CN103045117B - Heat dissipation adhesive tape applied to electronic device and preparation process of same - Google Patents
Heat dissipation adhesive tape applied to electronic device and preparation process of same Download PDFInfo
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- CN103045117B CN103045117B CN201210551732.0A CN201210551732A CN103045117B CN 103045117 B CN103045117 B CN 103045117B CN 201210551732 A CN201210551732 A CN 201210551732A CN 103045117 B CN103045117 B CN 103045117B
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Abstract
The invention discloses a heat dissipation adhesive tape applied to an electronic device, which is characterized by comprising a PET (polyethylene terephthalate) thin film with the thickness of 0.004 mm to 0.025 mm, wherein the lower surface of the PET thin film is coated with a heat conduction adhesive layer; the heat conduction adhesive layer is prepared from the following components in part by weight by baking after mixing: 100 parts of acrylic ester adhesive, 50 to 150 parts of graphite powder, 200 to 300 parts of solvent, 0.1 to 1 part of curing agent and 0.01 to 0.1 part of coupling agent; and the acrylic ester adhesive consists of the following components in part by weight: 100 parts of butyl acrylate, 0.1 to 1 part of benzoyl peroxide, 50 to 150 parts of iso-octyl acrylate, 2 to 5 parts of acrylic acid, 10 to 30 parts of methyl methacrylate, 0 to 10 parts of vinyl acetate and 0.1 to 1 part of 2-hydroxyethyl methacrylate. According to the invention, the effect that thermal conductivity is improved in both length and thickness directions is ensured; uniformity of thermal conductivity of the adhesive tape is realized; not only is the heat dissipation adhesive tape beneficial for dissipating heat, but also local overheating of the adhesive tape is avoided; and performance and service life of the product are improved.
Description
Technical field
The present invention relates to a kind of heat radiation adhesive tape and preparation technology thereof who is applied to electron device, belong to adhesive material technical field.
Background technology
Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function from strength to strength, causes integrated level more and more higher like this.Cause like this volume dwindling, function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating adopting in the past, because volume is large, can produce the problems such as noise, by market, eliminated gradually.And then produced other heat sink material, as Copper Foil, the heat radiation of aluminium foil class, but due to resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all finding new efficient heat sink material.Secondly, due to the diversity of electronic product, existing product often needs customization, thus the difficult popularization that is suitable for concrete use occasion and has limited its application; Therefore, if design a kind of for electronic product feature there is high-performance heat radiation adhesive tape, become the direction that those of ordinary skills make great efforts.
Summary of the invention
The object of the invention is to provide a kind of heat radiation adhesive tape and preparation technology thereof who is applied to electron device, this heat radiation adhesive tape and preparation technology thereof have guaranteed that length and thickness direction have all improved thermal conductivity, and realized the homogeneity of adhesive tape heat conductivility, both adhesive tape local superheating is also avoided in the diffusion that had been conducive to heat, has improved performance and the life-span of product; Secondly, product versatility and convenience, can be applicable to the electronic product of different shape.
For achieving the above object, the first technical scheme that the present invention adopts is: a kind of heat radiation adhesive tape that is applied to electron device, comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and after described heat-conducting glue adhesion coating is mixed by following parts by weight of component, baking obtains:
Acrylic ester adhesive 100,
Graphite Powder 99 50 ~ 150,
Solidifying agent 0.1 ~ 1,
Coupling agent 0.01 ~ 0.1;
Described acrylic ester adhesive is comprised of following parts by weight of component:
Benzoyl peroxide 0.1 ~ 1,
Vinyl acetate between to for plastic 0 ~ 10,
2-hydroxyethyl methacrylate 0.1 ~ 1;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:100 ~ 300:10 ~ 100;
Described Graphite Powder 99 diameter is 3 ~ 6 microns.
In technique scheme, further improved plan is as follows:
1,, in such scheme, the Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:200:100; Described Graphite Powder 99 diameter is 4 ~ 4.5 microns.
2,, in such scheme, described solvent is mixed and is obtained by the component of following weight percent:
Toluene 5 ~ 20%,
Ethyl acetate 30 ~ 70%,
Butanone 20 ~ 50%.
