JPH11274358A - Board for electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To connect a main current of a power semiconductor element with an electrode terminal for external connection of an insertion case without using metal thin wires and increase productivity, by arranging a first resin part covering at least the bottom region of a component mounting part of a metal plate and a second resin part collectively sealing a lead and the first resin part. SOLUTION: For this board for electronic components, a copper plate of 0.5 mm thickness is worked in a specified pattern by punching in the same manner as the lead frame work, and a metal plate 1 which has a component mounting part 1a on which components like a plurality of power semiconductor elements are mounted and a plurality of leads 3 turning to connecting terminals in the periphery of the component mounting part 1a is formed. The bottom region of the component mounting region 1a is covered with a first resin part 2 of high thermal conductivity, sealed, and fixed. Furthermore, the side surfaces of the first resin part 2 and the leads 3 are molded collectively with a second resin part 4. The first resin part 2 in the lower surface of the component mounting part 1a of the power semiconductor elements or the like, and the leads 3 are held and fixed with the second resin part 4. As a result, assembling cost is reduced, and productivity of the board for electronic components can be increased.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for an electronic component that handles a large amount of power by mounting a power semiconductor element (hereinafter referred to as a power semiconductor element), a control integrated circuit element, and the like.

[0002]

2. Description of the Related Art In the field of power electronics such as power conversion and control, as a kind of substrate for high-power electronic components used for control of a power motor and the like, a main body portion as shown in FIG. There is a package constituted by the unit 7. The main body is made of an aluminum base metal substrate 8, a heat spreader 9, and a power semiconductor element 1.
0 is provided. The insertion case 7 is made of PBT resin and PP
The metal-made external connection electrode terminals 11 made of a thermoplastic resin such as S resin are integrally formed with the insertion case 7.
The metal electrode terminal 11 is connected to the inner joint end 11 of the insertion case 7.
a is bent inward at a right angle, and the inner joint end 11
a is formed so as to be exposed from the insertion case 7. The insertion case 7 is adhered and fixed on the main body with resin, and then the power semiconductor element 1 of the main body is
The surfaces of the inner joint ends 11a of the electrode terminals 11 between the zeros and inside the insertion case 7 are electrically joined.

However, in the construction method using the insertion case 7, since the connection between the main body and the electrode terminals 11 for external connection is all made by the thin metal wires 12, the electrode terminals of the insertion case 7 are provided around the aluminum base metal substrate 8 of the main body. This requires a structure in which the internal bonding ends 11a of the semiconductor device 11 are arranged, and has a problem that the package becomes large. Further, in the circuit of the main current, it is necessary to increase the number of 12 thin metal wires between the power semiconductor element 10 and the electrode terminal 11 of the insertion case 7 by the current value. In that case, the width of the internal joint end 11a of the electrode terminal 11 had to be widened, and the size of the package was increased and the layout of the circuit pattern of the aluminum base metal substrate 8 was restricted. Further, the increase in the number of assembling man-hours due to the increase in the number of the thin metal wires 12 and the decrease in the yield lead to a cost increase.

[0004]

As described above, in the conventional method using the insertion case, the size of the package is increased due to the structure, the restriction on the circuit design due to the use of multiple thin metal wires of the main current circuit, and the like. There were problems such as an increase in the number of assembly steps and a decrease in yield. Therefore, an object of the present invention is to connect a main current of a power semiconductor element to an electrode terminal for external connection of an insertion case without using a thin metal wire without increasing the size of a package, thereby achieving high productivity corresponding to a large current. It is to provide a substrate for electronic components.

[0005]

According to a first aspect of the present invention, there is provided a substrate for an electronic component, comprising: a metal plate having a patterned component mounting portion and a plurality of leads around the component mounting portion; A first resin portion covers at least a bottom surface region of the component mounting portion of the plate, and a second resin portion integrally seals at least one of the leads and the first resin portion.

According to the electronic component substrate of the first aspect,
The main current of the power semiconductor element is reduced by forming and fixing at least one of the leads of the component mounting portion of the metal plate on which the component such as the power semiconductor element is mounted with the second resin portion and using the external resin as an external connection terminal. It can be taken out to the outside with low resistance without passing through a thin wire. Also, since the internal connection end of the electrode terminal of the insertion case, which is a connection portion of the conventional power semiconductor element with a thin metal wire, becomes unnecessary, the package size is reduced, and the assembly cost due to a drastic reduction in the connection with the thin metal wire is reduced. Reduction can be achieved, and the productivity of electronic component substrates can be increased.

According to a second aspect of the present invention, there is provided a substrate for an electronic component, comprising: a metal plate having a patterned component mounting portion and a plurality of leads around the component mounting portion; and at least a component mounting portion of the metal plate. A first resin portion that covers a bottom surface region of the portion, and a second resin portion that is sealed with at least one of the leads and surrounds the first resin portion two-dimensionally. According to the electronic component substrate of the second aspect, the component mounting portion and the bottom surfaces of the leads are covered with the first resin portion, and at least one lead is joined by being sealed with the second resin portion. First
Since the resin part of the above is two-dimensionally surrounded,
For example, the main current of the power semiconductor element can be taken out to the outside with low resistance, and a lead separated from the component mounting portion can be used as a connection terminal. Further, since the lead can be fixed by the second resin portion, the positional accuracy of the lead can be ensured.

