KR20110048301A - Heat radiating printed circuit board unified bracket for backlight unit and chassis structure having the same - Google Patents

Abstract

PURPOSE: A bracket-integrated heat radiating printed circuit board for a backlight unit and a chassis structure having the same are provided to simplify the fabrication process thereof and reduce the fabrication costs thereof. CONSTITUTION: A circuit pattern unit includes a chip mounting unit(180) and an electrode for supplying power to the chip mounting unit. A curved portion includes an electrode wire unit(140), and at least one curved portion is formed at the boundary of the circuit pattern unit and the curved portion. A connection unit connects the electrode unit to the chip mounting unit.

Description

HEAT RADIATING PRINTED CIRCUIT BOARD UNIFIED BRACKET FOR BACKLIGHT UNIT AND CHASSIS STRUCTURE HAVING THE SAME}

The present invention relates to a heat dissipation PCB for a backlight unit and a chassis structure having the same.

As the electronics industry develops, various display devices are being developed, and imaging devices, computers, and mobile communication terminals using the same are being developed. The liquid crystal display (LCD), which has appeared to reflect this trend, is currently in the spotlight as a display device such as a monitor and a mobile communication terminal.

Liquid crystal display (LCD) is an application of the electro-optical properties of liquid crystals having intermediate characteristics between liquid and solid to display devices. It is an electric device that changes and transmits various electrical information into visual information. It is a flat panel display that is widely used because of its low power consumption and low power consumption.

LCDs do not emit self-luminous light, so all LCDs always require backlight. The backlight acts as a light source of the LCD. The backlight unit includes a light source unit including a light source itself to irradiate light from the back of the liquid crystal module, and a power supply circuit for driving the light source and an integral part that forms uniform plane light. : BLU). Recently, a backlight unit using a light emitting diode (LED) has been proposed as a light source for illuminating the LCD. An LED is a light emitting device that generates light by using a light emission phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller than conventional light sources, have a long lifetime, and have high energy efficiency and low operating voltages because electrical energy are directly converted into light energy. Such a backlight unit is used by mounting a plurality of light source elements such as LEDs on a PCB. Since the PCB must endure heat emitted from the light source element, metal materials are mainly used. However, if the heat generated from the light source device is not properly discharged, the light source device may be destroyed or the life may be shortened.

FIG. 1 illustrates a cross-sectional view of a heat dissipation PCB 10 and a bracket 40 manufactured according to the related art in a chassis 50 which is a light guiding passage of a backlight unit.

Referring to FIG. 1, the heat dissipation PCB 10 and the bracket 40 for fixing it to the chassis 50 are separately manufactured and bonded by using the TIM 20, and to the chassis 50 used as the light guiding passage. The TIM 30 is used for mounting.

However, when the heat dissipation PCB 10 and the bracket 40 are separated and fabricated and bonded using the TIM 20, the heat transfer rate is lowered by the TIM 20, thereby lowering the heat dissipation effect.

Figure 2 shows a plan view of the conventional heat dissipation PCB.

Referring to FIG. 2, the heat dissipation PCB includes an electrode unit including a chip mounting unit 80 for mounting a light emitting device 90, and an anode 61 and a cathode 62 for supplying power to the chip mounting unit 80. (61, 62) and electrode wiring portions (71, 72) for connecting the chip mounting portion 80 and the electrode portions (61, 62).

In the conventional heat dissipation PCB, since the electrode wirings 71 and 72 are formed in the same area as the chip mounting part 80, the width X of the PCB is increased by the amount, contrary to the slimming of the BLU, and the current flows to the flow. There is a problem in that a defective circuit pattern is generated by the heat generated thereby shortening its lifespan.

The present invention has been made to solve the above problems, an object of the present invention is to maximize the heat dissipation characteristics by integrating the heat dissipation PCB and the bracket, to provide a simplified process and structure, and to reduce the material cost by not manufacturing the bracket separately It is to provide a bracket integrated heat dissipation PCB and a chassis structure having the same.

In addition, by forming the electrode wiring on a different plane from the chip mounting part and connecting the wires through holes or spaces, the width of the PCB is reduced, the heat generated in the area of the electrode wiring is separated, and the heat dissipation effect is increased. Another object of the present invention is to provide a bracket-integrated heat dissipation PCB and a chassis structure having the same to prevent the lifting of the circuit pattern portion generated by the stress due to the ductility difference between the metal substrate and the insulating layer by forming a gap.

