JP3951400B2 - Electronic circuit module - Google Patents

Electronic circuit module Download PDF

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Publication number
JP3951400B2
JP3951400B2 JP12998A JP12998A JP3951400B2 JP 3951400 B2 JP3951400 B2 JP 3951400B2 JP 12998 A JP12998 A JP 12998A JP 12998 A JP12998 A JP 12998A JP 3951400 B2 JP3951400 B2 JP 3951400B2
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JP
Japan
Prior art keywords
electronic component
connecting portion
metal plate
insulating material
composite insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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JP12998A
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Japanese (ja)
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JPH11195747A (en
Inventor
久雄 平城
令二 今野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP12998A priority Critical patent/JP3951400B2/en
Publication of JPH11195747A publication Critical patent/JPH11195747A/en
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Publication of JP3951400B2 publication Critical patent/JP3951400B2/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/222—Completing of printed circuits by adding non-printed jumper connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Description

【０００１】
【発明の属する技術分野】
本発明はインバータ回路や電源回路のような大電力を扱う電子機器に用いられる電子回路モジュールに関するものである。
【０００２】
【従来の技術】
従来のインバータ回路や電源回路のような大電力を扱う電子機器に用いられる放熱基板を利用した電子回路モジュールは図１０に示すように構成されていた。
【０００３】
すなわち、図１０において、１は配線パターン状に打抜いた金属板、２はこの金属板１の端子部６および電子部品３を実装する接続部を除いてモールドした高熱伝導性の複合絶縁材料、３は実装された半導体などの電子部品、４は上記複合絶縁材料２から表出するように金属板１に一体に設けた取付用のビス座、５は同じく電子部品３を実装するために金属板１の接続部を露出させるとともに電子部品３を収納するように複合絶縁材料２に設けたキャビティ、６はこの複合絶縁材料２の周縁部から突出するように金属板１で形成された端子部である。
【０００４】
上記構成において、所定の配線パターン状に打抜いた金属板１を高熱伝導性の複合絶縁材料２で、電子部品の接続部、端子部６、ビス座４を表出するように一体成形して放熱基板を構成し、キャビティ５の底面に表出する接続部に電子部品３を実装して電子回路モジュールを構成している。
【０００５】
また、放熱基板に電子部品３を実装する半田付けは、図１１に示すように熱源７に外周部を被われた液体槽８の溶融半田などの液体９の上面に箔体１０を被せ、上記放熱基板のキャビティ５に電子部品３を載置したものを載置して加熱し、金属板１の接続部あるいは電子部品３の電極部にあらかじめ施したクリーム半田を溶融して半田付けを行っていた。
【０００６】
【発明が解決しようとする課題】
しかしながら上記従来の構成では、放熱基板内の電子部品の接続部と同一平面上に電子部品３を実装して電子回路モジュールを構成しているため、放熱基板の外形面積以上の高密度の電子部品実装が困難であった。
【０００７】
また、配線パターンを打抜いた金属板１を複合絶縁材料２でモールドして放熱基板を構成しているため、金属板１としては配線パターンが繋がった構成にしか加工できず、放熱基板の外形面積内で配線パターンの最適な引きまわしが困難となり電子部品３が実装できないデッドスペースが大きくなってしまうという問題点を有していた。
【０００８】
さらに、液体槽８を用いた半田付け方法において、液体槽８の表面に配置した箔体１０の上に放熱板を載せて半田付けを行うため大型設備が必要となり、しかも箔体１０の管理も必要でコスト面、手数がかかる点で問題があった。
