KR20110051718A - Heat radiating printed circuit board unified bracket and chassis structure having the same and process for producing the same - Google Patents

Abstract

PURPOSE: A bracket integrated heat dissipation PCB for a backlight unit, a chassis structure including the same and manufacturing method thereof are provided to reduce a material cost, to simplify process/structure, and to maximize heat dissipation characteristic by unifying the heat dissipation PCB and a bracket. CONSTITUTION: A heat dissipation PCB mounting inside the chassis structure providing light guiding path of a backlight unit includes a metal substrate(150) and a circuit layer. The metal substrate has at least one bending area and a non bending area. The circuit layer forms a circuit pattern by patterning the metal layer and laminating a metal layer on the insulating layer. The insulating layer exists only in non bending area among the metal substrate by welding the circuit layer to the non bending area.

Description

HEAT RADIATING PRINTED CIRCUIT BOARD UNIFIED BRACKET AND CHASSIS STRUCTURE HAVING THE SAME AND PROCESS FOR PRODUCING THE SAME}

The present invention relates to a heat dissipation PCB for a backlight unit, a chassis structure having the same, and a method of manufacturing the same.

As the electronics industry develops, various display devices are being developed, and imaging devices, computers, and mobile communication terminals using the same are being developed. The liquid crystal display (LCD), which has appeared to reflect this trend, is currently in the spotlight as a display device such as a monitor and a mobile communication terminal.

Liquid crystal display (LCD) is an application of the electro-optical properties of liquid crystals having intermediate characteristics between liquid and solid to display devices. It is an electric device that changes and transmits various electrical information into visual information. It is a flat panel display that is widely used because of its low power consumption and low power consumption.

LCDs do not emit self-luminous light, so all LCDs always require backlight. The backlight acts as a light source of the LCD. The backlight unit includes a light source unit including a light source itself to irradiate light from the back of the liquid crystal module, and a power supply circuit for driving the light source and an integral part that forms uniform plane light. : BLU). Recently, a backlight unit using a light emitting diode (LED) has been proposed as a light source for illuminating the LCD. An LED is a light emitting device that generates light by using a light emission phenomenon generated when a voltage is applied to a semiconductor. Such LEDs have advantages in that they are smaller than conventional light sources, have a long lifetime, and have high energy efficiency and low operating voltages because electrical energy are directly converted into light energy. Such a backlight unit is used by mounting a plurality of light source elements such as LEDs on a PCB. Since the PCB must endure heat emitted from the light source element, metal materials are mainly used. However, if the heat generated from the light source device is not properly discharged, the light source device may be destroyed or the life may be shortened.

FIG. 1 illustrates a cross-sectional view of a chassis structure in which a heat dissipation PCB 10 and a bracket 40 manufactured according to the related art are mounted on a chassis 50 which is a light guiding passage of a backlight unit.

Referring to FIG. 1, the heat dissipation PCB 10 and the bracket 40 for fixing it to the chassis 50 are separately manufactured and bonded by using the TIM 20, and to the chassis 50 used as the light guiding passage. The TIM 30 is used for mounting.

However, when the heat dissipation PCB 10 and the bracket 40 are separated and manufactured and bonded using the TIM 20, the heat transfer rate is lowered by the TIM 20, which lowers the heat dissipation effect and the adhesion between the heat dissipation PCB and the bracket. De-lamination occurs due to the problem of poor quality.

The present invention has been made to solve the above problems, an object of the present invention is to maximize the heat dissipation characteristics by integrating the heat dissipation PCB and the bracket, to provide a simplified process and structure, and to reduce the material cost by not manufacturing the bracket separately To provide a bracket integrated heat dissipation PCB.

In addition, it reduces the occurrence of delamination due to the adhesion between the heat radiation PCB and the bracket to reduce the occurrence of quality defects, as well as the integrated bracket heat dissipation PCB that can reduce the interface (interface) between the heat radiation PCB and the bracket. Another object of the present invention is to provide a chassis structure having the same and a method of manufacturing the same.

According to an aspect of the present invention, there is provided a heat dissipation PCB mounted inside a chassis structure that provides a light guide path of a backlight unit, the heat dissipation PCB comprising: a metal substrate having a non-bending area and at least one bending area; And a circuit layer for laminating a metal layer on the insulating layer and patterning the metal layer to form a circuit pattern, wherein the insulating layer is present only in the non-bending region of the metal substrate by bonding the circuit layer to the non-bending region. By providing a bracket integrated heat dissipation PCB, it is possible to maximize the heat dissipation characteristics, simplify the process and simplify the structure, and at the same time, it does not use a separate bracket to reduce the material cost.

