WO2006080198A1 - Planar illuminating device - Google Patents

Planar illuminating device Download PDF

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Publication number
WO2006080198A1
WO2006080198A1 PCT/JP2006/300374 JP2006300374W WO2006080198A1 WO 2006080198 A1 WO2006080198 A1 WO 2006080198A1 JP 2006300374 W JP2006300374 W JP 2006300374W WO 2006080198 A1 WO2006080198 A1 WO 2006080198A1
Authority
WO
WIPO (PCT)
Prior art keywords
light source
point
surface
recess
point light
Prior art date
Application number
PCT/JP2006/300374
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroshi Johmen
Makoto Satoh
Original Assignee
Minebea Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2005-021673 priority Critical
Priority to JP2005021673A priority patent/JP2006210183A/en
Application filed by Minebea Co., Ltd. filed Critical Minebea Co., Ltd.
Publication of WO2006080198A1 publication Critical patent/WO2006080198A1/en

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0085Means for removing heat created by the light source from the package
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
    • G02B6/00Light guides
    • G02B6/0001Light guides specially adapted for lighting devices or systems
    • G02B6/0011Light guides specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0081Mechanical or electrical aspects of the light guide and light source in the lighting device peculiar to the adaptation to planar light guides, e.g. concerning packaging
    • G02B6/0086Positioning aspects
    • G02B6/009Positioning aspects of the light source in the package
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10424Frame holders

Abstract

A planar illuminating device in which heat from a point-like light source is effectively radiated taking full advantage of heat conductivity of a metal material and that can prevent positional displacement of the point-like light source. The planar illuminating device (11) has a light guiding plate (2), a point-like light source (3) provided on a light incident surface (2a) of the light guiding plate (2), a circuit board (4) for mounting the point-like light source (3), and a frame (6) for mounting these elements. A recess (10) having a through- hole provided in its bottom surface is formed on one surface (8a) side of a side wall (8), made of a metal material, of the frame (6). The point-like light source (3) is received in the recess (10), with a part of the mounting surface (3b) made to be in contact with the bottom surface of the recess (10), and is connected through the through-hole of the recess (10) to the circuit board (4) provided along the surface (8b) opposite the one surface of the side wall (8). By this, heat produced by the point-like light source (3) can be efficiently transmitted to the frame (6) and radiated.

Description

Specification

Planar lighting device

Technical field

[0001] The present invention relates to a planar lighting device of the sidelight type, particularly to a planar lighting device used as a lighting hand stage of the liquid crystal display device.

BACKGROUND

[0002] In the auxiliary light source for a liquid crystal display device used in a portable telephone or the like, the planar lighting device of the sidelight method of arranging the primary light source to the side end face of the light guide plate is mainly used (hereinafter, the primary light source There refers arranged side end surface even with light incident surface). As the primary light source of the planar lighting device of the sidelight type, conventionally, a cold cathode lamp has been used, at present, superior handling properties as compared to the cold cathode lamp, miniaturization is easy, shock resistant point light source of the white LED or the like is often used with excellent sex. Tend to applications to expand the planar lighting device using such a point light source is not limited to small-sized liquid crystal display device mounted on a cellular phone or the like, for example, relatively display size is large vehicle Nabiguta applied as an auxiliary light source of a liquid crystal display device used even come to be considered, Ru.

[0003] To accommodate expansion of such illumination area is to increase the current supplied to the point light source, it'll connexion, it is desirable to increase the amount of light emitted per point light sources. However, when the current supplied to the point light source increases, the amount of heat generated with the emission also increases, the heat generation problem of the luminous efficiency of the point light source for temperature rise is reduced by the arising. Further, when the heat generated from the point light source is transmitted to the light guide plate, as a result of the light guide plate expands, it occurs positional displacement point light source coupling efficiency between the point light source and the light guide plate caused Chi lowered.

[0004] Therefore, a method of escape to enable outside point light source force generated heat has been studied, for example, as the spread illuminating apparatus 1 shown in FIG. 5, the light guide plate 2, flexible printed Doo substrate (hereinafter also referred to as FPC) and the point-like light source 3 mounted on the 4, in their planar lighting device having a frame 5 for holding together, thermal conductivity such as aluminum material constituting the frame 5 it has been proposed to use a metal material having excellent resistance. Further, as a more efficient means for releasing heat to the outside, FPC 4 and the through-hole formed in a metal frame 5a of the back, the arrangement for filling the thermal conductivity of high! ヽ adhesive filler into the through-hole dissipating device point-like light source having has been proposed (e.g., see Patent Document 1). In this heat dissipation device, and a light source support frame also bottom and a metal material force that is closest package surface to the light emitting portion serving as a heating center of the point light source, the thermal conductivity of the high than FPC, connect with an adhesive filler What child stranded Rukoto 〖, improvement of heat dissipation characteristics are achieved.