For achieving the above object, the second technical scheme that the present invention adopts is: a kind of preparation technology of above-mentioned heat radiation adhesive tape, comprises the following steps:
The first step: Graphite Powder 99, solvent are mixed according to the weight part ratio of 50 ~ 150:200 ~ 300, and stir and form mixed solution 84 ~ 86 ℃ of conditions;
Second step: butyl acrylate, benzoyl peroxide, Isooctyl acrylate monomer, vinylformic acid, methyl methacrylate, vinyl acetate between to for plastic, 2-hydroxyethyl methacrylate are mixed with the mixed solution of the first step, and disperse 1 ~ 2 hour through high speed agitator, thereby mix formation mixing solutions;
The 3rd step: insulation after the mixing solutions of second step being heated to 80 85 ℃ in reactor, in insulating process, to divide and add for 1 ~ 3 time benzoyl peroxide to obtain the gluing mixed solvent of heat conduction, described soaking time is 4 ~ 10 hours;
The 4th step: the gluing mixed solvent of heat conduction that the 3rd step is obtained is coated the lower surface that upper surface has the PET film of aluminium foil layer;
The 5th step: the gluing mixed solvent of heat conduction in the 4th step is toasted and forms heat-conducting glue adhesion coating;
The 6th step: by the separated type material of fitting through another surface of heat-conducting glue adhesion coating of overbaking in the 5th step;
The 7th step: rolling.
In technique scheme, further improved plan is as follows:
1,, in such scheme, the whipping temp of the described the first step is 85 ℃.
2,, in such scheme, described solvent is mixed by toluene 5 ~ 20%, ethyl acetate 30 ~ 70%, butanone 20 ~ 50%.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
1, the present invention is applied to heat radiation adhesive tape and the preparation technology thereof of electron device, guaranteed that length and thickness direction have all improved thermal conductivity, and realized the homogeneity of adhesive tape heat conductivility, adhesive tape local superheating is also avoided in the diffusion that had both been conducive to heat, has improved performance and the life-span of product;
2, the present invention adopts the component of three kinds of certain content as solvent, has effectively avoided graphite granule agglomeration in the gluing system of subsequent technique acrylate, thereby is conducive to length and thickness direction heat conduction synchronously improves;
3, the present invention is specific according to its formula, adopting diameter is that the graphite of 36 microns and Thickness Ratio are the heat conduction pad pasting of 10:10 30:1 10 the PET film, heat-conducting glue adhesion coating and the aluminium foil layer that superpose successively, taking into account existing pad pasting performance simultaneously, more be conducive to spread heat and the transmission of electron device, thereby further avoided concentrating of adhesive tape amount of localized heat, the work-ing life of having improved product.
Accompanying drawing explanation
Accompanying drawing 1 is applied to the thermal paste band structure schematic diagram of electron device for the present invention;
The influence curve figure of the content that accompanying drawing 2 is toluene in mixed solvent of the present invention to thermal conductivity;
The influence curve figure of the content that accompanying drawing 3 is ethyl ester in mixed solvent of the present invention to thermal conductivity;
The graphic representation of the content that accompanying drawing 4 is butanone in mixed solvent of the present invention to thermal conductivity;
Accompanying drawing 5 is the influence curve figure of PET thickness of the present invention to heat conductivility;
Accompanying drawing 6 is the influence curve figure of churning time of the present invention to thermal conductivity;
Accompanying drawing 7 is for rotating speed of the present invention is on the impact of thermal conductivity (stirring 8H) graphic representation.
In above accompanying drawing: 1, PET film; 2, aluminium foil layer; 3, heat-conducting glue adhesion coating; 4, interleaving paper.
Embodiment
Below in conjunction with embodiment, the invention will be further described:
Embodiment: a kind of heat radiation adhesive tape that is applied to electron device, comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and after described heat-conducting glue adhesion coating is mixed by following parts by weight of component, baking obtains:
Acrylic ester adhesive 100,
Graphite Powder 99 50 ~ 150,
Solidifying agent 0.1 ~ 1,
Coupling agent 0.01 ~ 0.1;
Described acrylic ester adhesive is comprised of following parts by weight of component:
Benzoyl peroxide 0.1 ~ 1,
Vinyl acetate between to for plastic 0 ~ 10,
2-hydroxyethyl methacrylate 0.1 ~ 1;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:100 ~ 300:10 ~ 100;
Described Graphite Powder 99 diameter is 3 ~ 6 microns.
