KR20130003457A - The chassis structure having the radiant heat circuit board unified blanket and the backlight unit having the same - Google Patents

Abstract

PURPOSE: A chassis structure having a radiant heat circuit board unified blanket and a backlight unit having the same are provided to form a bent heat circuit board and to directly bond it to the side of a chassis without a bezel. CONSTITUTION: A heat radiant bonding layer(120) is formed in the bottom surface of a chassis(110). A blanket-integrated heat radiant circuit board(130) includes a first area(130b) and a second area(130a). A light emitting device(170) is mounted on the first area. The second area and the first area are bent. The lower side of the second area is adhered to the heat radiant bonding layer. The blanket-integrated heat radiant circuit board touches the bottom surface of the chassis.

Description

The chassis structure having the radiant heat circuit board unified blanket and the backlight unit having the same}

The present invention relates to a chassis structure comprising a blanket integral heat radiation circuit board.

Liquid crystal display (LCD) is a display device in which the liquid crystal is inclined according to the intensity of the electric field formed by the upper and lower electrodes, and displays an image by selectively transmitting the light emitted from the lower backlight according to the inclination degree. .

The liquid crystal display is a flat panel display that is widely used because of low power consumption and low power consumption.

The backlight of the liquid crystal display device is a light source for irradiating light to the rear of the liquid crystal panel, and a complex including a power supply circuit for driving the light source and an integral part to form a uniform plane light is called a backlight unit (BLU). do. In the backlight unit, a light source device such as a light emitting diode (LED) is mounted on a printed circuit board. The printed circuit board uses a metal material that can withstand the heat emitted by the light source element.

However, if the heat generated from the light source device is not released, the light source device may be destroyed or the life may be shortened.

FIG. 1 illustrates a cross-sectional view of a heat dissipation circuit board 10 and a blanket 40 manufactured according to the related art in a chassis 50 that is a light guiding passage of a backlight unit.

Referring to FIG. 1, the heat dissipation circuit board 10 and the blanket 40 for fixing it to the chassis 50 are separately manufactured and bonded using the adhesive layer 20, and the chassis 40 used as the light guiding passage. )).

In this case, the blanket 40 has a predetermined thickness, extends horizontally from the side wall of the chassis 50, is spaced apart from the side wall of the chassis 50 by a predetermined distance, and is bent at a first angle θ 1, and the chassis ( 50 is bent again at the bottom surface 110a and the second angle θ2. When the first angle θ1 of the blanket 40 is 0 to 90 degrees, the bezel of the chassis 50 increases in the heat dissipation circuit board 10, and the first angle θ1 is 90 to 270 degrees. In this case, when the thickness of the backlight unit is increased and the first angle θ1 is 270 to 360, a problem of obstructing an optical path of the light emitting diode occurs.

In addition, when the second angle θ1 formed between the side surface 110b and the bottom surface of the blanket 40 is 90 to 270 degrees, when the thickness of the backlight unit is increased and the second angle θ1 is 270 to 360 degrees, The problem is that the bezel is larger.

In addition, an air layer is formed between the blanket 40 and the chassis 50 to be separated by an impact, and the heat dissipation is deteriorated.

The embodiment provides a blanket integrated heat dissipation circuit board having a new structure and a chassis structure including the same.

Embodiments provide a blanket integrated heat dissipation circuit board having improved thermal efficiency and a chassis structure including the same.

The embodiment includes a chassis including a bottom surface, a heat dissipation adhesive layer formed on the bottom surface of the chassis, a first region in which a light emitting device is mounted, and a second region bent from the first region. A lower surface of the region is bonded to the heat dissipation adhesive layer to provide a chassis structure including a blanket integrated heat dissipation circuit board in contact with the bottom surface of the chassis.

The embodiment includes a bottom chassis including a bottom surface, a heat dissipation adhesive layer formed on a bottom surface of the chassis, a first region in which a light emitting device is mounted, and a second region bent from the first region. A light source including a blanket-integrated heat dissipation circuit board bonded to the bottom surface of the second chassis to be in contact with the bottom surface of the bottom chassis, and disposed on the bottom surface of the bottom chassis and irradiating light from the light source to the side surface; The present invention provides a backlight unit including a light guide plate that receives a light emitting plate.

According to the present invention, the heat dissipation circuit board to which the heat generating element is attached is formed in a bent shape, and the heat dissipation circuit board is directly bonded to the side of the chassis so that the chassis and the heat dissipation circuit board are combined without the bezel. In addition, by attaching the heat dissipation circuit board and the chassis through the heat dissipation tape, heat is directly transferred to improve heat dissipation, and since the bezel is not required, the space in which the light guide plate is formed can be expanded.