Patent Document 1: JP 2002- 162626 JP

Disclosure of the Invention

Problems that the Invention is to you'll solve

[0005] However, even using even high thermal conductivity adhesive filler, the thermal conductivity of the adhesive charge Hamazai is generally to 1Z100 following metallic materials, thermal device release described in Patent Document 1 It can not be said to be necessarily take full advantage of the heat dissipation effect of the frame made of a metal material force. Further, the planar lighting device described in Patent Document 1, One to misalignment of the point light source due to the thermal expansion of the light guide plate, Te, special measures are subjected, it.

[0006] Accordingly, the present invention is to thermally effectively radiate from the point light source to make the most of heat conductive metal material, a planar lighting device capable of preventing a positional deviation of the point light source an object of the present invention is to provide.

Means for Solving the Problems

[0007] To achieve the above object, the spread illuminating apparatus according to the present invention, a light guide plate, and the point-like light source disposed on the incident surface of the light guide plate, the circuit board for mounting the said point-like light source When, in the planar illumination device having a frame for them tower mounting, the frame comprises a sidewall ing a metallic material, on one surface side of the side wall, the recess having a through hole is provided on the bottom surface is formed and which, said circuit board, said said recess formed surface of the side wall are arranged Te 沿Tsu on the opposite side, the point light source, the contact part of the mounting surface to the bottom surface of the recess accommodated in the recess by, and electrodes of the point light source is characterized in that it is connected to the circuitry substrate through the through-hole.

[0008] Further, in the planar illumination device according to the present invention, the gap between the outer peripheral surface and the inner peripheral surface of said recess of said point-like light source, a characterized in that the thermally conductive material is filled to. Effect of the invention

[0009] According to the planar illumination device according to the present invention, since a configuration in which the point-like light sources to direct contact with the mounting surface of also the side walls and the point light source metal material force of the frame to be mounted, a metal material heat by utilizing the conductive maximally, it is possible to obtain excellent heat dissipation characteristics. And it connexion, while suppressing the temperature rise and drop of the light emission efficiency accompanying the point light sources makes it possible to increase the current provided feeding to point-like light source, increasing the amount of light emitted per point light source Te, it is possible to obtain a high-luminance surface lighting device. Furthermore, the point light source is to be disposed is accommodated in a recess provided in the side wall of the frame, it is possible to suppress a positional deviation of the point light source, the coupling efficiency between the point light source and the light guide plate it is possible to prevent the deterioration.

[0010] Further, in the planar illumination device according to the present invention, if the gap corresponding to between the inner peripheral surface of the concave outer peripheral surface and the point-like light source of point light source is accommodated is present, the thermal conductivity in the gap by having a configuration to fill the sexual material, in addition to the thermal conduction that by the direct contact between the mounting surface and the frame of the point light sources, heat conduction path to the frame from the outer peripheral surface of the point light source is also ensured, Yu with heat radiation characteristics which are retained can be fixed to ensure that the recess of the point light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] FIG. 1 is an exploded perspective view showing a main part of a planar illumination device according to an embodiment of the present invention.

[Figure 2] the point light sources to be mounted on the planar lighting device illustrated in FIG. 1 is a perspective view from the mounting surface.

In the spread illuminating apparatus shown in FIG. 3 FIG. 1 is a perspective view showing an enlarged recess for accommodating the point light sources.

In the spread illuminating apparatus shown in FIG. 4 FIG. 1 is a sectional view showing an enlarged vicinity of one point light source, (a) is a horizontal sectional view, (b) is a side sectional view.

Is a perspective view showing the FIG. 5 conventional spread illuminating apparatus.

