JP3855306B2 - Heat dissipating board for mounting electronic parts and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a power semiconductor used for an electronic circuit module that handles a large amount of power such as an inverter circuit or a power supply circuit, and an electronic component mounting heat dissipation board on which various electronic components are mounted, and a method for manufacturing the same.
[0002]
[Prior art]
In recent years, electronic circuits that handle large amounts of power, such as inverter circuits and power supply circuits, have been modularized as devices become smaller. In order to achieve modularization of this power electronic circuit, it is an important issue how to dissipate heat generated by the loss of a power semiconductor or the like mounted at high density. Conventionally, in this type of electronic circuit module, a conductive foil is laminated on the surface of a metal support plate via a thin insulator layer, and this conductive foil is etched to form a wiring pattern (hereinafter referred to as a metal base substrate). ) Was used, and a power semiconductor and various electronic components were mounted thereon to form a circuit.
[0003]
This conventional electronic circuit module will be described with reference to FIGS.
[0004]
16 and 17 show an electronic circuit module using a conventional metal base substrate. According to the figure, 91 is a metal support plate, 92 is an insulator layer, 93 is a conductor foil, and 94 is an electronic component including a power semiconductor. The conductor foil 93 is bonded to the metal support plate 91 via the insulator layer 92. The conductive foil 93 is formed into a wiring pattern by etching, and an electronic component 94 is mounted on the conductive foil 93 to constitute a circuit. An external connection terminal 95 is mounted in the same manner as the electronic component 94. Heat generated by the electronic component 94 is transmitted to the metal support plate 91 through the insulator layer 92. 96 is a bus bar for reducing the wiring resistance of the pattern, and 97 is a radiator, which is used to supplement the heat radiation when the heat radiation only by the metal support plate 91 is insufficient.
[0005]
[Problems to be solved by the invention]
However, in the above conventional configuration, since the wiring pattern is formed by etching, a thin conductor foil 93 such as 35 μm or 70 μm is used, and when configuring a power circuit in which a large current flows, the wiring resistance Is a problem. For this reason, the bus bar 96 is mounted on the substrate in a portion where a large amount of current flows. The heat dissipation characteristics of this metal base substrate are determined by an insulator layer 92 formed between the metal support plate 91 and the conductor foil 93. Generally, this kind of insulator layer 92 is formed by applying an epoxy resin. It is thinly molded to improve heat dissipation characteristics. For this reason, the insulation characteristics cannot be improved, and the distributed capacitance generated between the conductor foil 93 and the metal support plate 91 is increased, so that high frequency of the circuit is hindered or noise is generated via the metal support plate 91. There was a problem of easy propagation. Further, the external connection terminal 95 in the case of configuring a module needs to be mounted on the substrate as a separate part, and there is a problem that positioning of the plurality of external connection terminals is difficult.
[0006]
The present invention solves the above-mentioned conventional problems, and improves both the heat dissipation characteristics and the insulation characteristics, which are important characteristics of the heat dissipation board, and at the same time reduces the wiring resistance which is important in constructing a high-power electronic circuit. A heat dissipating board with a three-dimensional structure that can reduce the distribution capacity of wiring patterns that cause noise and can be integrated with external connection terminals, etc., and that can be easily realized and The object is to provide a manufacturing method thereof.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention comprises a metal plate punched into a predetermined wiring pattern, and a highly thermally conductive composite insulating material molded integrally with the metal plate, and at least from the composite insulating material, A component mounting portion in the metal plate is exposed, and a step processing portion is provided in the heat generating component arrangement portion in the component mounting portion .
[0008]
With this configuration, since the wiring pattern is a metal plate, the wiring resistance is naturally low, which is suitable for a large current circuit. In addition, the heat generated by the components mounted on this board is once diffused by the metal plate and then dissipated by the highly heat-conductive composite insulating material. Since the insulating layer can be made thick, the insulating property is improved, and the distributed capacity between patterns can be reduced. Further, since the metal plate is stamped and formed with a composite material having high thermal conductivity, the metal plate can be easily implemented, and a three-dimensional structure that is difficult with a conventional heat dissipation substrate is also possible.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention comprises a metal plate punched into a predetermined wiring pattern, and a high thermal conductivity composite insulating material integrally molded with the metal plate, from the composite insulating material, At least a component mounting portion in the metal plate is exposed, and a stepped portion is provided in the heat generating component placement portion in the component mounting portion. According to this, the composite formed in the lower portion of the heat generating component placement portion As a result, the insulating material becomes thinner, and as a result , after being thermally diffused by the metal plate, heat is dissipated by the highly heat-insulating insulating material, so that heat dissipation is improved and the distribution capacity of the wiring pattern can be reduced. is there.
