JP5506446B2 - Side edge type planar light emitting device - Google Patents

Side edge type planar light emitting device Download PDF

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JP5506446B2
JP5506446B2 JP2010035646A JP2010035646A JP5506446B2 JP 5506446 B2 JP5506446 B2 JP 5506446B2 JP 2010035646 A JP2010035646 A JP 2010035646A JP 2010035646 A JP2010035646 A JP 2010035646A JP 5506446 B2 JP5506446 B2 JP 5506446B2
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guide plate
emitting device
light guide
edge type
led array
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JP2011171211A (en
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尚也 曽根
安 谷田
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Stanley Electric Co Ltd
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本発明は複数のLEDパッケージを並べたもの及び複数のLEDチップを並べたもの(これらをLEDアレイと称する)よりなる線状発光装置を導光板と組合わせたサイドエッジ型面状発光装置に関する。サイドエッジ型面状発光装置は液晶表示(LCD)装置のバックライト光源として用いられる。   The present invention relates to a side-edge type planar light-emitting device in which a linear light-emitting device comprising a plurality of LED packages arranged and a plurality of LED chips arranged (referred to as an LED array) is combined with a light guide plate. The side edge type planar light emitting device is used as a backlight light source of a liquid crystal display (LCD) device.

LCD装置のバックライト光源として用いられる面状発光装置は冷陰極蛍光ランプ(CCFL)の代りにLED素子を用いたものが主流となっている。これにより、薄型化、軽量化、省電力化等を図っている。LED素子を用いた面状発光装置はサイドエッジ型と直下型とに大別されるが、サイドエッジ型面状発光装置は直下型面状発光装置に比較して薄型化の点で特に優れている。   2. Description of the Related Art A planar light emitting device used as a backlight light source of an LCD device is mainly a device using an LED element instead of a cold cathode fluorescent lamp (CCFL). Thereby, thickness reduction, weight reduction, power saving, etc. are aimed at. Surface light-emitting devices using LED elements are broadly classified into side-edge type and direct type, but side-edge type surface light-emitting devices are particularly superior in terms of thinning compared to direct-type surface light-emitting devices. Yes.

LCD装置に用いられる従来の線状のLEDアレイを含むサイドエッジ型面状発光装置においては、LCDパネルの背面に透明部材たとえばアクリル樹脂、ポリカーボネートよりなる導光板を配置し、導光板の側面に線状のLEDアレイを配置する。この場合、導光板とLEDアレイとは当接されていないので、熱によって導光板が伸縮すると、導光板とLEDアレイとの間の距離も変動する。従って、導光板とLEDアレイとの距離を確保して導光板への光取り込み効率を確保するために、LEDアレイの両端の外周囲に弾性部材よりなるリング状もしくはキャップ状のスペーサを設けている(参照:特許文献1)。   In a side-edge type planar light emitting device including a conventional linear LED array used in an LCD device, a light guide plate made of a transparent member such as acrylic resin or polycarbonate is disposed on the back surface of the LCD panel, and a line is formed on the side surface of the light guide plate. LED array is arranged. In this case, since the light guide plate and the LED array are not in contact, when the light guide plate expands and contracts due to heat, the distance between the light guide plate and the LED array also varies. Therefore, in order to secure the distance between the light guide plate and the LED array and to ensure the light capturing efficiency to the light guide plate, ring-shaped or cap-shaped spacers made of elastic members are provided on the outer periphery of both ends of the LED array. (Reference: Patent Document 1).

特開2008−192523号公報JP 2008-192523 A

しかしながら、上述の従来のサイドエッジ型面状発光装置において、線状に配置されたLEDアレイは細長いので、LEDアレイの両端のみに設けたリング状もしくはキャップ状のスペーサだけでは、導光板とLEDアレイとの距離を確保できないという課題がある。特に、大型のLCD装置に適用した場合には、線状配置したLEDアレイは非常に細長くなるので特に顕著となる。   However, in the above-described conventional side edge type planar light emitting device, the linearly arranged LED array is elongated, so that the light guide plate and the LED array can be obtained by using only ring-shaped or cap-shaped spacers provided only at both ends of the LED array. There is a problem that it is not possible to secure the distance. In particular, when applied to a large LCD device, a linearly arranged LED array becomes very long and particularly prominent.