According to a third aspect of the present invention, in the electronic component substrate according to the first or second aspect, the bottom surface of the first resin portion is the second resin portion.
It protrudes from the bottom surface of the resin part. According to the electronic component substrate of the third aspect, the same effects as those of the first or second aspect can be obtained. The electronic component substrate according to claim 4,
In claim 1 or claim 2, the wall-shaped portion of the second resin portion is formed higher than the component mounting portion on the inner wall side.

According to the electronic component substrate of the fourth aspect,
In addition to the same effect as in claim 1 or 2, the electronic component on the inner wall side is sealed with a third resin such as silicone gel or epoxy resin using the wall-shaped portion of the second resin portion as a container. Can be protected. According to a fifth aspect of the present invention, in the electronic component substrate according to the first or second aspect, the electronic component substrate has two or more component mounting portions, and a first resin portion is provided between the component mounting portions and at least an upper surface portion thereof is mounted. It is sealed flat at the same height as the mounting portion.

According to the electronic component substrate of the fifth aspect,
In addition to the same effect as in claim 1 or claim 2, since the component mounting portions are connected flat with the first resin, the mounting of the solder printed component at the time of component mounting is performed in the same manner as a normal printed wiring board. Can do it. According to a sixth aspect of the present invention, in the electronic component substrate according to the fifth aspect, the inner bottom surface of the second resin portion and the upper surface of the first resin portion are provided at substantially the same height.

According to the electronic component substrate of the sixth aspect,
In addition to the effect similar to that of the fifth aspect, when the second metal plate is embedded in the second resin as an external connection terminal and is exposed as a connection land on the second resin bottom surface, the first resin surface is substantially Since they are provided at the same height, the power semiconductor element in the component mounting portion of the metal plate and the connection land on the second resin can be easily connected by a thin metal wire.

According to a seventh aspect of the present invention, in the electronic component substrate according to the first or second aspect, the lead is bent, and the second resin portion is formed by bending the bent portion of the bent lead. At least a part of the raised portion is sealed. According to the electronic component substrate of the seventh aspect, in addition to the same effect as the first or second aspect, another second substrate is provided above the metal plate having the component mounting portion of the power semiconductor element. A structure for mounting via a lead can be easily realized. Further, since there is a positional accuracy of the leads, the connection with the second substrate via the through holes can be easily performed. Further, when the side wall is provided by the second resin portion, the inside of the side wall can be filled with the third resin.

According to an eighth aspect of the present invention, in the electronic component substrate according to the first or second aspect, the first resin portion integrally covers a predetermined portion on the bottom surface side of the lead and the component mounting portion. . According to the electronic component substrate described in claim 8, claim 1 is provided.
Or, there is an effect similar to that of the second aspect. According to a ninth aspect of the present invention, in the electronic component substrate according to the first or second aspect, the first resin portion is a thermosetting resin, and the second resin portion is a thermoplastic resin.

According to the electronic component substrate of the ninth aspect,
In addition to the same effects as in claim 1 or claim 2, by forming the first resin portion with a thermosetting resin such as an epoxy resin, the filler (filler) can be filled at a higher density, and the thermal conductivity is high. A substrate having high adhesive strength to a metal plate and high heat resistance can be formed. By making the second resin part a thermoplastic resin such as polyphenylene sulfide (PPS resin), a substrate for electronic parts such as a semiconductor device having high mechanical strength, realizing a complicated shape and having high productivity can be obtained. Can be made.

According to a tenth aspect of the present invention, in the electronic component substrate according to the first or second aspect, a high heat conductive substrate is provided below the first resin portion. According to the electronic component substrate of the tenth aspect, in addition to the same effects as those of the first or second aspect, the mechanical strength of the entire metal plate is reduced by providing the high thermal conductive substrate on the bottom surface of the first resin portion. Thus, the second resin can withstand the resin shrinkage stress when the side wall is formed around the metal plate with the second resin, and the metal plate does not deform (warp). Furthermore, the effect of the thermal conductivity and heat capacity of the high thermal conductive substrate itself can greatly reduce the thermal resistance of the power semiconductor device.

According to an eleventh aspect of the present invention, in the electronic component substrate according to the tenth aspect, the high heat conductive substrate is made of the same material as the metal plate. According to the electronic component substrate of the eleventh aspect, in addition to the same effects as the tenth aspect, the second metal plate of the same quality as the metal plate 1 of the component mounting portion is sealed on the bottom surface of the first resin portion. -By fixing, the bending strength of the substrate is approximately doubled, and the deformation of the substrate due to external force is reduced. Also, the first resin part is
Since the structure is sandwiched between the metal plate and the high thermal conductive substrate which is a metal plate of the same material, deformation of the substrate due to heat history at the time of assembly processing is reduced.

According to a twelfth aspect of the present invention, in the electronic component substrate according to the tenth aspect, at least the lower surface of the high heat conductive substrate and the second
And a bottom surface of a frame surrounding the high thermal conductive substrate by the resin portion. According to the electronic component substrate of the twelfth aspect, in addition to the same effects as the tenth aspect, the first
When the electronic component substrate is mounted on a heat dissipating device such as an aluminum fin by connecting the high thermal conductive substrate on the bottom surface of the resin portion and the second resin portion flat, the entire bottom surface of the electronic component substrate is Can be mounted with even pressure.

According to a thirteenth aspect of the present invention, in the electronic component substrate according to the tenth aspect, a connection portion of the first resin portion is provided between the high heat conduction substrate and a frame of the second resin portion surrounding the high heat conduction substrate. It is provided. According to the electronic component substrate according to the thirteenth aspect, in the tenth aspect, the high heat conductive substrate is sealed only on the surface of the first resin portion facing the component mounting portion.
The first resin can be fixed, and heat can be efficiently released only at a portion required for heat radiation, not on the entire surface of the first resin. Since the high heat conductive substrate can be made smaller, there is also an effect of reducing material costs.

According to a fourteenth aspect of the present invention, in the electronic component substrate according to the first or the second aspect, the electronic component substrate has two or more component mounting portions, and the lead integrated with the component mounting portion extends from the component mounting portion. It has at least one led-out metal plate.
According to the electronic component substrate of the fourteenth aspect, the same effect as that of the first or second aspect is obtained.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a schematic diagram showing a configuration of an electronic component substrate. The electronic component substrate shown in FIG. 1 has, for example, a component mounting portion 1a for mounting a component such as a plurality of power semiconductor elements by punching a copper plate having a thickness of 0.5 mm into a predetermined pattern similarly to lead frame processing. A metal plate 1 having a plurality of leads 3 serving as connection terminals around the component mounting portion 1a is formed. For example, the bottom surface area of the component mounting portion 1a is covered and sealed with a first resin portion 2 having high thermal conductivity, and the side surface of the first resin portion 2 and the leads 3 are fixed to the second resin portion 2a.
Are integrally formed with the resin portion 4. The second resin portion 4 holds and fixes the first resin portion 2 and the lead 3 on the lower surface of the component mounting portion 1a such as a power semiconductor element. 1b is a port for connecting a thin metal wire or the like.

The electronic component substrate shown in this embodiment is:
For example, as shown in FIG. 2, the metal plate 1 is formed into a circuit wiring board by punching using a press machine or the like, and the surface opposite to the component mounting portion 1a on which the power semiconductor element and the like are mounted is made of, for example, an epoxy resin having high thermal conductivity. The first resin portion 2 used is sealed by molding so as to be formed flat so as to form a substrate, and the side surface of the first resin portion 2 and the lead 3 of the metal plate 1 are connected to each other by, for example, a second resin made of thermoplastic resin. The bottom surface of the first resin portion 3 is the second
And is sealed and fixed integrally so as to be slightly projected from the bottom surface of the resin portion 4 and exposed. The second resin part 4
A resin frame is formed around the metal plate 1, and a wall-shaped portion 4a is formed higher than the component mounting portion 1a on the inner wall side. As a material of the second resin portion 4, polyphenylene sulfide (PPS resin), polybutylene terephthalate (PBT resin), or the like is used. Further, the first resin portion 2 covers at least the upper surface portion 2a between the component mounting portions 1a.
Is sealed flat so as to have the same height as the component mounting portion 1a, and the inner bottom surface portion 4b of the second resin portion 4 and the first resin portion 2
And the upper surface portion 2a are provided at substantially the same height. The resin frame of the second resin portion 4 has a mounting portion 14 projecting therefrom.

The metal plate 1 comprises a component mounting portion 1a and leads 3, and has two or more component mounting portions 1a on which components such as power semiconductor elements are mounted. 5 and 1 at right angles to each other
Extends from the resin frame of the second resin portion 4 in parallel with the surface of the first resin portion 2 and is connected to the required pattern of the metal plate 1 of the component mounting portion 1a so that the first resin portion 2 The portion 3a extending outward and the portion 3b independently extending directly from the first resin portion 2 without being connected to the component mounting portion 1a independently function as terminals. Parts placement part 1
The lead 3a connected to the pattern a is faston 11
The width is 2 mm and the plate thickness is 0.5 mm according to the specification of No. 0. Independent leads 3b that are not connected to the component mounting portion 1a have specifications that are thin and arranged at equal intervals in consideration of connection with another second substrate, and 20 wires having a width of 1 mm are arranged at equal intervals. They are lined up. In addition, the metal plate 1 may be a copper plate, or a plate obtained by subjecting the surface of a copper plate to Ni plating or the like.

FIG. 3 shows a state in which an electronic component 12 such as a power semiconductor element is mounted on the component mounting portion 1a. Reference numeral 12 denotes a thin metal wire for connecting the electronic component 12 to a necessary part. Since the lead 3a of the Faston No. 110 specification is directly connected to the power semiconductor element, it is not necessary to attach the lead by soldering or draw out to the outside via a thin metal wire as in the conventional case. Can handle. On the other hand, since the positions of the thin equally-spaced leads 3b are regulated by the resin frame forming the second resin portion 4, connection to the outside is easy. The height of the resin frame is 5 mm. The resin frame is provided with a structure of several screw tightening portions, and after mounting a power semiconductor element or the like to manufacture an electronic component substrate, it can be attached to a heat sink such as an aluminum fin.