In particular, the bonding of the non-bending region and the circuit layer of the metal substrate is characterized in that using an adhesive material to bond the circuit layer on the pre-bent metal substrate to integrate the heat radiation PCB and the bracket.

In addition, the circuit layer is characterized in that the solder resist is applied to the circuit pattern, the insulating layer is characterized in that any one of polyimide, polyester, epoxy resin, phenol resin.

In addition, a metal substrate having a non-bended region and at least one bent region and a metal layer on the insulating layer and a circuit layer for forming a circuit pattern by patterning the metal layer, the circuit layer is bonded to the non-bent region A bracket integrated heat dissipation PCB in which the insulating layer is present only in a non-bending region of the metal substrate; The heat dissipation PCB may provide a light guide passage of the backlight unit by using a heat dissipation PCB that maximizes heat dissipation characteristics by providing a chassis structure having a bracket integrated heat dissipation PCB, which is mounted to the chassis through a TIM.

In particular, the bonding of the non-bending region and the circuit layer of the metal substrate is characterized in that the adhesive material is used to bond the metal substrate and the circuit layer manufactured separately.

In addition, the insulating layer is characterized in that any one of polyimide, polyester, epoxy resin, phenol resin.

And a first step of forming a metal layer on the insulating layer; Forming a circuit pattern by patterning the metal layer; Bending the metal substrate to form at least one bent region; A fourth step of bonding the metal substrate and the insulating layer on which the circuit pattern is formed; By providing a method of manufacturing a bracket integrated heat dissipation PCB comprising a maximizing the heat dissipation characteristics, to simplify the process and structure and to be able to manufacture a heat dissipation PCB that can reduce the material cost.

In addition, the first step is to form a metal layer on an insulating layer made of any one of polyimide, polyester, epoxy resin, phenol resin, the second step is to apply a solder resist to the circuit pattern It further comprises a step.

In particular, the fourth step is a step of bonding the metal substrate and the insulating layer on which the circuit pattern portion is formed using a thermocompression bonding method or an adhesive material. It is possible to bond the substrate and the insulating layer on which the circuit pattern is formed.

According to the present invention, by integrating the heat radiation PCB and the bracket for fixing it, it is possible to prevent the heat transfer rate decrease by the use of the TIM, reduce the occurrence of the interface between the heat radiation PCB and the bracket to prevent the heat conduction degradation caused by the air layer to prevent the heat radiation PCB It is possible to maximize the heat dissipation characteristics of the heat dissipation PCB by integrating the bracket when manufacturing the heat dissipation PCB, it is not necessary to go through a separate bracket manufacturing process it is possible to simplify the process and structure.

In addition, there is no need to use a TIM between the heat dissipation PCB and the bracket, which reduces the amount of TIM usage and reduces the cost of materials by not using a bracket. This has the effect of eliminating the occurrence of de-lamination.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention may be modified in many different forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. Embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the elements in the drawings are exaggerated in order to emphasize a clearer description, and elements denoted by the same symbols in the drawings denote the same elements.

According to an aspect of the present invention, there is provided a heat dissipation PCB mounted inside a chassis structure that provides a light guide path of a backlight unit, the metal substrate having a non-bending area and at least one bending area; And a circuit layer for laminating a metal layer on the insulating layer and patterning the metal layer to form a circuit pattern, wherein the insulating layer is present only in the non-bending region of the metal substrate by bonding the circuit layer to the non-bending region. The main purpose is to have a bracket integrated heat dissipation PCB, a chassis structure having the same, and a manufacturing method thereof, maximizing heat dissipation characteristics through the bracket integrated heat dissipation PCB and simplifying the process and structure.

2A illustrates a process of forming a circuit pattern on an insulating layer.

Referring to FIG. 2A, a circuit pattern 130 is formed by stacking a metal layer 120, such as a Cu layer, on the insulating layer 110, and patterning the metal layer 120. In order to prevent the occurrence of a lead bridge (Solder Bridge) phenomenon, a solder resist (Solder Regist) 140 may be applied to protect the circuit.

In this case, the material of the insulating layer 110 is preferably a polyimide, but is not necessarily limited thereto, polyester, epoxy resin, phenol resin, etc. may also be a material of the insulating layer 110.