尚、上述のリング状スペーサをLEDアレイの途中にも設けて導光板とLEDアレイとの距離を確実に確保することも可能であるが、実際に、リング状のスペーサをLEDアレイの途中に設けることは非常に困難であり、しかも、途中のスペーサはLEDアレイからの光に対して影として存在するので発光効率の低下を招くことになる。   Although it is possible to provide the above-mentioned ring-shaped spacer in the middle of the LED array to ensure the distance between the light guide plate and the LED array, the ring-shaped spacer is actually provided in the middle of the LED array. This is very difficult, and the spacer in the middle exists as a shadow with respect to the light from the LED array, resulting in a decrease in light emission efficiency.

上述の課題を解決するために、本発明は、透明部材よりなる導光板と、導光板の側面に設けられた線状に配置されたLEDアレイとを具備するサイドエッジ型面状発光装置において、LEDアレイは、実装基板と、実装基板上の中央に1列に配置された複数のLEDチップと、実装基板上に設けられた円筒形状もしくは直方体形状の複数のスペーサとを具備し、複数のスペーサはLEDチップの列の両側にあってLEDチップに対向しない領域に配置されたものである。これにより、導光板とLEDアレイとの距離は確実に確保されると共にスペーサはLEDチップからの光に対して妨害とならないIn order to solve the above problems, the present invention provides a light guide plate made of a transparent member, the side-edge type planar light-emitting device comprising a LED array disposed provided linear on the side surface side of the light guide plate The LED array includes a mounting board, a plurality of LED chips arranged in a row in the center on the mounting board, and a plurality of cylindrical or rectangular parallelepiped spacers provided on the mounting board. The spacers are arranged in regions on both sides of the LED chip row that do not face the LED chips . Thereby, the distance between the light guide plate and the LED array is ensured, and the spacer does not interfere with the light from the LED chip .

さらに、上述のスペーサは千鳥状に配置される。 Furthermore, the above-mentioned spacers are arranged in a staggered manner .

本発明によれば、導光板とLEDアレイとの距離が確実に確保されるので、たとえ導光板が熱によって変動しても、導光板とLEDチップの距離は確保されるので、導光板がLEDチップに接触し、不灯その他の不具合が生じることがない。 According to the present invention, the distance between the light guide plate and the LED array is reliably ensured, even if the light guide plate is varied by the heat, the distance of the light guide plate and the LED chip is secured, the light guide plate LED It will not touch the tip and cause no lighting or other problems.

本発明に係るサイドエッジ型面状発光装置の実施の形態を示す断面図である。It is sectional drawing which shows embodiment of the side edge type planar light-emitting device concerning this invention. 図1のLEDアレイの平面図である。It is a top view of the LED array of FIG. 図1のサイドエッジ型面状発光装置の製造方法を説明するためのフローチャートである。It is a flowchart for demonstrating the manufacturing method of the side edge type planar light-emitting device of FIG.

図1は本発明に係るサイドエッジ型面状発光装置の実施の形態を示す断面図である。図1においては、LCDパネル1の背面に透明部材たとえばアクリル樹脂、ポリカーボネートよりなる導光板2を配置し、導光板2の側面に線状のLEDアレイ3を配置する。この場合、LEDアレイ3はベゼル4によってLCDパネル1に固定されている。   FIG. 1 is a sectional view showing an embodiment of a side edge type planar light emitting device according to the present invention. In FIG. 1, a light guide plate 2 made of a transparent member such as acrylic resin or polycarbonate is disposed on the back surface of the LCD panel 1, and a linear LED array 3 is disposed on the side surface of the light guide plate 2. In this case, the LED array 3 is fixed to the LCD panel 1 by the bezel 4.

