CN110861359A - Composite heat dissipation wave absorption film - Google Patents

Composite heat dissipation wave absorption film Download PDF

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Publication number
CN110861359A
CN110861359A CN201911163053.4A CN201911163053A CN110861359A CN 110861359 A CN110861359 A CN 110861359A CN 201911163053 A CN201911163053 A CN 201911163053A CN 110861359 A CN110861359 A CN 110861359A
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CN
China
Prior art keywords
layer
wave
heat dissipation
film
absorbing layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911163053.4A
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Chinese (zh)
Inventor
刘付胜聪
周作成
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SUZHOU YUQI MATERIALS TECHNOLOGY Co Ltd
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SUZHOU YUQI MATERIALS TECHNOLOGY Co Ltd
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Priority to CN201911163053.4A priority Critical patent/CN110861359A/en
Publication of CN110861359A publication Critical patent/CN110861359A/en
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/10—Properties of the layers or laminate having particular acoustical properties
    • B32B2307/102—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

Abstract

The invention discloses a composite heat dissipation wave absorption film which comprises a first plastic protection layer, a first adhesive layer, a first wave absorption layer, a heat dissipation film layer, a second wave absorption layer, a second adhesive layer and a second plastic protection layer from top to bottom; the first wave absorbing layer and the second wave absorbing layer are directly coated on the upper surface and the lower surface of the heat dissipation film layer; a plurality of through holes are formed in the heat dissipation film layer; the upper surface of the first wave-absorbing layer and the lower surface of the second wave-absorbing layer are respectively bonded with the first plastic protective layer and the second plastic protective layer through the first adhesive layer and the second adhesive layer. The composite heat dissipation wave absorption film can achieve the effects of electromagnetic shielding and electromagnetic noise suppression, and solves the problems of heat conduction and electromagnetic wave shielding of electronic equipment.