【０００９】
本発明は以上のような従来の欠点を除去するものであり、高密度実装が可能でデッドスペースを小さくできる電子回路モジュールを提供することを目的とするものである。
【００１０】
【課題を解決するための手段】
上記課題を解決するために本発明の電子回路モジュールは、配線パターン状に打抜いた金属板と、この金属板をモールドした高熱伝導性の複合絶縁材料と、この複合絶縁材料に設けられ上記金属板の電子部品接続部を露出させたキャビティと、上記複合絶縁材料より突出するように折曲された外部電子部品接続部と、上記電子部品接続部および外部電子部品接続部に実装された電子部品により構成されている。
【００１１】
上記構成とすることにより、高密度実装が可能で配線パターンの引きまわしの自由度が高まり電子部品の実装できないデッドスペースを小さくすることができる。
【００１２】
【発明の実施の形態】
本発明の請求項１に記載の発明は、配線パターン状に打抜いた金属板と、この金属板をモールドした高熱伝導性の複合絶縁材料と、この複合絶縁材料に設けられたキャビティと、このキャビティで露出する上記金属板の電子部品接続部と、上記キャビティから引出される上記金属板の外部電子部品接続部とを備え、この外部電子部品接続部は、上記複合絶縁材料より突出するように上記キャビティ内で折曲され、上記電子部品接続部および外部電子部品接続部にそれぞれ電子部品を配置した電子回路モジュールであり、電子部品が立体配置され実装密度を高め、配線パターンの引きまわしの自由度を高めることができる。
【００１３】
また本発明は、外部電子部品接続部が複合絶縁材料の片面あるいは両面上に部分的に突出して形成することにより、複合絶縁材料の外形内において電子部品の立体的実装が可能となる。
【００１４】
請求項２に記載の発明は、外部電子部品接続部が複合絶縁材料の側面から引出され、これを折曲して上記キャビティ上にくるように構成したものであり、複合絶縁材料から引出される外部電子部品接続部を任意な配線パターンに形成でき、数多くの電子部品の実装が可能となる。
【００１５】
また本発明は、複合絶縁材料の側面から突出させた外部電子部品接続部を高熱伝導性の複合絶縁材料でモールドし、この複合絶縁材料に電子部品を実装する部分にキャビティを設け、電子部品を実装したものを折曲して複合絶縁材料どうしを重ね合せた場合、電子部品で発生した熱が放散されやすいものとなる。
【００１６】
請求項３に記載の発明は、配線パターン状に打抜いた金属板の一部に渦巻状のパターンを形成した構成であり、インダクタンス機能を持せることができる。
【００１７】
請求項４に記載の発明は、電子部品を載置した金属板と複合絶縁材料からなる放熱基板の側面に引出した端子部を発熱体で加熱して金属板の電子部品接続部または外部電子部品接続部に電子部品を半田付けした構成で、電子部品の実装が簡単な設備によって効率的に行えることになる。
【００１８】
以下、本発明の実施の形態について図面を用いて説明する。
【００１９】
（実施の形態１）
図１は本発明の実施の形態１の電子回路モジュールを示す斜視図であり、１１は所定の配線パターン状に打抜いた金属板、１２はこの金属板１１をインサートモールドした高熱伝導性の複合絶縁材料、１３はこの複合絶縁材料１２の側面に突出した金属板１１の一部の端子部、１４は上記複合絶縁材料１２の上面あるいは下面に設けた電子部品１５を実装するキャビティ、１６はこのキャビティ１４に表出した金属板１１の一部の電子部品接続部、１７はキャビティ１４の端部あるいは複合絶縁材料１２の上面あるいは下面の一部から外方に突出し複合絶縁材料１２の上面あるいは下面から離れた位置で相対向して配置された外部電子部品接続部である。
【００２０】
上記のような構成で、金属板１１を所定の配線パターンを形成するように打抜き、金属板１１として一体化を図るため図１で破線で示すように周囲の枠部１８と端子部１３を接続したままの状態でモールド金型内にセットし、高熱伝導性の複合絶縁材料１２で電子部品１５を実装する部分にキャビティ１４を形成するように成形し、この成形後、金属板１１の枠部１８を切断除去し、キャビティ１４内に位置する外部電子部品接続部１７を折曲加工して放熱基板を構成する。
【００２１】
この放熱基板のキャビティ１４の電子部品接続部１６上に電子部品１５を載置するとともに外部電子部品接続部１７上にも電子部品１５を載置し、上記電子部品接続部１６および外部電子部品接続部１７に施した半田を加熱により溶融させて電子部品１５の電極と半田接続して電子回路モジュールを構成する。
【００２２】
このような構成とすることにより、電子部品１５の実装を立体配置することができ、実装密度を高め、金属板１１による配線パターンの引きまわしの設計自由度を著しく高めることができる。
【００２３】
（実施の形態２）
次に本発明の実施の形態２の電子回路モジュールについて図２，図３を用いて説明する。
【００２４】
図２，図３に示すように放熱基板としての基本構成は図１に示したものと同一であり、異なる点は、放熱基板の一部に配線パターン接続部１９を設けた点と、複合絶縁材料１２の一側面から引出した端子部を延長して外部電子部品接続部１７とし、その先端に上記配線パターン接続部１９に当接し半田付けされる端子接続部２０を折曲加工して設けた構成である。
【００２５】