The present invention provides a heat dissipation PCB mounted inside a chassis structure that provides a light guide path of a backlight unit, and includes a chip mounting part and an electrode part for supplying power to the chip mounting part. A circuit pattern portion to be formed; A bending region portion including an electrode wiring portion; At least one bent portion formed at a boundary between the circuit pattern portion and the bent region portion; By providing a bracket integrated heat dissipation PCB, characterized in that it comprises a connecting portion connecting the electrode portion or the chip mounting portion and the electrode wiring portion to maximize the heat dissipation characteristics, simplify the process and simplify the structure, and at the same time the electrode wiring portion Is formed in the bending area to reduce the width of the PCB to contribute to slimming the BLU.

Particularly, the connection part may form at least one hole in the circuit pattern part and the bent area to connect the electrode part or the chip mounting part and the electrode wiring part with a wire through the hole and the hole. The part forms a space part at one or both ends, and connects the electrode wiring part and the electrode part or the chip mounting part with a wire through a hole formed in the space part and the circuit pattern part. To be connected.

In the heat dissipation PCB, an insulating layer, a metal layer, and a circuit pattern are sequentially formed on the metal substrate, and the solder resist is applied to the circuit pattern portion and the bent region including the chip mounting portion and the electrode wiring portion. The bent portion is characterized in that a gap (Gap) is formed.

At this time, the gap is formed by removing the solder resist layer or the insulating layer of the bent portion to form a V-cut so that the metal substrate is exposed to the stress caused by the ductility difference between the metal substrate and the insulating layer during bending. This can prevent cracks from happening and the circuit pattern part is lifted up.

In addition, a circuit pattern portion including a chip mounting portion and an electrode portion for supplying power to the chip mounting portion; A bending region portion including an electrode wiring portion; At least one bent portion formed at a boundary between the circuit pattern portion and the bent region portion; A connection part connecting the electrode part or the chip mounting part and the electrode wiring part; Bracket integrated heat dissipation PCB comprising a and the circuit pattern portion is provided to provide a chassis structure having a bracket integrated heat dissipation PCB, characterized in that mounted to have a space portion spaced apart from the side of the chassis structure by reducing the width of the PCB and the heat dissipation effect To increase it.

The connection part may be connected through the space part. In particular, the at least one hole may be formed in the circuit pattern part and the bending area, and the electrode part or the chip mounting part and the electrode may be formed through the hole and the hole. The wiring portion may be connected by an electric wire, wherein the bent region portion forms a space portion at one or both ends thereof, and the electrode wiring portion and the electrode are formed through a space portion formed in the bent region portion and a hole formed in the circuit pattern portion. The connection portion or the chip mounting portion is characterized in that for connecting the wires through the empty space between the heat dissipation PCB and the backlight chassis.

And, any one of the distal end portion of the heat dissipation PCB, characterized in that formed in close contact with the side of the chassis structure, the heat dissipation PCB, the insulating layer, the metal layer, the circuit pattern is sequentially formed on the metal substrate The solder resist is applied to the circuit pattern portion and the bent region including the chip mounting portion and the electrode wiring portion.

In addition, the bent portion is characterized in that the gap is formed, the gap is characterized in that to form a V-cut to expose the metal substrate by removing the solder resist layer or insulating layer of the bent portion, the flexibility of the metal substrate and the insulating layer during bending Cracks are generated by the stress caused by the difference so that the circuit pattern part can be prevented from lifting.

According to the present invention, by integrating the heat dissipation PCB and the bracket for fixing it, it is possible to prevent the heat transfer rate decrease by the use of the TIM and reduce the interface generation to prevent the heat conduction deterioration due to the air layer to maximize the heat dissipation characteristics of the heat dissipation PCB. When the heat dissipation PCB is manufactured by integrally manufacturing the bracket, it is not necessary to go through a separate bracket manufacturing process, thereby simplifying the process and structure.

In addition, there is no need to use a TIM between the heat dissipation PCB and the bracket, so the amount of TIM is reduced, and the bracket is not used, thereby reducing the material cost.

