KR100574407B1 - Luminous device including LED chip and method for producing the same - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device including an LED chip used to provide a light source to a display device and the like, and more particularly, to an electrical connection with a substrate portion for driving a light source device. The present invention relates to a light source device having a configuration capable of connecting with a substrate portion through electrodes formed on the substrate, and a method of manufacturing the same. In the above-described light source device, a first electrode and a second electrode for electrically connecting the LED chip are formed on one surface thereof, and the first electrode and the second electrode are in the lateral direction so as to contact the substrate part for driving the light source device from the side surface. A substrate portion formed to be exposed to the outside, mounted parallel to one surface of the substrate portion, formed on the LED and the substrate portion electrically connected to the first electrode and the second electrode formed on the substrate portion, protecting the LED portion, and It may include a bracket for encapsulating the LED portion with a coating material.

Leads, Electrodes, Right Angles, Substrates, Flexible Substrates

Description

Luminous device including LED chip and method for producing the same             

Figure 1a is a view explaining the operation structure of the backlight unit according to the prior art.

Figure 1b is a view showing the configuration of a light source device of the backlight unit according to the prior art.

2 is a view illustrating an operation structure of a backlight unit according to a preferred embodiment of the present invention.

3A and 3B show the structure of a light source device according to a first preferred embodiment of the present invention.

4A and 4B show the structure of a light source device according to a second preferred embodiment of the present invention.

5A and 5B show the structure of a light source device according to a third preferred embodiment of the present invention.

6A and 6B show the structure of a light source device according to a fourth preferred embodiment of the present invention.

7 is a flowchart illustrating a manufacturing process of a light source device according to a preferred embodiment of the present invention.

8A to 8D are views showing a manufacturing process of the light source device according to the first preferred embodiment of the present invention.

9A to 9D are views illustrating a manufacturing process of a light source device according to a second preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

205: LED Chip

210-1: first electrode

210-2: second electrode

215: substrate portion

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device including an LED chip used to provide a light source to a display device and the like, and more particularly, to an electrical connection with a substrate unit for driving the light source device. It relates to a light source device having a configuration that can be connected to the substrate portion through an electrode formed on the side surface and a manufacturing method thereof.

Display panel is an essential component in the transmission of text and image information, and is now an important component-based industry that is categorized into three major parts industries along with semiconductors and batteries. It is pagination. In the past, the display device was mainly occupied by a CRT device, but today, the display device is being replaced by a flat panel display device in terms of light weight, small size, and mobile convenience. Among flat panel display devices, LCD devices are widely used due to low power consumption, high definition, and stabilization of technology.

Unlike PDP (PLASMA DISPLAY PANEL) and FED (FIELD EMISSION DISPLAY), transmissive LCD (Liquid Crystal Display) is a light-receiving element, so it cannot be used in the absence of light. The backlight unit (BLU) refers to a device that is located under the LCD panel PANEL which does not have a self-luminous power so as to irradiate uniform plane light to recognize the LCD.

Referring to FIG. 1A, the operation structure of a light source device in a conventional backlight unit is shown.

The light generated by the light source device 100 is converted into planar light through the backlight unit 170, and then uniformly irradiated to the liquid crystal display panel 160. Here, the liquid crystal display panel 160 is a display device driven by a voltage or an external force by the principle of liquid crystal.

As a light source device of such a backlight unit, LED (LIGHT EMITTING DIODE), CCFL (COLD CATHODE FLUORESCENT LAMP) and the like are used. LED (LIGHT EMITTING DIODE) can generate a small number of carriers (electrons or holes) injected using the p-n junction structure of the semiconductor, and can emit light by recombination of these. In the CCFL (COLD CATHODE FLUORESCENT LAMP), the electrode is disposed on the back of the discharge tube, and can provide high brightness and uniform light. Hereinafter, the LED will be described.

Referring to FIG. 1B, the internal structure of the light source device is shown in detail.

According to the prior art, the LED package uses a method of forming an electrode on the other surface corresponding to one surface on which the LED chip is mounted, and combining the electrode formed on the other surface with the substrate unit 150 to drive the LED package. Therefore, the substrate unit 150 is inconvenient to take a curved structure as shown in Figure 1b, and uses a flexible printed circuit board (FPCB) to satisfy this condition.

