KR101028341B1 - Heat radiating printed circuit board unified bracket and chassis structure having the same and processes for producing them - Google Patents

Abstract

PURPOSE: A heat radiating printed circuit board integrated with a bracket, structure with the heat radiating printed circuit board, and method for manufacturing the same are provided to integrate a heat radiating PCB with a bracket for fixing the heat radiating PCB to prevent a heat transferring rate from being lowered due to TIM, thereby maximally radiating heat. CONSTITUTION: An insulating layer and a metal layer are successively formed on a metal board. A circuit pattern part is formed on a non bending area except for a bending area. A gap is formed in a bending part to form at least one bending area on the metal board. A heat radiating PCB successively bonds an insulating layer(320) with a metal layer on the metal board.

Description

HEAT RADIATING PRINTED CIRCUIT BOARD UNIFIED BRACKET AND CHASSIS STRUCTURE HAVING THE SAME AND PROCESSES FOR PRODUCING THEM}

The present invention relates to a bracket integrated heat dissipation PCB, a structure having the same and a method of manufacturing the same.

As the electronics industry develops, various display devices are being developed, and imaging devices, computers, and mobile communication terminals using the same are being developed. The liquid crystal display (LCD), which has appeared to reflect this trend, is currently in the spotlight as a display device such as a monitor and a mobile communication terminal.

Liquid crystal display (LCD) is an application of the electro-optical properties of liquid crystals having intermediate characteristics between liquid and solid to display devices. It is an electric device that changes and transmits various electrical information into visual information. It is a flat panel display that is widely used because of its low power consumption and low power consumption.

LCDs do not emit self-luminous light, so all LCDs always require backlight. The backlight acts as a light source of the LCD. The backlight unit includes a light source unit including a light source itself to irradiate light from the back of the liquid crystal module, and a power supply circuit for driving the light source and an integral part that forms uniform plane light. : BLU). Recently, a backlight unit using a light emitting diode (LED) has been proposed as a light source for illuminating the LCD. An LED is a light emitting device that generates light by using a light emission phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller than conventional light sources, have a long lifetime, and have high energy efficiency and low operating voltages because electrical energy are directly converted into light energy. Such a backlight unit is used by mounting a plurality of light source elements such as LEDs on a PCB. Since the PCB must endure heat emitted from the light source element, metal materials are mainly used. However, if the heat generated from the light source device is not properly discharged, the light source device may be destroyed or the life may be shortened.

FIG. 1 illustrates a cross-sectional view of a heat dissipation PCB 10 and a bracket 40 manufactured according to the related art in a chassis 50 which is a light guiding passage of a backlight unit.

Referring to Figure 1, the heat dissipation PCB 10 and the bracket 40 for fixing it to the chassis 50 is manufactured separately and bonded using a TIM (Thermal Interface Material: TIM) 20, this is a light guide passage The TIM 30 is attached to the chassis 50 to be used.

However, when the heat dissipation PCB 10 and the bracket 40 are separated and manufactured and bonded using the TIM 20, the heat transfer rate is lowered by the TIM 20, and thus the heat dissipation effect is lowered.

In addition, if the bent portion is not formed without forming a gap such as V-Cut, there is a problem in that the crack is generated due to stress caused by the difference in ductility between the ductile metal substrate and the ductile insulation layer.

The present invention has been made to solve the above problems, an object of the present invention is to integrate the heat dissipation PCB and the bracket to maximize the heat dissipation characteristics, to simplify the process and structure, and to reduce the material cost by not manufacturing the bracket separately It is to provide a bracket integrated heat dissipation PCB and a structure having the same and a manufacturing method thereof.

In addition, a bracket-integrated heat dissipation PCB that prevents cracking caused by stress caused by the difference in ductility between the metal substrate and the insulating layer formed during bending by performing V-cut before bending, can eliminate the phenomenon of the circuit pattern part being lifted. Another object of the present invention to provide a structure and a method for producing the same and the same.

The present invention is a configuration for solving the above problems, the first step of sequentially forming an insulating layer and a metal layer on a metal substrate; A second step of forming a circuit pattern portion in the non-bending region except for a portion where the bending region is to be formed on the metal substrate; By providing a method for manufacturing a bracket-integrated heat dissipation PCB comprising a third step of forming a gap in the bent portion so that at least one bent region portion is provided on the metal substrate to maximize the heat dissipation characteristics, simplify the process and simplify the structure. At the same time, the amount of TIM is reduced without using a separate bracket, so that it can be saved in terms of material cost.

