CN101220915A - Light source module and backlight unit - Google Patents
Light source module and backlight unit Download PDFInfo
- Publication number
- CN101220915A CN101220915A CNA2008100040323A CN200810004032A CN101220915A CN 101220915 A CN101220915 A CN 101220915A CN A2008100040323 A CNA2008100040323 A CN A2008100040323A CN 200810004032 A CN200810004032 A CN 200810004032A CN 101220915 A CN101220915 A CN 101220915A
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- source module
- heat dissipation
- light source
- light
- dissipation element
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Abstract
A light source module comprises a circuit board, a plurality of luminous elements and at least a radiating element. The circuit board is provided with a patterning metal layer, which comprises a plurality of connecting parts and a pattern line which is connected with the connecting part. The luminous elements are respectively allotted on one of the connecting parts. The radiating element is allotted on the circuit board and contacted with the patterning metal layer. The radiating element and the luminous elements are at the same side of the circuit board. The light source module has good radiating efficiency. In addition, the invention also provides a back light unit which uses the light source module.
Description
Technical field
The present invention relates to a kind of light source module, and relate in particular to a kind of back light unit (backlightunit, light source module BLU) and back light unit that uses this light source module of can be used for.
Background technology
In recent years, cooperate the flat-panel screens (flat paneldisplay) that photoelectricity and semiconductor fabrication developed,, become the main flow of display product gradually because of it has thin thickness, advantage such as in light weight.Common flat-panel screens has LCD (liquid crystal display, LCD), organic electro-luminescent display (organic electro-luminescence display, OLED) and plasma display (plasma display panel, PDP) etc., wherein the market penetration rate of LCD is higher.
LCD mainly is made up of display panels (LCD panel) and back light unit, and wherein back light unit is in order to provide display panels required area source.(cold cathode fluorescent lamp is CCFL) as light emitting source with cathode fluorescent tube for traditional back light unit.Recently, (light emitting diode LED) also is used as the light emitting source of back light unit to light emitting diode.
Owing to can produce heat energy during lumination of light emitting diode,, when causing the temperature of light emitting diode too high, will cause the luminous efficiency of light emitting diode to reduce and the emission wavelength skew, and then influence the display quality of LCD if the heat radiation of back light unit is bad.
Summary of the invention
The invention provides a kind of light source module, it has radiating efficiency preferably.
The present invention also proposes a kind of back light unit, in order to provide quality comparatively stable area source.
For reaching above-mentioned advantage, the present invention proposes a kind of light source module, and it comprises circuit board, light-emitting component and heat dissipation element.Circuit board has patterned metal layer, and patterned metal layer comprises connecting portion and pattern circuit, and the pattern circuit connects connecting portion.Light-emitting component is disposed on the connecting portion.Heat dissipation element then is disposed on the circuit board, and the contact patterns metal level, and in addition, heat dissipation element and light-emitting component are positioned at the same side of circuit board.
In one embodiment of this invention, above-mentioned patterned metal layer also comprises at least one cooling pad, and this cooling pad connects connecting portion.Heat dissipation element is disposed on the cooling pad.
In one embodiment of this invention, above-mentioned patterned metal layer comprises a plurality of cooling pads, described cooling pad connect respectively connecting portion one of them.
In one embodiment of this invention, above-mentioned light source module comprises a plurality of heat dissipation elements, and described heat dissipation element is disposed on one of them of cooling pad respectively.
In one embodiment of this invention, above-mentioned light source module comprises a plurality of heat dissipation elements, and described heat dissipation element is disposed at respectively between adjacent two light-emitting components.
In one embodiment of this invention, above-mentioned light source module also comprises at least one heat-conducting medium, and this heat-conducting medium is disposed between heat dissipation element and the cooling pad.
In one embodiment of this invention, above-mentioned heat dissipation element is the passive heat radiation element.
In one embodiment of this invention, above-mentioned heat dissipation element is a metal derby.
In one embodiment of this invention, above-mentioned light-emitting component is a light emitting diode.
In one embodiment of this invention, above-mentioned circuit board be flexible PCB (flexible printedcircuit board, FPCB).
In one embodiment of this invention, above-mentioned circuit board be printed circuit board (PCB) (printed circuitboard, PCB).