Flexible printed circuit boards (FPCB, FLEXIBLE PRINTED CIRCUITS BOARD) has the flexibility, it can replace the existing cable weak in flexibility in the moving part, but has the disadvantage of being expensive compared to the general printed circuit board.

In general, in the LCD, due to the constraint that the substrate portion of the curved structure must be used, the manufacturing process is complicated and the manufacturing cost increases. For example, due to the electrode arrangement of the LED chip, there is a limit to the use of a flexible circuit board to satisfy the bending conditions.

As shown in FIG. 1B, the electrode is disposed on the other surface even when the lead frame is used, in addition to the electrode disposed on the other surface through the through hole.

As described above, the related art has a problem in that a substrate portion having a curved structure is used due to an electrode formed in a direction opposite to the direction in which incident light is dimmed.

Accordingly, the present invention has been made to solve the above problems, and to provide a light source device having a configuration that can be connected to the side of the substrate portion through the electrode formed on the side.

In addition, another object of the present invention to provide a method of manufacturing a light source device having a structure in which an electrode is formed on the side.

Further, another object of the present invention is to eliminate the complicated high-thickness junction structure by providing a light source device having a side junction structure.

According to one aspect of the present invention for achieving the above object, there can be provided a light source device having a configuration that can be connected to the substrate portion and the side.

In the above-described light source device, a first electrode and a second electrode for electrically connecting the LED chip are formed on one surface thereof, and the first electrode and the second electrode are in contact with the substrate part for driving the light source device from the side surface. A substrate portion formed to be exposed to the outside in the lateral direction, mounted parallel to one surface of the substrate portion, and formed on the LED and the substrate portion electrically connected to the first electrode and the second electrode formed on the substrate portion, It may include a bracket for protecting the LED unit, and encapsulating the LED unit with a predetermined coating material.

The LED may be wire-bonded with the first electrode and the second electrode, or may be bonded with the first electrode through a conductive adhesive, and may be wire-bonded with the second electrode. In addition, the LED may be flip chip bonded to the first electrode and the second electrode, respectively.

According to another aspect of the present invention for achieving the above object, there can be provided a method of manufacturing a light source device for side-contacting the substrate portion.

The method of manufacturing a light source device includes (a) forming a pattern of a first electrode and a second electrode on an upper side and a side of a substrate portion for electrically connecting the LED chip, and (b) mounting the LED chip on the substrate portion. And (c) bonding the first and second electrodes to the LED chip.

The manufacturing method may further include attaching a bracket to the upper portion of the substrate and cutting the substrate so that the first and second electrodes formed on the side surface are exposed to the outside. Of course, the manufacturing method may further include cutting the substrate portion so that the first electrode and the second electrode formed on the side surface are exposed to the outside, and attaching a bracket to the upper portion of the substrate portion.

Hereinafter, a preferred embodiment of a light source device including a LED chip and a method of manufacturing the same according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. The same or corresponding components are given the same reference numerals and redundant description thereof will be omitted.

Principle of operation

2 is a view showing a coupling structure of a light source device according to a preferred embodiment of the present invention.

Referring to FIG. 2, an LCD 160, a backlight unit 170 for injecting planar light into the LCD 160, and a light source device 200 for generating incident light are illustrated, and the light source device 200 is illustrated. The side of the has a structure in contact with the substrate 250. The light generated by the light source device 200 according to the present invention is converted into planar light through the backlight unit 170 and then uniformly irradiated to the liquid crystal display panel 160.

The liquid crystal used in the LCD 160 has a specific state property that exhibits anisotropy such as crystals, and uses an organic compound called a thermotropic liquid crystal which becomes a liquid crystal at a predetermined temperature range. Here, since the liquid crystal itself does not emit light, it requires a light source from the outside. Therefore, the LCD panel 160 is an essential component of a backlight in the form of a surface light source capable of maintaining the entire screen at a uniform brightness.

The backlight unit 250 includes a light source device 100 and a light guide member, a reflecting plate, a prism plate, a diffusion plate, a driving unit, and the like, which are not shown in the drawing.