The Thickness Ratio of above-mentioned PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:200:100; Described Graphite Powder 99 diameter is 4 ~ 4.5 microns.
Above-mentioned solvent is mixed and is obtained by the component of following weight percent:
Ethyl acetate 30 ~ 70%,
Table 1
Table 2
The preparation technology of the heat radiation adhesive tape of above-described embodiment, comprises the following steps:
The first step: Graphite Powder 99, solvent are mixed according to the weight part ratio of 50 ~ 150:200 ~ 300, and stir and form mixed solution 84 ~ 86 ℃ of conditions;
Second step: butyl acrylate, benzoyl peroxide, Isooctyl acrylate monomer, vinylformic acid, methyl methacrylate, vinyl acetate between to for plastic, 2-hydroxyethyl methacrylate are mixed with the mixed solution of the first step, and disperse 1 ~ 2 hour through high speed agitator, thereby mix formation mixing solutions;
The 3rd step: insulation after the mixing solutions of second step being heated to 80 85 ℃ in reactor, in insulating process, to divide and add for 1 ~ 3 time benzoyl peroxide to obtain the gluing mixed solvent of heat conduction, described soaking time is 4 ~ 10 hours;
The 4th step: the gluing mixed solvent of heat conduction that the 3rd step is obtained is coated the lower surface that upper surface has the PET film of aluminium foil layer;
The 5th step: the gluing mixed solvent of heat conduction in the 4th step is toasted and forms heat-conducting glue adhesion coating;
The 6th step: by the separated type material of fitting through another surface of heat-conducting glue adhesion coating of overbaking in the 5th step;
The 7th step: rolling.
The whipping temp of the above-mentioned the first step is 85 ℃.
Above-mentioned solvent is mixed by toluene 5 ~ 20%, ethyl acetate 30 ~ 70%, butanone 20 ~ 50%.
Above-described embodiment is only explanation technical conceive of the present invention and feature, and its object is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that spirit is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (4)
1. a heat radiation adhesive tape that is applied to electron device, it is characterized in that: comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and after described heat-conducting glue adhesion coating is mixed by following parts by weight of component, baking obtains:
Acrylic ester adhesive 100,
Graphite Powder 99 50 ~ 150,
Solvent 200 ~ 300;
Solidifying agent 0.1 ~ 1,
Coupling agent 0.01 ~ 0.1;
Described acrylic ester adhesive is comprised of following parts by weight of component:
Butyl acrylate 100,
Benzoyl peroxide 0.1 ~ 1,
Isooctyl acrylate monomer 50 ~ 150,
Vinylformic acid 2 ~ 5,
Methyl methacrylate 10 ~ 30,
Vinyl acetate between to for plastic 0 ~ 10,
2-hydroxyethyl methacrylate 0.1 ~ 1;
The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:100 ~ 300:10 ~ 100;
Described Graphite Powder 99 diameter is 3 ~ 6 microns.
2. heat radiation adhesive tape according to claim 1, is characterized in that: the Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:200:100; Described Graphite Powder 99 diameter is 4 ~ 4.5 microns.
3. dispel the heat described in claim 1 preparation technology of adhesive tape, is characterized in that: comprise the following steps:
The first step: Graphite Powder 99, solvent are mixed according to the weight part ratio of 50 ~ 150:200 ~ 300, and stir and form mixed solution 84 ~ 86 ℃ of conditions;
Second step: butyl acrylate, benzoyl peroxide, Isooctyl acrylate monomer, vinylformic acid, methyl methacrylate, vinyl acetate between to for plastic, 2-hydroxyethyl methacrylate are mixed with the mixed solution of the first step, and disperse 1 ~ 2 hour through high speed agitator, thereby mix formation mixing solutions;
The 3rd step: insulation after the mixing solutions of second step being heated to 80 85 ℃ in reactor, in insulating process, to divide and add for 1 ~ 3 time benzoyl peroxide to obtain the gluing mixed solvent of heat conduction, described soaking time is 4 ~ 10 hours;
The 4th step: the gluing mixed solvent of heat conduction that the 3rd step is obtained is coated the lower surface that upper surface has the PET film of aluminium foil layer;
The 5th step: the gluing mixed solvent of heat conduction in the 4th step is toasted and forms heat-conducting glue adhesion coating;
The 6th step: by the separated type material of fitting through another surface of heat-conducting glue adhesion coating of overbaking in the 5th step;
The 7th step: rolling.