[0010]
According to a second aspect of the present invention, the composite insulating material according to the first aspect constitutes a cavity capable of housing a component, and facilitates positioning of the electronic component to be mounted.
[0011]
According to a third aspect of the present invention, the composite insulating material according to the first aspect is provided with protrusions around the surface of the heat dissipating board for mounting electronic components, and the strength of the board is improved and the fitting with the case is performed. The joint can be formed very easily.
[0012]
According to a fourth aspect of the present invention, the metal plate according to the first aspect is punched into a predetermined wiring pattern, and at least a part thereof is bent or drawn so as to protrude from the plane of the metal plate. The metal plate can improve the strength of the heat dissipation substrate.
[0013]
According to a fifth aspect of the present invention, a part of the metal plate according to the first aspect is used as a terminal, and it is not necessary to provide a terminal part separately.
[0014]
According to a sixth aspect of the present invention, a terminal is formed by bending at least a part of the outer shape of the molded body of the high thermal conductivity composite insulating material integrally molded with the metal plate according to the fifth aspect. It is intended to improve the withstand voltage from the circuit by securing a creepage distance from the chassis and radiator that are connected to the rear surface.
[0015]
In the invention according to claim 7 of the present invention, first, a metal plate is punched into a predetermined wiring pattern, and a step processing is applied to a heat generating component arrangement portion of a component mounting portion of the metal plate, and then the metal plate is molded into a mold. held within, the mold pouring molten high thermal conductivity of the composite insulating material, integrally molded on the substrate by a composite insulating material of the high thermal conductivity of the metal plate while exposing at least the component mounting portion and, then the electrically connecting parts integrally molded substrate and processed into terminal then bending a portion of the metal plate, then the manufacture of electronic components mounting heat dissipation substrate which covers the components by the case or resin This method can efficiently manufacture a heat dissipation board for mounting electronic components on which electronic components are mounted.
[0016]
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0017]
(Embodiment 1)
1 and 2 are views showing an electronic component mounting heat dissipation board according to the first embodiment. FIG. 1 is a perspective view and FIG. 2 is a cross-sectional view. In FIG. 1, reference numeral 1 denotes a metal plate punched into a wiring pattern. The metal plate 1 is preferably a copper plate having good thermal conductivity and conductivity, and a press machine is used as a means for punching into a wiring pattern. It can be easily realized. Reference numeral 2 denotes a composite insulating material having high thermal conductivity, which is a material capable of insert molding of the metal plate 1 by injection molding or transfer molding, and has high heat resistance so that electronic parts can be soldered as a base resin material. Using thermosetting epoxy resin or thermoplastic polyphenylene sulfide, liquid crystal polymer, polystyrene, nylon, or a mixture of these materials, this base resin material is made of aluminum oxide, aluminum nitride, and oxide with insulation and high thermal conductivity. Powder filler made of magnesium, boron nitride, zinc oxide, silica, titania, spinel, etc., or a mixture selected from these with a coupling agent such as titanium or silane, and fiber such as glass or whisker Thermal conductivity and strength by kneading filler mainly composed of filler A composite dielectric material having enhanced.
[0018]
3 is an electronic component mounted on the heat dissipation board, 4 is an exposed portion of the metal plate 1 for electrically connecting the electronic component 3, 5 is a cavity for mounting the electronic component 3, and 6 is the metal plate 1 It was the terminal part that was. In FIG. 2, reference numeral 7 denotes an external radiator used when the heat radiation board alone is not sufficient for heat radiation. The metal plate 1 pierced into a wiring pattern with such a high thermal conductive composite insulating material 2 is integrally formed with the mounting portion of the electronic component 3 exposed.
[0019]
Since the heat dissipation substrate configured as described above is the metal plate 1 with the wiring pattern punched out, the wiring resistance is low, and the heat generated by the mounted electronic component 3 is thermally diffused by the metal plate 1 punched into the wiring pattern. After that, the heat is dissipated by the high thermal conductivity composite insulating material 2, and thus the heat dissipation characteristics are excellent. Further, even when the external radiator 7 is used, the insulating characteristic is good because the insulating layer is thick, and the distributed capacity between patterns can be reduced. Furthermore, the component mounting portion of the metal plate 1 is exposed and the mounting cavity 5 is configured by the high thermal conductive composite insulating material 2, thereby facilitating the positioning of the component and eliminating the need for a resist for preventing solder bridges. Become.