In the coupling with the substrate unit to drive the light source device 200, unlike the prior art, it is coupled with the substrate through an electrode formed on the side of the light source device. By forming the electrode for connecting to the substrate portion in this way, it is not necessary to form the substrate portion of the curved structure, so there is no need to use a flexible circuit board.

According to the conventional method, the LED package is formed in the opposite direction to the radiation direction of the LED chip, there is a limit to use the substrate portion of the curved structure in order to connect the LED package and the drive unit. However, the light source device according to the present invention can use the substrate portion 20 having a linear structure by forming an electrode on the side.

Electrode Formation Method

Hereinafter, an electrode pattern and a bonding method according to the present invention will be described with reference to some preferred embodiments, but it is obvious that the electrode forming structure according to the present invention is not limited to the above embodiment. A feature of the present invention is to form an electrode for coupling with the substrate portion on the side surface of the semiconductor package, so that the radial direction of the chip and the formation direction of the contact electrode are formed at right angles to connect the substrate portion without bending the substrate portion.

3A and 3B are views showing the structure of a light source device according to a first embodiment of the present invention. 3A and 3B, illustrations of general package components, such as a molding resin and an outer case, are omitted in order to avoid confusion in the description. 3A is a view showing the structure of a light source device according to a preferred embodiment of the present invention, Figure 3B is a view showing a cross-sectional view of a light source device according to a preferred embodiment of the present invention.

3A and 3B, the light source device according to the first embodiment may be electrically connected to a substrate through a substrate 215, an LED chip 205 mounted on the substrate, and wire bonding with the LED chip. The first and second electrodes 211-1 and 211-2 are connected to each other.

Here, the first and second electrodes 211-1 and 211-2 formed on the substrate 215 are not exposed to the lower portion of the substrate 215, but as shown in FIG. 3B. It is formed to be exposed to the side. That is, since the radiation direction of the light source and the substrate portion are formed at right angles, the first and second electrodes 211-1 and 211-2 formed on the side surfaces of the light source device are replaced with the first and second electrodes 211-1 and 211-. Corresponding to 2) can be electrically connected to leads not shown in the figure formed on the substrate portion. Therefore, by being configured to contact the substrate portion and the side surface of the light source device according to the present invention, it is not necessary to use the substrate portion of the curved structure.

4A and 4B show the structure of a light source device according to a second preferred embodiment of the present invention. 4A and 4B, general package components such as a molding resin, an outer case, etc. are omitted in order to avoid confusion in the description. 4A is a view showing the structure of a light source device according to a preferred embodiment of the present invention, Figure 4B is a view showing a cross-sectional view of the light source device according to a preferred embodiment of the present invention.

4A and 4B, the light source device according to the second embodiment may be electrically connected to a substrate through a substrate 215, an LED chip 205 mounted on the substrate, and wire bonding with the LED chip. The first and second electrodes 212-1 and 212-2 are connected to each other.

The first and second electrodes 212-1 and 212-2 are formed to extend in the mounting direction of the LED chip 205 than the electrodes 211-1 and 211-2 of the second embodiment. Therefore, wire bonding between the LED chips 212-1 and 212-2 can be symmetrically performed in the 180 direction.

Since other descriptions are the same as or similar to those of the first embodiment of FIGS. 3A and 3B, they will be omitted.

5A and 5B are views showing the structure of a light source device according to a third embodiment of the present invention. 5A and 5B, general package components such as a molding resin, an outer case, etc. are omitted in order to avoid confusion in the description. 5A is a view showing the structure of a light source device according to a preferred embodiment of the present invention, Figure 5B is a view showing a cross-sectional view of a light source device according to a preferred embodiment of the present invention.

5A and 5B, the light source device according to the third embodiment includes a substrate 215, an LED chip 205 mounted on the substrate, and a first electrically connected to the LED chip. And second electrodes 213-1 and 213-2.

Here, the LED chip 205 is electrically connected to the first electrode 213-1 through wire bonding, and the second electrode is mounted on the second electrode 410-2 by using a conductive adhesive. Thereby electrically connected. Since other descriptions are the same as or similar to those of the first embodiment of FIGS. 3A and 3B, they will be omitted.

