WO2013002611A3 - Radiant heat circuit board and chassis structure having the same - Google Patents

Radiant heat circuit board and chassis structure having the same Download PDF

Info

Publication number
WO2013002611A3
WO2013002611A3 PCT/KR2012/005203 KR2012005203W WO2013002611A3 WO 2013002611 A3 WO2013002611 A3 WO 2013002611A3 KR 2012005203 W KR2012005203 W KR 2012005203W WO 2013002611 A3 WO2013002611 A3 WO 2013002611A3
Authority
WO
WIPO (PCT)
Prior art keywords
radiant heat
circuit board
heat circuit
region
same
Prior art date
Application number
PCT/KR2012/005203
Other languages
French (fr)
Other versions
WO2013002611A2 (en
WO2013002611A9 (en
Inventor
Joo Hyang Park
Min Jae Kim
Hyun Gyu Park
Hyuk Soo Lee
In Hee Cho
Seung Kwon Hong
Original Assignee
Lg Innotek Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020110064830A external-priority patent/KR101294505B1/en
Priority claimed from KR1020110064828A external-priority patent/KR20130003457A/en
Application filed by Lg Innotek Co., Ltd. filed Critical Lg Innotek Co., Ltd.
Publication of WO2013002611A2 publication Critical patent/WO2013002611A2/en
Publication of WO2013002611A9 publication Critical patent/WO2013002611A9/en
Publication of WO2013002611A3 publication Critical patent/WO2013002611A3/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133615Edge-illuminating devices, i.e. illuminating from the side
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302Bending a rigid substrate; Breaking rigid substrates by bending
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Led Device Packages (AREA)

Abstract

Disclosed is a radiant heat circuit board mounted in a chassis providing a light guide passage of a backlight unit. The radiant heat circuit board includes a first region on which a heat generating element is mounted and a second region bent with respect to the first region, in which a bottom surface of the second region is bonded to the radiant heat adhesion layer to make contact with the bottom surface of the chassis. The radiant heat circuit board is bent to have an angle equal to or greater than 90 so that a mask is easily formed during a solder paste coating procedure, and a length of the radiant heat circuit board is extended so that thermal radiation is improved.
PCT/KR2012/005203 2011-06-30 2012-06-29 Radiant heat circuit board and chassis structure having the same WO2013002611A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR1020110064830A KR101294505B1 (en) 2011-06-30 2011-06-30 The radiant heat circuit board and the chassis structure having the same
KR1020110064828A KR20130003457A (en) 2011-06-30 2011-06-30 The chassis structure having the radiant heat circuit board unified blanket and the backlight unit having the same
KR10-2011-0064828 2011-06-30
KR10-2011-0064830 2011-06-30

Publications (3)

Publication Number Publication Date
WO2013002611A2 WO2013002611A2 (en) 2013-01-03
WO2013002611A9 WO2013002611A9 (en) 2013-04-04
WO2013002611A3 true WO2013002611A3 (en) 2013-05-23

Family

ID=47424712

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/005203 WO2013002611A2 (en) 2011-06-30 2012-06-29 Radiant heat circuit board and chassis structure having the same

Country Status (2)

Country Link
TW (1) TW201304626A (en)
WO (1) WO2013002611A2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110022204A (en) * 2009-08-27 2011-03-07 서울반도체 주식회사 Back light module
KR20110040430A (en) * 2009-10-14 2011-04-20 엘지이노텍 주식회사 Heat radiating printed circuit boad unified blanket and chassis structure having the same
KR20110048301A (en) * 2009-11-02 2011-05-11 엘지이노텍 주식회사 Heat radiating printed circuit board unified bracket for backlight unit and chassis structure having the same
KR20110051718A (en) * 2009-11-11 2011-05-18 엘지이노텍 주식회사 Heat radiating printed circuit board unified bracket and chassis structure having the same and process for producing the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20110022204A (en) * 2009-08-27 2011-03-07 서울반도체 주식회사 Back light module
KR20110040430A (en) * 2009-10-14 2011-04-20 엘지이노텍 주식회사 Heat radiating printed circuit boad unified blanket and chassis structure having the same
KR20110048301A (en) * 2009-11-02 2011-05-11 엘지이노텍 주식회사 Heat radiating printed circuit board unified bracket for backlight unit and chassis structure having the same
KR20110051718A (en) * 2009-11-11 2011-05-18 엘지이노텍 주식회사 Heat radiating printed circuit board unified bracket and chassis structure having the same and process for producing the same

Also Published As

Publication number Publication date
WO2013002611A2 (en) 2013-01-03
WO2013002611A9 (en) 2013-04-04
TW201304626A (en) 2013-01-16

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