[0020]
In addition, since the metal plate 1 is molded with the high thermal conductive composite insulating material 2, the degree of adhesion is improved, and the high thermal conductive composite insulating material 2 is disposed on both sides of the metal plate 1, so that the resin after molding is formed. The present invention has the advantage of the substrate structure that the warpage of the substrate due to shrinkage is reduced. Furthermore, the conventional wiring pattern formed on the surface of the substrate needs to secure a predetermined creepage distance in order to ensure insulation between the patterns, but according to this configuration, the wiring pattern is made of the composite insulating material 2 having high thermal conductivity. Since it is embedded, the pattern interval can be reduced.
[0021]
FIGS. 3 and 4 show an example in which the first embodiment is improved. FIG. 3 shows an example in which a frame-shaped protrusion 8 made of a highly heat-conductive composite insulating material 2 is provided on the surface of the heat dissipation substrate. By constructing such a protrusion 8, it is possible to provide various functions such as improving the strength of the heat dissipation substrate, ensuring the creepage distance necessary for insulation, and configuring the fitting portion with the case, etc. Depending on the mold, these configurations can be easily achieved.
[0022]
FIG. 4 shows an example in which a bent portion 9 is provided on the metal plate 1. The strength of the heat dissipation substrate can be improved by such bending and drawing. Further, the function of positioning the electronic component 3 can be provided by processing the metal plate 1 as described above. This type of processing can also be configured simultaneously with the formation of the wiring pattern by a press die. As described above, the heat dissipation board of this configuration can easily realize the three-dimensional processing that was difficult with the conventional heat dissipation board.
[0023]
The thickness of the copper plate as the metal plate 1 is preferably 0.5 mm or more in consideration of the thermal diffusion effect and the strength when the terminal is configured, and considering the workability when forming a pattern with a mold using a press. 1.0 mm or less is desirable. Moreover, the soldering property can be improved by plating the component mounting surface of the copper plate, and the surface of the bottom surface is roughened by blackening treatment or blasting treatment, so that the metal plate 1 and the high thermal conductive composite insulating material 2 Adhesion is improved. Further, when the pattern area of the metal plate 1 is large, the hole is partially drilled, so that the high thermal conductivity composite insulating material 2 penetrates into the hole-drilled portion at the time of integral molding, so that the adhesion can be further improved.
[0024]
(Embodiment 2)
Hereinafter, an integral molding method according to a second embodiment of the present invention will be described with reference to the drawings. 5 and 6 are cross-sectional views showing the integral molding method of (Embodiment 1). In FIG. 5, 1 is a metal plate punched into a wiring pattern, 11 is a first mold, 12 is a second mold, and 13 is a cavity provided in the first mold 11 and the second mold 12. , 14 is a protrusion for fixing the metal plate 1 provided on the first mold 11, 15 is a protrusion for fixing the metal plate 1 provided on the second mold 12, and 16 is a protrusion 15. A notch 17 provided at the tip of the spring 17 is a spring for holding the projection 15 protruding from the second mold 12. In FIG. 6, reference numeral 2 denotes a high thermal conductivity composite insulating material poured into the cavity 13.
[0025]
The integral molding method using the mold configured as described above will be specifically described. The metal plate 1 is held in the cavity 13 by a protrusion 14 provided on the first mold 11 and a protrusion 15 provided on the second mold 12. In this state, when the molten high thermal conductivity composite insulating material 2 is poured into the cavity 13, the metal plate 1 and the high thermal conductive composite insulating material 2 are integrally formed. Here, by forming the protruding portion 14 into a shape that can accommodate components, a cavity 13 that exposes a part of the metal plate 1 and that can accommodate components in the molded body of the composite insulating material 2 having high thermal conductivity can be configured. Further, the protrusion 15 is pressed down after the cavity 13 is completely filled with the high heat conductive composite insulating material 2 melted in the notch 16 provided at the tip thereof. As a result, the metal plate 1 is not exposed to this surface because the high thermal conductivity composite insulating material 2 having a thickness corresponding to the amount of movement of the protrusion 15 is disposed on the metal plate 1.
[0026]
The protrusion 15 can be mechanically slid from the outside, and the notch 16 is not necessary at this time.