6A and 6B are views showing the structure of a light source device according to a fourth preferred embodiment of the present invention. 6A and 6B, general package components such as a molding resin, an outer case, etc. are omitted in order to avoid confusion in the description. 6A is a view showing the structure of a light source device according to a preferred embodiment of the present invention, Figure 6b is a view showing a cross-sectional view of a light source device according to a preferred embodiment of the present invention.

6A and 6B, the light source device according to the fourth embodiment includes a substrate 216, an LED chip 206 mounted on the substrate, and a first electrically connected to the LED chip. And second electrodes 214-1 and 214-2.

Here, the LED chip 206 is not mounted in contact with the substrate 200, but is mounted on the first and second electrodes 210-1 and 210-2 by using a conductive adhesive, and is separately wire bonded. Work is unnecessary. The LED chip 206 is flip chip bonded with the first and second electrodes 214-1 and 214-2 by a conductive adhesive using a die bonder. For example, in performing the flip chip bonding, bonding may be performed by forming a solder bump having a protruding shape made of a solder or a metallic material such as Au or Sn-Ag-based alloy. Since other descriptions are the same as or similar to those of the first embodiment of FIGS. 3A and 3B, they will be omitted.

Manufacturing flowchart

Hereinafter, a manufacturing process of a semiconductor chip package having an electrode formed on a side surface according to the present invention will be described with reference to the accompanying drawings. According to the present invention, the electrode is formed on the side surface and the pattern may be manufactured by various methods such as lead frame, through hole, via hole formation, and the like, and is not limited to the manufacturing method described below.

7 is a flowchart illustrating a manufacturing process of a light source device according to a preferred embodiment of the present invention.

In operation S710, a predetermined electrode pattern is formed on the substrate. The predetermined electrode pattern includes first and second electrodes, and may further include a separate heat-dissipating copper foil corresponding to a position where the LED chip is formed. .

In step S720, an electrode is formed on the side of the substrate portion. A method of forming an electrode in the substrate portion is as follows. That is, by deepening the etching, by cutting the substrate portion to expose the side, it may be configured to form a side electrode (Figs. 8a to 8d), or may be configured to form the electrode on the side through a separate plating process. (FIGS. 8A-8D).

After the electrode is formed in this way, the mounting and bonding operations are performed in step S730, the bracket is mounted in step S740, and a light source device according to the present invention is manufactured through an epoxy resin molding process.

Here, although the description was made based on the case in which the bracket is mounted after the cutting of the substrate, the mounting of the bracket may be configured to cut the substrate. Hereinafter, a method of manufacturing a light source device according to the present invention will be described in detail with reference to FIGS. 8A to 8B and 9A to 9B.

8A to 8D are flowcharts illustrating a manufacturing process of a light source device according to a first exemplary embodiment of the present invention. Hereinafter, a manufacturing method of a light source device having an electrode formed on a side thereof with reference to FIGS. 8A to 8D will be described.

First, as shown in FIG. 8A, a plurality of substrates on which a printed circuit corresponding to a preset pattern is formed is manufactured. According to a preferred embodiment, the substrate may be implemented as a printed circuit board (PCB), it is a matter of course that a flexible printed circuit board can be used.

Referring to FIG. 8A, the circuit pattern may include first and second electrodes 210-1 and 210-2, and may further include a heat dissipating copper foil 217. According to a preferred embodiment, the printed circuit board manufacturing process is as follows. The copper sheet is placed on a reinforcing fiberglass or plastic substrate and then covered with a photoresist, followed by an exposure process that shines light onto the photoresist through a circuit engraved negative film, followed by etching. And a printed circuit can be manufactured by passing an electrolytic cell containing a strong acid.

In FIG. 8B, the substrate 215 is cut to expose the first and second electrodes 210-1 and 210-2 on the side surface to form an electrode on the side surface. Here, the electrode area formed on the side surface may be adjusted by adjusting the etching depth. As shown in FIG. 8C, the LED chip is mounted through the adhesive member, and bonding such as wire bonding or flip chip bonding is performed. And in Fig. 8d, a bracket is attached on the substrate portion. And by performing a coating operation with an epoxy resin, it is possible to manufacture an LED chip with an electrode pattern according to the present invention.