Description

Composite heat dissipation wave absorption film
Technical Field
The invention relates to a composite heat dissipation wave absorption film.
Background
The principle of the wave-absorbing material for shielding electromagnetic waves is that absorbed electromagnetic waves are converted into heat energy, which can cause the temperature of an electronic device to rise, not only can reduce the wave-absorbing effect of the wave-absorbing film, but also can reduce the power consumption and the stability of the electronic device. Therefore, the development of the wave-absorbing material with the heat dissipation function has urgent needs in intelligent electronic equipment.
The synthetic graphite film gradually becomes a hot spot in the heat conduction material due to the ultrahigh heat conductivity (800-. In patent document CN202799566U, a graphite heat-conducting film is directly attached to a wave-absorbing film through an adhesive tape. Although the heat conducting performance of the whole body is improved by adopting the graphite heat conducting material, the heat generated by the wave-absorbing material converting electromagnetic waves can not be conducted to the graphite film in time due to the thermal resistance of the adhesive tape. In addition, the graphite film is made of a single element of carbon, so that the graphite film is low in surface energy and is not easy to adhere to other materials. Furthermore, the synthetic graphite film is composed of thousands of graphite molecule layers, and the layers are combined by Van der Waals force, so that the synthetic graphite film is very easy to delaminate under the condition of external force, and the composition of the synthetic graphite film and other materials is damaged. Therefore, a method for stably combining the synthetic graphite film and the wave-absorbing material is needed, which can effectively solve the heating problem of the wave-absorbing material and increase the processing reliability of the wave-absorbing material.
Disclosure of Invention
The invention aims to provide a composite heat dissipation wave absorption film, and aims to solve the problems.
In order to achieve the purpose, the technical scheme of the invention is to design a composite heat dissipation wave absorption film which comprises a first plastic protection layer, a first adhesive layer, a first wave absorption layer, a heat dissipation film layer, a second wave absorption layer, a second adhesive layer and a second plastic protection layer from top to bottom; the first wave absorbing layer and the second wave absorbing layer are directly coated on the upper surface and the lower surface of the heat dissipation film layer; a plurality of through holes are formed in the heat dissipation film layer; the upper surface of the first wave-absorbing layer and the lower surface of the second wave-absorbing layer are respectively bonded with the first plastic protective layer and the second plastic protective layer through the first adhesive layer and the second adhesive layer.
Preferably, the heat dissipation film layer is a synthetic graphite film, the thickness of the heat dissipation film layer is 0.02mm, and the heat conductivity of the heat dissipation film layer is 2500W/m.k; the first wave absorbing layer and the second wave absorbing layer are prepared by mixing nickel-zinc-iron alloy powder and an epoxy resin adhesive, wherein the weight ratio of the nickel-zinc-iron alloy powder to the epoxy resin adhesive is 4: 1; the first wave absorbing layer and the second wave absorbing layer are 0.03mm thick and have 50 magnetic permeability.
Preferably, the diameter of the through hole on the heat dissipation film layer is 0.1-0.5 mm, and the density is 80/m2。
Preferably, the first adhesive layer and the second adhesive layer are made of acrylic adhesives.
Preferably, the first plastic protection layer and the second plastic protection layer are polybutylene terephthalate films, and the thickness of the polybutylene terephthalate films is 0.02-0.05 mm.
The invention has the advantages and beneficial effects that: the composite heat dissipation wave absorption film can achieve the effects of electromagnetic shielding and electromagnetic noise suppression, and solves the problems of heat conduction and electromagnetic wave shielding of electronic equipment.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is a schematic illustration of the separation of layers according to the present invention.
The wave absorbing material comprises a first plastic protective layer 1, a first adhesive layer 2, a first wave absorbing layer 3, a heat dissipation film layer 4, a second wave absorbing layer 5, a second adhesive layer 6 and a second plastic protective layer 7.
Detailed Description
The following description of the embodiments of the present invention will be made with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
Example (b):
a composite heat dissipation wave absorption film comprises a first plastic protection layer 1, a first adhesive layer 2, a first wave absorption layer 3, a heat dissipation film layer 4, a second wave absorption layer 5, a second adhesive layer 6 and a second plastic protection layer 7 from top to bottom; the first wave-absorbing layer 3 and the second wave-absorbing layer 5 are directly coated on the upper surface and the lower surface of the heat dissipation film layer 4; a plurality of through holes are formed in the heat dissipation film layer 4; the upper surface of the first wave-absorbing layer 3 and the lower surface of the second wave-absorbing layer 5 are respectively bonded with the first plastic protection layer 1 and the second plastic protection layer 7 through the first adhesive layer 2 and the second adhesive layer 6.
The heat dissipation film layer 4 is a synthetic graphite film, the thickness is 0.02mm, and the heat conductivity is 2500W/m.k; the first wave-absorbing layer 3 and the second wave-absorbing layer 5 are prepared by mixing nickel-zinc-iron alloy powder and an epoxy resin adhesive, wherein the weight ratio of the nickel-zinc-iron alloy powder to the epoxy resin adhesive is 4: 1; the first wave-absorbing layer 3 and the second wave-absorbing layer 5 have the thickness of 0.03mm and the magnetic conductivity of 50.
The diameter of the through hole on the heat dissipation film layer 4 is 0.1-0.5 mm, and the density is 80/m2。
The first adhesive layer 2 and the second adhesive layer 6 are made of acrylic acid adhesives.
The first plastic protection layer 1 and the second plastic protection layer 7 are polybutylene terephthalate films, and the thickness of the polybutylene terephthalate films is 0.02-0.05 mm.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the technical principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (5)