[0027]
7, 8, and 9 are cross-sectional views showing an improved example of the above-described integral molding method. 7, FIG. 8, and FIG. 9 that are the same as those in FIG. 5 and FIG. 6 are given the same reference numerals and explanation thereof is omitted. In FIG. 7, the difference from FIG. The processing part 18 is provided. The insulating layer formed of the high thermal conductivity composite insulating material 2 on the back surface of the metal plate 1 is desirably 0.4 mm or more in view of its insulating characteristics and resin strength. However, when all the back surfaces of the metal plate 1 are set to 0.4 mm, it is difficult to fill the high thermal conductive composite insulating material 2 whose viscosity is increased by adding the filler, and at the same time, the substrate strength is weakened. In addition, when the insulating layer is thickened, the heat dissipation characteristic is deteriorated. Accordingly, at least the stepped portion 18 is provided in the pattern portion of the metal plate 1 on which the heat generating component is disposed, and the insulating layer on the back surface of the stepped portion 18 is set to 0.4 mm. If the height of the notch 16 provided at the tip of the protrusion 15 is within 0.4 mm, the insulating layer can be 0.4 mm or more in all regions. With the above configuration, it is possible to achieve integral molding of a heat dissipation substrate having excellent heat dissipation characteristics and insulation characteristics, improved substrate strength, and excellent moldability. In this case, the distributed capacity can be further reduced.
[0028]
In addition, if the minimum value of the insulating layer thickness is set between 0.4 mm and 0.6 mm, there is no problem in the insulation characteristics and moldability, and only heat dissipation characteristics deteriorate above this. Further, by disposing a gate portion for pouring the composite insulating material 2 below the portion where the insulating layer is thinned by the step processing, the insulating layer can be easily formed without generating burrs on the exposed surface of the metal plate 1. .
[0029]
8 differs from FIG. 6 in that a projection 19 fixed to the second mold 12 is provided. The projecting portion 19 is provided at least on the back surface of the pattern portion of the metal plate 1 on which the heat generating component is disposed, and the insulating layer formed by the high thermal conductivity composite insulating material 2 in this portion is thinned. It is the same as the case of. 7 differs from FIG. 7 in that it is necessary to attach a projection similar to the projection 19 to the external radiator, but the step processing of the metal plate 1 can be eliminated, and the projection of the radiator is made higher than the projection 19. As a result, even when the heat dissipation substrate has a warp, the adhesion degree of this portion is good.
[0030]
9 differs from FIG. 5 in that a groove 20 is formed in the metal plate 1. The groove portion 20 is a portion in contact with the protrusion 14 provided on the first mold 11 and is formed around the inside of the exposed portion of the metal plate 1. Even when burrs are generated between the metal plate 1 and the protrusions 14 when the cavity 13 is filled with the composite insulating material 2 having a high thermal conductivity by the grooves 20, the burrs are stopped at the grooves 20, and thus the metal plate 1. No burr extends to the exposed part.
[0031]
(Embodiment 3)
A third embodiment of the present invention will be described below with reference to FIGS. FIG. 10 to FIG. 15 are diagrams for each manufacturing process of the heat dissipation board on which electronic components constituting the DC-DC converter are mounted as the third embodiment of the present invention.
[0032]
First, as shown in FIG. 10, the metal plate 1 forms a predetermined wiring pattern integrated with the outer frame frame by punching. Reference numeral 22 denotes a screw seat for fixing the heat radiating board to the chassis or the heat radiator. The screw seat 22 is processed at the same time as the metal plate 1 is punched, and the bottom surface thereof is flush with the bottom surface of the heat radiating board. Step processing is applied. Here, a 0.5 mm thick copper plate is used as the metal plate 1 as a material that can be soldered and has good thermal conductivity.
[0033]
Next, as shown in FIG. 11, the metal plate 1 is integrally formed on the heat dissipation substrate with the composite insulating material 2 having high thermal conductivity. As an integral molding method, the metal plate 1 is fixed in a mold having a substrate-shaped cavity, and in that state, a high-heat conductive composite insulating material 2 is poured into the mold and injection molding or transfer molding is performed. The law. The component mounting portion is provided with a protrusion on the mold, and the exposed portion 4 of the metal plate 1 for electrically connecting the electronic component 3 and the electronic component 3 are mounted by fixing the metal plate 1 with the protrusion. The cavity 5 is formed. In FIG. 11, the exposed portion 4 is indicated by hatching. The terminal portion 6 is fixed so that the upper surface and side surfaces thereof are in contact with the mold at the time of molding, thereby reducing the area in contact with the composite insulating material 2 having high thermal conductivity.