この構成とすることにより、図２に示すように放熱基板のキャビティ１４内の電子部品接続部１６に電子部品１５を実装するとともに放熱基板の一側面から外方に伸びた状態の外部電子部品接続部１７にも電子部品１５を実装し、最後にこの外部電子部品接続部１７を放熱基板に重なるように折曲し、端部の端子接続部２０を放熱基板の配線パターン接続部１９に半田付けして図３に示すような電子回路モジュールとする。
【００２６】
上記構成とすることで、電子部品１５の実装はほぼ同一面で同時に行え、実装後外部電子部品接続部１７を折曲加工することで立体的な電子部品１５の配置が行えるため、組立性に優れたものとすることができ、実装密度の向上、配線パターン設計の自由度の向上さらには外部電子部品接続部１７への数多くの電子部品１５の実装が可能となる。
【００２７】
（実施の形態３）
続いて本発明の実施の形態３の電子回路モジュールについて図４，図５について説明する。
【００２８】
基本的には実施の形態２で示したものに改良を加えたもので、外部電子部品接続部１７を放熱基板と同様に高熱伝導性の複合絶縁材料１２でモールドし、電子部品１５を実装する部分にキャビティ１４を形成した構成としたものである。
【００２９】
すなわち、放熱基板が２個金属板１１で連結されて一体に構成された構成となり、図４に示すように電子部品１５を金属板１１を折曲する前に平面的な状態で実装した後露出した金属板１１を折曲して複合絶縁材料１２どうしが当接するように重ね合せ、外部電子部品接続部１７の端部の端子接続部２０を放熱基板の配線パターン接続部１９に半田付けして図５に示す電子回路モジュールとする。
【００３０】
この構成とすることにより、実施の形態２で示した効果の他に、高熱伝導性の複合絶縁材料１２が当接して重なっているため、いずれに実装した電子部品１５から発生する熱も効率的に放散されることになる。
【００３１】
（実施の形態４）
次に本発明の実施の形態４の電子回路モジュールについて図６，図７を用いて説明する。
【００３２】
図６，図７に示すものは実施の形態２の変形例で、放熱基板の複合絶縁材料１２の一側面から引出した外部電子部品接続部１７を電子部品１５を実装するために用いずに一つの電子部品としてのジャンパーとして利用するものである。
【００３３】
すなわち、外部電子部品接続部１７の先端に折曲加工した端子接続部２０を形成し、この外部電子部品接続部１７を折曲げて放熱基板の配線パターン接続部１９に接続して、外部電子部品接続部１７をジャンパーとして利用するものである。
【００３４】
この構成とすることにより配線パターンの設計の自由度をより高めることができる。
【００３５】
（実施の形態５）
次に本発明の実施の形態５について図８を用いて説明する。この実施の形態５は、実施の形態４の変形例であり、金属板１１の一部に渦巻状のパターン２１を設け、これを複合絶縁材料１２でモールドしてインダクタンス部を構成し、その渦巻状のパターン２１の中心部の端子２２を露出させ、実施の形態４で示した外部電子部品接続部１７をジャンパーとして利用する構成を用いて外部に引出すようにしたものである。
【００３６】
この構成とすることにより、電子回路モジュールとして簡単にインダクタンス機能を持せることができる。
【００３７】
（実施の形態６）
次に上記各実施の形態で示した放熱基板を利用して電子部品１５を半田付けし実装する例について図９を用いて説明する。
【００３８】
すなわち、図９に示すように放熱基板に電子部品１５を載置した状態で金属板１１の端子部１３に発熱体２３を当接または近接させて金属板１１を加熱し、電子部品接続部１６にあらかじめ施してある半田を溶融させて電子部品１５の電極を電子部品接続部１６に接続することで電子回路モジュールを構成する。
【００３９】
これは、あまり大きな放熱基板では金属板１１の熱伝導だけで均一に加熱できず半田付けの信頼性に欠けるものとなるおそれがあるが、比較的小さな放熱基板では十分に半田付けの信頼性が確保できる。
【００４０】
また、この半田付けは、熱風炉や従来例で示した液体槽などの大がかりな半田付設備を必要とせず、きわめて小さな設備で安価に半田付けが行えることになる。
【００４１】
【発明の効果】
以上のように本発明の電子回路モジュールは、キャビティで露出する金属板の電子部品接続部と、キャビティから引出され、複合絶縁材料より突出するようにキャビティ内で折曲された外部電子部品接続部とにそれぞれ電子部品を配置したため、電子部品の立体的実装が行えて実装密度を高めることができるとともに配線パターンの設計の自由度が大きくなり、産業的に有効なものとなる。
【図面の簡単な説明】
【図１】 本発明の実施の形態１の電子回路モジュールの斜視図
【図２】 同実施の形態２の電子回路モジュールの組立途上の斜視図
【図３】 同断面図
【図４】 同実施の形態３の電子回路モジュールの組立途上の斜視図
【図５】 同断面図
【図６】 同実施の形態４の電子回路モジュールの組立途上の要部斜視図
【図７】 同要部断面図
【図８】 同実施の形態５の電子回路モジュールに用いる放熱基板の上面図
【図９】 同実施の形態６の電子回路モジュールを構成する半田付時の斜視図
【図１０】 従来の電子回路モジュールを示す斜視図
【図１１】 従来の電子回路モジュールの電子部品の実装状態を示す説明図
【符号の説明】
１１ 金属板
１２ 複合絶縁材料
１３ 端子部
１４ キャビティ
１５ 電子部品
