CN211208432U - Intelligent power module substrate, intelligent functional module and electronic equipment - Google Patents

Abstract

The utility model discloses an intelligent power module base plate, intelligent function module and electronic equipment, intelligent power module base plate includes: a metal layer; the heat dissipation layer is arranged on one side of the metal layer; the first insulating layer is arranged on one side, far away from the heat dissipation layer, of the metal layer; the circuit layer is arranged on one side, away from the metal layer, of the first insulating layer and is provided with a circuit; the bonding pad is arranged on one side, far away from the first insulating layer, of the circuit layer and is electrically connected with the circuit; and one side of the heat-conducting column is connected with the bonding pad, the heat-conducting column penetrates through the circuit layer, the first insulating layer and the metal layer, and one side, far away from the bonding pad, of the heat-conducting column is connected with the heat dissipation layer. The utility model discloses a run through the heat conduction post on circuit layer, first insulation layer and metal level, with the heat conduction of device to the heat dissipation layer on the pad, promoted radiating effect and performance, but wide application in the electrical apparatus field of making.

Description

Intelligent power module substrate, intelligent functional module and electronic equipment

Technical Field

The utility model relates to an electrical apparatus field of making, in particular to intelligent power module base plate, intelligent function module and electronic equipment.

Background

An Intelligent Power Module (IPM) is a Power driving product combining Power electronics and integrated circuit technology, is applied to an electric control board of equipment such as a driving fan and a compressor, is used for realizing continuous regulation of the rotating speed of a motor, and is a core component of a variable-frequency household appliance. The smart power module is a stand-alone package: the switching device (such as an Insulated Gate Bipolar Transistor (IGBT) and a metal-oxide semiconductor field effect transistor (MOSFET)), the diode, the control IC, the passive device and the like are welded on the substrate and wrapped by the packaging material, and the intelligent power module is connected with the outside through the pin.

However, current smart power module substrates generally dissipate heat through a metal layer (e.g., an aluminum substrate layer), and the heat dissipation effect and performance still need to be improved.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides an intelligence power module base plate can promote the radiating effect.

The utility model discloses still provide an intelligent function module who has above-mentioned intelligent power module base plate.

The utility model discloses still provide an electronic equipment with above-mentioned intelligent power module.

According to the utility model discloses an intelligent power module base plate of first aspect embodiment, include:

a metal layer;

the heat dissipation layer is arranged on one side of the metal layer;

the first insulating layer is arranged on one side, far away from the heat dissipation layer, of the metal layer;

the circuit layer is arranged on one side, away from the metal layer, of the first insulating layer, and a circuit is arranged on the circuit layer;

the bonding pad is arranged on one side, far away from the first insulating layer, of the circuit layer and is electrically connected with the circuit;

one side of the heat-conducting column is connected with the bonding pad, the heat-conducting column penetrates through the circuit layer, the first insulating layer and the metal layer, and one side, far away from the bonding pad, of the heat-conducting column is connected with the heat dissipation layer.

According to the utility model discloses intelligent power module base plate has following beneficial effect at least: including metal level, heat dissipation layer, first insulating layer, circuit layer, pad and heat conduction post, through the heat conduction post that runs through circuit layer, first insulating layer and metal level, with the heat conduction of device to the heat dissipation layer on the pad, promoted radiating effect and performance.

According to some embodiments of the present invention, the heat conduction post includes a first heat conduction post, a second insulating layer and a second heat conduction post, the first heat conduction post pass through the second insulating layer with the second heat conduction post is connected, the second insulating layer with the first insulating layer is connected. Therefore, when the heat conduction column is conductive, the heat of the device on the bonding pad can be conducted to the second heat conduction column through the first heat conduction column through the second insulating layer, and the heat dissipation effect is guaranteed while the circuit layer is prevented from being electrically connected with the metal layer.

According to some embodiments of the invention, the number of lines is a plurality of, every the surface covering of line has insulating protective layer. Therefore, the circuit layer can realize insulation between circuits and protection of the circuits through the insulating protection layer.