The present invention also proposes a kind of back light unit, it comprise light source module and the LGP that is disposed at this light source module next door (light guide plate, LGP).Light source module comprises circuit board, light-emitting component and heat dissipation element.Circuit board has patterned metal layer, and patterned metal layer comprises connecting portion and pattern circuit, and wherein the pattern circuit connects connecting portion.Light-emitting component is disposed on the connecting portion.Heat dissipation element then is disposed on the circuit board and the contact patterns metal level.Heat dissipation element and light-emitting component are positioned at the same side of circuit board, and heat dissipation element is disposed at respectively between adjacent two light-emitting components.In addition, the side of LGP has groove and is connected in incidence surface between the groove.Incidence surface is relative with light-emitting component, and heat dissipation element is resisted against groove.
In one embodiment of this invention, above-mentioned patterned metal layer also comprises a plurality of cooling pads, and described cooling pad connects one of them of connecting portion respectively.Heat dissipation element is disposed on the cooling pad.
In one embodiment of this invention, above-mentioned light source module also comprises a plurality of heat-conducting mediums, and described heat-conducting medium is disposed between heat dissipation element and the cooling pad.
In one embodiment of this invention, above-mentioned heat dissipation element is the passive heat radiation element.
In one embodiment of this invention, above-mentioned heat dissipation element is a metal derby.
In one embodiment of this invention, above-mentioned light-emitting component is a light emitting diode.
In one embodiment of this invention, above-mentioned circuit board is a printed circuit board (PCB).
In one embodiment of this invention, above-mentioned circuit board is a flexible PCB.
In light source module of the present invention, because of heat dissipation element and light-emitting component are positioned at the same side of circuit board, so the heat energy that light-emitting component produced can directly conduct to heat dissipation element via patterned metal layer, the heat energy that can distribute light-emitting component effectively like this and produced.Because light source module of the present invention has radiating efficiency preferably, so use the back light unit of this light source module can provide quality comparatively stable area source.
For above and other objects of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Fig. 1 is the vertical view of a kind of light source module of one embodiment of the invention;
Fig. 2 is the generalized section along the I-I ' line of Fig. 1;
Fig. 3 is the generalized section of the light source module of another embodiment of the present invention;
Fig. 4 is the schematic diagram of the back light unit of one embodiment of the invention.
Wherein, description of reference numerals is as follows:
100,100 ': light source module 110: circuit board
112: substrate 112a: loading end
114,114 ': patterned metal layer 114a: connecting portion
114b: pattern circuit 114c: cooling pad
120: light-emitting component 122: pin
130: heat dissipation element 140: heat-conducting medium
200: back light unit 210: LGP
212: the side 212a of LGP: groove
212b: incidence surface
The specific embodiment
Fig. 1 is the vertical view of a kind of light source module of one embodiment of the invention, and Fig. 2 is the generalized section along the I-I ' line of Fig. 1.Please refer to Fig. 1 and Fig. 2, the light source module 100 of present embodiment comprises circuit board 110, a plurality of light-emitting component 120 and heat dissipation element 130.Circuit board 110 has patterned metal layer 114, and furtherly, in the present embodiment, circuit board 110 comprises substrate 112, and has loading end 112a on the substrate 112, and patterned metal layer 114 then is disposed on the loading end 112a.Patterned metal layer 114 comprises a plurality of connecting portion 114a and pattern circuit 114b, and pattern circuit 114b is connected with connecting portion 114a.Light-emitting component 120 is disposed at respectively on one of them of connecting portion 114a.Heat dissipation element 130 is disposed on the circuit board 110 and contact patterns metal level 114.Heat dissipation element 130 and light-emitting component 120 are positioned at the same side of circuit board 110.
In above-mentioned light source module 100, the second portion that connecting portion 114a for example comprises the first that is positioned at light-emitting component 120 belows and is positioned at the first next door, wherein pattern circuit 114b is connected to second portion.In addition, patterned metal layer 114 can also comprise the cooling pad 114c that connects above-mentioned a plurality of connecting portion 114a.Specifically, cooling pad 114c is connected to the first of connecting portion 114a, and heat dissipation element 130 is disposed on the cooling pad 114c.In the present embodiment, can heat dissipation element 130 for example be fixed on the cooling pad 114c by the heat-conducting medium (not shown) between heat dissipation element 130 and cooling pad 114c by the mode of welding, wherein this heat-conducting medium can be scolding tin, thermal grease sheet or thermal paste, but not as limit.