１６ 電子部品接続部
１７ 外部電子部品接続部
１９ 配線パターン接続部
２０ 端子接続部
２１ 渦巻状のパターン
２２ 端子
２３ 発熱体[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic circuit module used in an electronic device that handles high power, such as an inverter circuit or a power supply circuit.
[0002]
[Prior art]
An electronic circuit module using a heat dissipation substrate used in a conventional electronic device that handles a large amount of power such as an inverter circuit or a power supply circuit is configured as shown in FIG.
[0003]
That is, in FIG. 10, 1 is a metal plate punched into a wiring pattern, 2 is a high thermal conductive composite insulating material molded excluding the terminal portion 6 of this metal plate 1 and the connection portion for mounting the electronic component 3, 3 is an electronic component such as a mounted semiconductor, 4 is a mounting screw seat integrally provided on the metal plate 1 so as to be exposed from the composite insulating material 2, and 5 is a metal for mounting the electronic component 3. A cavity provided in the composite insulating material 2 so as to expose the connecting portion of the plate 1 and accommodate the electronic component 3, and a terminal portion 6 formed of the metal plate 1 so as to protrude from the peripheral edge of the composite insulating material 2 It is.
[0004]
In the above configuration, the metal plate 1 punched into a predetermined wiring pattern is integrally molded with the high thermal conductivity composite insulating material 2 so as to expose the connection part of the electronic component, the terminal part 6 and the screw seat 4. An electronic circuit module is configured by configuring a heat dissipation board and mounting the electronic component 3 on the connection portion exposed on the bottom surface of the cavity 5.
[0005]
Further, the soldering for mounting the electronic component 3 on the heat dissipation board is performed by covering the upper surface of the liquid 9 such as the molten solder in the liquid tank 8 covered with the outer periphery of the heat source 7 as shown in FIG. An electronic component 3 placed on the cavity 5 of the heat dissipation board is placed and heated, and the solder paste applied in advance to the connecting portion of the metal plate 1 or the electrode portion of the electronic component 3 is melted and soldered. It was.
[0006]
[Problems to be solved by the invention]
However, in the above-described conventional configuration, the electronic component 3 is mounted on the same plane as the connection portion of the electronic component in the heat dissipation board to constitute the electronic circuit module, and therefore, a high-density electronic component that is larger than the outer area of the heat dissipation board. Implementation was difficult.
[0007]
Further, since the metal plate 1 punched with the wiring pattern is molded with the composite insulating material 2 to constitute the heat dissipation substrate, the metal plate 1 can only be processed into a configuration in which the wiring pattern is connected. There is a problem that it is difficult to optimally route the wiring pattern within the area, and a dead space in which the electronic component 3 cannot be mounted increases.
[0008]
Furthermore, in the soldering method using the liquid tank 8, a large facility is required for soldering by placing a heat sink on the foil body 10 disposed on the surface of the liquid tank 8, and the foil body 10 is also managed. There was a problem in terms of necessity and cost.
[0009]
SUMMARY OF THE INVENTION The present invention eliminates the above-mentioned conventional drawbacks, and an object of the present invention is to provide an electronic circuit module that can be mounted at high density and can reduce dead space.
[0010]
[Means for Solving the Problems]
In order to solve the above problems, an electronic circuit module of the present invention includes a metal plate punched into a wiring pattern, a high thermal conductivity composite insulating material molded with the metal plate, and the metal plate provided on the composite insulating material. A cavity exposing the electronic component connecting portion of the board, an external electronic component connecting portion bent so as to protrude from the composite insulating material, and an electronic component mounted on the electronic component connecting portion and the external electronic component connecting portion It is comprised by.
[0011]
With the above-described configuration, high-density mounting is possible, the degree of freedom in routing the wiring pattern is increased, and the dead space where electronic components cannot be mounted can be reduced.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
The invention according to claim 1 of the present invention includes a metal plate punched into a wiring pattern, a high thermal conductivity composite insulating material molded with the metal plate, a cavity provided in the composite insulating material, An electronic component connecting portion of the metal plate exposed in the cavity; and an external electronic component connecting portion of the metal plate drawn out from the cavity, the external electronic component connecting portion protruding from the composite insulating material. An electronic circuit module which is bent in the cavity and has electronic components arranged in the electronic component connecting portion and the external electronic component connecting portion, respectively, and the electronic components are arranged in three dimensions to increase the mounting density and to freely draw the wiring pattern. The degree can be increased.
[0013]
Further, according to the present invention, the external electronic component connecting portion is formed so as to partially protrude on one side or both sides of the composite insulating material, so that the electronic component can be three-dimensionally mounted within the outer shape of the composite insulating material.
[0014]
The invention according to claim 2 is configured such that the external electronic component connecting portion is drawn out from the side surface of the composite insulating material and bent so as to come on the cavity , and is drawn out from the composite insulating material. The external electronic component connecting portion can be formed in an arbitrary wiring pattern, and a large number of electronic components can be mounted.
[0015]
Further, the present invention molds an external electronic component connecting portion projecting from the side surface of the composite insulating material with a high thermal conductive composite insulating material, and provides a cavity in a portion where the electronic component is mounted on the composite insulating material. by bending a material obtained by implementing when superposed composite insulating material with each other, heat generated in the electronic components is that easily dissipated.
[0016]
The invention according to claim 3 is a configuration in which a spiral pattern is formed on a part of a metal plate punched into a wiring pattern, and can have an inductance function.
[0017]
According to a fourth aspect of the present invention, there is provided a metal plate electronic component connecting portion or an external electronic component in which a metal plate on which an electronic component is placed and a terminal portion drawn on a side surface of a heat dissipation substrate made of a composite insulating material are heated by a heating element With the configuration in which the electronic component is soldered to the connecting portion, the electronic component can be mounted efficiently with simple equipment.
