CN104267538A - Efficient cooling LED backlight device - Google Patents

Efficient cooling LED backlight device Download PDF

Info

Publication number
CN104267538A
CN104267538A CN201410509739.5A CN201410509739A CN104267538A CN 104267538 A CN104267538 A CN 104267538A CN 201410509739 A CN201410509739 A CN 201410509739A CN 104267538 A CN104267538 A CN 104267538A
Authority
CN
China
Prior art keywords
led
backlight
structural member
pcb lamp
lamp board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201410509739.5A
Other languages
Chinese (zh)
Inventor
李正荣
李拓辉
唐景坤
吴丽
徐立国
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AVIC Huadong Photoelectric Co Ltd
Original Assignee
AVIC Huadong Photoelectric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AVIC Huadong Photoelectric Co Ltd filed Critical AVIC Huadong Photoelectric Co Ltd
Priority to CN201410509739.5A priority Critical patent/CN104267538A/en
Publication of CN104267538A publication Critical patent/CN104267538A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00Point-like light sources
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336Illuminating devices
    • G02F1/133628Illuminating devices with cooling means

Abstract

The invention discloses an efficient cooling LED backlight device. The efficient cooling LED backlight device comprises an LED lamp, a PCB lamp panel, a heat conducting material, a white reflective sheet and a backlight cavity structural part; holes corresponding to LED lamps on the PCB lamp panel in position are formed in the backlight cavity structural part and the white reflective sheet; the PCB lamp panel is mounted on the outer side of the bottom surface of the backlight cavity structural part; the LED lamps extends into the backlight cavity structural part through the holes; the efficient cooling LED backlight device further comprises a structural back panel, a graphene thin film and a thermal radiation enhancement material, wherein the structural back panel is arranged on the lower surface of the PCB lamp panel, the graphene thin film is arranged between the backlight cavity structural part and the PCB lamp panel and the thermal radiation enhancement material is formed on the outer wall of the backlight cavity structural part by coating. Compared with the prior art, the efficient cooling LED backlight device has the advantages of enhancing the radiative heat transfer capacity of the backlight structure, improving the heat dissipation capacity of the whole backlight system and reducing the junction temperatures of the LED lamps, and furthermore, improving the reliability of the LED backlight, prolonging the service life of the LED backlight and improving the luminous efficiency.

