CN203021492U - Heat-conducting double-faced adhesive tape - Google Patents
Heat-conducting double-faced adhesive tape Download PDFInfo
- Publication number
- CN203021492U CN203021492U CN 201220527385 CN201220527385U CN203021492U CN 203021492 U CN203021492 U CN 203021492U CN 201220527385 CN201220527385 CN 201220527385 CN 201220527385 U CN201220527385 U CN 201220527385U CN 203021492 U CN203021492 U CN 203021492U
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- heat
- layer
- adhesive tape
- conducting
- material layer
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Abstract
The utility model discloses a heat-conducting double-faced adhesive tape comprising an adhesive layer, wherein a plurality of graphite particles are evenly distributed inside the adhesive layer; a first release material layer is pasted to cover one surface of the adhesive layer, while a second release material layer is pasted to cover the other surface of the adhesive layer; the diameter ranges of the graphite particles are from 3 to 6 microns; the first release material layer is a release film layer or a release paper layer; and the second release material layer is also a release film layer or a release paper layer. The heat-conducting double-faced adhesive tape provided by the utility model adopts a heat-conducting interface material with excellent heat conductivity, and is convenient to use; and the heat-conducting double-faced adhesive tape is pasted to the surface of a heat source and a heat dissipation assembly respectively as long as the release paper on the surfaces is stripped; and in this way, the surface of the heat source (an electronic device) can be firmly jointed with the heat-conducting adhesive tape.
Description
Technical field
The utility model relates to a kind of double sticky tape, relates in particular to a kind of heat-conducting double-sided adhesive tape.
Background technology
The fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function causes integrated level more and more higher from strength to strength like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating that adopted in the past because volume is large, can produce the problems such as noise, is eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.Scientific discovery, the distinctive heat radiator performance of graphite material can satisfy the heat radiation of existing electronic devices and components well.
And in the market graphite paper heat radiation be many, but also there are some shortcomings in this, the processing more complicated will be passed through special processing, and thickness relatively thick (graphite material thickness is thicker, and radiating effect is poorer).
Summary of the invention
The utility model provides a kind of heat-conducting double-sided adhesive tape, this heat-conducting double-sided adhesive tape has the heat-conducting interface material of thermal conductive resin, easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
For achieving the above object, the technical solution adopted in the utility model is: a kind of heat-conducting double-sided adhesive tape, comprise an adhesive-layer, this adhesive-layer inside is evenly distributed with several graphite granules, described adhesive-layer one surface label is covered with the first separated type material layer, and another surface label of this adhesive-layer is covered with the second separated type material layer.
In technique scheme, further improved technical scheme is as follows:
1. in such scheme, the diameter range of described graphite granule is 3-6 microns.
2. in such scheme, described the first separated type material layer is release film layer or off-style paper layer.
3. in such scheme, described the second separated type material layer is release film layer or off-style paper layer.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model heat-conducting double-sided adhesive tape, heat-conducting interface material with thermal conductive resin, its adhesive-layer inside is evenly distributed with several graphite granules, easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Description of drawings
Accompanying drawing 1 is the utility model heat-conducting double-sided adhesive tape structure schematic diagram.
In above accompanying drawing: 1, adhesive-layer; 2, the first separated type material layer; 3, the second separated type material layer; 4, graphite granule.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of heat-conducting double-sided adhesive tape, comprise an adhesive-layer 1, and this adhesive-layer 1 inside is evenly distributed with several graphite granules 4, and described adhesive-layer 1 one surface labels are covered with the first separated type material layer 2, and this adhesive-layer 1 another surface label is covered with the second separated type material layer 3.
The diameter range of above-mentioned graphite granule 4 is 3.2 microns.
Above-mentioned the first separated type material layer 2 is release film layers, and above-mentioned the second separated type material layer 3 is off-style paper layers.
Embodiment 2: a kind of heat-conducting double-sided adhesive tape, comprise an adhesive-layer 1, and this adhesive-layer 1 inside is evenly distributed with several graphite granules 4, and described adhesive-layer 1 one surface labels are covered with the first separated type material layer 2, and this adhesive-layer 1 another surface label is covered with the second separated type material layer 3.
The diameter range of above-mentioned graphite granule 4 is 5.5 microns.
Above-mentioned the first separated type material layer 2 is release film layers, and above-mentioned the second separated type material layer 3 is release film layers.
Adopt above-mentioned heat-conducting double-sided adhesive tape, heat-conducting interface material with thermal conductive resin, its adhesive-layer 2 inside are evenly distributed with several graphite granules 4, easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences of doing according to the utility model spirit change or modify, within all should being encompassed in protection domain of the present utility model.
Claims (3)
1. heat-conducting double-sided adhesive tape is characterized in that: comprise a heat radiation adhesive-layer (1), this heat radiation adhesive-layer (1) one surface label is covered with the first separated type material layer (2), and this another surface label of heat radiation adhesive-layer (1) is covered with the second separated type material layer (3).
2. heat-conducting double-sided adhesive tape according to claim 1, it is characterized in that: described the first separated type material layer (2) is release film layer or off-style paper layer.
3. heat-conducting double-sided adhesive tape according to claim 1, it is characterized in that: described the second separated type material layer (3) is release film layer or off-style paper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220527385 CN203021492U (en) | 2012-10-15 | 2012-10-15 | Heat-conducting double-faced adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220527385 CN203021492U (en) | 2012-10-15 | 2012-10-15 | Heat-conducting double-faced adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203021492U true CN203021492U (en) | 2013-06-26 |
Family
ID=48645487
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220527385 Expired - Lifetime CN203021492U (en) | 2012-10-15 | 2012-10-15 | Heat-conducting double-faced adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203021492U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104877586A (en) * | 2014-01-26 | 2015-09-02 | 苏州斯迪克新材料科技股份有限公司 | Film with high mechanical tensile property |
-
2012
- 2012-10-15 CN CN 201220527385 patent/CN203021492U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104877586A (en) * | 2014-01-26 | 2015-09-02 | 苏州斯迪克新材料科技股份有限公司 | Film with high mechanical tensile property |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130626 |
|
| CX01 | Expiry of patent term |