[0018]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0019]
(Embodiment 1)
FIG. 1 is a perspective view showing an electronic circuit module according to Embodiment 1 of the present invention, in which 11 is a metal plate punched into a predetermined wiring pattern, and 12 is a high thermal conductive composite in which this metal plate 11 is insert-molded. Insulating material, 13 is a terminal portion of a part of the metal plate 11 protruding from the side surface of the composite insulating material 12, 14 is a cavity for mounting an electronic component 15 provided on the upper surface or the lower surface of the composite insulating material 12, and 16 is this A part of the electronic component connecting portion 17 of the metal plate 11 exposed to the cavity 14 protrudes outward from an end of the cavity 14 or a part of the upper surface or the lower surface of the composite insulating material 12, and the upper surface or the lower surface of the composite insulating material 12. It is the external electronic component connection part arrange | positioned facing each other in the position away from.
[0020]
With the above configuration, the metal plate 11 is punched out so as to form a predetermined wiring pattern, and the peripheral frame portion 18 and the terminal portion 13 are connected as shown by a broken line in FIG. In this state, it is set in a mold, and is molded so as to form a cavity 14 in a portion where the electronic component 15 is mounted with a high thermal conductivity composite insulating material 12, and after this molding, the frame portion of the metal plate 11 is formed. 18 is cut and removed, and the external electronic component connecting portion 17 located in the cavity 14 is bent to form a heat dissipation substrate.
[0021]
The electronic component 15 is placed on the electronic component connecting portion 16 of the cavity 14 of the heat dissipation board, and the electronic component 15 is also placed on the external electronic component connecting portion 17 to connect the electronic component connecting portion 16 and the external electronic component. The solder applied to the portion 17 is melted by heating and soldered to the electrodes of the electronic component 15 to constitute an electronic circuit module.
[0022]
With such a configuration, the mounting of the electronic components 15 can be three-dimensionally arranged, the mounting density can be increased, and the degree of freedom in designing the wiring pattern by the metal plate 11 can be significantly increased.
[0023]
(Embodiment 2)
Next, an electronic circuit module according to Embodiment 2 of the present invention will be described with reference to FIGS.
[0024]
As shown in FIGS. 2 and 3, the basic structure of the heat dissipation board is the same as that shown in FIG. 1 except that a wiring pattern connecting portion 19 is provided on a part of the heat dissipation board and composite insulation. A terminal portion drawn out from one side of the material 12 is extended to form an external electronic component connecting portion 17, and a terminal connecting portion 20 that is in contact with and soldered to the wiring pattern connecting portion 19 is provided at the tip thereof. It is a configuration.
[0025]
With this configuration, as shown in FIG. 2, the electronic component 15 is mounted on the electronic component connecting portion 16 in the cavity 14 of the heat dissipation board and the external electronic component connection is extended outward from one side surface of the heat dissipation board. The electronic component 15 is also mounted on the portion 17, and finally, the external electronic component connection portion 17 is bent so as to overlap the heat dissipation substrate, and the terminal connection portion 20 at the end is soldered to the wiring pattern connection portion 19 of the heat dissipation substrate. Thus, an electronic circuit module as shown in FIG. 3 is obtained.
[0026]
With the above configuration, the electronic components 15 can be mounted on substantially the same surface at the same time, and the three-dimensional electronic components 15 can be arranged by bending the external electronic component connecting portion 17 after mounting. It is possible to improve the mounting density, to improve the degree of freedom of wiring pattern design, and to mount a large number of electronic components 15 on the external electronic component connecting portion 17.
[0027]
(Embodiment 3)
Next, the electronic circuit module according to Embodiment 3 of the present invention will be described with reference to FIGS.
[0028]
Basically, an improvement is made to the one shown in the second embodiment, and the external electronic component connecting portion 17 is molded with the high thermal conductive composite insulating material 12 and the electronic component 15 is mounted in the same manner as the heat dissipation substrate. The cavity 14 is formed in the portion.
[0029]
In other words, the heat dissipation board is connected by two metal plates 11 to form an integrated structure, and the electronic component 15 is mounted after being mounted in a planar state before the metal plate 11 is bent as shown in FIG. The metal plate 11 is bent and overlapped so that the composite insulating materials 12 are in contact with each other, and the terminal connection portion 20 at the end of the external electronic component connection portion 17 is soldered to the wiring pattern connection portion 19 of the heat dissipation board. The electronic circuit module shown in FIG. 5 is assumed.
[0030]
By adopting this configuration, in addition to the effects shown in the second embodiment, the composite insulating material 12 with high thermal conductivity is in contact and overlapped with each other, so that heat generated from the electronic component 15 mounted thereon is also efficient. Will be dissipated.
[0031]
(Embodiment 4)
Next, an electronic circuit module according to Embodiment 4 of the present invention will be described with reference to FIGS.
[0032]
6 and 7 show a modification of the second embodiment. The external electronic component connecting portion 17 drawn from one side surface of the composite insulating material 12 of the heat dissipation board is used without mounting the electronic component 15. It is used as a jumper as one electronic component.
[0033]
That is, a bent terminal connection portion 20 is formed at the tip of the external electronic component connection portion 17, the external electronic component connection portion 17 is bent and connected to the wiring pattern connection portion 19 of the heat dissipation board, and the external electronic component The connection part 17 is used as a jumper.
[0034]
With this configuration, the degree of freedom in designing the wiring pattern can be further increased.
[0035]
(Embodiment 5)
Next, a fifth embodiment of the present invention will be described with reference to FIG. The fifth embodiment is a modification of the fourth embodiment, in which a spiral pattern 21 is provided on a part of the metal plate 11, and this is molded with the composite insulating material 12 to form an inductance portion. The terminal 22 at the center of the pattern 21 is exposed, and the external electronic component connecting portion 17 shown in the fourth embodiment is used as a jumper, and is drawn out to the outside.
[0036]
With this configuration, the electronic circuit module can easily have an inductance function.
[0037]
(Embodiment 6)
Next, an example in which the electronic component 15 is soldered and mounted using the heat dissipation substrate shown in the above embodiments will be described with reference to FIG.
[0038]
That is, as shown in FIG. 9, in a state where the electronic component 15 is placed on the heat dissipation board, the heating plate 23 is brought into contact with or close to the terminal portion 13 of the metal plate 11 to heat the metal plate 11, and the electronic component connection portion 16. The electronic circuit module is configured by melting the solder applied in advance and connecting the electrodes of the electronic component 15 to the electronic component connecting portion 16.
[0039]
This is because if the heat dissipation board is too large, the metal plate 11 cannot be heated uniformly only by heat conduction, and the reliability of soldering may be lacking. However, if the heat dissipation board is relatively small, the reliability of soldering is sufficiently high. It can be secured.
[0040]
Further, this soldering does not require a large-scale soldering facility such as a hot stove or a liquid tank as shown in the conventional example, and can be soldered at a low cost with a very small facility.
[0041]
【The invention's effect】
As described above, the electronic circuit module of the present invention includes the metal plate electronic component connecting portion exposed in the cavity, and the external electronic component connecting portion that is drawn from the cavity and bent in the cavity so as to protrude from the composite insulating material. In addition, since the electronic components are respectively arranged , the electronic components can be three-dimensionally mounted, the mounting density can be increased, and the degree of freedom in designing the wiring pattern is increased, which is industrially effective.
[Brief description of the drawings]
FIG. 1 is a perspective view of an electronic circuit module according to Embodiment 1 of the present invention. FIG. 2 is a perspective view of the electronic circuit module according to Embodiment 2 during assembly. FIG. 3 is a sectional view. FIG. 5 is a cross-sectional view of the electronic circuit module according to the third embodiment of the present invention. FIG. 6 is a cross-sectional view of the electronic circuit module according to the fourth embodiment. 8 is a top view of a heat dissipation board used in the electronic circuit module of the fifth embodiment. FIG. 9 is a perspective view during soldering that constitutes the electronic circuit module of the sixth embodiment. FIG. FIG. 11 is a perspective view showing a module. FIG. 11 is an explanatory diagram showing a mounting state of electronic components of a conventional electronic circuit module.