Description

A kind of LED backlight device of high efficiency and heat radiation
Technical field
The present invention relates to electric elements heat abstractor, in particular a kind of LED backlight device of high efficiency and heat radiation.
Background technology
In recent years, liquid crystal display (LCD) advantage in size, weight and power consumption etc. is more and more significant, and progressively replaces cathode-ray tube (CRT) (CRT) display, becomes the display device of main flow.Liquid crystal panel itself can not be luminous, must rely on the light from backlight.As shown in Figure 1, for using direct-type backlight unit LCD MODULE, be made up of liquid crystal display panel 3, blooming 2, back light unit 1, mechanical structure system 4 and driving circuit section.Under the support of physical construction and the effect of fixing protection; light is sent by back light system under driving circuit controls; form the uniform backlight with certain brightness by the even light of blooming and blast effect, the selection of recycling liquid crystal display finally shows all kinds of image information through function.
Along with the fast development of semiconductor technology, LED replaces CCFL gradually because of advantages such as its low-voltage driving, specular removal, environmental protections, is widely used in the back light unit of liquid crystal display.The luminescence efficiency of LED probably can reach about 30%, and separately have the energy of about 70% to change into heat, and LED is as semiconductor devices, the performance of its luminescence chip is very sensitive to temperature, comprises reliability, life-span and luminescence efficiency.As shown in Figure 2, be the relation of Philip model LED life-span and junction temperature (temperature of semiconductor luminous chip P-N junction), when junction temperature is increased to 135 DEG C from 115 DEG C, the life-span reduced to 20,000 hours from 50,000 hours.As shown in Figure 3, be Cree company model LED relative radiation flux and junction temperature relation, when junction temperature rises to 150 DEG C from 75 DEG C, LED relative radiation flux reduces by 10%.Junction temperature is too high in addition, easily causes LED inefficacy, dead lamp.Therefore, carry out the radiating treatment of back light unit, reduce the junction temperature of LED and effectively can improve LED-backlit reliability, extend its life-span, improve luminescence efficiency.
For the display that general room uses, stock size is less, brightness is lower (about 300cd/m 2) liquid crystal display, its back light unit is not clearly to the demand of radiating treatment, and for open air use, high brightness (1000cd/m 2), the display be exposed in hot environment, the radiating treatment of backlight has vital effect to the power consumption reducing display, serviceable life of extending backlight.Especially for the LCD MODULE of the purposes such as airborne, military, the luminescence efficiency of backlight, life-span, reliability are all had higher requirements.
Be illustrated in figure 5 the partial schematic diagram of the PCB lamp board 13 being welded with multiple LED 11, wherein black arrow is depicted as the conductive process of heat in PCB lamp board that LED luminescence chip produces.As we can see from the figure, the heat that the luminescence chip of LED 11 produces is passed to PCB lamp board by the electrode 114 be welded in PCB lamp board 13.In PCB lamp board, heat spreads along layers of copper 132 to surrounding, then respectively to upper surface and lower surface diffusion, is finally delivered in surrounding air.
The PCB lamp board 13 being welded with multiple LED 11 as shown in Figure 4, is arranged in the backlight cavities structural member 41 of structural member by the processing mode of usual back light unit; The higher diffusive reflective film of one deck reflectivity 12 is pasted, for reducing PCB lamp board 13 and backlight cavities structural member 41 inwall absorbs light at the upper surface of PCB lamp board 13 and the inwall of backlight cavities structural member 41; The good conducting strip of one deck heat conductivility 14 is pasted between the lower surface and backlight cavities structural member 41 bottom surface structure part of PCB lamp board 13, the heat that such LED 11 produces passes to conducting strip 14 by PCB lamp board 13, pass to backing structure part 41 by conducting strip 14 again, pass to surrounding air by structural member 41.If space outerpace allow, can make on the outer wall of backlight cavities structural member radiating fin 45, heat sink or other be configured to heat radiation.
Carry out from backlight luminous board lower surface the junction temperature that radiating mode can reduce LED 11 to a certain extent though above-mentioned, but as shown in Figure 5, heat is delivered to lower surface from the upper surface of PCB lamp board 13, need by multiple layers of copper 132 and insulating resin layer 133, the heat conductivility of insulating resin layer 133 is poor, and the thermal resistance therefore from the electrode 114 of LED 11 to PCB lamp board lower surface is often much larger than the thermal resistance to PCB lamp board upper surface.Carry out radiating treatment if only considered from the lower surface of PCB lamp board 13, for the PCB lamp board large for some power, heating is many or the capacity of heat transmission is poor, can not meet the radiating requirements of back light unit.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of LED backlight device of high efficiency and heat radiation.
The present invention is achieved by the following technical solutions: a kind of LED backlight device of high efficiency and heat radiation, comprise LED, PCB lamp board, Heat Conduction Material, white reflection sheet and backlight cavities structural member, LED is welded in PCB lamp board, white reflection sheet is covered on the inwall of backlight cavities structural member, Heat Conduction Material is filled between PCB lamp board and backlight cavities structural member, backlight cavities structural member with white reflection sheet has multiple perforate corresponding with LED position in PCB lamp board, PCB lamp board is arranged on the outer side bottom surface of backlight cavities structural member, and LED stretches in backlight cavities structural member through perforate.
As the further improvement of such scheme, Heat Conduction Material is heat-conducting silicone grease or heat-conducting pad.
As the further improvement of such scheme, backlight cavities structural member selects copper material or aluminium to make.
As the further improvement of such scheme, also comprise one deck graphene film, graphene film is arranged between backlight cavities structural member and PCB lamp board, to increase the horizontal capacity of heat transmission.
As the further improvement of such scheme, also comprise one deck heat radiation reinforcing material, heat radiation reinforcing material is coated in the outer wall of backlight cavities structural member.
