CN101389180A - Double surface soft board having heat conductive design - Google Patents
Double surface soft board having heat conductive design Download PDFInfo
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- CN101389180A CN101389180A CNA2007101460549A CN200710146054A CN101389180A CN 101389180 A CN101389180 A CN 101389180A CN A2007101460549 A CNA2007101460549 A CN A2007101460549A CN 200710146054 A CN200710146054 A CN 200710146054A CN 101389180 A CN101389180 A CN 101389180A
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- heat
- heat conduction
- soft board
- double surface
- surface soft
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Abstract
The invention provides a double surface soft board having heat conductive design, mainly comprising a substrate, a wire layer and a heat radiating layer dispose of two surfaces of the substrate respectively, and a heat conducting hole for conducting the wire layer and the heat radiating layer. The wire layer comprises at least a connection pad capable of electrically connected to an electronic component. The electronic component can be driving IC of liquid crystal screen. Thus, heat generated by mounted electronic components can be conducted to the heat radiating layer through the wire layer and the heat conducting hole, so as to avoid burning down the electronic component.
Description
Technical field
The present invention relates to a kind of double surface soft board, relate in particular to a kind of double surface soft board of tool heat conduction design.
Background technology
In general, in liquid crystal panel, roughly constitute a plurality of pixels alternately by many brake cables and many data lines.Wherein, the lock signal (GV) of input brake cable is provided by gate drive, and the driving voltage of input data line (PV) is provided by data driver.
Yet, many thermals source are arranged in liquid crystal panel, for example backlight or above-mentioned drive IC or the like, if suitably do not make radiating treatment, be easy to make that the liquid crystal panel running is undesired, even the overheated drive IC of burning, cause relative row's pixel to be driven, and then cause certain some normally display frames of row's pixel of liquid crystal panel, promptly be commonly called as the bright line defective.
For many CPU, chipsets that can produce high heat, existing many people propose to utilize all kinds of fin, fan, strengthen the radiating effect of this electron-like assembly, avoid irregular working or burn.But, the volume of above-mentioned driver own is very little, adds that again this quasi-driver normally is installed on the soft board, and fin can't be installed or fan solves this class problem, and the volume of LCD screen is also little, has not had the space that radiating subassemblies such as radiator fan are set.
In order to address this problem, existing people proposes Republic of China's patent announcement number I229577 flexible circuit board.In this prior art, mainly be to be connected on the connection gasket of electronic building brick, additionally to form a plurality of through holes, rely on the surface area (additionally having increased the area of each through hole wall) that increases connection gasket, and increase the radiating effect of connection gasket itself.Yet, in fact, transmit because near the heat the through hole only sees through the air of low heat conduction, make its heat still be trapped near the connection gasket, can't be effectively with heat band that electronic building brick produced from.
Summary of the invention
Main purpose of the present invention is to provide a kind of double surface soft board of tool heat conduction design, mainly utilize the heat conduction through hole of conducting line layer and heat dissipating layer, and the heat that electronic building brick (for example drive IC of LCD screen) is produced, utilize the heat conduction through hole and the heat dissipating layer of metal, be directed to the heat dissipating layer on the another side of double sided board, with the thermal source band from.
Based on above-mentioned purpose, the invention provides a kind of double surface soft board of tool heat conduction design, comprise: a substrate;
One line layer is formed on this substrate, and comprises a connection gasket that can be electrically connected to an electronic building brick at least;
One heat dissipating layer is formed on the another side relative with line layer on the described substrate; And
One heat conduction through hole is arranged in this substrate, and is switched on to described line layer and described heat dissipating layer;
Described heat conduction through hole on the position with respect to the connection gasket in the described line layer.
Described heat dissipating layer is metal level independently.
The double surface soft board of described tool heat conduction design is put, and it is characterized in that, further comprises:
One heat conductive pad is arranged in the described line layer between the connection gasket, but and heat conduction be connected to a connection pin position that on described electronic building brick, is oppositely arranged;
Wherein, the thermal source that this heat conductive pad conducted is conducted to heat dissipating layer via heat conduction through hole relative on the position.
Described heat dissipating layer is a plurality of independently metal levels, and respectively with respect to this connection gasket and this heat conductive pad.
The connecting pin position that is provided with on the described electronic building brick can be the grounding leg position.
The invention has the advantages that, between conducting line layer in the present invention and the heat dissipating layer heat conduction through hole is set, can be with the heat that electronic building brick produced, utilize the high heat transfer effect of the heat conduction through hole and the heat dissipating layer of metal, be directed to the heat dissipating layer on the another side of double sided board, rapidly with the thermal source band from, thereby avoid overheated this electronic building brick that burns effectively.
Description of drawings
Fig. 1 is the schematic diagram of the double surface soft board of tool heat conduction design in the first embodiment of the invention.
Fig. 2 is the schematic diagram of the double surface soft board of tool heat conduction design in the second embodiment of the invention.
Wherein, description of reference numerals is as follows:
10 electronic building brick 10a pins
10b connecting pin position 12 line layers
14 substrates, 16 heat conduction through holes
18 heat dissipating layers, 19 heat-conducting glues
Embodiment
With reference to figure 1, Fig. 1 is the first enforcement schematic diagram of the double surface soft board of tool heat conduction design of the present invention.As shown in the figure, the double surface soft board of tool heat conduction of the present invention design mainly comprises substrate 14, divides the heat conduction through hole 16 that is located at substrate 14 line layer 12 on two-sided and heat dissipating layer 18 and conducting line layer 12 and heat dissipating layer 18.Heat dissipating layer 18 is metal level independently, electrically conducts to avoid improper, causes problems such as short circuit.
