101U (en) | 2020-08-07 |
Family
ID=71879167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920787418.XU Active CN211199101U (en) | 2019-05-29 | 2019-05-29 | Heat-conducting wave-absorbing material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211199101U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867377A (en) * | 2020-12-16 | 2021-05-28 | 苏州驭奇材料科技有限公司 | Heat-conducting wave absorber and preparation method and application thereof |
| CN114905803A (en) * | 2022-04-08 | 2022-08-16 | 中国科学院宁波材料技术与工程研究所 | Composite material with heat conduction and electromagnetic protection functions and preparation method and application thereof |
-
2019
- 2019-05-29 CN CN201920787418.XU patent/CN211199101U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867377A (en) * | 2020-12-16 | 2021-05-28 | 苏州驭奇材料科技有限公司 | Heat-conducting wave absorber and preparation method and application thereof |
| CN114905803A (en) * | 2022-04-08 | 2022-08-16 | 中国科学院宁波材料技术与工程研究所 | Composite material with heat conduction and electromagnetic protection functions and preparation method and application thereof |
| CN114905803B (en) * | 2022-04-08 | 2023-11-24 | 中国科学院宁波材料技术与工程研究所 | Composite material with heat conduction and electromagnetic protection functions and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104981138B (en) | A kind of manufacturing method for being electromagnetically shielded heat dissipation film | |
| CN204350556U (en) | A kind of electromagnetic shielding heat dissipation film | |
| CN211199101U (en) | Heat-conducting wave-absorbing material | |
| CN104972708B (en) | One kind inhales the difunctional composite of wave dispersion heat and its manufacture method | |
| CN105007704B (en) | Composite radiating inhales ripple film | |
| CN206242623U (en) | A kind of heat conduction wave absorbing patch | |
| CN109605862B (en) | Composite material with heat conduction and electromagnetic shielding functions and preparation method thereof | |
| CN103929933B (en) | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same | |
| TWI482585B (en) | Shielding composite diaphragm | |
| CN213924617U (en) | Composite adhesive tape capable of shielding and absorbing electromagnetic waves | |
| CN207978250U (en) | A kind of ultra-thin heat radiating type magnetic field shielding piece | |
| CN211210360U (en) | Heat-insulation wave-absorbing material | |
| CN211199100U (en) | Heat-insulation heat-conduction wave-absorbing material | |
| CN203876309U (en) | Wave-absorbing heat-dissipating bi-functional compound device | |
| CN203876307U (en) | High-heat-dissipation wave-absorbing composite film | |
| CN218337024U (en) | Can realize inhaling anti-interference shielding film of ripples | |
| CN213534067U (en) | Heat-insulation shielding film | |
| CN207944054U (en) | FPC conductive double sided adhesive tapes | |
| CN207706631U (en) | A kind of suction wave graphite flake | |
| JP4075481B2 (en) | Metal-graphite sheet composite and electronic device | |
| CN210840545U (en) | Wave-absorbing shielding film with heat dissipation and conduction functions | |
| JP4311654B2 (en) | Laminated electromagnetic wave absorber | |
| CN211607245U (en) | Low-frequency shielding heat-conducting composite structure | |
| CN210157586U (en) | Composite electromagnetic wave absorbing plate for electronic equipment | |
| CN210443363U (en) | Magnetic conductive sheet for wireless charger |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220104 Address after: 213222 No. 139, Huaye Road, Jintan District, Changzhou City, Jiangsu Province Patentee after: Changzhou yuweili Material Technology Co.,Ltd. Address before: 314006 workshop, No.5, Zhonghuan South Road North, Daqiao Town, Nanhu District, Jiaxing City, Zhejiang Province Patentee before: ZHEJIANG KANGTING ELECTRONIC TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 213222 No. 139, Huaye Road, Jintan District, Changzhou City, Jiangsu Province Patentee after: Yuqi Material Technology Changzhou Co.,Ltd. Address before: 213222 No. 139, Huaye Road, Jintan District, Changzhou City, Jiangsu Province Patentee before: Changzhou yuweili Material Technology Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |