JP2013074244A - Wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wiring board which enables a connection terminal of an IC to connect with a metal core material with a simple operation.SOLUTION: A wiring board includes: a conductive metal core material 21; insulation layers 41, 43 which are disposed so as to cover an outer peripheral surface of the metal core material 21, and an IC 12 which has multiple connection terminals 17a, 18a and is mounted on at least one surface of the insulation layer. The insulation layer existing in a region of at least one connection terminal which is provided on the IC 12 is removed, and a copper plate 15 is provided at the region. The connection terminal and the metal core material 21 are electrically connected to each other through the copper plate 15. The structure allows the connection terminal of the IC 12 to connect with the metal core material 21 with a simple operation and improves the heat radiation characteristics.

Description

  The present invention relates to a wiring board provided with a metal core layer, and more particularly to a technique for improving heat dissipation characteristics of an electronic component mounted on the surface of the board.

  For example, a wiring board mounted on a vehicle raises the temperature of an electronic component such as an IC mounted on the board when energized. Therefore, it is desirable to efficiently dissipate this heat. Therefore, conventionally, for example, as disclosed in Patent Document 1, by connecting the connection terminal of the electronic component to a portion excellent in heat dissipation such as a bus bar provided on the core layer of the substrate or the back side of the substrate. It has been proposed to efficiently dissipate heat accumulated in electronic components.

FIG. 5 is a plan view of a conventional wiring board 100 having a metal core layer, and FIG. 6 is a cross-sectional view thereof. As shown in FIG. 5, an electronic component 101 such as an IC is mounted substantially at the center of the board 113. . Further, as shown in FIG. 6, a conductive core layer 102 is provided in the middle of the substrate 113, and insulating layers 103 and 104 are formed on the upper surface and the lower surface, respectively, and wiring is formed on the upper surface side of the insulating layer 103. A pattern 105 is formed, and a wiring pattern 106 is formed on the lower surface side of the insulating layer 104. An electronic component 101 such as an IC is mounted on the surface of the substrate. Further, a part of the core layer 102 protrudes to the outside and serves as a terminal part 102a for connection to an external device. Further, a part of the insulating layer 104 serves as an opening 107, and the opening 107 The core layer 102 is exposed on the surface of the portion thus formed. The connection terminal 111 of the electronic component 101 is connected to the wiring pattern 105, and the connection terminal 112 is connected to the core layer 102 through the opening 107.

  Accordingly, since the current flowing through the connection terminal 112 flows through the core layer 102, the conductivity of the connection terminal 112 is increased and the heat transfer characteristics are improved, so that a large current flows through the connection terminal 112. However, the temperature rise of the electronic component 101 can be suppressed.

JP 2006-100353 A

  However, in the conventional wiring substrate 100 shown in FIG. 6, it is necessary to extend the connection terminal 112 of the electronic component 101 to the core layer 102 provided below the opening 107 formed in the insulating layer 103. There was a problem that it was difficult to mount the electronic component on the substrate as it was.

  The present invention has been made in order to solve such a conventional problem, and an object of the present invention is to provide a wiring board capable of connecting a connection terminal of an electronic component to a metal core material with a simple operation. It is to provide.

  In order to achieve the above object, the invention according to claim 1 of the present application includes a conductive metal core material (21), and an insulating layer (41, 43) disposed so as to cover the outer peripheral surface of the metal core material, An electronic component (12) having a plurality of connection terminals (17a to 17e, 18a, 18b) and mounted on at least one surface of the insulating layer, and at least one of the connections provided in the electronic component Removing the insulating layer present in the terminal region, providing a conductive plate (for example, a copper plate 15) in this region, and electrically connecting the connection terminal and the metal core material via the conductive plate; Features.

  The invention according to claim 2 is characterized in that the conductive plate is arranged so that a surface thereof coincides with a surface of the insulating layer.

  The invention described in claim 3 is characterized in that conductive and long terminal portions (22a to 22d) projecting outward are provided on the same layer as the metal core material.

  The invention according to claim 4 is characterized in that the metal core material is separated into a plurality of core members (21a to 21c), and each core member is connected to the different connection terminal via the conductive plate. And

  In the first aspect of the present invention, the insulating layer covering the upper surface of the metal core material is removed from the portion that becomes the region of the terminal portion, the conductive plate is provided in this region, and the terminal portion is further connected to the conductive plate. Heat generated from the electronic component to be mounted can be efficiently transferred to the metal core material, and heat dissipation characteristics can be improved.

  In the invention of claim 2, since the conductive plate is arranged so that the surface of the insulating layer and the surface of the conductive plate coincide with each other, the substrate surface can be leveled and general-purpose electronic components can be easily mounted. Is possible.

  In the invention of claim 3, since the terminal portion is provided in the same layer as the metal core material, it can be used as a connector for connecting to other electronic components, and the wiring board can be easily connected.

  In the invention of claim 4, since the metal core material is separated into a plurality of core members, it is possible to dissipate heat by connecting a plurality of connection terminals provided in the electronic component to the plurality of core members.

It is a top view of the wiring board concerning one embodiment of the present invention. It is a top view which shows the metal core layer of the wiring board which concerns on one Embodiment of this invention. 1 is a schematic cross-sectional view of a wiring board according to an embodiment of the present invention. It is sectional drawing which shows the structure which molded the wiring board which concerns on one Embodiment of this invention with resin. It is a top view of the wiring board using the conventional metal core material. It is sectional drawing of the wiring board using the conventional metal core material.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1 and 2 are explanatory views showing the configuration of a wiring board 51 according to an embodiment of the present invention. FIG. 1 is a plan view, and FIG. 2 is a metal core material 21 (core members 21a, 21b, 21c inside the board). ) Is a plan view of the layer provided. FIG. 3 is a schematic cross-sectional view of the wiring board 51.

  As shown in FIG. 1, the wiring board 51 has a board body 11 having a rectangular shape as a whole. An IC 12 (electronic component) and various parts 13 are mounted on the surface of the board body 11. ing. As shown in FIG. 3, the wiring board 51 has a multilayer structure, and a conductive metal core material 21 (metal core material; for example, a copper plate) is provided in the center layer, and the upper surface (FIG. 2). An insulating layer 41 is laminated on the upper side of the metal core material 21 shown in FIG. 2, and an insulating layer 43 is laminated on the lower surface (the lower side of the metal core material 21 shown in FIG. 2). That is, the insulating layers 41 and 43 are laminated so as to cover the periphery of the metal core material 21.

  Further, as shown in FIG. 2, the metal core material 21 is divided into a plurality (three in this example) of core members 21a to 21c. Further, the insulating layer 41 is removed from a partial region of the substrate body 11, and a copper plate (conductive plate) 15 is provided in the removed region. At this time, the surface of the copper plate 15 and the surface of the insulating layer 41 are provided so as to coincide with each other.

  The copper plate 15 can be connected to the metal core material 21 using spot welding, press fitting, or the like. The connection between the connection terminal 18a and the copper plate 15 can be performed by spot welding or soldering.

  Further, the wiring pattern 14 (14 a, 14 b) is formed on the upper surface of the insulating layer 41, and the wiring pattern 44 is formed on the lower surface of the insulating layer 43. Since the wiring patterns 14 and 44 are routed as necessary, there is a region where the wiring patterns 14 and 44 do not exist. In this region, the insulating layers 41 and 43 shown in FIG. Will be exposed. Note that the wiring patterns 14 and 44 shown in the cross-sectional view of FIG. 3 are exaggerated in thickness to facilitate understanding. Therefore, the thickness of the wiring patterns 14 and 44 is actually thinner than that of the insulating layers 41 and 43.

  As shown in FIG. 1, the IC 12 includes connection terminals 17a to 17e and connection terminals 18a and 18b. Of these, the connection terminal 17a is connected to the wiring pattern 14a. Further, a through hole 16a is formed in the wiring pattern 14a, and as shown in FIG. 2, the through hole 16a is electrically connected to the core member 21a and eventually integrated with the core member 21a. It is connected to the terminal part 22a which protrudes outside.