According to some embodiments of the invention, the wiring layer comprises a wiring groove and a filler, the filler being filled on the wiring groove. Therefore, the circuit layer can be filled with the nonmetal conductive material (such as graphite) or the composite conductive material (such as silver paste or tin paste) as the filler on the circuit groove to form the circuit of the circuit layer, and the conductivity of the circuit layer is improved.

According to some embodiments of the utility model, the heat conduction post with glue through the bonding between the pad and be connected. Therefore, the heat-conducting column can be tightly attached to the bonding pad through the adhesive, and heat of a device on the bonding pad is transferred to the heat dissipation layer through the heat-conducting column.

According to some embodiments of the invention, the material of the circuit layer is graphite, silver paste or solder paste. Therefore, the material of the circuit layer can be graphite, silver paste or tin paste with good conductivity, and the conductivity of the circuit layer is improved.

According to some embodiments of the utility model, the pad adopts copper pad, silver-colored pad or tin pad, the angular deviation of pad for the horizontal plane is less than 5. Therefore, the bonding pad can be selected from a copper bonding pad, a silver bonding pad or a tin bonding pad with good heat conduction and welding performance, and the welding and heat conduction performance of the substrate is improved. And the angle deviation of the bonding pad relative to the horizontal plane is less than 5 degrees, so that the problem that the bonding pad is easy to break due to unevenness is solved, and the bonding pad is more reliable.

According to some embodiments of the utility model, the heat conduction post adopts graphite alkene post or soldering tin post. Therefore, the heat-conducting column can be selected from the graphene column or the soldering tin column with good heat-conducting performance, and the heat-radiating effect of the substrate is improved.

According to the utility model discloses an intelligent function module of second aspect embodiment, include:

a substrate, the substrate being the smart power module substrate of the embodiment of the first aspect;

the device is arranged on one side, far away from the line layer, of the bonding pad.

According to the utility model discloses intelligent function module has following beneficial effect at least: including having metal level, heat dissipation layer, first insulating layer, circuit layer, pad and the heat conduction post's of heat conduction intelligent power module base plate, through the heat conduction post that runs through circuit layer, first insulating layer and metal level, with the heat conduction of device to the heat dissipation layer on the pad, promoted radiating effect and performance.

According to the utility model discloses an electronic equipment of third aspect embodiment, including the intelligent function module of second aspect embodiment.

According to the utility model discloses electronic equipment has following beneficial effect at least: including intelligent function module, intelligent function module is including having the intelligent power module base plate of metal level, heat dissipation layer, first insulating layer, circuit layer, pad and heat conduction post, through the heat conduction post that runs through circuit layer, first insulating layer and metal level, with the heat conduction of device to the heat dissipation layer on the pad, has promoted radiating effect and performance.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of an intelligent power module substrate according to an embodiment of the present invention;

FIG. 2 is a partially enlarged schematic view of the wiring layer shown in FIG. 1;

FIG. 3 is a schematic structural view of the heat conductive column shown in FIG. 1;

fig. 4 is another schematic structural diagram of the smart power module substrate according to the embodiment of the present invention;

fig. 5 is a schematic structural diagram of an intelligent power module according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a specific embodiment of the smart power module shown in fig. 5.

Reference numerals: 100. a heat dissipation layer; 200. a metal layer; 300. a first insulating layer; 400. a circuit layer; 410. a line slot; 420. a filler; 500. an insulating protective layer; 600. a pad; 700. a heat-conducting column; 710. a first thermally conductive post; 720. a second insulating layer; 730. a second thermally conductive post; 800. a printed circuit board.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood not to include the number. If there is a description to first, second, third etc. for the purpose of distinguishing between technical features, it is not intended to indicate or imply relative importance or to implicitly indicate the number of technical features indicated or to implicitly indicate the precedence of technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

In one aspect of the present invention, the utility model provides an intelligent power module substrate. According to the embodiment of the present invention, referring to fig. 1, the smart power module substrate includes a heat dissipation layer 100, a metal layer 200, a first insulating layer 300, a circuit layer 400, a pad 600 and a heat conduction pillar 700, wherein the heat conduction pillar 700 runs through the circuit layer 400, the first insulating layer 300 and the metal layer 200, and two ends of the heat conduction pillar 700 are respectively connected to the heat dissipation layer 100 and the pad 600 (the connection relationship between the heat conduction pillar 700 and the pad 600 is not directly shown in fig. 1).

