CN211607245U - Low-frequency shielding heat-conducting composite structure - Google Patents
Low-frequency shielding heat-conducting composite structure Download PDFInfo
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- CN211607245U CN211607245U CN201922276767.8U CN201922276767U CN211607245U CN 211607245 U CN211607245 U CN 211607245U CN 201922276767 U CN201922276767 U CN 201922276767U CN 211607245 U CN211607245 U CN 211607245U
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Abstract
The utility model discloses a low-frequency shielding heat-conducting composite structure, which comprises a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are arranged in sequence, wherein the layers are bonded together in sequence; wherein the low frequency shielding layer is made of permalloy, ferrite sheet or ferrite polymer. The utility model discloses a structural design can effectively reduce the signal or the electromagnetic interference of shielding low frequency when the heat source is thermal, has guaranteed the steady operation of electronic product.
Description
Technical Field
The utility model relates to a shielding heat conduction material, concretely relates to low frequency shielding heat conduction composite construction.
Background
With the development of the electronic industry and the high application of electronic equipment, electromagnetic radiation is considered as the fourth major public nuisance following water pollution, noise pollution and air pollution, and the electromagnetic interference caused by the electromagnetic radiation not only affects the normal life of people, but also increasingly threatens the military confidentiality of the country. Especially in the modernized battlefield of soft killer weapons, electromagnetic wave emergence, when the electromagnetic wave penetrates sensitive devices of military equipment, the radar of the opposite side is lost, a radio communication command system fails, missiles and artillery weapons are out of control. The electromagnetic weapon with extremely high destructive power can become an important operation means on a future battlefield, so that the research on high-performance electromagnetic shielding materials to improve the protection capability of various weapon platforms is an important task in the military field of all countries. In addition, electromagnetic radiation also presents a serious challenge to the health of people. Electromagnetic waves emitted by various communication devices, networks and household appliances can induce various diseases, such as insufficient sleep, dizziness and vomiting, and can even induce cancer and cardiovascular diseases seriously. Therefore, research and development of electromagnetic shielding materials are important methods for controlling electromagnetic environments in recent years.
The common electromagnetic shielding materials comprise metal materials, polymer composite materials and the like, the metal materials can be used as main electromagnetic shielding materials because the metal materials have good electrical conductivity (copper, aluminum, nickel and the like) and high magnetic conductivity (permalloy, iron-silicon alloy and the like), and when electromagnetic energy flows through the metal materials, the main shielding mechanisms of the metal materials are reflection attenuation R and absorption attenuation A, the electromagnetic waves can be effectively reflected and absorbed, the electromagnetic energy is attenuated, and therefore a good shielding effect is achieved. Most polymer materials have poorer electrical conductivity than metals, which greatly reduces the electromagnetic shielding effectiveness of the polymer materials.
At present, most of shielding heat-conducting composite materials are developed around good-conductor high-heat-conducting metals, and the materials have good shielding effect on high-frequency electromagnetic wave energy, but have no shielding effect on low-frequency magnetic fields. Therefore, it is highly desirable to develop a low frequency shielding composite material to solve the current problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at overcoming the not enough of prior art, provide a low frequency shielding heat conduction composite construction.
The utility model discloses a low-frequency shielding heat-conducting composite structure, which comprises a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are arranged in sequence, wherein the layers are bonded together in sequence;
the low-frequency shielding layer is a film layer prepared from permalloy, ferrite sheets or ferrite polymers.
As an embodiment of the utility model provides a further improvement, low frequency shielding heat conduction composite construction is including the single face of laminating in proper order from type layer, first ya keli glue film, first thin layer, second ya keli glue film, graphite layer, third ya keli glue film, second thin layer, fourth ya keli glue film, low frequency shielding layer and protection rete.
As a further improvement of the embodiment of the present invention, the graphite layer is made of artificial graphite flakes or natural graphite flakes.
As a further improvement of the embodiment of the present invention, the thickness range of the graphite layer is selected from 0.01 to 0.3 mm.
As a further improvement of the embodiment of the present invention, the thickness range of the graphite layer is selected from 0.01 to 0.1 mm.
As a further improvement of the embodiment of the present invention, the thickness range of the low frequency shielding layer is selected from 0.01 to 0.2 mm.
As a further improvement of the embodiment of the present invention, the thickness range of the low frequency shielding layer is selected from 0.01 to 0.1 mm.
As a further improvement of the embodiment of the present invention, the ferrite sheet is formed by sintering one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide, and strontium oxide.
As a further improvement of the embodiment of the present invention, the ferrite polymer includes a filler and a polymer, the filler is configured by one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide, and strontium oxide, and the filler and the polymer are formed by banburying, calendering, curing and molding.
As a further improvement of the embodiment of the present invention, the polymer is one selected from the group consisting of PE resin, PP resin, acrylic resin, urethane resin, silicone rubber, and epoxy resin.
As a further improvement of the embodiment of the present invention, the layers are formed into a continuous compact layered structure in a film or sheet shape by extrusion or coating and extrusion commonly applied processing methods.