DESCRIPTION OF SYMBOLS

[0012] 2: the light guide plate

3: point light sources

3b: the mounting surface 4: a flexible printed circuit board

6: Frame

8: side wall

10: recess

10a: heat transfer portion

10b: through-hole

11: the planar lighting device

BEST MODE FOR CARRYING OUT THE INVENTION

[0013] Hereinafter, will be explained with reference to the embodiment accompanying drawings of the present invention, the drawings are of Me other description, do not necessarily accurately reflect the actual shape, dimension. In addition, through 1-4, the same components as those of the planar lighting device 1 shown in FIG. 5, reference the same reference numerals.

Figure 1 is an exploded perspective view showing a main part of a planar illumination device 11 in an embodiment facilities embodiment of the present invention. Planar illumination device 11 in this embodiment is implemented with the light guide plate 2, and three point light sources 3 which are arranged on the light incident surface 2a which is one end surface of the light guide plate 2, the point light sources 3 It includes a flexible printed circuit board (FPC) 4 is a circuit board, a frame 6 for mounting them. Here, the light guide plate 2 is, for example, by molding a transparent 榭脂 made plate-shaped light guide, such as an acrylic 榭脂 Ya polycarbonate 榭脂, the point light source 3, for example, white LED power, the surface ( hereinafter also light emitting surface, earthenware pots) 3a is disposed opposite to the light incident surface 2a of the light guide plate 2, Ru.

[0014] In the present embodiment, the frame 6 is preferably made of metal material having excellent thermal conductivity such as aluminum, a flat portion 7 for mounting the light guide plate 2, provided light incident surface 2a side of the light guide plate 2 It is configured to have a side wall 8 that is. Further, the side walls 8, on one surface 8a side opposite to the light incident surface 2a of the light guide plate 2, the concave portion 10 for accommodating the respective point light sources 3 are formed. FP C4, for example on a film substrate such as polyimide, (FIG. 1 illustrates only a portion) point light source because was supplying a driving current to the third predetermined wiring pattern is formed also than, is disposed along the face 8b opposite to the surface where recesses 10 are formed in the side wall 8, it is fixed to the side wall 8 by means of sticking or adhesion. The aforementioned wiring patterns, include land portion 4a electrode point-like light source 3 to be described later is connected, FPC 4 is the rear surface of the point light sources 3 side to expose the run-de portion 4a through the side walls 8 (hereinafter, also referred to as mounting surface) is arranged so as to face the, Ru.

[0015] Referring now to FIGS. 2 and 3, theory bright-configuration of the recesses 10 in this embodiment. Figure 2 is a perspective view of the point light source 3 from the mounting surface 3b side, FIG. 3 is a perspective view showing an enlarged recess 10. As shown in FIG. 2, on the mounting face 3b of the point light source 3, two electrodes 3c are formed. The recess, as shown in FIG. 3, the bottom surface of the recess 10 which is a point light source 3 is accommodated is provided with two through holes 10b, the remaining part thereof, as the heat transfer unit 1 Oa having a flat surface those forming a substantial bottom 10. These heat transfer members 10a and the through hole 10b, as described later, the point light source 3 when accommodated in the recess 10, the point-like portion whose area 3d of the mounting surface 3b of the light source 3 is heat transfer portion 10a contacts the, and it is configured such that each electrode 3c is arranged on each corresponding through-hole 10b, Ru.

[0016] Next, with reference to FIGS. 1 to 4, a description will be given of a manner of arrangement of the point light sources 3 and FPC4 in this embodiment. Here, FIG. 4 (a), in the spread illuminating apparatus 11, a horizontal sectional view of the vicinity of one point light source 3 from the upper surface side, FIG. 4 (b), likewise one point the Jo light source 3 near a side cross sectional view seen from the side. In the present embodiment, the point light sources 3 is housed in a recess 10 formed in the side wall 8 of the frame over arm 6, in which, as shown in FIGS. 4 (a) and 4 (b), recesses opening shape of 10 is larger slightly than the outer shape of the point light sources 3, the gap between the inner circumferential surface 10d of the outer peripheral surface 3e and recesses 10 of the point light sources 3, the thermally conductive material 14 is filled It is. Thermally conductive material 14 in this embodiment is a shall which have a electrical insulation, for example, 榭脂 material silicone, or alumina, aluminum nitride, nonconductive thermal conductivity such as carbonization silicon it can be used high thermal conductivity 榭脂 material sexual FILLER one was added. In this way, the point light sources 3 are arranged and fixed at a predetermined position in the recess 10, in the predetermined position, the region 3d of the mounting surface 3b contacts the heat transfer portion 10a forming the bottom surface of the recess 10, and each electrode 3c are intended to be placed on the corresponding through-hole 10b. In the present embodiment, the depth of the recess 10 is made shallower shape than the thickness of the point light sources 3, when the point light sources 3 are disposed at a predetermined position in the recess 10, the emission of the point light source 3 surface 3a are those which projects the light guide plate 2 side than the surface 8a of the side wall 8. [0017] FPC 4 which is disposed and fixed on the surface 8b side of the side wall 8, as shown in FIG. 4 (b), the land portion 4a, is aligned with the through hole 10b of the recess 10, from the surface 8b side It is arranged so as to face the corresponding electrodes 3c, respectively that of the point light sources 3, each of the land portions 4a are connected by their electrodes 3c and any suitable conductive adhesive 12.