Wherein the heat dissipation layer 100 is used to accelerate lateral heat dissipation. Alternatively, the structure of the heat dissipation layer 100 can be flexibly selected, such as a structure with a heat dissipation function, such as a heat sink, a heat dissipation coating, and the like. The material of the heat dissipation layer 100 can also be flexibly selected, for example, the heat dissipation layer 100 can be made of heat dissipation silicone, graphene, or the like.

The metal layer 200 serves as a base of the entire substrate and is used to support components (e.g., power devices) on the entire circuit layer and bonding pads. In some embodiments, the material of the metal layer 200 may include, but is not limited to, copper, or aluminum, or nickel, or gold, etc.

And a first insulating layer 300 for insulating the metal layer from the line layer. In some embodiments, the material of the first insulating layer 300 may include, but is not limited to, epoxy, rubber, ceramic, and the like.

And the circuit layer 400 is used for connecting various components (such as power devices). The circuit layer 400 may be formed with a circuit or trace of a component through a printing or etching (e.g., laser etching, electrical spark etching, etc.) process, so as to achieve electrical connection between the components. Copper foil is generally selected for the circuit layer and the bonding pad of the existing intelligent power module substrate. In some embodiments, the circuit layer 400 may be selected from a different circuit layer material than the pad material. For example, the circuit layer 400 may be made of a superconducting material such as graphite having a good conductive property, silver paste, or solder paste. Graphite is a superconducting material with the following properties: 1) high temperature resistance: the graphite has a melting point of 3850 ℃ and a boiling point of 4250 ℃, and even if the graphite is burnt by an ultrahigh-temperature electric arc, the weight loss is small and the thermal expansion coefficient is small. The strength of graphite is enhanced with the increase of temperature, and at 2000 ℃, the strength of graphite is doubled. 2) Electric and thermal conductivity: the conductivity of graphite is one hundred times higher than that of common non-metallic ore. The thermal conductivity exceeds that of metal materials such as steel, iron, lead and the like. The thermal conductivity decreases with increasing temperature and even at very high temperatures, graphite forms a thermal insulator. 3) Chemical stability: the graphite has good chemical stability at normal temperature, and can resist acid, alkali and corrosion of organic flux. 4) Thermal shock resistance: the graphite can withstand the drastic change of temperature without damage when used at normal temperature, and the volume change of the graphite is not large and cracks cannot be generated when the temperature changes suddenly. Silver adhesive is an adhesive with certain conductive performance after being cured or dried, and generally takes matrix resin and conductive filler, namely conductive particles as main components, and the conductive particles are combined together through the bonding action of the matrix resin to form a conductive path. The solder paste is a paste mixture formed by mixing solder powder, soldering flux and other surfactants, thixotropic agents and the like, and is mainly used for welding components in the surface mounting industry.

In some embodiments, the circuit layer 400 may include a plurality of circuits, and a surface of each circuit is covered with an insulating protection layer 500, as shown in fig. 1. The insulation protection layer 500 is used to insulate and protect different lines in the line layer 400, and can prevent the exposed lines from conducting electricity (i.e., short circuit) due to the external environment. The insulating protective layer 500 may be made of a coating type insulating material such as green oil, three-proofing paint, etc.

