CN213522950U - PI wave absorbing plate - Google Patents
PI wave absorbing plate Download PDFInfo
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- CN213522950U CN213522950U CN202022531717.2U CN202022531717U CN213522950U CN 213522950 U CN213522950 U CN 213522950U CN 202022531717 U CN202022531717 U CN 202022531717U CN 213522950 U CN213522950 U CN 213522950U
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Abstract
The utility model provides a PI wave absorbing plate, which comprises a ferrite wave absorbing layer and a PI film layer, wherein the ferrite wave absorbing layer is adhered to one side of the PI film layer through high-temperature vulcanization to form an integral structure, and a double-sided adhesive layer is adhered to the side of the PI film layer away from the ferrite layer; the utility model provides a wave absorption body with good compliance, bendable provides better interference absorption, ripples, shielding scheme and application for flexible screen and folding screen.
Description
Technical Field
The utility model relates to an electromagnetic wave absorbing material technical field especially relates to a wave plate is inhaled to PI.
Background
Magnetic wave radiation has become a further nuisance following noise pollution, atmospheric pollution, water pollution, solid waste pollution. Electromagnetic interference generated by electromagnetic wave radiation not only affects the normal operation of various electronic devices, but also has great harm to the health of human bodies. The miniaturization, integration and high-frequency development of electronic technology make the problem of electromagnetic compatibility more and more prominent, and the core content of electromagnetic compatibility, namely, the anti-electromagnetic interference, is more and more emphasized. The wave-absorbing material technology is a common anti-electromagnetic interference means, can absorb, convert and attenuate useless and harmful electromagnetic energy generated by electromagnetic pollution, and has become a hotspot of research in the technical fields of stealth of military equipment of various countries, civil anti-electromagnetic radiation and the like.
The existing electronic wave absorber basically adopts ferrite for interference absorption, wave absorption and shielding of electronic products, but has poor flexibility, is fragile and cannot be bent, and is not suitable for being used on products with complex surfaces and bending requirements such as 5G base stations, flexible screens and the like.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a wave plate is inhaled to PI aims at solving the fragile technical problem that can not buckle of current wave absorbing body.
In order to achieve the above object, the utility model provides a wave plate is inhaled to PI, it includes ferrite wave-absorbing layer and PI rete, ferrite wave-absorbing layer vulcanizes laminating to PI rete one side through high temperature in order to form a body structure, the PI rete is kept away from ferrite layer one side and is binded and have had two-sided adhesive layer.
Preferably, the double-sided adhesive layer comprises an adhesive layer and a release film.
Preferably, the thickness of the ferrite wave absorbing layer is 0.01mm-2 mm.
Preferably, the thickness of the PI film layer is 0.01mm-0.1 mm.
Preferably, the double-sided adhesive layer is an acrylic double-sided adhesive tape.
Preferably, the thickness of the double-sided adhesive tape layer is 0.005mm-0.1 mm.
Compared with the prior art, the utility model discloses possess following beneficial effect:
the utility model provides a PI wave absorbing plate, which comprises a ferrite wave absorbing layer and a PI film layer, wherein the ferrite wave absorbing layer is adhered to one side of the PI film layer through high-temperature vulcanization to form an integral structure, and a double-sided adhesive layer is adhered to the side of the PI film layer away from the ferrite layer; the ferrite wave-absorbing layer is used for interference absorption, wave absorption and shielding, the PI film layer is used as a base material, the base material has flexibility, and the bendable double-sided adhesive layer is used for bonding and fixing the PI wave-absorbing plate and an electronic product and is convenient to use and assemble. The utility model provides a wave absorption body with good compliance, bendable provides better interference absorption, ripples, shielding scheme and application for flexible screen and folding screen.
Drawings
FIG. 1 is a schematic diagram of a PI wave-absorbing plate of the present invention;
fig. 2 is a schematic structural diagram of an embodiment of the PI absorption plate of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings.
The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention, and all other embodiments obtained by those skilled in the art without creative efforts based on the embodiments of the present invention belong to the protection scope of the present invention.
The PI film of the PI film layer is a polyimide film (polyimide film), is a film type insulating material with the best performance in the world, and is formed by polycondensation and film-casting of pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent and imidization. The film is a biphenyl polyimide film or a biphenyl polyimide film. The former is a product of DuPont, USA, with the trade name of Kapton, and is prepared from pyromellitic dianhydride and diphenyl ether diamine. The latter is produced by Nippon corporation under the trade name Uplix and is prepared from biphenyltetracarboxylic dianhydride and diphenyletherdiamine (R type) or m-phenylenediamine (S type).