1 is a cross-sectional view of a conventional blanket integrated heat dissipation circuit board and chassis structure.
2 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to the first embodiment of the present invention.
3 is a top view of the blanket integrated heat dissipation circuit board shown in FIG. 2.
4 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to a second embodiment of the present invention.
5 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to a third embodiment of the present invention.
6 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to a fourth embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Throughout the specification, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless specifically stated otherwise.

In order to clearly illustrate the present invention in the drawings, thicknesses are enlarged in order to clearly illustrate various layers and regions, and parts not related to the description are omitted, and like parts are denoted by similar reference numerals throughout the specification .

Whenever a portion of a layer, film, region, plate, or the like is referred to as being "on" another portion, it includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. Conversely, when a part is "directly over" another part, it means that there is no other part in the middle.

The present invention provides a blanket integrated heat dissipation circuit board, which is directly bonded to the chassis and through the heat dissipation tape.

Hereinafter, a heat dissipation circuit board according to a first embodiment of the present invention will be described with reference to FIGS. 2 and 3.

2 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to the first embodiment of the present invention, and FIG. 3 is a top view of the blanket integrated heat dissipation circuit board shown in FIG. 2.

2 and 3, the chassis structure 100 of the present invention includes a blanket integrated heat dissipation circuit board, an adhesive layer 120, and a chassis 110.

The chassis 110 may be a bottom chassis of a display device including a backlight unit such as a liquid crystal display, and includes a bottom surface having an area for accommodating a light guide plate, a display panel, and the like.

The chassis 110 may be formed of a metal having high thermal conductivity, and may be formed of an alloy including copper or aluminum.

The blanket integrated heat dissipation circuit board includes a support substrate 130 made of an alloy including copper, aluminum, nickel, or the like having high heat conductivity and excellent heat dissipation.

An insulating layer 140 including an epoxy resin or a polyimide resin is formed on the support substrate 130, and a pattern 150 formed by patterning a copper foil layer on the insulating layer 140, specifically, Pads 150a and 150b or a circuit pattern 150c are formed.

In this case, the pads 150a and 150b are electrically connected to the electrode pad 150a and the plurality of electrode pads 150a of the light emitting device 170 mounted thereon to transmit external power. It may be a connector pad 150c, and the pads 150a and 150b may be exposed by the solder resist 160.

On the other hand, as shown in Figure 3, the heat dissipation circuit board is composed of two bent regions (130a, 130b), one bent region (130a) has a first width (X), the other bent region (130b) is a second It has a width (Y).

The first width X and the second width Y may be equal to each other, but are not limited thereto.

Pads 150a and 150b and a circuit pattern 150c are formed to mount the light emitting device 170 in one of the two bent regions 130a and 130b.

That is, the pads 150a and 150b and the circuit pattern 150c are formed in one bent region 130b, and the metals are formed in the bent region 150b where the pads 150a and 150b and the circuit pattern 150c are formed. The insulating layer 140 is formed on the support substrate 130.

In this case, a device region A on which a plurality of light emitting elements 170, for example, a light emitting diode is mounted, is defined on the electrode pad 150a of the one bent region 130b.

As shown in FIG. 3, both the insulating layer 140 and the pattern 150 may be formed in only one of the two bent regions 130a and 130b, and the other bent region 130a may be a dummy region. In contrast, the insulating layer 140 is formed in both of the bent regions 130a and 130b, the electrode pad 150a of the light emitting device 170 is formed in one of the bent regions 130b, and the other bent region 130a. A circuit pattern 150c may be formed in the light emitting device 170 to transmit a signal to each light emitting device 170.

Meanwhile, in the bent regions 130a and 130b, the bent region 130a, in which the light emitting element 170 is not mounted, is in contact with the bottom surface of the chassis 110, and an element region A for mounting the light emitting element 170 is provided. The defined bending region 130b is formed to protrude from the bottom surface of the chassis 110.

When the chassis 110 has a side surface, the second width Y of the bending area 130b may have the same height as the side surface of the chassis 110, but is not limited thereto.

In this case, an air gap may occur in a spaced area between the chassis 110 and the heat dissipation circuit board.

In the present invention, the adhesive layer 120 is formed between the chassis 110 and the heat dissipation circuit board to remove the air gap.

The adhesive layer 120 uses a thermal interface material (TIM) such as thermal grease or thermal compound having high thermal conductivity and excellent adhesion.

The adhesive layer 120 may have a tape type to facilitate bonding.

The chassis 110 and the heat dissipation circuit board may be fixed by disposing an adhesive layer 120 between the bottom surface of the chassis 110 and the heat dissipation circuit board.

As such, while forming a bent heat radiating circuit board without a separate blanket, the heat radiating circuit board is formed of an L-shape, and an air gap is formed by forming the adhesive layer 120 as a heat transfer material in a space between the chassis 110. The heat dissipation is improved by directly transferring heat to the chassis 110.