In some embodiments, the wiring layer 400 may include a wiring groove 410 and a filler 420, and the filler 420 is filled on the wiring groove 410, as shown in fig. 2. The line groove 410 may be formed by etching the metal layer 200 through an etching process (e.g., laser etching, spark etching). The filler 420 may be made of a material having good conductive properties, such as solder or graphite. Alternatively, the filler 420 may be obtained by filling liquid graphene, silver paste, or the like into the line groove 410 and then drying the filled material. At this time, the line groove 410 is used to guide the flow direction of the liquid graphene, silver paste, or the like; the filler 420 serves as a conductive layer for the circuit layer. Liquid graphene: the original graphite powder can be dispersed into uniform graphene colloidal solution by ultrasonic treatment in a specific solution (organic flux, ionic solution and aqueous solution), and the organic flux should have specific surface tension (about 40-50 mN/m) and appropriate Hansen solubility parameters. Methylpyrrolidone NMP is a representative organic flux for the preparation of graphene.

The bonding pad 600 is used for mounting various components by mounting, welding, and the like, and signal connection between the components and the circuit in the circuit layer 400 is realized. The bonding pad 600 may be made of a material having electrical and thermal conductivity, such as copper, silver, tin, etc. In order to facilitate the processes of solder paste printing, Diffusion Bonding (DB), Surface Mount Technology (SMT), and Wire Bonding (WB) of the smart power module, the pad 600 may be formed of a copper foil. In some embodiments, in order to solve the problem that the pad is prone to fracture due to unevenness, the material of the pad may be selected to have an angular deviation (i.e., a tilt angle) of less than 5 ° with respect to a horizontal plane, for example, the angular deviation of the plane in which the pad material is located with respect to the horizontal plane may be 1 °, 1.5 °, 2 °, 3 °, 4 °, and the like.

The heat conductive pillars 700 are used to transfer heat generated from the components on the bonding pads 600 in a longitudinal direction. The material of the heat conducting pillar 700 may be, but is not limited to, graphene, solder, and other materials with good heat conducting properties. The two sides of the heat-conducting pillar 700 are respectively connected to the pad 600 and the heat-dissipating layer 100 (the connection relationship between the heat-conducting pillar 700 and the pad 600 is not directly shown in fig. 1), and the heat-conducting pillar 700 penetrates through the circuit layer 400, the first insulating layer 300 and the metal layer 200, so that the pad 600, the heat-conducting pillar 700 and the heat-dissipating layer 100 together form an integrated heat-conducting and heat-dissipating component, and the heat-conducting and heat-dissipating capability of the smart power module substrate is enhanced. In some embodiments, a through hole (a square hole corresponding to the shape of the heat conductive pillar 700 shown in fig. 3) penetrating through the circuit layer 400, the first insulating layer 300 and the metal layer 20 is formed between the bonding pad 600 and the heat dissipation layer 100 by an etching process, and then the heat conductive pillar 700 is obtained by adding a heat conductive pillar material into the through hole.

In some embodiments, the thermal conductive pillar 700 may be further divided into a first thermal conductive pillar 710, a second insulating layer 720, and a second thermal conductive pillar 730, as shown in fig. 4. As can be seen from the foregoing discussion, the heat conductive pillar 700 penetrates the wiring layer 400, the first insulating layer 300, and the metal layer 200 in view of heat conductivity. In view of the conductivity, the circuit layer 400 and the metal layer 200 cannot be conducted, otherwise, the entire smart power module substrate fails. For this, as shown in fig. 4, when the heat conductive pillar 700 has both electrical and thermal conductivity, the heat conductive pillar 700 is divided into two parts, i.e., a first heat conductive pillar 710 and a second heat conductive pillar 730 by a second insulating layer 720, the first heat conductive pillar 710 penetrates through the circuit layer 400, and the second heat conductive pillar 730 penetrates through the metal layer 200. The second insulating layer 720 can be made of insulating and heat-conducting materials such as epoxy resin, rubber, and ceramics. In order to avoid the conductive connection between the circuit layer 400 and the metal layer 200, the second insulating layer 720 may be disposed at the interface between the circuit layer 400 and the metal layer 200. Alternatively, the second insulating layer 720 may be connected with the first insulating layer 300. Structurally, the connection may mean that the second insulating layer 720 and the first insulating layer 300 are both located at the boundary of the circuit layer 400 and the metal layer 200 (i.e., they are on the same horizontal plane); from the manufacturing process point of view, the connection may mean that the second insulating layer 720 and the first insulating layer 300 are integrally formed. Therefore, the heat conduction column conducts the heat of the device on the bonding pad from the first heat conduction column to the second heat conduction column through the second insulating layer (namely, the heat conduction is communicated), and the heat dissipation effect is ensured while the circuit layer is prevented from being electrically connected with the metal layer (namely, the electric conduction is insulated).