In simple terms, the double surface soft board of tool heat conduction design of the present invention, mainly utilize the high heat transfer effect of heat conduction through hole 16 with the heat dissipating layer 18 of metal, the heat that electronic building brick 10 (for example drive IC of LCD screen) is produced, be directed to the heat dissipating layer 18 on the another side of double sided board apace, rapidly with the thermal source band from, to avoid overheated this electronic building brick 10 that burns.What need pay special attention to is in order to increase the heat extraction effect of electronic building brick 10, can also be coated with heat-conducting glue 19 at the periphery of electronic building brick 10.
Above-mentioned electronic building brick 10 can utilize pin 10a to be mounted on the connection gasket 12a in the line layer 12, and can be electrically connected to other assembly or circuit by connection gasket 12a.Heat conduction through hole 16 on the position with respect to the connection gasket 12a in the line layer 12, so that can directly derive the heat that electronic building brick 10 is produced.
With reference to figure 2, Fig. 2 is the second enforcement schematic diagram of the double surface soft board of tool heat conduction design of the present invention.As shown in the figure, the double surface soft board of tool heat conduction of the present invention design also includes heat conductive pad 12a except comprising substrate 14, dividing the heat conduction through hole 16 that is located at substrate 14 line layer 12 on two-sided and heat dissipating layer 18 and conducting line layer 12 and heat dissipating layer 18.
Heat conductive pad 12a is set in the line layer 12 between the connection gasket 12a, but and heat conduction be connected to the connecting pin position 10b that on electronic building brick 10, is oppositely arranged.Thus, the thermal source that heat conductive pad 12a is conducted can be conducted to heat dissipating layer 18 via heat conduction through hole relative on the position 16.This wherein, the connecting pin position 10b that is provided with on the electronic building brick 10 can be the grounding leg position or non-ly is electrical equipment pin position.
What need pay special attention to is, heat dissipating layer 18 is a plurality of independently metal levels, and as previously discussed respectively with respect to connection gasket 12a and heat conductive pad 12b.
By the detailed description of above specific embodiment, hope can be known description feature of the present invention and spirit more, and is not to come scope of the present invention is limited by above-mentioned disclosed specific embodiment.On the contrary, its objective is that hope can contain in the claim of being arranged in of various changes and tool equality institute of the present invention desire application.
Claims (6)
1. the double surface soft board of a tool heat conduction design is characterized in that, comprises:
One substrate;
One line layer is formed on this substrate, and comprises a connection gasket that can be electrically connected to an electronic building brick at least;
One heat dissipating layer is formed on the another side relative with line layer on the described substrate; And
One heat conduction through hole is arranged in this substrate, and is switched on to described line layer and described heat dissipating layer.
2. the double surface soft board of tool heat conduction as claimed in claim 1 design is characterized in that, described heat conduction through hole on the position with respect to the connection gasket in the described line layer.
3. the double surface soft board of tool heat conduction as claimed in claim 1 design is characterized in that, described heat dissipating layer is metal level independently.
4. the double surface soft board of tool heat conduction design as claimed in claim 1 is characterized in that, further comprises:
One heat conductive pad is arranged in the described line layer between the connection gasket, but and heat conduction be connected to a connection pin position that on described electronic building brick, is oppositely arranged.
5. the double surface soft board of tool heat conduction design as claimed in claim 4 is characterized in that described heat dissipating layer is a plurality of independently metal levels, and respectively with respect to this connection gasket and this heat conductive pad.
6. the double surface soft board of tool heat conduction design as claimed in claim 4 is characterized in that the connecting pin position that is provided with on the described electronic building brick can be the grounding leg position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101460549A CN101389180A (en) | 2007-09-10 | 2007-09-10 | Double surface soft board having heat conductive design |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007101460549A CN101389180A (en) | 2007-09-10 | 2007-09-10 | Double surface soft board having heat conductive design |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101389180A true CN101389180A (en) | 2009-03-18 |
Family
ID=40478274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007101460549A Pending CN101389180A (en) | 2007-09-10 | 2007-09-10 | Double surface soft board having heat conductive design |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101389180A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841976A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity |
| CN101841974A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | High-thermal conductivity circuit board and method for producing same by using electroplating method |
| CN102548368A (en) * | 2012-02-13 | 2012-07-04 | 中兴通讯股份有限公司 | Radiation structure, electronic equipment and radiation method |
| CN106550540A (en) * | 2015-09-23 | 2017-03-29 | 景硕科技股份有限公司 | Wing coil and preparation method thereof |
-
2007
- 2007-09-10 CN CNA2007101460549A patent/CN101389180A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101841976A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | Method for manufacturing circuit board with high thermal conductivity by oil printing method and circuit board with high thermal conductivity |
| CN101841974A (en) * | 2010-05-12 | 2010-09-22 | 珠海市荣盈电子科技有限公司 | High-thermal conductivity circuit board and method for producing same by using electroplating method |
| CN102548368A (en) * | 2012-02-13 | 2012-07-04 | 中兴通讯股份有限公司 | Radiation structure, electronic equipment and radiation method |
| CN106550540A (en) * | 2015-09-23 | 2017-03-29 | 景硕科技股份有限公司 | Wing coil and preparation method thereof |
| CN106550540B (en) * | 2015-09-23 | 2018-11-30 | 景硕科技股份有限公司 | Wing coil and preparation method thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20090318 |