The utility model provides a wave plate is inhaled to PI, see figure 1, it includes ferrite and inhale wave layer 1 and PI rete 2, ferrite inhale wave layer 1 through high temperature vulcanization laminating to 2 one sides of PI rete in order to form a body structure, PI rete 2 is kept away from ferrite layer 1 and is simultaneously binded and have two-sided adhesive layer 3.
In the embodiment, the ferrite wave-absorbing layer 1 and the PI film layer 2 are of a flexible wave-absorbing integrated structure, the ferrite wave-absorbing layer 1 is used for interference absorption, wave absorption and shielding, and the PI film layer 2 is used as a base material, has flexibility and bendability, and can be used for solving the problem of bending of a wave-absorbing material and better using the wave-absorbing material on complex surfaces and products with bending requirements such as 5G flexible screens and the like, so that the wave-absorbing material has good flexibility and can provide better interference absorption, wave absorption and shielding schemes and application for the flexible screens and the folding screens; improves the flexible quality and safety of the product and has simple operation. In this embodiment, the double-sided adhesive layer 3 is used for bonding and fixing the PI absorption plate and an electronic product, and is convenient to use and assemble.
In one embodiment, referring to fig. 2, the double-sided adhesive layer 3 includes an adhesive layer 301 and a release film 302. The adhesive 301 is used for bonding and fixing the PI wave absorbing plate comprising the ferrite wave absorbing layer 1 and the PI film layer 2 with an electronic product, and is convenient to use and assemble. The release film 302 is used for protecting the adhesiveness of the adhesive 301, so that the adhesive effect cannot be reduced due to storage or air leakage.
Wherein, the thickness of the ferrite wave absorbing layer 1 is 0.01mm-2mm, the thickness of the PI film layer 2 is 0.01mm-0.1mm, and the thickness of the double-sided adhesive layer 3 is 0.005mm-0.1 mm. The thickness of each part of the PI wave absorption plate suitable for interference absorption can be selected according to the bending state of electronic products to be subjected to wave absorption shielding interference waves with different sizes and the electronic products.
In the present embodiment, the double-sided adhesive layer 3 is an acrylic double-sided adhesive tape. The acrylic double-sided adhesive tape is an acrylic foam adhesive tape, a high-density acrylic foam base material and an acrylic back adhesive, and has excellent bonding strength, good sealing performance, ultraviolet resistance and solvent resistance.
The above embodiments are only used for illustrating the present invention, and not for limiting the present invention, and those skilled in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the present invention, so that all equivalent technical solutions also belong to the scope of the present invention, and the protection scope of the present invention should be defined by the claims.
Claims (4)
1. The utility model provides a wave plate is inhaled to PI, its characterized in that, includes ferrite and inhale wave layer and PI rete, ferrite is inhaled the wave layer and is laminated to PI rete one side in order to form a body structure through high temperature vulcanization, the PI rete is kept away from ferrite one side and is binded there is double-sided adhesive layer, double-sided adhesive layer includes the adhesive layer and leaves the type membrane, ferrite is inhaled the thickness on wave layer and is 0.01mm-2 mm.
2. The PI wave plate according to claim 1, wherein the thickness of the PI film layer is 0.01mm to 0.1 mm.
3. The PI wave plate of claim 1, wherein the double-sided adhesive layer is an acrylic double-sided adhesive.
4. The PI wave plate according to claim 1, wherein the double-sided adhesive layer has a thickness of 0.005mm to 0.1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022531717.2U CN213522950U (en) | 2020-11-05 | 2020-11-05 | PI wave absorbing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022531717.2U CN213522950U (en) | 2020-11-05 | 2020-11-05 | PI wave absorbing plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN213522950U true CN213522950U (en) | 2021-06-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022531717.2U Active CN213522950U (en) | 2020-11-05 | 2020-11-05 | PI wave absorbing plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN213522950U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114179449A (en) * | 2021-11-25 | 2022-03-15 | 广州金南磁性材料有限公司 | Wave-absorbing material for folding screen and preparation method and application thereof |
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2020
- 2020-11-05 CN CN202022531717.2U patent/CN213522950U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114179449A (en) * | 2021-11-25 | 2022-03-15 | 广州金南磁性材料有限公司 | Wave-absorbing material for folding screen and preparation method and application thereof |
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