In some embodiments, the heat conducting pillar 700 may be adhered to the bonding pad 600 by an adhesive, so that the bonding pad 600 and the heat conducting pillar 700 are tightly attached or connected, and the heat conducting performance is ensured. The adhesive can be adhesive with heat conductivity, such as ZS-1071 high temperature resistant inorganic adhesive. The ZS-1071 high-temperature resistant inorganic adhesive has good wettability and bonding performance with metal refractory materials such as corundum, quartz, high-alumina ceramics, graphite, carbon and the like. Has good strength at high temperature, and has average compression strength of 90MPa and tensile strength of 8MPa at 1300 ℃. The thermal expansion coefficient of the water-based inorganic high-temperature adhesive is equivalent to that of a matrix refractory material, so that the performance of the high-temperature resistant material is improved, and the service life is prolonged; it can be used in the coating which needs to be coated on the surface of metal, graphite and various high-temperature resistant materials to form a protective layer.

As can be seen from the above, unlike the prior art that relies on a metal layer (e.g., an aluminum substrate layer) for heat dissipation, the heat dissipation process of the smart power module substrate is as follows: heat generated by components (such as power devices) is transmitted to the heat-conducting column through the bonding pad, the heat is longitudinally transmitted to the heat-radiating layer through the heat-conducting column, and finally, transverse heat radiation is carried out through the heat-radiating layer, and the overall heat radiation effect and performance of the intelligent power module substrate are improved through the mode that the heat is longitudinally transmitted to the heat-conducting column and the heat is transversely radiated through the heat-radiating layer.

According to the utility model discloses a some embodiments to first insulating layer and second insulating layer integrated into one piece and material are the insulating cement, and the heat dissipation layer is graphite alkene layer, and the heat conduction post is the graphite alkene post, and insulating protective layer is green oil layer as an example, and the preparation technology of this intelligent power module base plate is as follows:

firstly, a plurality of square holes with different sizes are processed on a metal layer serving as a substrate by adopting the processes of stamping and the like (as shown in fig. 5);

then, coating, brushing or pressing a graphene layer on the lower surface of the metal layer to serve as a heat dissipation layer;

then, machining a circuit groove with a certain depth (for example, 0.05-1mm deep) on the metal layer by a process such as CNC, electric spark or laser etching (as shown in FIG. 2);

then, coating a layer of insulating glue on the surface of the line slot and the inner walls of the square holes with different sizes to form an insulating layer (comprising a first insulating layer and a second insulating layer for preventing the line layer from conducting with the metal layer);

then, filling liquid graphene into the line grooves and the square holes with different sizes and drying the liquid graphene;

after the graphene is dried to form a circuit, covering a layer of solder resist green oil on the surface of the circuit, and adhering a gold-plated copper foil on the pad;

finally, the smart power module substrate is formed by machining (e.g., CNC V-CUT cutting, cutting incoming material to a corresponding product size). The smart power module substrate includes a printed circuit board 800 (shown in fig. 5), a graphene pillar, a graphite line layer, a pad, a graphene coating, and the like.

Therefore, the embodiment of the utility model provides a only need 7 processes just can accomplish the preparation of intelligent power module base plate, include twenty multiple processes with current intelligent power module base plate usually and compare, it is more high-efficient.

The utility model discloses an on the other hand, the embodiment of the utility model provides an intelligent function module, include:

the substrate is the intelligent power module substrate;

the device is arranged on one side, far away from the line layer, of the bonding pad.

Thus, the smart power module has all the features and advantages of the substrate embodiments described above, and will not be described herein again. Generally speaking, the intelligent power module has good heat dissipation, electric conduction and other use performances, and meets the requirement of miniaturization development of the intelligent power module.