As the further improvement of such scheme, also comprise fabric backplanes, fabric backplanes is arranged on PCB lamp board lower surface, fills Heat Conduction Material between fabric backplanes and PCB lamp board.
As the further improvement of such scheme, also comprise radiating fin, radiating fin is arranged on backlight cavities structural member side-wall outer side.
As the further improvement of such scheme, radiating fin is arranged on fabric backplanes lower surface.
The present invention has the following advantages compared to existing technology: the radiant heat transfer ability enhancing backing structure, improves the heat-sinking capability of whole back light system, reduces the junction temperature of LED, thus improve LED-backlit reliability, extend its life-span, improve luminescence efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation using direct-type backlight unit LCD MODULE in prior art.
Fig. 2 be in prior art Philip LED product junction temperature to the influence curve figure in LED life-span.
Fig. 3 is the changing trend diagram of relative radiation flux with junction temperature of Cree company LED product in prior art.
Fig. 4 is that in prior art, backlight luminous board is installed and radiating mode structural representation.
Fig. 5 is partial structurtes and the heat transfer schematic diagram of the PCB lamp board being welded with multiple LED in prior art.
Fig. 6 is the LED backlight apparatus structure schematic diagram of the high efficiency and heat radiation in embodiments of the invention one.
Fig. 7 is the LED backlight apparatus structure schematic diagram of the high efficiency and heat radiation in embodiments of the invention two.
Embodiment
Elaborate to embodiments of the invention below, the present embodiment is implemented under premised on technical solution of the present invention, give detailed embodiment and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
Embodiment one:
As shown in Figure 6, a kind of LED backlight device of high efficiency and heat radiation, comprise LED 11, PCB lamp board 13, Heat Conduction Material 14, white reflection sheet 12 and backlight cavities structural member 43, LED 11 is welded in PCB lamp board 13, white reflection sheet 12 is covered on the inwall of backlight cavities structural member 43, effectively to reduce the absorption of backlight cavities to light, improve backlight cavities light utilization, Heat Conduction Material 14 is filled between PCB lamp board 13 and backlight cavities structural member 43, Heat Conduction Material 14 is heat-conducting silicone grease or heat-conducting pad, like this can better by the heat conduction of PCB lamp board 1313 upper surface to backlight cavities structural member 43, backlight cavities structural member 43 with white reflection sheet 12 has multiple perforate corresponding with LED 11 position in PCB lamp board 13, so that PCB lamp board 13 can load from the outside of backlight cavities bottom surface easily, PCB lamp board 13 is arranged on the outer side bottom surface of backlight cavities structural member 43, LED 11 stretches in backlight cavities structural member 43 through perforate, backlight cavities structural member 43 selects the good copper material of the capacity of heat transmission (coefficient of heat conductivity 400Wm-1K-1) or aluminium (coefficient of heat conductivity 236Wm-1K-1) to make, in order to strengthen its horizontal capacity of heat transmission, one deck graphene film 15 (coefficient of heat conductivity can reach 2000Wm-1K-1) is prepared further between backlight cavities structural member 43 and PCB lamp board 13, to increase the horizontal capacity of heat transmission, so just can faster by heat trnasfer on backlight cavities structural member 43, and then be passed to surrounding air, also comprise one deck heat radiation reinforcing material 16, heat radiation reinforcing material 16 is coated in the outer wall of backlight cavities structural member 43, to increase the radiant heat transfer ability of backing structure system, thus dispel the heat better, to reduce the junction temperature of LED 11, comprise radiating fin 45 in addition, radiating fin 45 is arranged on backlight cavities structural member 43 side-wall outer side.
Embodiment two:
As shown in Figure 7, a kind of LED backlight device of high efficiency and heat radiation, comprise LED 11, PCB lamp board 13, Heat Conduction Material 14, white reflection sheet 12 and backlight cavities structural member 43, LED 11 is welded in PCB lamp board 13, white reflection sheet 12 is covered on the inwall of backlight cavities structural member 43, effectively to reduce the absorption of backlight cavities to light, improve backlight cavities light utilization, Heat Conduction Material 14 is filled between PCB lamp board 13 and backlight cavities structural member 43, Heat Conduction Material 14 is heat-conducting silicone grease or heat-conducting pad, like this can better by the heat conduction of PCB lamp board 13 upper surface on backlight cavities structural member 43 and fabric backplanes 44, backlight cavities structural member 43 with white reflection sheet 12 has multiple perforate corresponding with LED 11 position in PCB lamp board 13, so that PCB lamp board 13 can load from the outside of backlight cavities bottom surface easily, PCB lamp board 13 is arranged on the outer side bottom surface of backlight cavities structural member 43, LED 11 stretches in backlight cavities structural member 43 through perforate, backlight cavities structural member 43 selects the good copper material of the capacity of heat transmission (coefficient of heat conductivity 400Wm-1K-1) or aluminium (coefficient of heat conductivity 236Wm-1K-1) to make, in order to strengthen its horizontal capacity of heat transmission, one deck graphene film 15 (coefficient of heat conductivity can reach 2000Wm-1K-1) is prepared on the surface contacted with PCB lamp board 13 at backlight cavities structural member 43 further, be conducive to so faster by heat trnasfer to backlight cavities structural member 43 sidewall, and then be passed to surrounding air, effective reduction junction temperature, improve LED-backlit reliability, extend its life-span, improve luminescence efficiency, also comprise one deck heat radiation reinforcing material 16, heat radiation reinforcing material 16 is coated in the outer wall of backlight cavities structural member 43, to increase the radiant heat transfer ability of backing structure system, thus dispel the heat better, to reduce the junction temperature of LED 11, also comprise fabric backplanes 44 and radiating fin 45, fabric backplanes 44 is arranged on PCB lamp board 13 lower surface, Heat Conduction Material 14 is filled between fabric backplanes 44 and PCB lamp board 13, radiating fin 45 is arranged on fabric backplanes 44 lower surface and backlight cavities structural member 43 side-wall outer side, thus increase area of dissipation, accelerate heat radiation.
These are only preferred embodiment of the present invention, not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (8)