From the above, heat dissipation element 130 can be not need activation that the passive heat radiation element of radiating effect just can be provided, as fin or metal derby etc.The optional usefulness of the material of heat dissipation element 130 has the material of high thermal conductivity coefficient, as copper, aluminium etc.In addition, light-emitting component 120 for example is a light emitting diode, but not as limit.Two pins (lead) 122 of light-emitting component 120 are electrically connected to the second portion of connecting portion 114a, and the luminous zone of light-emitting component 120 (being the hot zone) is positioned at the top of the first of connecting portion 114a.In addition, circuit board 110 can be flexible PCB or printed circuit board (PCB).
In the present embodiment, be positioned at the same side of circuit board 110 because of heat dissipation element 130 and light-emitting component 120, and cooling pad 114c and connecting portion 114a belong to same one deck (being patterned metal layer 114), so the heat that light-emitting component 120 is produced can reach cooling pad 114c via connecting portion 114a rapidly, and reach the heat dissipation element 130 that is positioned on the cooling pad 114c.Can distribute the heat energy that light-emitting component 120 is produced effectively like this, cause the phenomenon that luminous efficiency reduces and emission wavelength is offset because of temperature is too high to avoid light-emitting component 120.
It should be noted that in above-mentioned light source module 100, the quantity of cooling pad 114c can be a plurality of, and the quantity of heat dissipation element 130 also can be a plurality of.In the case, each cooling pad 114c connects one of them of connecting portion 114a respectively, and each heat dissipation element 130 is disposed on one of them of cooling pad 114c.
Fig. 3 is the schematic diagram of the light source module of another embodiment of the present invention.Please refer to Fig. 3, the structural similarity of the light source module of present embodiment 100 ' and the light source module 100 of Fig. 2 below only describes at difference.Light source module 100 ' has a plurality of heat dissipation elements 130, and the quantity of the cooling pad 114c of the patterned metal layer 114 ' of the circuit board 110 of light source module 100 ' is a plurality of.Heat dissipation element 130 is disposed at respectively between two adjacent light-emitting components 120.In other words, the cooling pad 114c of patterned metal layer 114 ' lays respectively between two adjacent connecting portion 114a.In addition, light source module 100 ' also comprises a plurality of heat-conducting mediums 140, and described heat-conducting medium 140 is disposed between heat dissipation element 130 and the cooling pad 114c.In other words, heat dissipation element 130 is fixed on the cooling pad 114c by heat-conducting medium 140.Heat-conducting medium can be scolding tin, thermal grease sheet or thermal paste, but not as limit.
Because the advantage of the light source module 100 ' of present embodiment is similar to the advantage of above-mentioned light source module 100, so will no longer repeat at this.In addition, above-mentioned light source module 100,100 ' can be applicable in the back light unit, will be that example and conjunction with figs. illustrate back light unit of the present invention with light source module 100 ' below.
Fig. 4 is the schematic diagram of the back light unit of one embodiment of the invention.Please refer to Fig. 4, the back light unit 200 of present embodiment comprises LGP 210 and above-mentioned light source module 100 ', and wherein light source module 100 ' is disposed at the next door of LGP 210.One side 212 of LGP 210 has a plurality of groove 212a and is connected in a plurality of incidence surface 212b between the groove 212a.These incidence surfaces 212b is relative with one of them of the light-emitting component 120 of light source module 100 ' respectively, and the heat dissipation element 130 of light source module 100 ' is respectively against one of them of groove 212a.
Because the LGP 210 of present embodiment has a plurality of groove 212a, described groove 212a is in order to ccontaining heat dissipation element 130, so can use larger-size heat dissipation element 130, can further improve the radiating efficiency of light source module 100 ' like this, cause the phenomenon that luminous efficiency reduces and emission wavelength is offset because of temperature is too high to avoid light-emitting component 120.In addition, because of the groove 212a of LGP 210 is formed at the next door of incidence surface 212b, so the light that can not influence light-emitting component 120 and provided goes into to inject LGP 210.Therefore, the back light unit 200 of present embodiment can provide quality comparatively stable area source, thereby, this back light unit 200 is applied to can improve in the LCD display quality of LCD.
In sum, the present invention has following advantage at least:
1. in the present invention, because light-emitting component and heat dissipation element are positioned at the same side of circuit board, and cooling pad and connecting portion belong to same patterned metal layer, so the heat that light-emitting component produced can be rapidly reached heat dissipation element via connecting portion and cooling pad.Therefore, the heat energy that light source module of the present invention can distribute light-emitting component effectively and produced, and then avoid light-emitting component Yin Wendu too high and cause luminous efficiency to reduce and the phenomenon of emission wavelength skew.