2B illustrates a cross-sectional view of the metal substrate on which the bent region is formed.

Referring to FIG. 2B, the metal substrate 150 such as Al may be bent to form one non-bending region to bond the two bending regions and the insulating layer 110 on which the circuit pattern 130 is formed. 2b, the bent metal substrate 150 may have a 'c' shaped structure. Since this is only a preferred embodiment of the present invention, there may be one bending region as in the metal substrate 150 of FIG. 4D, and as shown in FIG. 4C, the metal substrate 150 has two bending regions, but 'It may not be a shaped structure. Of course, the metal substrate may form three or more bent regions through bending.

As described above, the bracket-integrated heat dissipation PCB of the present invention does not form a circuit pattern by sequentially stacking an insulating layer and a metal layer on the metal substrate 150, but the metal substrate 150 and the circuit pattern 130 having the bending area are formed. The insulating layer 110 may be manufactured separately and bonded by using thermocompression bonding or an adhesive material as shown in FIG. 3A or 3B.

3A and 3B are cross-sectional views of a bracket-integrated heat dissipation PCB in which the insulating layer 110 on which the circuit pattern 130 of FIG. 2A is formed and the metal substrate 150 on which the bent region of FIG. 2B are bonded are joined.

Referring to FIG. 3A, the bracket-integrated heat dissipation PCB of the present invention laminates a metal layer 120 such as a Cu layer on the insulating layer 110 and patterns the metal layer 120 to form a circuit pattern 130 and protect a circuit. In order to do this, a circuit layer coated with the solder resist 140 may be formed to be bonded to a non-bended region of the metal substrate 150 having a 'c' shape. In this case, the bonding of the circuit layer and the metal substrate 150 may be made by a thermocompression method using heat and pressure. As described above, according to the present invention, the metal substrate 150 having the bent region and the circuit layer are separately manufactured and bonded by thermocompression so that the insulating layer 110 does not exist in the bent region. Therefore, a region in which the insulating layer 110 does not exist may exist on the metal substrate 150.

Referring to FIG. 3B, as in FIG. 3A, the bracket-integrated heat dissipation PCB of the present invention has a metal substrate having a 'c' shape by forming a bent region of the circuit layer on which the circuit pattern 130 is formed on the insulating layer 110. It can be bonded to 150. However, the difference from 3a is that the bonding of the circuit layer and the metal substrate 150 uses the adhesive material 160, not the thermocompression bonding method. In this case, the adhesive material 160 is preferably a TIM, but is not necessarily limited thereto.

As described above, in bonding the separately manufactured metal substrate 150 and the circuit layer, thermocompression bonding or an adhesive material 160 may be used, and the metal substrate 150 may have a region in which the insulating layer 110 does not exist. Can be.

4A to 4D illustrate cross-sectional views of a chassis structure in which a bracket integrated heat dissipation PCB having a metal substrate and a circuit layer bonded thereto is mounted on the chassis.

Referring to FIG. 4A, the bracket integrated heat dissipation PCB of FIG. 3A may be mounted to the chassis 180 through the TIM 170. In the bracket integrated heat dissipation PCB of the present invention, a circuit layer is bonded to a non-bending region of the metal substrate 150, and the circuit layer is formed on the insulating layer 110 to protect the circuit thereon. The solder resist 140 is applied, and the circuit layer is bonded to the non-bending region of the metal substrate 150 bent in a '-' shape by thermocompression bonding. In this case, the bracket integrated heat dissipation PCB is mounted to the chassis 180 via the TIM 170 using the lower end of the metal substrate 150 as a mounting portion.

Referring to FIG. 4B, the bracket integrated heat dissipation PCB of FIG. 3B is mounted on the chassis 180 through the TIM 170. In this case, the heat dissipation PCB is a circuit layer bonded to the non-bending region of the metal substrate 150 having the 'c' structure, as in the heat dissipation PCB of Figure 4a, but the bonding is not a thermocompression bonding method such as TIM Will be used.

Referring to FIG. 4C, a bracket-integrated heat dissipation PCB, in which a metal layer 150 having a bent region is formed by using an adhesive material 160 and a circuit layer, is mounted on the chassis 180 via the TIM 170. . In this case, the bonding is to use an adhesive material 160, such as TIM. However, unlike FIG. 4A and FIG. 4B, the metal substrate 150 having the bent regions has a structure in which two bent regions do not face each other, rather than a 'c' structure.