In particular, the second step of the present invention, after forming the circuit pattern portion further comprises the step of applying a solder resist (Solder Resist) on the metal substrate, wherein in the third step the gap is a bending portion Forming a V-Cut so that the metal substrate is exposed by removing the solder resist layer or the insulating layer, cracking occurs due to stress due to the ductility difference between the metal substrate and the insulating layer through the V-Cut during bending The circuit pattern portion can be prevented from lifting.

In addition, after the third step of the present invention, it is characterized in that it further comprises a fourth step of forming a bent region portion by bending the bent portion formed with the V-Cut.

In addition, a first step of sequentially forming an insulating layer and a metal layer on the metal substrate; A second step of forming a circuit pattern portion on a non-bending region except for a portion where the bending region is to be formed on the metal substrate, and applying a solder resist; Forming a V-cut in the bent portion such that at least one bent region is formed on the metal substrate; A fourth step of bending the bent portion to form a bent region portion; By providing a method of manufacturing a structure having a bracket-integrated heat dissipation PCB, any one of the bent regions includes a fifth step of mounting the TIM to the chassis. Prevent the pattern part from lifting.

In particular, the fifth step of the present invention, the step of mounting so as to have a space portion spaced apart from the side surface and the circuit pattern surface of the chassis structure, by providing a space between the heat dissipation PCB and the chassis structure heat dissipation effect To increase it.

In addition, the bracket-integrated heat dissipation PCB of the present invention is a heat dissipation PCB mounted inside the chassis structure providing a light guide passage of the backlight unit, wherein the PCB has a circuit pattern portion and at least one bent region portion, any of the bent region portion One is provided with a mounting portion to be mounted to the chassis structure via the TIM, characterized in that the gap formed in the bent portion on the boundary between the bent region portion and the circuit pattern portion.

In this case, the heat dissipation PCB may be formed by sequentially forming an insulating layer, a metal layer, a circuit pattern on a metal substrate and applying a solder resist, wherein the gap is a metal substrate by removing the solder resist layer or the insulating layer of the bent portion. It may be characterized by forming the V-Cut to be exposed.

The configuration of the bracket integrated heat dissipation PCB may be various modifications, one example of the metal substrate may be characterized in that the Al substrate.

In addition, the structure of the present invention provides a light guide passage of the backlight unit, characterized in that the bracket integrated heat dissipation PCB is mounted so as to have a space portion spaced apart between the circuit pattern portion and the side of the chassis structure. Maximized and cracks are generated by stress due to ductility difference.

Further, any one of the end portion of the bent region of the heat dissipation PCB, characterized in that formed in close contact with the side of the chassis structure, so that the heat dissipation PCB can be fixed to the chassis in place of the bracket.

According to the present invention, by integrating the heat radiation PCB and the bracket for fixing it, it is possible to prevent the heat transfer rate decrease by the use of the TIM and reduce the occurrence of the interface (interface) to prevent the heat conduction degradation caused by the air layer to maximize the heat radiation characteristics of the heat radiation PCB can do.

In addition, by integrating the brackets during fabrication of heat dissipation PCB, there is no need to go through a separate bracket manufacturing process, thereby simplifying the process and structure.

In addition, there is no need to use a TIM between the heat dissipation PCB and the bracket, so the amount of TIM is reduced, and the bracket is not used, thereby reducing the material cost.

Furthermore, by forming a gap such as V-Cut at the boundary between the bent region and the region where the circuit pattern is formed before bending, the pattern portion is prevented from lifting due to the stress of the insulating layer having a smaller ductility than the metal substrate, thereby preventing the occurrence of circuit pattern defects. It will have the effect of minimizing.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

The present invention comprises a first step of sequentially forming an insulating layer and a metal layer on a metal substrate; A second step of forming a circuit pattern portion in the non-bending region except for a portion where the bending region is to be formed on the metal substrate; Bracket integrated heat dissipation PCB having a bracket integrated heat dissipation PCB manufactured by the third step of forming a gap in the bent portion so that at least one bent region portion is provided on the metal substrate, the structure mounted therein and a method of manufacturing the same. Maximizing the heat dissipation characteristics through the PCB, simplifying the process and structure, and furthermore, by forming V-Cut at the boundary before bending, it prevents the pattern part from being lifted due to the stress of the insulating layer, which is less ductile than the metal substrate. It is key.

FIG. 2 is a cross-sectional view when the sheet is bent without forming a gap in the bent portion, which is a boundary between the bent region portion and the circuit pattern portion.