According to this embodiment, at least one of the leads 3 of the component mounting portion 1a of a metal plate on which components such as a power semiconductor element are mounted is molded and fixed by the second resin portion 4 to form an external connection terminal. As a result, the main current of the power semiconductor element can be extracted to the outside with low resistance without passing through a thin metal wire. Also, since the internal connection end of the electrode terminal of the insertion case, which is a connection portion of the conventional power semiconductor element with a thin metal wire, becomes unnecessary, the package size is reduced, and the assembly cost due to a drastic reduction in the connection with the thin metal wire is reduced. Reduction can be achieved, and the productivity of electronic component substrates can be increased.

Further, since the wall-shaped portion 4a of the second resin portion 4 is formed higher than the component mounting portion 1a on the inner wall side, the wall-shaped portion 4a of the second resin portion 4 is formed into a container. The electronic component 10 and the like on the inner wall can be sealed with a third resin such as silicone gel or epoxy resin to protect the electronic component 10 and the like. Further, the component mounting section 1
a, the first resin portion 2 is provided between the component mounting portions 1a.
Since at least the upper surface 2a is sealed flat at the same height as the component mounting portion 1a, the mounting of solder printed components at the time of component mounting can be performed in the same manner as a normal printed wiring board.

Since the inner bottom surface portion 4b of the second resin portion 4 and the upper surface portion 2a of the first resin portion 2 are provided at substantially the same height, for example, like the lead 3b, the second When the second metal plate is embedded in the resin portion 4 as an external connection terminal and is exposed as the connection land 3b 'on the second resin bottom portion, the first resin surface is provided at substantially the same height. The electronic component 10 such as the power semiconductor element of the component mounting portion 1a of the metal plate and the connection land 3b 'on the second resin can be easily connected by the thin metal wire 12.

Although all of the leads 3 are sealed by the second resin portion 4, at least one of the leads 3 and the first resin portion 2 are integrally sealed by the second resin portion 4. It is sufficient if they are combined. Further, the first resin portion 2 may cover at least the bottom surface region of the component mounting portion 1a. A second embodiment of the present invention will be described with reference to FIG. FIG. 4 shows a component mounting portion 1 for mounting components such as a power semiconductor element of the metal plate 1.
a and a lower surface of a predetermined region of the lead 3 are covered with a first resin portion 2 of high thermal conductivity, sealed and fixed to form a substrate, and further, a side surface of the first resin portion 2 is two-dimensionally surrounded, and a lead is formed. 3, a resin frame is integrally formed with the second resin portion 4 so that the lower surface of the first resin portion 2 slightly projects and is exposed. The second resin portion 4 holds the component mounting portion 1a such as a power semiconductor element and the lead 3 and extends outward from the resin frame of the second resin portion 4 in parallel with the surface of the first resin portion 2. The lead 3 is fixed.

The first resin portion 2 has a high thermal conductivity filler for quickly releasing heat of the power semiconductor element.
Is used at a high density of 80% by weight or more. Epoxy resin is specifically used in terms of electrical insulation properties, adhesive strength to the metal plate 1, heat resistance, ease of flame retarding treatment, and price. The second resin portion 4 is made of a thermoplastic resin containing 20% by weight or more of glass fiber in terms of mechanical strength, realization of a relatively large and complicated shape, moldability, and cost. Specifically, polybutylene terephthalate (PBT resin) or polyphenylene sulfide (P
A thermoplastic resin such as PS resin is used.

According to this embodiment, the main current of the power semiconductor element can be extracted to the outside with low resistance, and all the leads 3b separated from the component mounting portion 1a can be used as connection terminals. Since all the leads 3 are sealed and fixed by the second resin portion 4, the leads 3
The internal connection end (connection portion of the thin metal wire with the power semiconductor) is unnecessary on both the side of the lead 3a handling the main current and the independent lead 3b not connected to the power semiconductor mounting portion 1a, and the package size is further reduced. The size can be reduced. Since the lead 3 is fixed by the second resin portion 4, the positional accuracy of the lead 3 can be ensured.

Since the first resin portion 2 is made of a thermosetting resin such as an epoxy resin, the filler (filler) can be filled at a higher density, so that the heat conductivity is good and the adhesive strength to the metal plate 1 is good. By forming the second resin part 4 from a thermoplastic resin such as polybutylene terephthalate or polyphenylene sulfide, the second resin part 4 has high mechanical strength and realizes a high productivity realizing a complicated shape. It is possible to provide an integrated case of the electronic component substrate.