1. the LED backlight device of a high efficiency and heat radiation, comprise LED, PCB lamp board, Heat Conduction Material, white reflection sheet and backlight cavities structural member, described LED is welded in described PCB lamp board, described white reflection sheet is covered on the inwall of described backlight cavities structural member, described Heat Conduction Material is filled between described PCB lamp board and described backlight cavities structural member, it is characterized in that: described backlight cavities structural member has with on described white reflection sheet the perforate that in multiple and described PCB lamp board, described LED position is corresponding, described PCB lamp board is arranged on the outer side bottom surface of described backlight cavities structural member, described LED stretches in described backlight cavities structural member through described perforate.
2. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 1, is characterized in that: described Heat Conduction Material is heat-conducting silicone grease or heat-conducting pad.
3. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 1 or 2, is characterized in that: described backlight cavities structural member selects copper material or aluminium to make.
4. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 1 or 2, it is characterized in that: also comprise one deck graphene film, described graphene film is arranged between described backlight cavities structural member and described PCB lamp board.
5. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 1 or 2, it is characterized in that: also comprise one deck heat radiation reinforcing material, described heat radiation reinforcing material is coated on the outer wall of described backlight cavities structural member.
6. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 1 or 2, it is characterized in that: also comprise fabric backplanes, described fabric backplanes is arranged on described PCB lamp board lower surface, fills Heat Conduction Material between described fabric backplanes and described PCB lamp board.
7. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 1 or 2, it is characterized in that: also comprise radiating fin, described radiating fin is arranged on described backlight cavities structural member side-wall outer side.
8. the LED backlight device of a kind of high efficiency and heat radiation as claimed in claim 7, it is characterized in that: also comprise radiating fin, described radiating fin is arranged on described fabric backplanes lower surface.
CN201410509739.5A 2014-09-28 2014-09-28 Efficient cooling LED backlight device Pending CN104267538A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410509739.5A CN104267538A (en) 2014-09-28 2014-09-28 Efficient cooling LED backlight device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410509739.5A CN104267538A (en) 2014-09-28 2014-09-28 Efficient cooling LED backlight device