Referring to FIG. 2, the metal substrate 60 is larger in ductility than the insulating layer 70. Therefore, when bending without forming a gap such as V-Cut or the like, in the insulating layer 70 having a small ductility due to deformation of the large ductility metal substrate 60, cracks are generated due to stress and the circuit pattern portion is lifted ( 100) takes place. When the phenomenon in which the circuit pattern part 100 is lifted up occurs, the circuit formed in the circuit pattern part is damaged, thereby producing a defective product.

Therefore, in the following, by forming a gap such as V-Cut to prevent the lifting phenomenon of the circuit pattern portion, as well as the heat dissipation PCB of the present invention in which the bracket is integrated through bending of the metal substrate.

3 is a view showing a manufacturing process of the bracket integrated heat dissipation PCB of an embodiment of the present invention.

Referring to FIG. 3, metal layers such as an insulating layer and a Cu layer are sequentially formed on a metal substrate, leaving a bent region to be used as a bracket, and a circuit pattern is formed in the non-bent region.

Solder resist is applied to the non-bending region where the circuit pattern is formed so that solder is not applied when soldering, V-Cut is performed on the bending portion that is the boundary between the bending region and the non-bending region, and then the bending portion where the V-Cut is performed is bent. To form a bent region. This is a preferred embodiment of the present invention can be applied to the solder resist not only in the non-bent region, but also in the bent region.

Figure 4 illustrates a cross-sectional view of one preferred embodiment of the present invention.

Referring to FIG. 4, the present invention includes a bracket integrated heat dissipation PCB 110, a TIM 150, and a chassis 170.

The bracket integrated heat dissipation PCB 110 is manufactured by the manufacturing method shown in FIG. 2 and includes a circuit pattern region 140 and two bent regions. The circuit pattern region 140 includes an insulating layer on a metal substrate. And a circuit pattern and a solder resist are formed in order, and the chip holding part provided with the light emitting element 160 is provided. The bent region is formed by bending an area where a circuit pattern is not formed by performing V-cut, and the upper end 120 of the bent region is fixed to the side of the chassis 170, and the lower end 130 of the bent region. Silver is a mounting portion mounted to the chassis 170 structure, the space portion (P) spaced apart from the side of the chassis 170 is mounted to the bottom of the chassis 170 by the TIM 150 to dissipate without using a separate bracket By matching the PCB and the bracket, the heat dissipation effect can be maximized, the process and structure can be simplified, and the delamination caused by the adhesion problem during bending can be eliminated.

In this case, the circuit pattern region 140 and the two bent regions have a '-' shaped structure. That is, the two bent regions in which the circuit pattern is not formed in the heat dissipation PCB 110 are formed at right angles at angles θ1 and θ2 with the rear surface of the circuit pattern region 140 of the heat dissipation PCB 110. This is only a preferred embodiment of the present invention, and two bent regions are not necessarily perpendicular to the circuit pattern region 140.

The light emitting device 160 is mounted on the chip holding portion provided in the circuit pattern region 140 of the heat dissipation PCB 110 to become a light source of the backlight unit, and the chip mounting portion is provided with an LED as the light emitting element 160. It is preferred, but not necessarily limited thereto.

In addition, the metal substrate is preferably an Al substrate, but is not necessarily limited thereto.

5 is a cross-sectional view of another embodiment of the present invention.

Referring to FIG. 5, in the bracket-integrated heat dissipation PCB 110, there is one bending area where no circuit pattern is formed, and the bending area is perpendicular to the angle θ2 between the front surface of the circuit pattern area 140. The space portion P spaced apart from the side of the chassis 170 is mounted to the bottom of the chassis 170 by the TIM 150. The light emitting device 160 is mounted on the chip holding portion provided in the circuit pattern region 140 to become a light source of the backlight unit. The light emitting device 160 is preferably an LED, and the metal of the heat dissipation PCB 110 is provided. The substrate is preferably an Al substrate, but is not necessarily limited thereto.

FIG. 6 shows a plan view of the same bracket-integrated heat dissipation PCB 110 formed on a panel.

Referring to FIG. 6, the same heat dissipation PCB 110 is formed on the panel to increase productivity, and when the manufacturing process is completed, the process is divided into individual PCBs. In order to facilitate the division, the V-Cut 250 is disposed on the interface. Form.

Looking at the heat dissipation PCB individually, each heat dissipation PCB 110 is composed of two bent region portion, one circuit pattern portion 230 and the boundary portion (210, 220) forming the V-Cut. The circuit pattern unit 230 is a circuit pattern is formed by sequentially bonding an insulating layer and a metal layer, such as a Cu layer on a metal substrate, a solder resist is coated so that solder is not applied during soldering.