[0034]
Next, as shown in FIG. 12, the electronic component 3 is disposed in the cavity 5 formed on the heat dissipation substrate and electrically connected to the exposed portion 4. The electronic component 3 is electrically connected by soldering. Since the surface of this heat radiating substrate is not flat, there are a solder placement method such as a dispenser coating method, a transfer coating method, and a plate-like solder placement method. A heat radiating board on which solder and electronic components 3 are placed is placed on the surface of the foil body 32 of the heating means composed of a liquid tank 31 controlled in temperature by a heat source 30 and a foil body 32 placed on the surface of the liquid tank 31. A process of heating and soldering is used. The foil body 32 is used for preventing the material of the liquid tank 31 from adhering to the heat dissipation substrate and improving the adhesion to the heat dissipation substrate. Specifically, a highly heat-resistant plastic film such as polyimide or Teflon is arranged as a foil body 32 on the surface of a liquid tank 31 using a molten metal such as oil or solder controlled at a predetermined temperature, and a heat dissipation board is placed thereon. Heating and soldering.
[0035]
In the case of reflow using a gas phase, it takes time until the heat dissipation substrate having a large heat capacity reaches a predetermined temperature, and an excessive thermal stress is applied to the electronic component 3 and the high thermal conductivity composite insulating material 2. For example, since the heat dissipation substrate and the electronic component 3 on the substrate are not heated above the temperature of the liquid tank 31, thermal stress on the high thermal conductivity composite insulating material 2 and the electronic component 3 constituting the heat dissipation substrate can be greatly reduced. Further, since the substrate itself has excellent thermal conductivity, heat transfer to the solder is fast and the soldering time can be shortened. Furthermore, the soldering time can be further shortened by preheating in one tank using two liquid tanks 31.
[0036]
Needless to say, this soldering method can achieve the same effect even with a heat dissipation substrate such as a metal base substrate or an alumina substrate.
[0037]
Next, as shown in FIG. 13, the outer frame frame of the metal plate 1 is cut away to make the wiring pattern independent. It is also possible to perform an electrical test of the circuit in this state. Thereafter, the terminal portion 6 is bent up. At this time, the bent portion of the terminal portion 6 is set to the inner side of the outer shape of the heat dissipation board. The terminal portion 6 is easily peeled off because the area where the high thermal conductivity composite insulating material 2 is in contact with the mold is reduced in advance, and the plurality of terminal portions 6 can be separated from the high thermal conductive composite insulating material 2. Since it is integrated, the positioning is easy. Further, since the creeping distance from the chassis and the radiator connected to the back surface can be ensured by bending the terminal portion 6 on the inner side of the outer shape, the withstand voltage from the circuit can be improved.
[0038]
Next, as shown in FIG. 14, molding or casing is performed so as to cover the electronic component 3 with a part of the terminal portion 6 exposed.
[0039]
FIG. 15 is a perspective view of a heat dissipation board in which the configurations of the metal plate 1 and the high thermal conductive composite insulating material 2 of FIG. 11 are changed. 15 differs from FIG. 11 in that a plurality of terminal portions 6 are integrally formed of a composite insulating material 2 independent of the heat dissipation substrate, and the metal plates 1 are alternately arranged at a predetermined interval.
[0040]
In FIG. 15, reference numeral 41 denotes a composite insulating material molded body that integrates the terminal portion 6, and 42 denotes a facing portion of the metal plate 1. The composite insulating material molded body 41 can improve the relative positional accuracy and terminal strength of the terminal portion 6, and can also define the distance from the heat dissipation substrate when another substrate is inserted into the terminal. The opposing part 42 of the metal plate 1 can improve the strength of the heat dissipation board while being insulated.
[0041]
【The invention's effect】
As described above, the electronic component mounting heat dissipating board of the present invention includes a metal plate punched into a predetermined wiring pattern, and a highly thermally conductive composite insulating material integrally molded with the metal plate, and the composite insulating material Therefore, since at least the component mounting portion of the metal plate is exposed, the wiring pattern is a metal plate, so that the wiring resistance is naturally low, which is suitable for a large current circuit.
[0042]
In addition, by providing a stepped portion in the heat generating component placement portion in the component mounting portion, the composite insulating material formed under the heat generating component placement portion is thinned to improve heat dissipation characteristics, insulation characteristics, and substrate It is possible to achieve both improvement in strength.