The other parts are the same as in the first embodiment.
A third embodiment of the present invention will be described with reference to FIG. FIG. 5 shows a component mounting portion 1a on which the power semiconductor element is mounted on the metal plate 1 and a predetermined bottom surface area of the lead 3 sealed and fixed so as to be covered with the first resin portion 2 having high thermal conductivity to form a substrate. The lead 3 is bent perpendicularly to the surface side with respect to the component mounting portion 1a at a portion extending outward from the first resin portion 2, and the lead 3 is further bent by a second resin portion 4 into a first resin portion. The lower surface of the first resin portion 2 slightly exposes a predetermined area of the side surface 2b and the lead 3 bent to the front side, and the lead 3 bent to the front side is fixed to the side wall portion of the substrate, that is, the first side. It is molded so as to be integrated with the side surface 2b of the resin portion 2 of FIG. The predetermined area of the lead 3 is at least one part of the bent part 3c of the bent lead 3 and the part 3d that is bent and rises, and the second resin part 4 is sealed and joined. ing. More specifically, all of the leads 3a connected to the pattern of the component mounting portion 1a of the metal plate 1 and the independent leads 3b not connected to the component mounting portion 1a extend from the first resin portion 2 by 2 mm. And is formed and sealed so as to be surrounded by the side wall of the second resin part 4. Although the height of the side wall is 11 mm from the lower surface of the first resin portion 2, it can be higher or lower depending on the desired circuit configuration of the electronic component substrate. That is, in the case of a circuit configuration including only a power semiconductor element, it is sufficient that the metal thin line connecting the power semiconductor element has a height that can be hidden. A second substrate having a control circuit with a two-story structure can be mounted and connected to the second substrate. Further, since the leads 3 extend vertically from the side walls of the second resin portion 4 to the front surface side, the connection with the second substrate and the connection with another third substrate can be easily performed.

According to this embodiment, the component placement section 1a
The second end of the lead 3 extends to the front side with respect to
Therefore, a structure in which another second substrate is mounted via the leads 3 above the metal plate 1 having the component mounting portion 1a can be easily realized. In addition, since all the leads 3 have positional accuracy, connection to the second substrate 2 via through holes is also easy. Second
Since the resin portion 4 has a side wall, the inside of the side wall can be filled with the third resin portion. Further, the connection with another third substrate can be similarly easily performed.

The other points are the same as in the second embodiment.
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 shows a component mounting portion 1a of the power semiconductor element of the metal plate 1,
A predetermined lower surface area of the lead 3 whose tip is bent in the vertical direction is sealed and fixed with the first resin part 2 having high thermal conductivity to form a substrate,
Further, when the side surfaces of the first resin portion 2 and the leads 3 extending from the metal plate 1 are integrally formed with the second resin 4 to form a resin frame, a ceramic plate is formed on the lower surface region of the first resin portion 2. Alternatively, a high heat conductive substrate 5 such as a metal plate such as a metal plate 6 of the same quality as the metal plate 1 is fixed. Specifically, when a predetermined lower surface area of the metal plate 1 is sealed and fixed with the first resin portion 2, the lower surface of the first resin portion 2 is cut in advance in accordance with the region of the first resin portion 2. The high heat conductive substrate 5 such as a ceramic plate or a metal plate is overlapped, the first resin portion 2 is integrally molded as an adhesive to form a substrate, and the first resin portion 2 and the side surfaces of the high heat conductive substrate 5 are further formed. The lead 3 extending from the first resin portion 2 is integrally formed with the second resin portion 4 so that the lower surface of the high thermal conductive substrate 5 slightly projects and is exposed to form a resin frame around the substrate. is there. High thermal conductive substrate 5
In order to quickly release the heat generated by the power semiconductor element,
Of the resin portion 2. The metal plate 1 and the high thermal conductive substrate 5 are electrically insulated by the first resin portion 2. The thickness of the high thermal conductive substrate 5 is
For example, the metal plate (copper plate) 1 needs to have a thickness of about 0.5 mm, and the ceramic plate of the high heat conductive substrate 5 has a thickness of 0 mm because of the molding pressure when the substrate is formed via the first resin portion 2. 0.5 mm or more, and preferably 0.2 mm or more for a metal plate such as a copper plate or an aluminum plate. The insulation distance between the metal plate 1 and the high thermal conductive substrate 5 via the first resin portion 2 is 0.5 mm.
It is. In particular, as a metal plate used for the high heat conductive substrate 5,
The size is adjusted to the area of the first resin portion 2 and the metal plate 1
The thickness is preferably 0.2 to 2.0 mm with respect to the thickness of 0.5 mm and the thickness of the first resin portion 2 of 0.5 mm.

According to this embodiment, the first resin portion 2
By fixing the high thermal conductive substrate 5 to the bottom surface of the substrate, the mechanical strength of the entire substrate is improved, and the second resin portion 4 also withstands resin shrinkage stress when the side wall is formed around the substrate by deformation of the substrate (warpage). ) Does not occur. In addition, there is an effect of suppressing the occurrence of deformation (warpage) of the substrate even with respect to the heat treatment when assembling the electronic component substrate by mounting the power semiconductor element or the like. Furthermore, the effect of the thermal conductivity and heat capacity of the high thermal conductive substrate 5 itself provides a significant effect of reducing the thermal resistance of the power semiconductor element.