DESCRIPTION OF SYMBOLS 11 Metal plate 12 Composite insulating material 13 Terminal part 14 Cavity 15 Electronic component 16 Electronic component connection part 17 External electronic component connection part 19 Wiring pattern connection part 20 Terminal connection part 21 Spiral pattern 22 Terminal 23 Heating element

Claims (4)

配線パターン状に打抜いた金属板と、
この金属板をモールドした高熱伝導性の複合絶縁材料と、
この複合絶縁材料に設けられたキャビティと、
このキャビティで露出する上記金属板の電子部品接続部と、
上記キャビティから引出される上記金属板の外部電子部品接続部とを備え、
この外部電子部品接続部は、上記複合絶縁材料より突出するように上記キャビティ内で折曲され、
上記電子部品接続部および外部電子部品接続部にそれぞれ電子部品を配置した電子回路モジュール。A metal plate punched into a wiring pattern,
A composite insulating material with high thermal conductivity molded from this metal plate,
A cavity provided in the composite insulating material ;
An electronic component connecting portion of the metal plate exposed in the cavity ;
An external electronic component connecting portion of the metal plate drawn out from the cavity,
The external electronic component connecting portion is bent in the cavity so as to protrude from the composite insulating material,
An electronic circuit module in which electronic components are arranged in the electronic component connecting portion and the external electronic component connecting portion, respectively . 配線パターン状に打抜いた金属板と、
この金属板をモールドした高熱伝導性の複合絶縁材料と、
この複合絶縁材料に設けられたキャビティと、
このキャビティで露出する上記金属板の電子部品接続部と、
上記複合絶縁材料の側面から引出された上記金属板の外部電子部品接続部とを備え、
この外部電子部品接続部は、上記キャビティ上にくるように折曲され、
上記電子部品接続部および外部電子部品接続部にそれぞれ電子部品を配置した電子回路モジュール。 A metal plate punched into a wiring pattern,
A composite insulating material with high thermal conductivity molded from this metal plate,
A cavity provided in the composite insulating material;
An electronic component connecting portion of the metal plate exposed in the cavity;
An external electronic component connecting portion of the metal plate drawn out from the side surface of the composite insulating material ,
The external electronic component connecting portion is bent so as to be on the cavity ,
An electronic circuit module in which electronic components are arranged in the electronic component connecting portion and the external electronic component connecting portion, respectively. 配線パターン状に打抜いた金属板の一部に渦巻状のパターンを形成した請求項１または２に記載の電子回路モジュール。The electronic circuit module according to claim 1 or 2 , wherein a spiral pattern is formed on a part of a metal plate punched into a wiring pattern. 電子部品を載置した金属板と複合絶縁材料よりなる放熱基板の側面に引出した端子部を発熱体で加熱して金属板の電子部品接続部または外部電子部品接続部に電子部品を半田付けした請求項１または２に記載の電子回路モジュール。The metal plate on which the electronic component is placed and the terminal portion drawn out on the side surface of the heat dissipation substrate made of the composite insulating material are heated by a heating element, and the electronic component is soldered to the electronic component connecting portion or the external electronic component connecting portion of the metal plate. The electronic circuit module according to claim 1 or 2 .
JP12998A 1998-01-05 1998-01-05 Electronic circuit module Expired - Fee Related JP3951400B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12998A JP3951400B2 (en) 1998-01-05 1998-01-05 Electronic circuit module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12998A JP3951400B2 (en) 1998-01-05 1998-01-05 Electronic circuit module

Publications (2)

Publication Number Publication Date
JPH11195747A JPH11195747A (en) 1999-07-21
JP3951400B2 true JP3951400B2 (en) 2007-08-01

Family

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Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10147707B2 (en) 2017-02-20 2018-12-04 Kabushiki Kaisha Toshiba Semiconductor device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4551552B2 (en) * 2000-10-24 2010-09-29 米沢電線株式会社 Composite circuit board
DE10307846A1 (en) * 2003-02-25 2004-09-02 Daimlerchrysler Ag Method for electrically contacting a component with a flat cable
JP4514497B2 (en) * 2004-04-12 2010-07-28 パナソニック株式会社 Manufacturing method of semiconductor device
DE102007014337B4 (en) * 2007-03-26 2017-07-06 Robert Bosch Gmbh Method for equipping a contacting element with an electrical component and a contacting element with an electrical component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10147707B2 (en) 2017-02-20 2018-12-04 Kabushiki Kaisha Toshiba Semiconductor device
US10861833B2 (en) 2017-02-20 2020-12-08 Kabushiki Kaisha Toshiba Semiconductor device

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