導光板2の背面側には、反射シート2aが設けられ、また、導光板2の正面側には、拡散板2bが設けられている。さらに、導光板2の背面には、ドットパターン2cが印刷塗布されている。反射シート2aは光を反射させるためのものであり、ドットパターン2cは導光板出射面からの出射輝度を均一に制御するためのものであり、拡散板2bは光を拡散するためのものである。   A reflective sheet 2 a is provided on the back side of the light guide plate 2, and a diffusion plate 2 b is provided on the front side of the light guide plate 2. Further, a dot pattern 2 c is printed on the back surface of the light guide plate 2. The reflection sheet 2a is for reflecting light, the dot pattern 2c is for uniformly controlling the emission luminance from the light guide plate emission surface, and the diffusion plate 2b is for diffusing light. .

LEDアレイ3は、たとえばアルミや銅またはガラスエポキシ樹脂やポリイミドよりなる実装基板31、実装基板31上に実装されたLEDチップ32、及び実装基板31上に設けられたスペーサ33よりなる。   The LED array 3 includes a mounting substrate 31 made of, for example, aluminum, copper, glass epoxy resin, or polyimide, an LED chip 32 mounted on the mounting substrate 31, and a spacer 33 provided on the mounting substrate 31.

図1においては、矢印に示すごとく、LEDアレイ3のLEDチップ32から光を導光板2の側面から入射させ、導光板2内の正面、背面間を反射しながら、導光板2の背面のドットパターン2cによって散乱させ、この散乱光を導光板2の正面の出射面から出光させ、拡散板2bを介してLCDパネル1に入射させる。   In FIG. 1, as indicated by an arrow, light is incident from the side surface of the light guide plate 2 from the LED chip 32 of the LED array 3, and the dots on the back surface of the light guide plate 2 are reflected while reflecting between the front and back surfaces in the light guide plate 2. The light is scattered by the pattern 2c, and the scattered light is emitted from the light exit surface on the front surface of the light guide plate 2 and is incident on the LCD panel 1 through the diffusion plate 2b.

図1のLEDアレイ3の平面図である図2に示すように、LEDチップ32は実装基板31の中央に1列に配置され、Auボンディングワイヤ34によって直列接続されている。   As shown in FIG. 2 which is a plan view of the LED array 3 in FIG. 1, the LED chips 32 are arranged in a row at the center of the mounting substrate 31 and are connected in series by Au bonding wires 34.

また、図2に示すように、スペーサ33は円筒形状を有した金属もしくは樹脂によって形成され、LEDチップ32の両側にLEDチップ32に対向しない領域に配置されると共に千鳥状に配置されている。従って、スペーサ33がLEDチップ32からの光に対して妨害となることはない。尚、スペーサ33の円筒形状は他の形状たとえば直方体形状であってもよい。   As shown in FIG. 2, the spacers 33 are formed of a metal or resin having a cylindrical shape, and are arranged on both sides of the LED chip 32 in regions not facing the LED chip 32 and in a staggered manner. Therefore, the spacer 33 does not interfere with the light from the LED chip 32. The cylindrical shape of the spacer 33 may be another shape such as a rectangular parallelepiped shape.

図2における実装基板31の両端に設けられた通電基板35はLEDチップ32に電力を供給するためのものである。   The energizing substrates 35 provided at both ends of the mounting substrate 31 in FIG. 2 are for supplying power to the LED chip 32.