[0018] The above-configured surface illumination device as 11 causes the light point light source 3 by a driving current supplied via the FPC 4, guiding the light incident from the light entrance surface 2a to the light guide plate 2 by uniformly emitted from the surface 2b while propagating to the inner portion of the optical plate 2 is intended to function as a surface light source. At that time, the point light source 3 is arranged to be received in the recess 10 formed in the side wall 8 of the frame 6, the mounting surface 3b and the metal material of the direct light portion which is also the heat source of the point-like light sources 3 (die) since the direct contact without passing through the thermal resistance elements of the side wall 8 and the force FPC4 or other 榭脂 materials of the frame 6 becomes a force, heat occurred with the light emission of the point light sources 3, a concave portion 10 efficiently conducted to the frame 6 side through the heat transfer members 10a, Ru is radiated. This Yotsute, it is possible to increase the drive current supplied while suppressing a decrease in the temperature rise and luminous efficiency associated therewith the point light source 3, to increase the Shako discharge amount per one of the point light sources 3 Te, it is possible to achieve higher brightness of the planar lighting device 11. Further, by the point-like light source 3 is accommodated in the recess 10, for example by heat generated from the point light source 3 to the light guide plate 2, even if the thermal expansion occurs without misalignment in the point light source 3 occurs , reduction of the coupling efficiency between the point-like light source 3 and the light guide plate 2 is prevented.

[0019] Karoete, thermally conductive material 14 filled in the gap between the inner peripheral surface 10d of the outer peripheral surface 3e and recesses 10 of the point light source 3, from the outer peripheral surface 3e of the point light sources 3 of the frame 6 together to secure the route of heat transfer to the side walls 8, fulfills the function of securely fixing the point light source 3 into the recess 10, it is to facilitate the achievement of high brightness of the planar lighting device 11.

[0020] In order to verify the operation and effect described above, by numerical analysis based on the finite volume method, configuration of the planar lighting device 11 of the conventional structure and the present embodiment as the spread illuminating apparatus 1 shown in FIG. 5 for, it was compared and the heat dissipation effect. The conditions used in the analysis are as follows. First, the definition of material (corresponding to 5052 secondary aluminum © beam member) a thermal conductivity of the frame 137WZm'K, 140. The plane direction of the thermal conductivity of FPC 3W / mK, likewise in the thickness direction thermal conductivity rates and 0. 304WZm'K, and point light source and the frame, the thermal conductivity of 榭脂 material interposed between the point light sources and FPC, and the FP C and the frame and 2WZm'K. Further, the ambient temperature of 25 ° C, and the heating value of the point light source and 0. 35W. As a result of performing the calculation by the above setting, in the conventional structure, the light emitting portion temperature of the point light source whereas was 67. 6 ° C, in the configuration of the planar lighting device 11 of the present embodiment, the light emitting portion temperature was shown to be reduced to 61. 7 ° C.

In the planar illumination device 11 in this embodiment, the opening shape of the recess 10 for accommodating the point light sources 3 were as forming slightly larger than the outer shape of the point light source 3, a planar according to the present invention a lighting device, so that the contour of the opening shape and the point light sources 3 of the recess 10 is formed so that to substantially match the inner circumferential surface 10d of the outer peripheral surface 3e and recesses 10 of the point light source 3 is in direct contact it may be configured to.

