JP2000244077A - Resin-molded substrate and resin-molded substrate with built-in electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a miniaturized resin-molded substrate that has a means on which a power system IC chip is directly mounted and maintains reinforced insulation structure. SOLUTION: In a substrate, the surface of an electrode pattern 2 is coated with a synthetic resin 3, and on a position for part mounting thereof, a recessed part 4 in which at least a part of an electronic part is buried is formed, and a part of the electrode pattern 2 is exposed at a bottom part 5 of the recessed part 4. An electronic part placed in the recessed part 4 of the substrate is fixed in a condition where an electrode of the electronic part and the electrode pattern of the substrate electrically conduct to each other with conductive resin or insulating resin with which the recessed part is filled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molded substrate in which the surface of an electrode pattern is covered with a synthetic resin, and a resin molded substrate in which electronic components are mounted on the resin molded substrate.

[0002]

2. Description of the Related Art In recent years, electronic components have been mounted at a high density in accordance with demands for miniaturization and high performance of electronic devices. As a result, surface-mount electronic components without lead wires have become widespread, and with the progress of reflow soldering techniques using cream soldering and the like, there has been a growing emphasis on high-density mounting of electronic components on printed circuit boards.

Further, attention has been paid to IC mounting in which an IC chip is directly mounted on a substrate, and miniaturization of electronic circuits has been progressing.

[0004]

However, in the field of handling a large current or a high frequency, not only the surface mounting of electronic components is delayed, but also it is difficult to reduce the size of the substrate by the circuit configuration. , The size of the equipment is late.
This is because, on a conventional printed circuit board, an electrode pattern is formed of copper foil on glass epoxy resin or paper phenol resin. This is because the wiring interval cannot be reduced.

[0005] In general, an IC chip used in an electronic circuit generates a large amount of heat and thus requires a heat radiator or a heat radiator such as a heat sink. In order to solve these problems, some electronic circuit units employ a method of directly mounting an IC chip on a high heat dissipation substrate such as an aluminum substrate. FIG. 5 shows a conventional electronic circuit unit.

[0006] A power IC chip (hereinafter, referred to as an “IC chip”) 6 used in an electronic circuit is generally mounted on a metal substrate 18 because it generates heat during operation. The metal substrate 18 has an insulating layer 16 on the surface of the metal plate 15 serving as a base.
Are formed, and the necessary wiring patterns 17 are arranged thereon. Here, as the metal plate 15, a copper plate plated with nickel is often used.

The IC chip 6 is a transistor in many cases. A collector electrode is formed on one side of the IC chip 6 and two electrodes, a gate electrode and an emitter electrode, are formed on the other side. Since heat generated during the operation of the IC chip 6 is generated from the collector electrode, the collector electrode is grounded to the metal substrate 18 side, and wiring is formed by wire bonding from the upper two electrodes. At this time, an aluminum wire having a large electric capacity is used as the wire 19.

In an electric circuit using a large current and a high voltage, a certain insulation distance is required between patterns or between a pattern and a substrate surface in order to secure insulation reliability.
This insulation distance requires a long distance in the air, but can be shortened when covered with an insulator. Then, the metal substrate 18 is housed in the case 20, and the case 20 is filled with the insulating sealing material 13 such as a silicone resin.
The IC chip 6, the aluminum wire, and the electrode pattern 2 of the metal substrate 18 are not exposed to the air.

However, since the electronic circuit configured as described above must be sealed with the insulating sealing material 13, it cannot be made smaller than the case 20 that seals the electronic circuit. The insulating resin used as the insulating sealing material 13 is generally a liquid resin because it is necessary to completely cover the wiring portion. Therefore, a process management for enclosing the insulating resin into the case 20 without mixing bubbles. Is not only tough,
Since the resin is sealed and heated and cured, the manufacturing process becomes complicated.

Further, the metal substrate 18 has a higher price than a paper phenol substrate or a glass epoxy substrate, and the cost of the power supply unit increases. Further, as the insulating resin used as the insulating sealing material 13, an insulating resin which is liquid at normal temperature, among which a silicon resin which is liquid at normal temperature and has high insulating properties, is often used. Among these silicone resins,
Some may be in a gel state after curing, and some may be capable of correcting bubbles, but need to be kept at a temperature higher than room temperature for a long time for curing. Among them, 10 at 80 ° C
Some of them require a curing time of about an hour, so that not only furnace equipment for thermally curing the case 20 after encapsulating the resin in large quantities is required, but also the production lead time is lengthened.

Further, as described above, since heat generated from the IC chip 6 is generated from a limited portion of the IC chip 6,
Only the part of the IC chip needs a heat radiator.
However, due to the manufacturing of the metal substrate 18, only a part of the metal plate 1 is used.
5 cannot be provided, and the metal plate 15 is required for all the electrode patterns, which contributes to an increase in cost.

On the other hand, as a method for reducing the size of an electronic circuit by a method different from that of the metal substrate 18, a resin molded substrate in which an electrode pattern is formed by a metal plate and the surface thereof is covered with a resin has been proposed. FIG. 6 shows a conventional resin molded substrate. As shown in FIG. 6A, a desired electrode pattern is formed on a metal plate 21 by pressing or etching, cut into a predetermined size, and a hole 22 for inserting an electronic component is formed on the surface thereof. The lead frame 23 is formed.