2. the light source module of back light unit of the present invention has radiating efficiency preferably, so can provide quality comparatively stable area source.
3. in one embodiment, because LGP has a plurality of grooves, thus can select the heat dissipation element of large-size for use, with the radiating efficiency of further raising light source module.Like this, back light unit can provide quality more stable area source.
Though the present invention with preferred embodiment openly as above; right its is not in order to limit the present invention; those skilled in the art are under the situation that does not break away from design of the present invention and scope; can make some and change and revise, so protection scope of the present invention should be as the criterion according to the scope that the accompanying Claim book is defined.
Claims (10)
1. light source module comprises:
One circuit board have a patterned metal layer, and this patterned metal layer comprises a plurality of connecting portions and a pattern circuit, and wherein this pattern circuit connects described connecting portion;
A plurality of light-emitting components are disposed at respectively on each described connecting portion; And
At least one heat dissipation element is disposed on this circuit board and contacts this patterned metal layer, and this heat dissipation element and described light-emitting component are positioned at the same side of this circuit board.
2. light source module as claimed in claim 1, wherein this patterned metal layer also comprises at least one cooling pad, described cooling pad connects described connecting portion, and this heat dissipation element is disposed on the described cooling pad.
3. light source module as claimed in claim 2, wherein this patterned metal layer also comprises a plurality of described cooling pads, described cooling pad connects one of them of described connecting portion respectively.
4. light source module as claimed in claim 3, wherein this light source module comprises a plurality of described heat dissipation elements, described heat dissipation element is disposed at respectively on each described cooling pad.
5. light source module as claimed in claim 2, wherein this light source module also comprises at least one heat-conducting medium, described heat-conducting medium is disposed between described heat dissipation element and the described cooling pad.
6. light source module as claimed in claim 1, wherein this light source module comprises a plurality of described heat dissipation elements, described heat dissipation element is disposed at respectively between two adjacent light-emitting components.
7. light source module as claimed in claim 1, wherein said light-emitting component are light emitting diode.
8. light source module as claimed in claim 1, wherein said heat dissipation element are metal derby.
9. back light unit comprises:
One light source module comprises:
One circuit board has a patterned metal layer, and this patterned metal layer comprises a plurality of connecting portions and a pattern circuit, and wherein this pattern circuit connects described connecting portion;
A plurality of light-emitting components are disposed on one of them of described connecting portion respectively; And
A plurality of heat dissipation elements are disposed on this circuit board and contact this patterned metal layer, and described heat dissipation element and described light-emitting component are positioned at the same side of this circuit board, and described heat dissipation element is disposed at respectively between two adjacent light-emitting components; And
One LGP, be disposed at a side of this light source module, and a side of this LGP has a plurality of grooves and is connected in a plurality of incidence surfaces between the described groove, and described incidence surface is relative with each described light-emitting component respectively, and described heat dissipation element lays respectively in each described groove.
10. back light unit as claimed in claim 9, wherein this patterned metal layer also comprises a plurality of cooling pads, described cooling pad connects one of them of described connecting portion respectively, and described heat dissipation element is disposed on the described cooling pad, in addition, also comprise a plurality of heat-conducting mediums between described heat dissipation element and the described cooling pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100040323A CN101220915B (en) | 2008-01-16 | 2008-01-16 | Light source module and backlight unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008100040323A CN101220915B (en) | 2008-01-16 | 2008-01-16 | Light source module and backlight unit |