Further, in the planar illumination device 11 in this embodiment, the point light sources 3, the frame has been assumed that the two electrodes 3c are arranged so as to be arranged in the thickness direction of the light guide plate, the point light source 3 6 it can be the angle attachment to the side wall 8 of the arbitrarily set. The shape of the through holes 10b provided on the bottom surface of the concave portion 10 is formed in any suitable shape corresponding to the shape of the point light sources 3 of the electrode 3c which Nag limited to a rectangle as shown in FIG. 3 be able to.

Claims

The scope of the claims
[1] and the light guide plate, and the point-like light source disposed on the incident surface of the light guide plate, and the circuitry board to implement the point-like light source, in the planar illumination device having a frame for mounting them,
Wherein the frame includes a side wall which also metallic material forces, on one surface side of the side wall, penetrations holes are recess provided formed on the bottom surface,
It said circuit board is arranged along a surface opposite to the recess formed surface of the side wall,
The point light source is housed a part of the mounting surface in the recess in contact with the bottom surface of the recess, the electrode of the point-like light source, and features a Rukoto connected to the circuit board through the through-hole a planar illumination device for.
[2] into the gap between the outer peripheral surface and the inner peripheral surface of the concave portion of the point light source, the thermally conductive material is Hama charge planar lighting device according to claim 1, characterized in Rukoto .
PCT/JP2006/300374 2005-01-28 2006-01-13 Planar illuminating device WO2006080198A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005-021673 2005-01-28
JP2005021673A JP2006210183A (en) 2005-01-28 2005-01-28 Planar lighting equipment

Publications (1)

Publication Number Publication Date
WO2006080198A1 true WO2006080198A1 (en) 2006-08-03

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ID=36740232

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/300374 WO2006080198A1 (en) 2005-01-28 2006-01-13 Planar illuminating device

Country Status (3)

Country Link
JP (1) JP2006210183A (en)
TW (1) TW200641479A (en)
WO (1) WO2006080198A1 (en)

Cited By (2)

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EP1947490A2 (en) * 2006-09-25 2008-07-23 Samsung Electronics Co., Ltd. Backlight assembly and cover for a compact display apparatus
EP2527890A1 (en) * 2011-05-25 2012-11-28 Kocam International Co., Ltd. Backlight module with three-dimensional circuit structure

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KR101284053B1 (en) * 2006-10-26 2013-07-10 삼성디스플레이 주식회사 Back-light assembly and display apparatus having the same
KR101303892B1 (en) 2006-11-03 2013-09-05 삼성디스플레이 주식회사 Backlight assembly and liquid crystal display having the same
KR101367132B1 (en) 2006-12-05 2014-02-25 삼성디스플레이 주식회사 Light source unit, light emission device and display device provided with the same
JP4973213B2 (en) 2007-01-31 2012-07-11 三菱電機株式会社 Light source device, planar light source device, and display device
JP2010122330A (en) * 2008-11-18 2010-06-03 Hitachi Displays Ltd Liquid crystal display device
KR101055023B1 (en) * 2010-01-15 2011-08-05 엘지이노텍 주식회사 Backlight unit and display device using same
EP2431654B1 (en) * 2010-09-17 2018-11-14 LG Innotek Co., Ltd. Lighting module and lighting apparatus including the same
US9563008B2 (en) 2010-09-17 2017-02-07 Lg Innotek Co., Ltd. Lighting module and lighting apparatus including the same
KR20120095625A (en) * 2011-02-21 2012-08-29 삼성전자주식회사 Display module and display apparatus having the same
JP6026606B1 (en) * 2015-08-25 2016-11-16 コンクラフト ホールディング コーポレーション エルティーデーConcraft Holding Co., Ltd. Light guiding structure of fingerprint authentication panel

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JP2002299700A (en) * 2001-04-02 2002-10-11 Nichia Chem Ind Ltd Led illuminating device
WO2003056636A1 (en) * 2001-12-29 2003-07-10 Hangzhou Fuyang Xinying Dianzi Ltd. A led and led lamp

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EP1947490A2 (en) * 2006-09-25 2008-07-23 Samsung Electronics Co., Ltd. Backlight assembly and cover for a compact display apparatus
EP1947490B1 (en) * 2006-09-25 2014-09-24 Samsung Display Co., Ltd. Backlight assembly and cover for a compact display apparatus
EP2527890A1 (en) * 2011-05-25 2012-11-28 Kocam International Co., Ltd. Backlight module with three-dimensional circuit structure

Also Published As

Publication number Publication date
JP2006210183A (en) 2006-08-10
TW200641479A (en) 2006-12-01

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