In addition, by forming a gap, such as V-cut, between the bent region and the region where the circuit pattern is formed before bending, the circuit pattern portion is prevented from being lifted due to the stress of the insulating layer having a smaller ductility than the metal substrate.

Furthermore, by forming the electrode wiring portion in the bent region, the electrode wiring portion can be separated from the circuit pattern portion. Therefore, the width of the PCB can be reduced by that, making the BLU slim, and by separating the heat generated by the current flowing through the electrode line, the heat dissipation characteristics can be secured.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration and operation of the present invention. In the following description, well-known functions or constructions are not described in detail to avoid unnecessarily obscuring the subject matter of the present invention.

According to an aspect of the present invention, there is provided a heat dissipation PCB mounted inside a chassis structure that provides a light guiding passage of a backlight unit, comprising: a circuit pattern unit including a chip mounting unit and an electrode unit for supplying power to the chip mounting unit; A bending region portion including an electrode wiring portion; At least one bent portion formed at a boundary between the circuit pattern portion and the bent region portion; The bracket integral heat dissipation PCB and the chassis structure having the same, characterized in that it comprises a connecting portion for connecting the electrode portion or the chip mounting portion and the electrode wiring portion, maximize the heat dissipation characteristics through the bracket integral heat dissipation PCB and It simplifies the structure and forms the electrode wiring on a different plane from the circuit pattern, thereby reducing the PCB width and contributing to the slimming of the BLU.

3 shows a cross-sectional view of one preferred embodiment of the present invention.

Referring to FIG. 3, in the bracket integrated heat dissipation PCB, the insulating layer 120 and the metal layer are sequentially stacked on the metal substrate 110 to form a circuit pattern, and the chip mounting unit 180 and the electrode wiring unit 140 are The solder resist 130 is coated on the formed circuit pattern portion and the bent region, and one circuit pattern portion and two bent region portions are formed in a '-' shape. The circuit pattern part includes a chip mounting part 180 and an electrode part 180 for supplying power to the chip mounting part 180, and an upper end of the bent area part is the chip mounting part 180 is an electrode part. The electrode wiring unit 140 is connected to be supplied with power from the 180. Holes 160 and 170 are formed in the bent region including the circuit pattern part and the electrode wiring part 140, and the electrode part 180 or the chip mounting part of the circuit pattern part is formed through the holes 160 and 170. 180 and the electrode wiring 140 of the bent region are connected to the wire 150.

Therefore, unlike the conventional PCB formed in the circuit pattern portion, the electrode wiring portion 140 is formed in the bent region portion and connected to the circuit pattern through the holes 160 and 170, thereby reducing the width of the PCB and contributing to slimming of the BLU. As the PCB board also serves as a bracket, the amount of TIM used can be reduced to maximize the heat dissipation characteristics.

FIG. 4 is a plan view illustrating the heat dissipation PCB of FIG. 3 before bending.

Referring to FIG. 4, the bracket integrated heat dissipation PCB includes a circuit pattern part 210 including an electrode part 260 and a chip mounting part 270, two bent region parts 220 and 230, and the circuit pattern part 210. ) And two bent portions 290 at the boundary between the bent region portions 220 and 230. The bent portion 290 may be formed with a gap such as V-Cut to remove the floating phenomenon of the circuit pattern portion 210 due to the ductility difference when bending. Holes 240 and 250 are formed in the circuit pattern part 210 and the bent area part 230, and the electrode wiring part 280 formed in the bent area part 230 through the holes 240 and 250 is formed. The electrode unit 260 and the chip mounting unit 270 formed in the circuit pattern unit 210 are connected to each other. That is, as shown in Figure 3, by using the space behind the circuit pattern portion 210 is connected to the wire through the hole 240 and the hole 250.

5 is a cross-sectional view of another embodiment of the present invention.

Referring to FIG. 5, the bracket-integrated heat dissipation PCB has a circuit pattern portion and two bent region portions formed in a 'c' shape, and the circuit pattern portion includes an electrode portion 180 and a chip mounting portion 180. The upper end of the bent region part includes an electrode wiring part 140.

However, the difference from FIG. 3 is that the space portion is formed at the end of the bent region without forming a hole in the bent region, as will be described below with reference to FIG. 6. Therefore, the electrode wiring unit 140 is connected to the electrode unit 180 by connecting the wire 150 to pass through the hole 170 formed in the circuit pattern portion through the space portion.

