CN202989042U - Heat conductive adhesive tape for electronic products - Google Patents
Heat conductive adhesive tape for electronic products Download PDFInfo
- Publication number
- CN202989042U CN202989042U CN 201220525204 CN201220525204U CN202989042U CN 202989042 U CN202989042 U CN 202989042U CN 201220525204 CN201220525204 CN 201220525204 CN 201220525204 U CN201220525204 U CN 201220525204U CN 202989042 U CN202989042 U CN 202989042U
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- layer
- adhesive tape
- electronic products
- foil layer
- heat conductive
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Abstract
The utility model discloses heat conductive adhesive tape for electronic products. The heat conductive adhesive tape for the electronic products comprises a copper foil layer, wherein a first aluminum foil layer and a second aluminum foil layer are respectively plated on the upper surface and the lower surface of the copper foil layer, a mucilage glue layer is coated on the surface of the second aluminum foil layer, a plurality of graphite particles are evenly distributed inside the mucilage glue layer, a release material layer is coated on the other surface of the mucilage glue layer, the diameter of each graphite particle is from 2 micrometers to 4 micrometers, and the release material layer is a release film layer or a release paper layer. The heat conductive adhesive tape for the electronic products has the advantages of ensuring that thermal conductivity is improved both in the length direction and in the thickness direction, achieving evenness of the thermal conductivity of the adhesive tape, benefiting spread of heat, avoiding local overheating of the adhesive tape and improving performance and the service life of the products.
Description
Technical field
The utility model relates to a kind of heat conduction adhesive tape, relates in particular to a kind of use for electronic products heat conduction adhesive tape.
Background technology
The fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function causes integrated level more and more higher from strength to strength like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating that adopted in the past because volume is large, can produce the problems such as noise, is eliminated by market gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.Scientific discovery, the distinctive heat radiator performance of graphite material can satisfy the heat radiation of existing electronic devices and components well.
Summary of the invention
The utility model provides a kind of use for electronic products heat conduction adhesive tape, it has guaranteed that length and thickness direction have all improved thermal conductivity this use for electronic products heat conduction adhesive tape, and realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product.
For achieving the above object, the technical solution adopted in the utility model is: a kind of use for electronic products heat conduction adhesive tape, comprise a copper foil layer, the equal plating in the upper and lower surface of this copper foil layer has first, second aluminium foil layer, this the second aluminium foil layer surface-coated has the heat radiation adhesive-layer, and described another surface label of heat radiation adhesive-layer is covered with the separated type material layer.
In technique scheme, further improved technical scheme is as follows:
[0006]1. in such scheme, the thickness of described first, second aluminium foil layer is 0.0010.003mm.
2. in such scheme, described separated type material layer is release film layer or off-style paper layer.
Because technique scheme is used, the utility model compared with prior art has following advantages:
The utility model use for electronic products heat conduction adhesive tape, it has guaranteed that length and thickness direction have all improved thermal conductivity, and has realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, its adhesive-layer inside is evenly distributed with several graphite granules, and is easy to use, after only needing the separate-type paper on surface is peeled off, covers respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Description of drawings
Accompanying drawing 1 is the utility model use for electronic products heat-conducting glue band structure schematic diagram.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further described:
Embodiment 1: a kind of use for electronic products heat conduction adhesive tape, comprise a copper foil layer 1, the equal plating in the upper and lower surface of this copper foil layer 1 has first, second aluminium foil layer 51,52, these the second aluminium foil layer 52 surface-coated have heat radiation adhesive-layer 2, described heat radiation adhesive-layer 2 is for being embedded with the adhesive-layer of several graphite granules 4, and described heat radiation adhesive-layer 2 another surface labels are covered with separated type material layer 3.
The diameter range of above-mentioned graphite granule 4 is 3.2 microns.
Above-mentioned first, second aluminium foil layer 51,52 thickness are 0.0015mm.
Above-mentioned separated type material layer 3 is release film layers.
Embodiment 2: a kind of use for electronic products heat conduction adhesive tape, comprise a copper foil layer 1, the equal plating in the upper and lower surface of this copper foil layer 1 has first, second aluminium foil layer 51,52, these the second aluminium foil layer 52 surface-coated have heat radiation adhesive-layer 2, described heat radiation adhesive-layer 2 is for being embedded with the adhesive-layer of several graphite granules 4, and described heat radiation adhesive-layer 2 another surface labels are covered with separated type material layer 3.
The diameter range of above-mentioned graphite granule 4 is 2.5 microns.
Above-mentioned first, second aluminium foil layer 51,52 thickness are 0.0022mm.
Above-mentioned separated type material layer 3 is off-style paper layers.
When adopting above-mentioned use for electronic products heat conduction adhesive tape, it has guaranteed that length and thickness direction have all improved thermal conductivity, and has realized the homogeneity of adhesive tape heat conductivility, and the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, its heat radiation adhesive-layer 2 inside are evenly distributed with several graphite granules 4, and are easy to use, after only needing the separate-type paper on surface is peeled off, cover respectively thermal source surface and radiating subassembly, can be combined closely with the heat-conducting glue adhesive tape in thermal source (electron device) surface.
Above-described embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow person skilled in the art scholar can understand content of the present utility model and implement according to this, can not limit protection domain of the present utility model with this.All equivalences of doing according to the utility model spirit change or modify, within all should being encompassed in protection domain of the present utility model.
Claims (3)
1. use for electronic products heat conduction adhesive tape, it is characterized in that: comprise a copper foil layer (1), the equal plating in the upper and lower surface of this copper foil layer (1) has first, second aluminium foil layer (51,52), this the second aluminium foil layer (52) surface-coated has heat radiation adhesive-layer (2), and another surface label of described heat radiation adhesive-layer (2) is covered with separated type material layer (3).
2. use for electronic products heat conduction adhesive tape according to claim 1, it is characterized in that: the thickness of described first, second aluminium foil layer (51,52) is 0.0010.003mm.
3. use for electronic products heat conduction adhesive tape according to claim 1, it is characterized in that: described separated type material layer (3) is release film layer or off-style paper layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525204 CN202989042U (en) | 2012-10-15 | 2012-10-15 | Heat conductive adhesive tape for electronic products |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220525204 CN202989042U (en) | 2012-10-15 | 2012-10-15 | Heat conductive adhesive tape for electronic products |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202989042U true CN202989042U (en) | 2013-06-12 |
Family
ID=48560239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220525204 Expired - Lifetime CN202989042U (en) | 2012-10-15 | 2012-10-15 | Heat conductive adhesive tape for electronic products |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202989042U (en) |
-
2012
- 2012-10-15 CN CN 201220525204 patent/CN202989042U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: 223900 Sihong Province Economic Development Zone, Suqian, West Ocean West Road, No. 6 Patentee after: JIANGSU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. Address before: 215400 Taicang, Suzhou, Taicang Economic Development Zone, Qingdao West Road, No. 11, No. Patentee before: SUZHOU SIDIKE NEW MATERIALS SIENCE & TECHNOLOGY Co.,Ltd. |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130612 |
|
| CX01 | Expiry of patent term |