In particular, the metal plate 1 is provided on the bottom of the first resin portion 2.
By fixing the second metal plate 6 of the same quality as that of the first embodiment, the bending strength of the substrate is improved, and the deformation at the time of molding the substrate and at the time of molding the resin frame by the second resin portion 4 is reduced. Further, since the first first resin portion 2 is sandwiched between the second metal plates 6 of the same quality as the metal plate 1, the heat history when assembling the electronic component substrate by mounting the power semiconductor element or the like is determined. Substrate deformation is also reduced. Further, the thermal resistance and thermal capacity of the second metal plate 6 can reduce the thermal resistance of the power semiconductor element.

The high heat conductive substrate has a thickness of 0.2 to 2.
If the material is equivalent to a 0 mm metal plate, the first resin portion 2
By sealing and fixing a second metal plate of the same quality as the metal plate 1 of the component mounting portion 1a on the bottom surface of the substrate, the bending strength of the substrate is approximately doubled, and deformation of the substrate due to external force is reduced. Further, the first resin portion 2 is made of the metal plate 1 and the metal plate 1 of the high thermal conductive substrate 5.
Since the structure is sandwiched between metal plates made of the same material as the above, deformation of the substrate due to heat history at the time of assembly processing is reduced. Further, the effect of the thermal conductivity and heat capacity of the metal plate as the high thermal conductive member 5 has the effect of reducing the thermal resistance of the power semiconductor element.

The other points are the same as in the third embodiment.
A fifth embodiment of the present invention will be described with reference to FIG. FIG. 7 shows a fourth embodiment in which a component mounting portion 1a and a predetermined lower surface region of a lead 3 are sealed and fixed with a first resin portion 2 having high thermal conductivity to form a substrate, and further a first resin portion is formed. When the resin frame is formed by integrally molding the side surfaces of the lead 2 and the leads 3 extending from the metal plate 1 with the second resin portion 4, the second metal plate 6 is placed on the lower surface region of the first resin portion 2. The lower surface is the second resin part 4
It is molded so as to be flat with the bottom surface of the frame. Specifically, when sealing a predetermined lower surface region of the metal plate 1 with the first resin portion 2, the second metal plate 6 is superimposed on the lower surface of the first resin portion 2, and the first resin The part 2 is integrally formed into a substrate by using an adhesive as an adhesive, and further, the first resin part 2 and the side surfaces of the second metal plate 6 which is the high thermal conductive substrate 5 and the leads 3 extending from the first resin part 2 Is formed integrally with the second resin portion 4 so as to be flat with the lower surface of the second metal plate 6 to form a resin frame around the substrate.

According to this embodiment, the second metal plate 6
When the electronic component substrate is attached to a heat dissipating device such as an aluminum fin by a fixing method such as a screw by connecting the lower surface region of the second resin portion 4 surrounding the periphery of the electronic component and the second resin portion 4 flat, the electronic component substrate The entire bottom surface of the can be tightened with even pressure. Others are the same as the fourth embodiment.

A sixth embodiment of the present invention will be described with reference to FIG. FIG. 8 shows a semiconductor device mounting portion 1a and a predetermined lower surface region of a lead 3 sealed and fixed with a first resin portion 2 having high thermal conductivity to form a substrate, and further a side surface of the first resin portion 2 and a metal plate 1 are formed. When the resin frame is formed by integrally molding the lead 3 extending from the second resin portion 4 with the second resin portion 4, the first resin portion is provided between the second metal plate 6 and the bottom surface of the frame of the second resin portion 4. The second metal plate 6 is fixed to the lower surface area of the first resin portion 2 so as to provide a connection portion by the second metal plate 6. Specifically, when a predetermined lower surface area of the metal plate 1 is sealed and fixed with the first resin portion 2, the second metal plate 6 which is slightly smaller than the first resin portion 2 is overlapped, and Is integrally formed so as to surround the periphery of the second metal plate 6 and slightly expose the lower surface of the second metal plate 6. Further, the side surfaces of the first resin portion 2 and the leads 3 extending from the first resin portion 2 are integrally formed with the second resin portion 4 so that the second metal plate 6 slightly projects and is exposed.
A resin frame is formed around the substrate.

According to this embodiment, the first resin portion 2
The second metal plate 6 can be sealed and fixed only on the relative surface side of the component mounting portion 1a of the power semiconductor element, and not on the entire surface of the first resin portion 2 but only on any portion required for heat radiation. The heat can be efficiently dissipated. Since the second metal plate 6 can be made as small as possible, there is also an effect of reducing material costs.

FIG. 9 shows a modification of FIG. 6, in which a predetermined lower surface area of the metal plate 1 is sealed and fixed with the first resin portion 2.
A second metal plate 6 slightly smaller than the first resin portion 2 is superimposed on the lower surface of the first resin portion 2, and the first resin portion 2 is formed.
Surrounds the periphery of the second metal plate 6 and
Are molded so as to be buried in the first resin portion 2 and the lower surface thereof is flattened in the same manner as the bottom surface of the first resin portion 2. Further, the side surface of the first resin portion 2 and the terminal lead 3 extending from the first resin portion 2 are connected to the lower surface of the frame of the second resin 4 and the connection portion of the first resin portion 2 and the second metal plate 6. Are molded integrally with the second resin 4 so that the lower surface of the substrate becomes flat.