In addition, the area occupied by the blanket is removed, thereby increasing the area acting as the surface light source of the backlight unit.

4 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to a second embodiment of the present invention.

The chassis structure 200 according to the second embodiment shown in FIG. 4 includes a blanket integrated heat dissipation circuit board and a chassis 110 as shown in FIG. 2.

In this case, the chassis structure 200 of FIG. 4 forms an adhesive layer 151 between the bent region 130b where the light emitting region A of the heat dissipation circuit board is defined and the side surface 110b of the chassis 110. It is formed to be bonded at the side (110b) of the chassis (110).

5 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to a third embodiment of the present invention.

In the chassis structure 300 of FIG. 5, an adhesive layer 153b is formed between the bent region 130b where the light emitting region A of the heat dissipation circuit board is defined and the side surface 110b of the chassis 110. Since the adhesive layer 153a is formed between the bent region 130a where the light emitting region A is not defined and the bottom surface 110a of the chassis 110, adhesion is performed not only on the side surface 110b but also on the bottom surface 110a. It is formed to be made.

Therefore, since the attachment is made on the front surface of the heat dissipation circuit board, adhesion between the chassis 110 and the support substrate 130 of the heat dissipation circuit board is made firm and heat dissipation is improved.

6 is a cross-sectional view of a blanket integrated heat dissipation circuit board and a chassis structure including the same according to a fourth embodiment of the present invention.

In the chassis structure 400 of FIG. 6, an adhesive layer 120 is formed between the bent region 130a where the light emitting region A of the heat radiating circuit board is not defined and the bottom surface 110a of the chassis 110. have.

In addition, a plurality of protrusions 131 are formed under the support substrate 130 of the bent region 130b in which the light emitting region A of the heat radiating circuit board is defined.

Meanwhile, a plurality of grooves 111 are formed in the side surface 110b of the chassis 110 to correspond to the protrusion 131 of the heat dissipation circuit board, and the protrusion 131 and the chassis 110 of the heat dissipation circuit board are formed. By fitting the grooves 111 of the side surface 110b with each other, the side surface 110b may be coupled without a separate adhesive layer.

In addition, by forming the protrusion 131 on the adhesive surface of the chassis 110 and the heat dissipation circuit board, the contact area can be extended to improve heat dissipation.

According to various embodiments as described above, by attaching the heat dissipation circuit board directly to the chassis without a blanket, it is possible to secure the heat dissipation while not occupying a light emitting area.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, It belongs to the scope of right.

Chassis Structures 100, 200, 300, 400
Support substrate 130
Chassis 110
Heating element 170
Adhesive Layer 120, 151, 153a, 153b

Claims (11)

Chassis including bottom surface,
A heat dissipation adhesive layer formed on the bottom surface of the chassis, and
A blanket integrated heat dissipation circuit including a first region in which a light emitting device is mounted, and a second region bent from the first region, wherein a bottom surface of the second region is bonded to the heat dissipation adhesive layer to contact the bottom surface of the chassis. Board
Chassis structure comprising a. The method of claim 1,
The heat dissipation circuit board
A support substrate comprising the first region and the second region bent to each other,
An insulating layer formed on the support substrate,
A circuit pattern or pad formed on the insulating layer, and
A chassis structure comprising solder resist exposing the pad. The method of claim 1,
The adhesive layer is a chassis structure of a thermal interface material (TIM). The method of claim 3,
The adhesive layer is a chassis structure formed in the form of a tape. The method of claim 2,
And the circuit pattern is formed in the first region. The method of claim 1,
The chassis includes a side that is bent vertically from the bottom surface to form a receiving space. The method according to claim 6,
The heat dissipation circuit board includes a plurality of coupling protrusions on a lower surface of the support substrate,
A plurality of coupling grooves on the side of the chassis,
Chassis structure that the coupling protrusion and the plurality of coupling grooves are fitted. The method according to claim 6,
The chassis structure has a chassis structure in which the first area of the heat dissipation circuit board is in contact with the side surface of the chassis. The method according to claim 6,
The adhesive layer is formed in common to the first region and the second region of the support substrate. The method of claim 1,
The light emitting device is a chassis structure. Bottom chassis with bottom surface,
A heat dissipation adhesive layer formed on the bottom surface of the chassis,
A first region in which the light emitting device is mounted, and a second region bent from the first region, wherein a bottom surface of the second region is bonded to the heat dissipation adhesive layer to contact the bottom surface of the bottom chassis. A light source including a circuit board, and
The light guide plate is disposed on the bottom surface of the bottom chassis and emits light to the upper surface by irradiating light from the light source to the side surface.
Backlight unit comprising a.

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