FIG. 6 is a plan view illustrating the heat dissipation PCB of FIG. 5 before bending.

Referring to FIG. 6, the holes 300 are not formed in the bent regions 220 and 230, but the space 300 is formed at the ends of the bent regions 230. Therefore, the electrode 240 is connected to the electrode part 280 by connecting the wire 240 through the hole 240 formed in the circuit pattern part 210 and the space 300 at the end of the bent region part 230. This is only an embodiment of the present invention. Unlike FIG. 6, the space portions are formed at both ends of the bent region portion 230 to form the space portions at both ends of the hole 240 and the bent region portion 230 of the circuit pattern portion 210. The electrode wiring unit 280 and the electrode unit 260 or the chip mounting unit 270 may be connected by connecting the wires through the wires.

FIG. 7 is a cross-sectional view illustrating the bracket integrated heat dissipation PCB of FIG. 4.

Referring to FIG. 7, in the heat dissipation PCB, the insulating layer 120 and the metal layer are sequentially stacked on the metal substrate 110 to form a circuit pattern, and the chip mounting unit 180 and the electrode wiring unit 140 are formed. The solder resist 130 is applied to the circuit pattern portion and the bent region. The bent portion 190 at the boundary of the circuit pattern portion and the bent region portion forms a V-cut so that the metal substrate 110 or the solder resist layer 130 is removed and the metal substrate 110 is exposed. This is to prevent the floating of the circuit pattern portion due to the stress of the insulating layer 120 having a small ductility due to the ductility difference between the metal substrate 110 and the insulating layer 120. In addition, holes 160 and 170 are formed in the circuit pattern part and the bending area part. The electrode wiring part 140 is connected to the electrode part 180 or the chip by connecting electric wires through the hole 160 and the hole 170. It may be connected to the mounting unit 180.

8 and 9 are schematic cross-sectional views of one embodiment of a chassis structure in which a bracket integrated heat dissipation PCB is attached to a chassis.

Referring to FIG. 8, the bracket integrated heat dissipation PCB 310 includes a circuit pattern portion and two bent region portions having a 'c' shape, in which the heat dissipation PCB of FIG. 3 is mounted on the chassis 330. The upper end of the bent region portion is in close contact with the side of the chassis 330, the circuit pattern portion is mounted to the chassis 330 with a space portion spaced apart from the side of the chassis 330. The wires connecting through the holes and the holes of FIG. 3 use spaces spaced apart from the side surfaces of the heat dissipation PCB 310 and the chassis 330. In this case, the lower end of the bending area is connected to the chassis 330 by the TIM 320. ) Is mounted.

Referring to FIG. 9, the circuit pattern part and the two bent area parts are provided as in FIG. 8, but the lower end of the bent area part of the bracket integrated heat dissipation PCB 310 does not face the upper part. However, as shown in FIG. 8, the side of the chassis 330 and the circuit pattern part have a space part spaced apart from each other, and the wire is connected to the wire through the holes and holes formed in the circuit pattern part and the bent area part using the space part, or the end of the bent area part. The electrode wiring portion and the electrode portion may be connected by connecting the holes of the stage and the hole of the circuit pattern portion with wires. At this time, the lower end of the bent area portion is mounted to the chassis 330 via the TIM (320).

In the foregoing detailed description of the present invention, specific examples have been described. However, various modifications are possible within the scope of the present invention. The technical spirit of the present invention should not be limited to the above-described embodiments of the present invention, but should be determined not only by the claims, but also by those equivalent to the claims.

1 is a cross-sectional view showing a heat radiation PCB, a bracket and a chassis mounted therein according to the prior art.

2 is a plan view showing a heat radiation PCB according to the prior art.

3 is a cross-sectional view of a bracket-integrated heat dissipation PCB formed by forming a hole and connected by using an empty space between the heat dissipation PCB and the chassis according to an embodiment of the present invention.

FIG. 4 is a plan view illustrating the heat dissipation PCB of FIG. 3 before bending.

FIG. 5 is a cross-sectional view illustrating a bracket-integrated heat dissipation PCB that is formed by forming a space portion at the end of the bent region and connected by using an empty space between the heat dissipation PCB and the chassis.

FIG. 6 is a plan view illustrating the heat dissipation PCB of FIG. 5 before bending.