Here, it is obvious that after mounting the bracket, it can be configured to cut the substrate portion.

9A to 9D are flowcharts illustrating a manufacturing process of a light source device according to a first exemplary embodiment of the present invention. Hereinafter, a manufacturing method of a light source device having an electrode formed on a side thereof with reference to FIGS. 9A to 9D will be described.

First, as shown in FIG. 9A, a plurality of substrates on which a printed circuit corresponding to a preset pattern is formed is manufactured. Here, the circuit pattern is configured to be formed only on the upper portion of the substrate portion. Here, it is preferable to configure so that the side portion is exposed so that the electrode can be formed on the side portion.

In FIG. 9B, the first and second electrodes 210-1 and 210-2 are formed on the side portions by plating the side portions by electroless plating or the like. A cutting operation of the substrate portion may be performed immediately after the side electrode forming step, or a cutting operation of the substrate portion may be performed after another process.

That is, as shown in FIG. 9C, the LED chip is mounted through an adhesive member, and the bonding including wire bonding or flip chip bonding is performed. And a bracket is attached on the said board | substrate part. And after performing a coating operation with an epoxy resin, it is possible to cut the substrate portion.

In addition, after cutting the substrate portion as shown in Figure 9d, mounting, bonding, attaching the bracket, etc. can be performed, and is not limited to the above-described embodiment, the cutting process may be configured to be performed after other processes. Of course. In addition, although the side electrode is formed to correspond to the side thickness of the substrate portion, it is natural that it can be configured to be formed only a part of the side thickness. Other descriptions are the same as or similar to those of the first embodiment of FIGS. 8A to 8B and will be omitted.

Although the technical idea of the present invention has been described in detail according to the above-described embodiment, the above-described embodiment is for the purpose of description and not of limitation, and a person of ordinary skill in the art of the present invention It will be understood that various embodiments are possible within the scope.

As described above, according to the present invention, there is an effect of providing a light source device having a configuration capable of connecting to the substrate portion and the side surface through an electrode formed on the side surface and a manufacturing method thereof.

In addition, the present invention also has the effect of eliminating the complicated high-thickness junction structure by providing a light source device of the side junction structure.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art to which the present invention pertains without departing from the spirit and scope of the present invention as set forth in the claims below It will be appreciated that modifications and variations can be made.

Claims (8)

A light source apparatus comprising an LED chip for generating incident light incident on a backlight unit for incident plane light on an LCD, On one surface, a first electrode and a second electrode for electrically connecting with the LED chip are formed by a plating process, and the first electrode and the second electrode are provided for side-to-side contact with a substrate portion for driving the light source device. A light source device substrate portion formed by a plating process so as to be exposed to the outside in the lateral direction; An LED mounted parallel to one surface of the light source device substrate and electrically connected to the first electrode and the second electrode formed on the light source device substrate; And And a bracket formed on an upper portion of the light source device substrate, the bracket protecting the LED and encapsulating the LED with a predetermined coating material. The method of claim 1, The LEDs And a wire bond with the first electrode and the second electrode, respectively. The method of claim 1, The LEDs And the first electrode is bonded through a conductive adhesive, and the second electrode is wire bonded to the first electrode. The method of claim 1, The LEDs And a flip chip bonded to the first electrode and the second electrode, respectively. A method of manufacturing a light source device comprising an LED chip for generating incident light incident on a backlight unit for incident plane light on an LCD, (a) forming a pattern of a first electrode and a second electrode for electrically connecting the LED chip to the top and side surfaces of the light source device substrate by a plating process; (b) mounting the LED chip to the light source device substrate; And (c) bonding the first and second electrodes with the LED chip. The method of claim 5, Attaching a bracket over the light source device substrate; And Cutting the light source device substrate so that the first electrode and the second electrode formed on the side surface are exposed to the outside Light source device manufacturing method characterized in that it further comprises. The method of claim 5, Cutting the light source device substrate to expose the first and second electrodes formed on the side surface; And Attaching a bracket to an upper portion of the light source device substrate; Light source device manufacturing method characterized in that it further comprises. The method according to claim 6 or 7, Coating an upper portion of the light source device substrate with resin; Light source device manufacturing method characterized in that it further comprises.

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