According to the utility model discloses a device can be through welding setting on the base plate, and the device can include power component and non-power component to make intelligent power module have good service function.

According to the specific embodiment of the present invention, the device may include a rectifier bridge, a power factor correction element, an insulated gate bipolar transistor, a fast recovery diode, or an integrated circuit chip, etc. As shown in fig. 6, the power factor correction element is a power factor correction insulated gate bipolar transistor PFCIGBT, the insulated gate bipolar transistors are IGBT1, IGBT2, IGBT3, IGBT4, IGBT5, and IGBT6, the fast recovery diodes are FRD1, FRD2, FRD3, FRD4, FRD5, and FRD6, and the integrated circuit chip is an IC. These devices in fig. 6 may be mounted on the pad shown in fig. 5 at positions corresponding to the square holes. Therefore, the intelligent power module is a high-integration intelligent power module and has higher integration level. High integrated intelligent power module is because integrated component is more, and the heat that produces in the working process is also more, through the utility model discloses the heat conduction post of base plate embodiment can be well with the heat vertical conduction that device (like power device) produced down to the heat dissipation layer in, through heat dissipation layer with heat lateral diffusion at last, reaches better radiating effect, improves integrated intelligent power module's performance.

In another aspect of the present invention, an embodiment of the present invention provides an electronic device, including the intelligent function module as described above. The detailed structure of the intelligent power module can refer to the substrate embodiment, and is not described herein again; it can be understood that, because the utility model discloses above-mentioned intelligent power module has been used in electronic equipment (household electrical appliances such as air conditioner, washing machine, refrigerator, etc. or the electronic equipment of electric automobile trade, or the electronic equipment in fields such as industrial robot), therefore, the embodiment of the electronic equipment of the invention includes all technical schemes of the whole embodiments of above-mentioned intelligent power module, and the technical effect that reaches is also identical, and no longer repeated description here.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the gist of the present invention within the knowledge range of those skilled in the art.

Claims (10)

1. A smart power module substrate, comprising:

a metal layer;

the heat dissipation layer is arranged on one side of the metal layer;

the first insulating layer is arranged on one side, far away from the heat dissipation layer, of the metal layer;

the circuit layer is arranged on one side, away from the metal layer, of the first insulating layer, and a circuit is arranged on the circuit layer;

the bonding pad is arranged on one side, far away from the first insulating layer, of the circuit layer and is electrically connected with the circuit;

one side of the heat-conducting column is connected with the bonding pad, the heat-conducting column penetrates through the circuit layer, the first insulating layer and the metal layer, and one side, far away from the bonding pad, of the heat-conducting column is connected with the heat dissipation layer.

2. The smart power module substrate of claim 1, wherein the thermal pillar comprises a first thermal pillar, a second insulating layer, and a second thermal pillar, the first thermal pillar connected to the second thermal pillar through the second insulating layer, the second insulating layer connected to the first insulating layer.

3. The smart power module substrate as claimed in claim 1, wherein the number of the lines is plural, and a surface of each of the lines is covered with an insulating protective layer.

4. The smart power module substrate as claimed in claim 1, wherein the wiring layer includes a wiring groove and a filler filled on the wiring groove.

5. The smart power module substrate as claimed in claim 1, wherein the heat-conducting pillars are connected to the pads by an adhesive.

6. The smart power module substrate as claimed in claim 1, wherein the material of the circuit layer is graphite, silver paste or solder paste.

7. The smart power module substrate as claimed in claim 1, wherein the bonding pads are copper bonding pads, silver bonding pads or tin bonding pads, and the bonding pads have an angle deviation of less than 5 ° with respect to a horizontal plane.

8. The smart power module substrate as claimed in claim 1, wherein the heat conducting pillars are graphene pillars or solder pillars.

9. An intelligent functional module, comprising:

a substrate that is the smart power module substrate of any one of claims 1-8;

the device is arranged on one side, far away from the line layer, of the bonding pad.

10. An electronic device characterized by comprising the intelligent function module of claim 9.

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