FIG. 7 is a sectional view of FIG. 4.

8 and 9 are cross-sectional views schematically illustrating a chassis structure having a bracket integrated heat dissipation PCB according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: metal substrate 120: insulating layer

130: solder resist 140: electrode wiring portion

150: electric wire 160, 170: hole

180: electrode portion, chip mounting portion 190: bent portion formed V-Cut

210: circuit pattern portion 220, 230: bending area portion

240, 250: hole 260: electrode portion

270: chip mounting unit 280: electrode wiring unit

290: bending portion 300: the space portion at the end of the bending area portion

310: integral bracket heat dissipation PCB 320: TIM

330 chassis

Claims (14)

In the heat dissipation PCB mounted inside the chassis structure that provides the light guide passage of the backlight unit, A circuit pattern part including a chip mounting part and an electrode part for supplying power to the chip mounting part; A bending region portion including an electrode wiring portion; At least one bent portion formed at a boundary between the circuit pattern portion and the bent region portion; A connection part connecting the electrode part or the chip mounting part and the electrode wiring part; Bracket integrated heat dissipation PCB comprising a. The method according to claim 1, The connecting portion, At least one hole is formed in the circuit pattern portion and the bending region portion. Bracket-integrated heat dissipation PCB, characterized in that for connecting the electrode portion or the chip mounting portion and the electrode wiring portion via a wire through the hole. The method according to claim 2, The bending area portion, Form a space at one or both ends The bracket integrated heat dissipation PCB, characterized in that for connecting the electrode wiring portion and the electrode portion or the chip mounting portion through a wire formed in the space portion and the circuit pattern portion. The method according to any one of claims 1 to 3, The heat dissipation PCB, The insulating layer, the metal layer, and the circuit pattern are sequentially formed on the metal substrate A bracket integrated heat dissipation PCB, comprising: applying a solder resist to a circuit pattern portion and a bent region including a chip mounting portion and an electrode wiring portion; The method according to claim 4, The bent portion, Bracket integrated heat dissipation PCB, characterized in that the gap (Gap) is formed. The method according to claim 5, The gap is, The bracket-integrated heat dissipation PCB, characterized in that to form a V-cut (V-Cut) to expose the metal substrate by removing the solder resist layer or the insulating layer of the bent portion. A circuit pattern part including a chip mounting part and an electrode part for supplying power to the chip mounting part; A bending region portion including an electrode wiring portion; At least one bent portion formed at a boundary between the circuit pattern portion and the bent region portion; A connection part connecting the electrode part or the chip mounting part and the electrode wiring part; Bracket integral heat dissipation PCB comprising a And the circuit pattern part is mounted to have a space part spaced apart from the side surface of the chassis structure. The method of claim 7, The connecting portion, Chassis structure having a bracket integrated heat dissipation PCB, characterized in that connected through the space. The method according to claim 8, The connecting portion, At least one hole is formed in the circuit pattern portion and the bending region portion. Chassis structure having a bracket-integrated heat-dissipating PCB, characterized in that for connecting the electrode portion or the chip mounting portion and the electrode wiring portion through a wire through the hole and the hole. The method according to claim 9, The bending area portion, Form a space at one or both ends The chassis structure having a bracket-integrated heat dissipation PCB, characterized in that for connecting the electrode wiring portion and the electrode portion or the chip mounting portion with a wire through a space formed in the bent region portion and a hole formed in the circuit pattern portion. The method according to any one of claims 7 to 10, Any one of the distal end of the heat dissipation PCB, The chassis structure having a bracket integrated heat dissipation PCB, characterized in that formed in close contact with the side of the chassis structure. The method of claim 11, The heat dissipation PCB, The insulating layer, the metal layer, and the circuit pattern are sequentially formed on the metal substrate A chassis structure having a bracket-integrated heat dissipation PCB, wherein a solder resist is applied to a circuit pattern portion including a chip mounting portion and an electrode wiring portion and a bending region. The method according to claim 12, The bent portion, Chassis structure having a bracket integrated heat dissipation PCB, characterized in that the gap is formed. 14. The method of claim 13, The gap is, A chassis structure with a bracket-integrated heat dissipation PCB, characterized in that to form a V-cut to expose the metal substrate by removing the solder resist layer or the insulating layer of the bent portion.

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