As a further improvement of the embodiment of the present invention, the adhesive selected for bonding is selected from polyurethane hot melt adhesive, polyurethane solvent adhesive or epoxy resin adhesive.
The utility model discloses a low frequency shielding heat conduction composite construction can effectively reduce the heat source heat, shields the signal or the electromagnetic interference of low frequency simultaneously, has guaranteed the steady operation of electronic product.
Drawings
FIG. 1 is a schematic structural diagram of the low-frequency shielding composite material of the present invention;
the examples in the figures are represented as:
1-single-sided release layer; 2-a first acrylic adhesive layer; 3-a first thin film layer; 4-a second acrylic adhesive layer; 5-a graphite layer; 6-third acrylic adhesive layer; 7-a second film layer; 8-fourth acrylic adhesive layer; 9-a low frequency shielding layer; 10-protective film layer.
Detailed Description
The utility model discloses a low-frequency shielding heat-conducting composite structure, which comprises a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are arranged in sequence, wherein the layers are bonded together in sequence;
the low frequency shielding layer is made of iron oxide, and in other alternative embodiments, may be made of permalloy, other ferrite sheets, or ferrite polymer. Other ferrite pieces can be prepared by sintering one or more of nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide.
In the embodiment of the present invention, as shown in fig. 1, the bonding structure of the low-frequency shielding heat-conducting composite structure includes a release layer, a first acrylic adhesive layer, a first thin layer, a second acrylic adhesive layer, a graphite layer, a third acrylic adhesive layer, a second thin layer, a fourth acrylic adhesive layer, a low-frequency shielding layer and a protection film layer, which are laminated in sequence.
Wherein, the graphite layer is prepared by artificial graphite flakes, or natural graphite flakes can be selected for preparation; the graphite layers have a thickness of 0.1 and in other alternative embodiments, the thickness is selected from the range of 0.01 to 0.3 mm.
In an embodiment of the present invention, the thickness of the low frequency shielding layer is 0.1mm, and the thickness range is selected from 0.01-0.2mm, and more preferably, from 0.01-0.1 mm.
The ferrite polymer comprises a filler and a polymer, wherein the filler is prepared from one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide, and the filler and the polymer are subjected to banburying, calendaring, curing and forming.
The polymer is selected from one of PE resin, PP resin, acrylic resin, polyurethane resin, silicon rubber and epoxy resin.
Each layer is a continuous compact laminated structure formed by extrusion or a processing mode of coating and extrusion, and is in a film shape or a sheet shape.
The adhesive selected for bonding is selected from polyurethane type hot melt adhesive, polyurethane type solvent adhesive or epoxy resin adhesive.
The utility model discloses a low frequency shielding heat conduction composite construction can effectively reduce the heat source heat, shields the signal or the electromagnetic interference of low frequency simultaneously, has guaranteed the steady operation of electronic product.
Claims (7)
1. A low-frequency shielding heat-conducting composite structure is characterized by comprising a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are sequentially arranged, wherein the layers are sequentially bonded together;
the low-frequency shielding layer is a film layer prepared from permalloy, ferrite sheets or ferrite polymers.
2. The low-frequency shielding and heat conducting composite structure as claimed in claim 1, comprising a single-sided release layer, a first acrylic adhesive layer, a first film layer, a second acrylic adhesive layer, a graphite layer, a third acrylic adhesive layer, a second film layer, a fourth acrylic adhesive layer, a low-frequency shielding layer and a protective film layer, which are sequentially attached.
3. The low frequency shielding thermally conductive composite structure of claim 1 or 2, wherein the graphite layer is made of artificial graphite sheet or natural graphite sheet.
4. The low frequency shielding thermally conductive composite structure of claim 3, wherein said graphite layer has a thickness selected from the range of 0.01-0.3 mm.
5. The low frequency shielding thermally conductive composite structure of claim 4, wherein the graphite layer has a thickness selected from the range of 0.01-0.1 mm.
6. The low frequency shielding thermally conductive composite structure of claim 1 or 2, wherein the thickness of the low frequency shielding layer is selected from the range of 0.01-0.2 mm.
7. The low frequency shielding thermally conductive composite structure of claim 6, wherein said low frequency shielding layer has a thickness selected from the range of 0.01-0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922276767.8U CN211607245U (en) | 2019-12-17 | 2019-12-17 | Low-frequency shielding heat-conducting composite structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922276767.8U CN211607245U (en) | 2019-12-17 | 2019-12-17 | Low-frequency shielding heat-conducting composite structure |
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| CN211607245U true CN211607245U (en) | 2020-09-29 |
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| CN201922276767.8U Active CN211607245U (en) | 2019-12-17 | 2019-12-17 | Low-frequency shielding heat-conducting composite structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023096610A1 (en) * | 2021-11-24 | 2023-06-01 | Tusas- Turk Havacilik Ve Uzay Sanayii Anonim Sirketi | A protective structure |
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2019
- 2019-12-17 CN CN201922276767.8U patent/CN211607245U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023096610A1 (en) * | 2021-11-24 | 2023-06-01 | Tusas- Turk Havacilik Ve Uzay Sanayii Anonim Sirketi | A protective structure |
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