According to this embodiment, the second resin portion 4
Since the lower surface of the frame and the bottom surface of the first resin portion 2 serving as the connection portion and the lower surface of the second metal plate 6 are substantially flush with each other, when the electronic component substrate is mounted on a heat dissipation device such as an aluminum fin, The entire bottom surface of the electronic component substrate can be tightened with uniform pressure. Others are the same as the sixth embodiment.

[0043]

According to the electronic component substrate of the first aspect, at least one of the leads of the component mounting portion of the metal plate on which the components such as the power semiconductor element are mounted is molded and fixed by the second resin portion. By using it as an external connection terminal, the main current of the power semiconductor element can be extracted to the outside with low resistance without passing through a thin metal wire. Also, since the internal connection end of the electrode terminal of the insertion case, which is a connection portion of the conventional power semiconductor element with a thin metal wire, becomes unnecessary, the package size is reduced, and the assembly cost due to a drastic reduction in the connection with the thin metal wire is reduced. Reduction can be achieved, and the productivity of electronic component substrates can be increased.

According to the electronic component substrate of the second aspect,
The component mounting portion and the bottom surfaces of the leads are covered with a first resin portion, and at least one lead is joined by sealing with a second resin portion to two-dimensionally surround the first resin portion. Therefore, as in the first aspect, for example, the main current of the power semiconductor element can be extracted to the outside with low resistance, and a lead separated from the component mounting portion can be used as a connection terminal. Further, since the lead can be fixed by the second resin portion, the positional accuracy of the lead can be ensured.

According to the electronic component substrate of the third aspect,
There is an effect similar to that of claim 1 or claim 2. Claim 4
According to the electronic component substrate described above, in addition to the same effect as in claim 1 or claim 2, the electronic component on the inner wall side is formed of a silicone gel, an epoxy resin or the like using the wall portion of the second resin portion as a container. The electronic component can be protected by sealing with the resin of No. 3.

According to the electronic component substrate of the fifth aspect,
In addition to the same effect as in claim 1 or claim 2, since the component mounting portions are connected flat with the first resin, the mounting of the solder printed component at the time of component mounting is performed in the same manner as a normal printed wiring board. Can do it. According to the electronic component substrate of the sixth aspect, in addition to the same effect as the fifth aspect, the second metal plate is embedded in the second resin as an external connection terminal, and the second metal plate is connected to the second resin bottom surface. When exposed as lands, since the first resin surface is provided at substantially the same height, the connection lands on the second resin and the power semiconductor elements on the component mounting portion of the metal plate can be easily formed by thin metal wires. Can be connected.

According to the electronic component substrate of the seventh aspect,
In addition to the same effect as in claim 1 or claim 2, another second plate is provided above the metal plate having the component mounting portion of the power semiconductor element.
A structure in which the substrate is placed via the leads can be easily realized. Further, since there is a positional accuracy of the leads, the connection with the second substrate via the through holes can be easily performed. Further, when a side wall made of the second resin portion is provided,
The inside of the side wall can be filled with the third resin.

According to the electronic component substrate of the eighth aspect,
There is an effect similar to that of claim 1 or claim 2. Claim 9
According to the electronic component substrate described above, in addition to the same effects as those of claim 1 or claim 2, the filler (filler) can be further reduced by using a thermosetting resin such as an epoxy resin for the first resin portion. A high-density filling, a substrate having high heat conductivity, high adhesive strength to a metal plate, and high heat resistance can be formed. By making the second resin part a thermoplastic resin such as polyphenylene sulfide (PPS resin), a substrate for electronic parts such as a semiconductor device having high mechanical strength, realizing a complicated shape and having high productivity can be obtained. Can be made.

According to the electronic component substrate of the tenth aspect, in addition to the same effects as those of the first or second aspect, the first
By providing a high heat conductive substrate on the bottom surface of the resin portion, the mechanical strength of the entire metal plate is improved, and the second resin also withstands resin shrinkage stress when the side wall is formed around the metal plate with the second resin, thereby deforming the metal plate. (Warpage) does not occur. Furthermore, the effect of the thermal conductivity and heat capacity of the high thermal conductive substrate itself can greatly reduce the thermal resistance of the power semiconductor device.

According to the electronic component substrate of the eleventh aspect, in addition to the same effects as the tenth aspect, the second metal plate of the same quality as the metal plate 1 of the component mounting portion is provided on the bottom surface of the first resin portion. By sealing and fixing, the bending strength of the substrate is approximately doubled, and the deformation of the substrate due to external force is reduced. In addition, since the first resin portion is sandwiched between a metal plate and a high heat conductive substrate which is a metal plate of the same material, deformation of the substrate due to heat history during assembly processing is reduced.