1. The utility model provides a compound heat dissipation wave absorption membrane which characterized in that: the heat-dissipation film comprises a first plastic protection layer, a first adhesive layer, a first wave-absorbing layer, a heat-dissipation film layer, a second wave-absorbing layer, a second adhesive layer and a second plastic protection layer from top to bottom; the first wave absorbing layer and the second wave absorbing layer are directly coated on the upper surface and the lower surface of the heat dissipation film layer; a plurality of through holes are formed in the heat dissipation film layer; the upper surface of the first wave-absorbing layer and the lower surface of the second wave-absorbing layer are respectively bonded with the first plastic protective layer and the second plastic protective layer through the first adhesive layer and the second adhesive layer.
2. The composite heat dissipation and wave absorption film of claim 1, wherein: the heat dissipation film layer is a synthetic graphite film, the thickness of the heat dissipation film layer is 0.02mm, and the heat conductivity of the heat dissipation film layer is 2500W/m.k; the first wave absorbing layer and the second wave absorbing layer are prepared by mixing nickel-zinc-iron alloy powder and an epoxy resin adhesive, wherein the weight ratio of the nickel-zinc-iron alloy powder to the epoxy resin adhesive is 4: 1; the first wave absorbing layer and the second wave absorbing layer are 0.03mm thick and have 50 magnetic permeability.
3. The composite heat dissipation and wave absorption film of claim 1, wherein: the diameter of the through hole on the heat dissipation film layer is 0.1-0.5 mm, and the density is 80/m2。
4. The composite heat dissipation and wave absorption film of claim 1, wherein: the first adhesive layer and the second adhesive layer are made of acrylic adhesives.
5. The composite heat dissipation and wave absorption film of claim 1, wherein: the first plastic protection layer and the second plastic protection layer are made of polybutylene terephthalate films, and the thickness of the polybutylene terephthalate films is 0.02-0.05 mm.
CN201911163053.4A 2019-11-25 2019-11-25 Composite heat dissipation wave absorption film Pending CN110861359A (en)

Priority Applications (1)

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CN201911163053.4A CN110861359A (en) 2019-11-25 2019-11-25 Composite heat dissipation wave absorption film

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CN201911163053.4A CN110861359A (en) 2019-11-25 2019-11-25 Composite heat dissipation wave absorption film

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CN110861359A true CN110861359A (en) 2020-03-06

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111587061A (en) * 2020-06-22 2020-08-25 深圳市鸿富诚屏蔽材料有限公司 Preparation process and finished product of heat-conducting wave-absorbing tape

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171937A (en) * 1991-07-22 1992-12-15 Champlain Cable Corporation Metal-coated shielding materials and articles fabricated therefrom
JPH11340673A (en) * 1998-05-22 1999-12-10 Porimatec Kk Electromagnetic wave shielding sheet of high thermal conductivity and its manufacture
CN102555314A (en) * 2011-12-30 2012-07-11 深圳市爱诺菲科技有限公司 SMD (surface mounted device) with cooling and electromagnetic wave absorption functions and preparation method and application thereof
CN104972709A (en) * 2014-04-10 2015-10-14 苏州驭奇材料科技有限公司 High-heat-dissipation wave-absorbing composite film and manufacturing method thereof
CN105007704A (en) * 2014-04-24 2015-10-28 苏州驭奇材料科技有限公司 Composite heat-dissipation wave-absorbing film
CN105025694A (en) * 2015-07-28 2015-11-04 苏州驭奇材料科技有限公司 Electromagnetic wave absorbing material with protective layer and manufacturing method of electromagnetic wave absorbing material

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5171937A (en) * 1991-07-22 1992-12-15 Champlain Cable Corporation Metal-coated shielding materials and articles fabricated therefrom
JPH11340673A (en) * 1998-05-22 1999-12-10 Porimatec Kk Electromagnetic wave shielding sheet of high thermal conductivity and its manufacture
CN102555314A (en) * 2011-12-30 2012-07-11 深圳市爱诺菲科技有限公司 SMD (surface mounted device) with cooling and electromagnetic wave absorption functions and preparation method and application thereof
CN104972709A (en) * 2014-04-10 2015-10-14 苏州驭奇材料科技有限公司 High-heat-dissipation wave-absorbing composite film and manufacturing method thereof
CN105007704A (en) * 2014-04-24 2015-10-28 苏州驭奇材料科技有限公司 Composite heat-dissipation wave-absorbing film
CN105025694A (en) * 2015-07-28 2015-11-04 苏州驭奇材料科技有限公司 Electromagnetic wave absorbing material with protective layer and manufacturing method of electromagnetic wave absorbing material

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111587061A (en) * 2020-06-22 2020-08-25 深圳市鸿富诚屏蔽材料有限公司 Preparation process and finished product of heat-conducting wave-absorbing tape
CN111587061B (en) * 2020-06-22 2022-04-19 深圳市鸿富诚新材料股份有限公司 Preparation process and finished product of heat-conducting wave-absorbing tape

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Application publication date: 20200306

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