Referring to FIG. 4D, a bracket integrated heat dissipation PCB having a circuit layer bonded to a metal substrate 150 having one bent region may be mounted to the chassis 180 via the TIM 170. In this case, the bonding is using a thermocompression method.

As shown in FIGS. 3A to 4D, one or two bent regions formed on the metal substrate may be three or more. In addition, the bonding between the metal substrate and the circuit layer may be an adhesive material such as thermocompression bonding or TIM.

The best embodiments have been disclosed in the drawings and specification above. Although specific terms have been used herein, they are used only for the purpose of describing the present invention and are not used to limit the scope of the present invention as defined in the meaning or claims. Therefore, those skilled in the art will understand that various modifications and equivalent other embodiments are possible from this. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

1 is a view showing a heat dissipation PCB, a bracket and a chassis structure mounted therein according to the related art.

FIG. 2A illustrates a process of forming a circuit pattern on an insulating layer and applying a solder resist.

2B is a cross-sectional view illustrating a metal substrate having a bent region.

3A and 3B are cross-sectional views illustrating a bracket-integrated heat dissipation PCB in which a metal substrate and a circuit layer are bonded by thermocompression bonding or an adhesive material.

4A to 4D are cross-sectional views illustrating a chassis structure in which a bracket integrated heat dissipation PCB is mounted to a chassis.

<Explanation of symbols for the main parts of the drawings>

110: insulating layer 120: metal layer

130: circuit pattern 140: solder resist

150: metal substrate 160: adhesive material

170: TIM 180: chassis

Claims (12)

In the heat dissipation PCB mounted in the chassis structure that provides the light guide passage of the backlight unit, A metal substrate having a non-bending region and at least one bending region; And And a circuit layer for forming a circuit pattern by laminating a metal layer on the insulating layer and patterning the metal layer. Bonding a circuit layer to the non-bending area, the bracket integrated heat dissipation PCB, characterized in that the insulating layer is present only in the non-bending area of the metal substrate. The method according to claim 1, The junction between the non-bending region of the metal substrate and the circuit layer is Bracket integrated heat dissipation PCB, characterized in that using the adhesive material. The method according to claim 2, The circuit layer, Bracket integrated heat dissipation PCB, characterized in that to apply a solder resist to the circuit pattern. The method according to any one of claims 1 to 3, The insulating layer, Bracket integrated heat dissipation PCB, characterized in that any one of polyimide, polyester, epoxy resin, phenol resin. In the heat dissipation PCB mounted in the chassis structure that provides the light guide passage of the backlight unit, A metal substrate having a non-bending area and at least one bending area; A circuit layer is formed on the insulating layer by laminating a metal layer and patterning the metal layer to form a circuit pattern. A bracket integrated heat dissipation PCB in which the insulating layer is present only in the non-bending region of the metal substrate by bonding a circuit layer to the non-bending region; The heat dissipation PCB is a chassis structure having a bracket integrated heat dissipation PCB, characterized in that mounted on the chassis via the TIM. The method according to claim 5, The junction between the non-bending region of the metal substrate and the circuit layer is Chassis structure having a bracket integrated heat dissipation PCB, characterized in that using the adhesive material. The method according to claim 6, The insulating layer, A chassis structure having a bracket integrated heat dissipation PCB, characterized in that any one of polyimide, polyester, epoxy resin, phenol resin. Forming a metal layer on the insulating layer; Forming a circuit pattern by patterning the metal layer; Bending the metal substrate to form at least one bent region; A fourth step of bonding the metal substrate and the insulating layer on which the circuit pattern is formed; Bracket integrated heat dissipation PCB manufacturing method comprising a. The method according to claim 8, The first step, The method of manufacturing a bracket-integrated heat dissipation PCB, characterized in that the step of forming a metal layer on the insulating layer made of any one of polyimide, polyester, epoxy resin, phenol resin. The method according to claim 9, The second step, The method of claim 1, further comprising applying a solder resist to the circuit pattern. The method according to any one of claims 8 to 10, The fourth step is And a step of bonding the metal substrate and the insulating layer on which the circuit pattern part is formed by a thermocompression bonding method. The method according to any one of claims 8 to 10, The fourth step, And bonding the metal substrate and the insulating layer on which the circuit pattern part is formed using an adhesive material.

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