  Further, as shown in FIG. 1, the connection terminal 18b is connected to the wiring pattern 14b, and a through hole 16b is formed in the wiring pattern 14b. Accordingly, the wiring pattern 14b is electrically connected to the core member 21c shown in FIG. 2, and is connected to the terminal portion 22d that is integrated with the core member 21c and protrudes to the outside.

  The connection terminal 18a is connected to the copper plate 15, and the copper plate 15 is further connected to the core member 21b. Furthermore, it is connected to the terminal portions 22b and 22c that are integrated with the core member 21b and project outside. Therefore, the connection terminal 18a of the IC 12 is connected to the core member 21b, and as a result, is electrically connected to the terminal portions 22b and 22c provided so as to protrude outward from the core member 21b.

  As shown in FIG. 3, the wiring board 51 has a configuration in which a part of the insulating layer 41 is removed and the copper plate 15 is provided in the removed portion, so that the connection terminal 18 a of the IC 12 is connected to the copper plate 15. Thus, the connection terminal 18 a and the core member 21 b can be electrically connected via the copper plate 15. Further, the IC 12 can be connected to the core member 21b having high heat dissipation characteristics.

  In this manner, in the wiring board 51 according to the present embodiment, the connection terminal 18a of the IC 12 is connected to the core member 21a via the copper plate 15, and eventually connected to the terminal portions 22b and 22c. Compared with the case where a connection terminal and a metal core material are connected via the, the conductivity can be improved. Further, since the heat generated in the IC 12 is coupled to the core member 21b having high heat dissipation characteristics via the connection terminal 18a and the copper plate 15, the heat generated in the IC 12 can be efficiently radiated, and the temperature of the IC 12 is increased. Can be suppressed.

  Further, as shown in FIG. 4, the wiring board 51 according to the present embodiment covers the periphery with an exterior material 32, fills the inside with a resin 31 and molds the whole, thereby modularizing the wiring board 51. With the configuration, since the copper plate 15 and the resin 31 are in contact with each other, the heat generated in the IC 12 can be transmitted to the resin 31 through the copper plate 15 and a further heat radiation effect can be achieved. .

  The wiring board of the present invention has been described based on the illustrated embodiment. However, the present invention is not limited to this, and the configuration of each part may be replaced with an arbitrary configuration having the same function. it can.

  For example, in the above-described embodiment, an example in which one connection terminal 18a is connected to the core member 21b has been described. However, the other connection terminals 17a to 17e and 18b are connected to the core member 21a or 21c via a conductive plate. It is good also as a structure.

  In the above-described embodiment, the example in which the copper plate 15 is provided as the conductive plate material (conductive plate) in the portion from which the insulating layer 41 is removed has been described. However, the present invention is not limited to this, A conductive plate made of a material may be used.

  The present invention can be used to improve the heat dissipation of a wiring board.

11 Board body 12 IC
13 Parts 14 (14a, 14b) Wiring pattern 15 Copper plates 16a, 16b Through holes 17a-17e Connection terminals 18a, 18b Connection terminals 21 Metal core materials 21a-21c Core members 22a-22d Terminal portions 31 Resins 32 Exterior materials 41, 43 Insulating layers 44 Wiring pattern 51 Wiring board 100 Wiring board 101 Electronic component 102 Core layer 102a Terminal portion 103, 104 Insulating layer 105 Wiring pattern 107 Openings 111, 112 Connection terminal 113 Substrate

Claims (4)

A conductive metal core material;
An insulating layer disposed so as to cover the outer peripheral surface of the metal core material;
An electronic component having a plurality of connection terminals and mounted on at least one surface of the insulating layer,
The insulating layer existing in the region of at least one of the connection terminals provided in the electronic component is removed, a conductive plate is provided in this region, and the connection terminal and the metal core material are electrically connected via the conductive plate. A wiring board characterized by being connected to a wiring board.   The wiring board according to claim 1, wherein the conductive plate is disposed so that a surface thereof coincides with a surface of the insulating layer.   3. The wiring board according to claim 1, wherein a conductive and long terminal portion protruding outward is provided on the same layer as the metal core material. 4.   The said metal core material is isolate | separated into the several core member, and each core member is connected to the said connection terminal which is each different via the said electrically conductive board, The any one of Claims 1-3 characterized by the above-mentioned. Wiring board as described in.

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