次に、図1のLEDアレイ3の製造方法を図3のフローチャートを参照して説明する。尚、LEDアレイのサイズは約2.5mm×約150mm×高さ約2mmである。また、実装基板31の厚さはたとえば0.3mm〜1.0mm、LEDチップ32は約0.3mm×約0.3mm、スペーサ33は直径約0.2mm×高さ約1mmの円筒もしくは約0.2mm×約0.2mm×高さ約1mmの直方体をなしている。   Next, a method for manufacturing the LED array 3 of FIG. 1 will be described with reference to the flowchart of FIG. The size of the LED array is about 2.5 mm × about 150 mm × height about 2 mm. Further, the thickness of the mounting substrate 31 is, for example, 0.3 mm to 1.0 mm, the LED chip 32 is about 0.3 mm × about 0.3 mm, the spacer 33 is a cylinder of about 0.2 mm in diameter × about 1 mm in height, or about 0.2 mm × about 0.2 mm. × It has a rectangular parallelepiped with a height of about 1mm.

始めに、ステップ301において、実装基板31上に接合剤たとえば白色シリコーン接着剤を塗布する。   First, in step 301, a bonding agent such as a white silicone adhesive is applied on the mounting substrate 31.

次に、ステップ302において、LEDチップ32、スペーサ33及び通電基板35を実装して接着剤を硬化させる。スペーサは、ガラス製または樹脂製でもよく、チップより背の高い不灯チップを用いてもよい。また、通電基板35は、たとえば、ガラスエポキシ基板、メタルコア基板あるいはセラミック基板である。   Next, in step 302, the LED chip 32, the spacer 33, and the energizing substrate 35 are mounted and the adhesive is cured. The spacer may be made of glass or resin, and a non-lighting tip that is taller than the tip may be used. The energizing substrate 35 is, for example, a glass epoxy substrate, a metal core substrate, or a ceramic substrate.

最後に、ステップ303において、LEDチップ32と通電基板35間をAuボンディングワイヤ34によって接続する。   Finally, in step 303, the LED chip 32 and the current-carrying substrate 35 are connected by the Au bonding wire 34.

このように、スペーサ33はLEDチップ32と同時に実装されるので、特別の工程を増加させることなく図1のサイドエッジ型面状発光装置を製造することができる。   Thus, since the spacer 33 is mounted simultaneously with the LED chip 32, the side edge type planar light emitting device of FIG. 1 can be manufactured without increasing the number of special steps.

1:LCDパネル
2:導光板
2a:反射シート
2b:拡散板
2c:ドットパターン
21:凸型斜面
22:凹型斜面
3:LEDアレイ
31:実装基板
32:LEDチップ
33:スペーサ
34:Auボンディングワイヤ
35:通電基板
1: LCD panel 2: Light guide plate 2a: Reflective sheet 2b: Diffuser plate 2c: Dot pattern 21: Convex slope
22: concave slope
3: LED array 31: mounting substrate 32: LED chip 33: spacer 34: Au bonding wire 35: energizing substrate

Claims (2)

透明部材よりなる導光板と、
前記導光板の側面に設けられた線状のLEDアレイと
を具備するサイドエッジ型面状発光装置において、
前記LEDアレイは、
実装基板と、
前記実装基板上の中央に1列に配置された複数のLEDチップと、
前記実装基板上に設けられた円筒形状もしくは直方体形状の複数のスペーサと
を具備し、
前記複数のスペーサは前記LEDチップの列の両側にあって該LEDチップに対向しない領域に配置されたことを特徴とするサイドエッジ型面状発光装置。
A light guide plate made of a transparent member;
In a side edge type planar light emitting device comprising: a linear LED array provided on a side surface of the light guide plate;
The LED array
A mounting board;
A plurality of LED chips arranged in a row in the center on the mounting substrate;
A plurality of cylindrical or rectangular parallelepiped spacers provided on the mounting substrate;
Comprising
The side-edge type planar light-emitting device, wherein the plurality of spacers are disposed on regions on both sides of the LED chip row and not facing the LED chips .
前記スペーサは千鳥状に配置された請求項に記載のサイドエッジ型面状発光装置。 The side edge type planar light emitting device according to claim 1 , wherein the spacers are arranged in a staggered pattern.
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