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| Publication Number | Publication Date |
|---|---|
| CN101220915A true CN101220915A (en) | 2008-07-16 |
| CN101220915B CN101220915B (en) | 2010-06-30 |
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| CN2008100040323A Active CN101220915B (en) | 2008-01-16 | 2008-01-16 | Light source module and backlight unit |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102182955A (en) * | 2010-01-07 | 2011-09-14 | Lg伊诺特有限公司 | Optical assembly, backlight unit having the same, and display apparatus thereof |
| US8322904B2 (en) | 2010-01-07 | 2012-12-04 | Lg Innotek Co., Ltd. | Backlight unit, and display apparatus thereof |
| US8506154B2 (en) | 2010-01-07 | 2013-08-13 | Lg Innotek Co., Ltd. | Optical assembly and display apparatus thereof |
| CN103292221A (en) * | 2013-06-07 | 2013-09-11 | 南通亚浦照明电器制造有限公司 | LED projection lamp |
| CN103390602A (en) * | 2012-05-11 | 2013-11-13 | 矽品精密工业股份有限公司 | Semiconductor package and package substrate thereof |
| CN103994344A (en) * | 2013-02-14 | 2014-08-20 | 松下电器产业株式会社 | Illumination device and light source |
| CN104062806A (en) * | 2014-06-27 | 2014-09-24 | 深圳市华星光电技术有限公司 | Backlight component and liquid crystal display thereof |
| CN104235661A (en) * | 2013-06-19 | 2014-12-24 | 瑞轩科技股份有限公司 | Light bar and direct backlight module |
| CN104251414A (en) * | 2013-06-25 | 2014-12-31 | 致伸科技股份有限公司 | Backlight module |
| US9395577B2 (en) | 2014-06-27 | 2016-07-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Backlight assembly and liquid crystal display using the same |
| CN106481992A (en) * | 2015-09-01 | 2017-03-08 | 株式会社藤仓 | Optical module |
| CN115249444A (en) * | 2021-04-27 | 2022-10-28 | Lg电子株式会社 | Display device |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2634572Y (en) * | 2003-08-15 | 2004-08-18 | 品能科技股份有限公司 | Circuit board structure with modulized luminous diode |
| CN2840595Y (en) * | 2005-08-08 | 2006-11-22 | 胜华科技股份有限公司 | Circuit board with radiating effect |
-
2008
- 2008-01-16 CN CN2008100040323A patent/CN101220915B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8322904B2 (en) | 2010-01-07 | 2012-12-04 | Lg Innotek Co., Ltd. | Backlight unit, and display apparatus thereof |
| US8353601B2 (en) | 2010-01-07 | 2013-01-15 | Lg Innotek Co., Ltd. | Optical assembly, backlight unit having the same, and display apparatus thereof |
| US8506154B2 (en) | 2010-01-07 | 2013-08-13 | Lg Innotek Co., Ltd. | Optical assembly and display apparatus thereof |
| CN102182955B (en) * | 2010-01-07 | 2014-07-23 | Lg伊诺特有限公司 | Optical assembly, backlight unit having the same, and display apparatus thereof |
| CN102182955A (en) * | 2010-01-07 | 2011-09-14 | Lg伊诺特有限公司 | Optical assembly, backlight unit having the same, and display apparatus thereof |
| CN103390602B (en) * | 2012-05-11 | 2016-09-07 | 矽品精密工业股份有限公司 | Semiconductor package and package substrate thereof |
| CN103390602A (en) * | 2012-05-11 | 2013-11-13 | 矽品精密工业股份有限公司 | Semiconductor package and package substrate thereof |
| CN103994344A (en) * | 2013-02-14 | 2014-08-20 | 松下电器产业株式会社 | Illumination device and light source |
| CN103292221A (en) * | 2013-06-07 | 2013-09-11 | 南通亚浦照明电器制造有限公司 | LED projection lamp |
| CN104235661B (en) * | 2013-06-19 | 2018-05-29 | 瑞轩科技股份有限公司 | Lamp bar and direct type backlight module |
| CN104235661A (en) * | 2013-06-19 | 2014-12-24 | 瑞轩科技股份有限公司 | Light bar and direct backlight module |
| CN104251414A (en) * | 2013-06-25 | 2014-12-31 | 致伸科技股份有限公司 | Backlight module |
| US9395577B2 (en) | 2014-06-27 | 2016-07-19 | Shenzhen China Star Optoelectronics Technology Co., Ltd | Backlight assembly and liquid crystal display using the same |
| WO2015196508A1 (en) * | 2014-06-27 | 2015-12-30 | 深圳市华星光电技术有限公司 | Backlight assembly and liquid crystal display thereof |
| CN104062806B (en) * | 2014-06-27 | 2017-05-10 | 深圳市华星光电技术有限公司 | Backlight component and liquid crystal display thereof |
| CN104062806A (en) * | 2014-06-27 | 2014-09-24 | 深圳市华星光电技术有限公司 | Backlight component and liquid crystal display thereof |
| CN106481992A (en) * | 2015-09-01 | 2017-03-08 | 株式会社藤仓 | Optical module |
| CN106481992B (en) * | 2015-09-01 | 2019-07-23 | 株式会社藤仓 | Optical module |
| CN115249444A (en) * | 2021-04-27 | 2022-10-28 | Lg电子株式会社 | Display device |
| CN115249444B (en) * | 2021-04-27 | 2024-05-24 | Lg电子株式会社 | Display device |
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|---|---|
| CN101220915B (en) | 2010-06-30 |
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