[0043]
In addition , the heat generated by the electronic components mounted on this board is once diffused by the metal plate, and then dissipated by the high thermal conductivity composite insulating material, so the heat dissipation is good. Even in the case of mounting, the heat resistance between the heat-generating component and the radiator is low. By improving the heat dissipation, the insulating layer made of the high thermal conductivity composite insulating material can be made thicker, so that the insulating property is improved and the distributed capacity between patterns can be reduced. In addition, the metal plate is stamped and formed with a high thermal conductivity composite insulating material, so that it can be easily implemented, and a three-dimensional structure that is difficult with a conventional heat dissipation substrate is also possible. .
[Brief description of the drawings]
FIG. 1 is a perspective view of a heat dissipation board for mounting electronic components according to an embodiment of the present invention. FIG. 2 is a sectional view of the same side. FIG. 3 is a perspective view of a state in which the electronic components are arranged. FIG. 5 is a side sectional view showing a method for manufacturing a heat dissipation board for mounting electronic components according to another embodiment of the present invention. FIG. 6 is a view showing a molding state when the composite insulating material is filled. Side sectional view [FIG. 7] Side sectional view of the improved example [FIG. 8] Side sectional view illustrating the molded state of the improved example [FIG. 9] Side sectional view illustrating the molded state of the improved example [FIG. 10] The perspective view of the metal plate of the principal part of other embodiment of this invention [FIG. 11] The perspective view of the state integrally molded with the composite insulating material which is the principal part [FIG. 12] The mounting state of the same electronic component is demonstrated. Side cross-sectional view [Fig. 13] Perspective view of the electronic component mounting board with the metal plate cut and the terminals bent. [Fig. FIG. 15 is a perspective view of a state where it is integrally formed with a composite insulating material, which is a main part of the improvement example. FIG. 16 is a perspective view of a conventional heat dissipation board for mounting electronic components. Side sectional view [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Metal plate 2 Composite insulating material 3 Electronic component 4 Exposed part 5 Cavity 6 Terminal part 8 Protrusion part 9 Bending part 11 1st metal mold | die 12 2nd metal mold | die 13 Cavity 14 Protrusion part 15 Protrusion part 16 Notch part 17 Spring 18 Step processed portion 19 Projection portion 20 Groove portion 22 Screw seat 30 Heat source 31 Liquid tank 32 Foil body

Claims (7)

A metal plate punched into a predetermined wiring pattern, and a high thermal conductive composite insulating material integrally molded with the metal plate, from the composite insulating material, exposing at least a part mounting portion in the metal plate ; A heat dissipating board for mounting an electronic component, in which a stepped portion is provided in a heat generating component arrangement portion in the component mounting portion .   2. The electronic component mounting heat dissipation board according to claim 1, wherein a composite insulating material is integrally formed on both the upper and lower surfaces of the metal plate so as to form a cavity in which at least a component mounting portion of the metal plate is exposed and a component can be stored. .   The heat radiation for mounting an electronic component according to claim 2, wherein a composite insulating material is integrally formed so as to be disposed on both upper and lower surfaces of the metal plate with at least a component mounting portion of the metal plate exposed. substrate.   The heat dissipating board for mounting an electronic component according to claim 1, wherein the metal plate is punched into a predetermined wiring pattern, and at least a part thereof is bent or drawn so as to protrude from the plane of the metal plate.   The electronic component mounting heat dissipation board according to claim 1, wherein a composite insulating material is integrally formed with at least a part of the metal plate exposed, and the part of the metal plate is used as a terminal.   6. The heat dissipating board for mounting electronic parts according to claim 5, wherein the metal plate is bent at least partly inside the outer shape of the integrally formed molded body of high thermal conductivity composite insulating material to form a terminal. First, the metal plate is punched into a predetermined wiring pattern, and a step processing is performed on the heat-generating component placement portion of the component mounting portion of the metal plate, and then the metal plate is held in the mold and melted in the mold. pouring the conductivity of composite insulation material, the integrally formed on a substrate by a composite insulating material of the high thermal conductivity metal plate while exposing at least the component mounting portion, electrical components subsequently the integrally molded substrate was connected, it was processed into a terminal and then folding a portion of the metal plate, a method of manufacturing an electronic component mounting heat dissipation substrate which covers the components by subsequent case or resin.

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