The heat dissipation PCB 110 is divided into two bent region portions and one circuit pattern portion 230 by performing V-Cut, which is only a preferred embodiment of the present invention. As well as forming two bent regions as shown in FIG. 5, one bent region may be formed as shown in FIG. 5, and three or more bent regions may be formed.

7 is a cross-sectional view of the bracket integrated heat dissipation PCB after forming the V-Cut, before bending.

Referring to FIG. 7, the heat dissipation PCB sequentially bonds an insulating layer 320 and a metal layer such as a Cu layer on the metal substrate 310, and then forms a circuit pattern 330 in the non-bending region. In this process, the metal layer of the bent region is removed and the circuit pattern region is protected to prevent the occurrence of solder bridges between the circuit and the circuit in the wave soldering process performed during component mounting. In order to apply a solder resist 340. After applying the solder resist 340, the bent region and the circuit pattern portion are distinguished by V-cutting the bent portion which is a boundary between the bent region portion and the circuit pattern portion, and the V-Cut is an insulating layer 320 present in the bent portion. It is preferable to remove the and to expose the metal substrate 310. This is to prevent lifting of the circuit pattern part 310 due to the stress of the insulating layer 320 having a small ductility due to the ductility difference between the metal substrate 310 and the insulating layer 320 during bending.

FIG. 8 is a cross-sectional view of the bracket-integrated heat dissipation PCB having the bent portion bent after the V-cut is formed in the bent portion that is the boundary between the bent region portion and the circuit pattern portion.

Referring to FIG. 8, in the heat dissipation PCB, two bent regions and one circuit pattern portion form a '-' shape, and the circuit pattern portion has an insulating layer 320 and a circuit pattern on the metal substrate 310. 330 and solder resist 340 are formed. Although the bent portion in which the V-Cut is formed in the heat radiation PCB of FIG. 7 is bent, it can be seen that the floating phenomenon of the circuit pattern portion does not occur due to the stress as the V-Cut is formed. The heat dissipation PCB is mounted to the chassis structure via a TIM, and includes a light emitting element in the chip holding portion to provide a light guide passage of the backlight unit as shown in FIG. 4.

9 illustrates a cross-sectional view of another embodiment of the present invention.

Referring to FIG. 9, when V-Cut is formed in a bent portion that is a boundary between a circuit pattern portion and a bent region portion, unlike FIG. 7, a solder resist present in a boundary portion of the solder resist 340 formed in the circuit pattern portion 340 may also be removed together with the insulating layer 320 to prevent cracks from occurring due to stress with the insulating layer 320 having low ductility.

FIG. 10 is a cross-sectional view of the bracket-integrated heat dissipation PCB that is bent from the bent portion that forms the V-cut of FIG. 9.

Referring to FIG. 10, the heat dissipation PCB has a structure in which two bent regions and one circuit pattern portion form a '-' shape, and the circuit pattern portion has an insulating layer 320 and a circuit pattern on the metal substrate 310. 330 and solder resist 340 are formed. In FIG. 9, when the circuit pattern portion is bent to the outside from the bent portion where the V-Cut is formed, lifting of the circuit pattern portion due to stress does not occur as the V-Cut is formed.

11 illustrates a cross-sectional view of another embodiment of the present invention.

Referring to FIG. 11, unlike FIG. 7 and FIG. 9, the solder resist 340 is applied not only to the circuit pattern portion but also to the bent region, and only the insulating layer 320 of the bent region is formed when V-Cut is formed. Rather, there is a difference in removing the solder resist 340.

FIG. 12 is a cross-sectional view of the bracket-integrated heat dissipation PCB bent from the bent portion forming the V-Cut of FIG. 11.

As can be seen in FIGS. 10 and 12, the solder resist 340 may be applied not only to the circuit pattern portion but also to the bent region, and not only the insulating layer 320 when V-Cut is formed in the bent portion. The solder resist 340 may also be removed.

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined by the claims and equivalents thereof.

1 is a cross-sectional view showing a heat dissipation PCB, a bracket and a chassis mounted therein according to the related art.

FIG. 2 is a cross-sectional view of the bracket-integrated heat dissipation PCB in the case where the gap is bent without forming a gap.

3 is a view illustrating a manufacturing process of the bracket integrated heat dissipation PCB.

4 is a cross-sectional view illustrating a chassis having a light emitting device integrated with a bracket according to an embodiment of the present invention and mounted therein.

5 is a cross-sectional view illustrating a chassis in which a light emitting device is integrated in a heat dissipation PCB integrated with a bracket according to another embodiment of the present invention and mounted therein.

FIG. 6 is a plan view illustrating a panel V-cutting the same bracket integrated heat dissipation PCB formed on the panel.