Publications (1)

Publication Number Publication Date
CN104267538A true CN104267538A (en) 2015-01-07

Family

ID=52159071

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410509739.5A Pending CN104267538A (en) 2014-09-28 2014-09-28 Efficient cooling LED backlight device

Country Status (1)

Country Link
CN (1) CN104267538A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105527752A (en) * 2015-12-25 2016-04-27 厦门天马微电子有限公司 Backlight module and display device thereof
CN106507638A (en) * 2016-09-27 2017-03-15 维沃移动通信有限公司 A kind of radiator structure of display screen
CN107426949A (en) * 2017-07-13 2017-12-01 安徽大鸿智能科技有限公司 LED display heat abstractor
CN107835916A (en) * 2015-05-15 2018-03-23 莫门蒂夫性能材料股份有限公司 The light-emitting diode component of heat management is carried out using pyrolytic graphite
CN108110124A (en) * 2016-11-25 2018-06-01 佛山市国星光电股份有限公司 A kind of TOP-LED devices and its manufacturing method
CN114167644A (en) * 2021-11-22 2022-03-11 重庆惠科金渝光电科技有限公司 Backlight module and liquid crystal display panel

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107835916A (en) * 2015-05-15 2018-03-23 莫门蒂夫性能材料股份有限公司 The light-emitting diode component of heat management is carried out using pyrolytic graphite
CN105527752A (en) * 2015-12-25 2016-04-27 厦门天马微电子有限公司 Backlight module and display device thereof
CN106507638A (en) * 2016-09-27 2017-03-15 维沃移动通信有限公司 A kind of radiator structure of display screen
CN108110124A (en) * 2016-11-25 2018-06-01 佛山市国星光电股份有限公司 A kind of TOP-LED devices and its manufacturing method
CN107426949A (en) * 2017-07-13 2017-12-01 安徽大鸿智能科技有限公司 LED display heat abstractor
CN114167644A (en) * 2021-11-22 2022-03-11 重庆惠科金渝光电科技有限公司 Backlight module and liquid crystal display panel

Similar Documents

Publication Publication Date Title
CN104267538A (en) Efficient cooling LED backlight device
CN100437277C (en) Back-light model group
CN100580528C (en) LCD and back light module thereof
CN102588841B (en) Temperature self-adaptation high-brightness LED directly-down liquid crystal backlight module
TWI393833B (en) Heat-dissipating structure, backlight module, and display apparatus for standing use
CN102620204B (en) Backlight module and liquid crystal display device comprising same
WO2009082871A1 (en) A led light source module having a heat conduction system and a heat radiation system
CN206805058U (en) A kind of display module
CN106801823A (en) A kind of backlight module and display device
CN201119120Y (en) Improved printed circuit board for LED
TWM361214U (en) Display
CN103439831B (en) Side-light type liquid crystal module, directly-down liquid crystal module and televisor
CN202501430U (en) LED (Light-Emitting Diode) heat radiation device, backlight module and liquid crystal device
CN207065281U (en) Backlight module and display device
CN206741164U (en) A kind of backlight and liquid crystal display die set
CN101975376B (en) Luminous source heat-dissipation structure of backlight module
CN101382259A (en) High-efficiency heat radiation high-power LED street lamp holder
CN102563470A (en) High-brightness temperature-adaptive direct-type cold cathode fluorescent lamp liquid crystal backlight module
CN202065933U (en) Heat dissipation component of backlight light source
CN201606844U (en) LED side backlight heat sink
CN209281110U (en) A kind of liquid crystal display encapsulation module
CN102374509A (en) Liquid crystal display device, backlight module and heat radiating method thereof
CN201944802U (en) LED heat radiation substrate structure
CN209982613U (en) Novel heat dissipation LED TV
TWI275879B (en) Heat-sinking structure of direct type back light module

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20150107