According to the electronic component substrate of the twelfth aspect, in addition to the same effects as the tenth aspect, the high thermal conductive substrate on the bottom surface of the first resin portion and the second resin portion are connected flat. Accordingly, when the electronic component substrate is mounted on a heat radiating device such as an aluminum fin, the entire bottom surface of the electronic component substrate can be mounted with a uniform pressure. According to the electronic component substrate according to the thirteenth aspect, in the tenth aspect, the high heat conductive substrate can be sealed and fixed only on the surface of the first resin portion facing the component mounting portion. The heat can be efficiently dissipated only in the portions required for heat dissipation, not on the entire surface of the resin. Since the high heat conductive substrate can be made smaller, there is also an effect of reducing material costs.

According to the electronic component substrate of the fourteenth aspect, the same effects as those of the first or second aspect can be obtained.

[Brief description of the drawings]

FIGS. 1A and 1B show an electronic component substrate according to a first embodiment of the present invention, wherein FIG. 1A is a perspective view and FIG.

FIG. 2 is a perspective view after punching a metal plate.

3A and 3B show a state in which electronic components are mounted on a component mounting portion and wired with thin metal wires, wherein FIG. 3A is a perspective view and FIG. 3B is a cross-sectional view.

FIG. 4 is a sectional view of an electronic component substrate according to a second embodiment of the present invention.

FIGS. 5A and 5B show an electronic component substrate according to a third embodiment of the present invention, wherein FIG. 5A is a perspective view and FIG.

6A and 6B show an electronic component substrate according to a fourth embodiment of the present invention, wherein FIG. 6A is a perspective view and FIG. 6B is a cross-sectional view.

7A and 7B show an electronic component substrate according to a fifth embodiment of the present invention, wherein FIG. 7A is a perspective view and FIG. 7B is a cross-sectional view.

8A and 8B show an electronic component substrate according to a sixth embodiment of the present invention, wherein FIG. 8A is a perspective view and FIG. 8B is a cross-sectional view.

9A and 9B show an electronic component substrate according to a modification of the sixth embodiment of the present invention, wherein FIG. 9A is a perspective view and FIG. 9B is a cross-sectional view.

FIG. 10 is a cross-sectional view of an electronic component substrate using a conventional insertion case.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 metal plate 1a component mounting portion 2 first resin portion 2a upper surface portion 2b side surface 3 lead 3a lead connected to component mounting portion 3b lead not connected to component mounting portion 3c bent portion 3d rising portion 4 second 5 High heat conductive substrate 6 Second metal plate 7 Insertion case 8 Aluminum base metal substrate 9 Heat spreader 10 Power semiconductor element 11 Electrode terminal 11a Internal connection end of electrode terminal 12 Thin metal wire

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Koichi Hirano 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (14)

[Claims] 1. A metal plate having a patterned component mounting portion and a plurality of leads around the component mounting portion, and a first plate covering at least a bottom surface area of the metal mounting portion of the metal plate. And a second resin part for integrally sealing at least one of the leads and the first resin part. 2. A metal plate having a patterned component mounting portion and a plurality of leads around the component mounting portion, and a first portion of the metal plate covering at least a bottom surface area of the component mounting portion. And a second resin part which is encapsulated in at least one of the leads and two-dimensionally surrounds the first resin part. 3. The electronic component substrate according to claim 1, wherein a bottom surface of the first resin portion protrudes from a bottom surface of the second resin portion. 4. The electronic component substrate according to claim 1, wherein the wall-shaped portion of the second resin portion is formed higher than the component mounting portion on the inner wall side. 5. A semiconductor device having two or more component placement portions, and a first resin portion between the component placement portions and at least an upper surface portion thereof are flatly sealed at the same height as the component placement portions. The electronic component substrate according to claim 1. 6. The electronic component substrate according to claim 5, wherein an inner bottom surface of the second resin portion and an upper surface portion of the first resin portion are provided at substantially the same height. 7. The lead according to claim 1, wherein the lead is bent, and the second resin portion seals at least a part of the bent part of the bent lead and a part which is bent and rises. The electronic component substrate as described in the above. 8. The method according to claim 1, wherein the first resin portion integrally covers a predetermined portion on the bottom side of the lead and the component mounting portion.
The electronic component substrate as described in the above. 9. The electronic component substrate according to claim 1, wherein the first resin portion is a thermosetting resin, and the second resin portion is a thermoplastic resin. 10. The electronic component substrate according to claim 1, wherein a high heat conductive substrate is provided below the first resin portion. 11. The electronic component substrate according to claim 10, wherein the high thermal conductive substrate is made of the same material as the metal plate. 12. At least the lower surface of the high thermal conductive substrate and the second
11. The electronic component substrate according to claim 10, wherein the resin portion forms a flat bottom surface with the bottom surface of the frame surrounding the high thermal conductive substrate. 13. The electronic component substrate according to claim 10, wherein a connection portion of the first resin portion is provided between the high heat conduction substrate and a frame of the second resin portion surrounding the high heat conduction substrate. 14. The device according to claim 1, wherein the component mounting portion has two or more component mounting portions, and at least one lead integrated with the component mounting portion has a metal plate led out from the component mounting portion. Item 3. An electronic component substrate according to item 2.