FIG. 7 is a cross-sectional view illustrating a bracket-integrated heat dissipation PCB in which a V-cut is formed to remove an insulating layer.

8 is a cross-sectional view of the bracket-integrated heat dissipation PCB having the bent portion formed after the V-cut is formed.

FIG. 9 is a cross-sectional view illustrating a bracket-integrated heat dissipation PCB in which a V-cut is formed on a bend to remove an insulating layer and solder resist.

11 is a cross-sectional view illustrating a bracket-integrated heat dissipation PCB in which a solder resist and an insulating layer are formed by forming a V-cut in the bent portion when a solder resist is also applied to the bent region portion.

10 and 12 are cross-sectional views illustrating bending of the bracket integrated heat dissipation PCB of FIGS. 9 and 11.

<Explanation of symbols for main parts of the drawings>

10: heat dissipation PCB 20, 30: TIM

40: bracket 50: chassis

60: metal substrate 70: insulating layer

90: solder resist 100: lifting phenomenon of the circuit pattern portion

110: bracket integrated heat dissipation PCB 120: upper end of the bending area

130: lower portion of the bending region 140: circuit pattern region portion

150: TIM 160: light emitting element

170: chassis

P: space portion spaced apart from the circuit pattern area portion and the side of the chassis

θ1, θ2: angle between bending area portion and circuit pattern area portion

210, 220: boundary portion of the bent region portion and the circuit pattern portion where the V-cut is formed

230: circuit pattern portion

250: boundary between each heat dissipation PCB forming V-Cut

310: metal substrate 320: insulating layer

330: circuit pattern 340: solder resist

Claims (12)

A first step of sequentially forming an insulating layer and a metal layer on the metal substrate; A second step of forming a circuit pattern portion in the non-bending region except for a portion where the bending region is to be formed on the metal substrate; Forming a gap in the bent portion such that at least one bent region is formed on the metal substrate; Bracket integrated heat dissipation PCB manufacturing method comprising a. The method according to claim 1, The second step, And forming a solder resist on the metal substrate after the circuit pattern portion is formed. The method according to claim 2, The third step, The gap is a method of manufacturing a bracket-integrated heat dissipation PCB, characterized in that for forming a V-cut so that the metal substrate is exposed by removing the solder resist layer or insulating layer of the bent portion. The method of claim 3, After the third step, And a fourth step of forming a bent region by bending the bent portion where the V-cut is formed as a starting point. A first step of sequentially forming an insulating layer and a metal layer on the metal substrate; A second step of forming a circuit pattern portion on a non-bending region except for a portion where the bending region is to be formed on the metal substrate, and applying a solder resist; Forming a V-cut in the bent portion such that at least one bent region is formed on the metal substrate; A fourth step of bending the bent portion to form a bent region portion; A fifth step in which any one of the bent area portions is mounted to the chassis structure via a TIM; Method of manufacturing a structure having a bracket integrated heat dissipation PCB comprising a. The method according to claim 5, The fifth step, And mounting the bracket so that the side surface of the chassis structure and the circuit pattern surface are spaced apart from each other. In the heat dissipation PCB mounted in the chassis structure that provides the light guide passage of the backlight unit, The PCB has a circuit pattern portion and at least one bent region portion, One of the bent area portion is provided with a mounting portion that is mounted to the chassis structure via a TIM, The bracket integrated heat dissipation PCB, characterized in that the gap is formed in the bent portion at the boundary between the bent region portion and the circuit pattern portion. The method of claim 7, The heat dissipation PCB, An insulating layer, a metal layer, and a circuit pattern are sequentially formed on the metal substrate; Bracket-integrated heat dissipation PCB, characterized by applying a solder resist. The method according to claim 8, The gap is a bracket integrated heat dissipation PCB, characterized in that to form a V-Cut to expose the metal substrate by removing the solder resist layer or insulating layer of the bent portion. The method according to claim 9, The metal substrate is a bracket integrated heat dissipation PCB, characterized in that the Al substrate. In the heat dissipation PCB mounted in the chassis structure that provides the light guide passage of the backlight unit, The heat dissipation PCB has a circuit pattern portion and at least one bent region portion, One of the bent area portion is provided with a mounting portion that is mounted to the chassis structure via a TIM, PCB characterized in that the V-Cut is formed in the bent portion at the boundary between the bent region portion and the circuit pattern portion; and And the circuit pattern part is mounted to have a space part spaced apart from the side surface of the chassis structure. The method of claim 11, Any one of the distal end portion of the bent region of the heat dissipation PCB, Structure having a bracket integrated heat dissipation PCB, characterized in that formed in close contact with the side of the chassis structure.

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