4. preparation technology according to claim 3, is characterized in that: the whipping temp of the described the first step is 85 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210551732.0A CN103045117B (en) | 2012-12-18 | 2012-12-18 | Heat dissipation adhesive tape applied to electronic device and preparation process of same |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210551732.0A CN103045117B (en) | 2012-12-18 | 2012-12-18 | Heat dissipation adhesive tape applied to electronic device and preparation process of same |
Related Child Applications (6)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310648263.9A Division CN103694920A (en) | 2012-12-18 | 2012-12-18 | Manufacturing method of graphite heat-conducting adhesive tape |
| CN201310647193.5A Division CN103694918A (en) | 2012-12-18 | 2012-12-18 | Graphite heat-conducting adhesive tape |
| CN201310648178.2A Division CN103694919A (en) | 2012-12-18 | 2012-12-18 | Graphite heat-dissipation adhesive tape for electronic products |
| CN201310468148.3A Division CN103865414A (en) | 2012-12-18 | 2012-12-18 | Preparation process of heat dissipation type pressure sensitive tape |
| CN201310467497.3A Division CN103571365B (en) | 2012-12-18 | 2012-12-18 | Heat sinking acrylic ester adhesive tape |
| CN201310468129.0A Division CN103865413A (en) | 2012-12-18 | 2012-12-18 | Acrylate rubber belt for electronic device |
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| Publication Number | Publication Date |
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| CN103045117A CN103045117A (en) | 2013-04-17 |
| CN103045117B true CN103045117B (en) | 2014-02-12 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6420906B2 (en) * | 2015-06-15 | 2018-11-07 | 株式会社寺岡製作所 | Adhesive composition and adhesive tape |
| CN105647417A (en) * | 2016-03-21 | 2016-06-08 | 苏州锦腾电子科技有限公司 | Heat dissipation adhesive tape for electronic product |
| CN107629740A (en) * | 2016-07-05 | 2018-01-26 | 广州北峻工业材料有限公司 | Adhesive, two-sided tape and preparation method thereof |
| CN108034379A (en) * | 2017-12-08 | 2018-05-15 | 江苏伊诺尔新材料科技有限公司 | Ultra-thin High temperature-resistanadhesive adhesive tape and its manufacture method |
| CN108219718A (en) * | 2018-02-26 | 2018-06-29 | 合肥思博特软件开发有限公司 | A kind of heat-conducting glue for electronic product radiating |
| CN108676514A (en) * | 2018-05-07 | 2018-10-19 | 合肥羿振电力设备有限公司 | It is a kind of to prevent the dry electronic device heat radiating material to fall off |
| CN117186793A (en) * | 2023-09-13 | 2023-12-08 | 凯仁精密材料(江苏)有限公司 | Heat dissipation type acrylic ester adhesive tape |
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| US6616999B1 (en) * | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
| CN202008886U (en) * | 2011-05-06 | 2011-10-12 | 苍南县三维电子塑胶有限公司 | Novel insulating plate |
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| CN102746799A (en) * | 2012-07-27 | 2012-10-24 | 天津博苑高新材料有限公司 | Heat-conducting insulated pressure sensitive tape and preparation method thereof |
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|---|---|---|---|---|
| KR20080029041A (en) * | 2006-09-28 | 2008-04-03 | 엘지.필립스 엘시디 주식회사 | Back light unit for liquid crystal display device module |
| KR100936535B1 (en) * | 2007-09-14 | 2010-01-15 | 주식회사 오산 | An electroconductive elastic composite sheet and a method and for preparation of the same |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6616999B1 (en) * | 2000-05-17 | 2003-09-09 | Raymond G. Freuler | Preapplicable phase change thermal interface pad |
| CN202008886U (en) * | 2011-05-06 | 2011-10-12 | 苍南县三维电子塑胶有限公司 | Novel insulating plate |
| CN102260466A (en) * | 2011-06-14 | 2011-11-30 | 中山金利宝胶粘制品有限公司 | Insulation heat-conducting double-sided adhesive tape and preparation method thereof |
| CN102746799A (en) * | 2012-07-27 | 2012-10-24 | 天津博苑高新材料有限公司 | Heat-conducting insulated pressure sensitive tape and preparation method thereof |
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