When the metal plate 15 is made of copper or brass, and the surface of the metal plate is tin-plated or nickel-plated to prevent oxidation of the surface of the metal plate during soldering. There is also. As shown in FIG. 6B, a resin molded substrate 26 is obtained by covering the surface of the lead frame 23 with a synthetic resin 24 and molding. Note that the synthetic resin 24 is prevented from adhering to a portion used as the electrode portion 25 of the electronic component.

As the resin used at this time, any resin such as a thermosetting resin represented by an epoxy resin and a thermoplastic resin represented by a liquid crystal polymer can be used. As a resin molding method, injection molding or transfer molding is generally performed. Therefore, lead frame 2
3 does not need to be formed in a planar shape,
By performing molding after performing the bending process 27 as shown in (c), the resin molded substrate 1 having a three-dimensional shape can be configured.

The resin-molded substrate 26 covers the lead frame 23 with a synthetic resin 24 to achieve electrical insulation of the pattern, and a certain distance is secured between the pattern and the surface of the substrate by the resin. You. The minimum value of the insulation distance to be secured here is determined by the International Electrotechnical Commission (hereinafter referred to as “IEC”) standard according to the magnitude of the current flowing. To allow for this, the thickness of the resin is set to be larger than the minimum value specified by the IEC standard.

Such a state in which the patterns are separated by an insulator is called a reinforced insulation structure, and the insulation distance can be greatly reduced. The resin molded substrate 26 can be manufactured at a lower cost than the metal substrate 18 described above, but has a problem that it is difficult to form an electrode pattern for mounting the IC chip 6.

The resin molded substrate 1 configured as described above is mainly used for inserting electronic components with leads, and is not used in the field of IC mounting. In order to mount the IC chip 6, the electrode portion 2 on the substrate side is required.
This is because it is necessary to prepare the substrate 2 on the surface of the substrate and mount the substrate 2 in a state where a plane portion is secured. In the resin-molded substrate 1, the lead frame 23 is formed of a copper plate as described above, and the surface thereof is formed of a synthetic resin 24. Therefore, the lead frame 23 is generally formed of a single plate, and the surface thereof is flat. It has a shape. Therefore, the position of the lead frame 23 in the substrate thickness direction is uniquely determined.

Therefore, in order to form an electrode portion on the surface of the substrate, it is necessary to expose all the lead frames 23 to the surface of the substrate, so that a reinforced insulating structure cannot be obtained. Therefore, in this state, the resin molded substrate 1 does not substitute for the metal substrate 18 from the viewpoint of miniaturization. There is also a problem that a heat radiator cannot be provided to the mounted IC chip 6.

When the IC chip 6 is mounted with the heat-generating surface of the IC facing down, the lower side of the IC chip 6
3 and the synthetic resin 24 forming the substrate are present. Therefore, even if the radiator is brought into close contact with the resin molded substrate 1,
Since the distance between the IC chip 6 and the heat radiator is long, an efficient heat radiation effect cannot be obtained. Conversely, when the IC chip 6 is mounted with the heat generating surface facing upward, the heat radiator can be brought into close contact with the IC chip 6, but the heat radiator is supported by the IC chip 6.
Therefore, it becomes difficult to support the radiator.

There is also a problem that it is difficult to enclose an insulating resin for ensuring the insulation of the mounted IC chip 6. When the IC chip 6 is directly mounted on the surface of the resin molded substrate 1, it is necessary to mount the IC chip 6 with the heat generation surface of the IC chip 6 facing down as described above. As in the case of the metal substrate 18, it is necessary to encapsulate an insulating resin such as a silicon resin. Since the surface of the resin molded substrate 1 has a flat surface, an enclosing case is required, which hinders miniaturization.

An object of the present invention is to solve the above-mentioned problems and to provide a resin molded substrate having means for directly mounting a power IC chip and capable of realizing miniaturization while maintaining a reinforced insulating structure. .

[0022]

The resin molded board of the present invention is characterized in that an electronic component mounting portion capable of burying at least a part of an electronic component is provided on a mounting surface of the resin molded substrate. According to the present invention, it is possible to obtain a resin molded substrate that can directly mount an electronic component on the resin molded substrate and that can be reduced in size while maintaining a reinforced insulation structure.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The resin molded substrate according to the first aspect is
A resin molded substrate in which the surface of the electrode pattern is covered with a synthetic resin, wherein a recess is formed at a component mounting position on the component mounting surface so that at least a part of the electronic component can be embedded therein. A part is exposed so that the electrode pattern and the electrode of the electronic component can be connected.

The resin molded substrate according to the second aspect is the first aspect of the invention.
Wherein an annular wall surrounding the opening of the recess is formed at the outer peripheral edge of the recess. According to a third aspect of the present invention, there is provided the resin molded substrate according to the first or second aspect, wherein a support portion for supporting the heat radiator is provided in a portion of the recess from the substrate surface to the bottom surface or inside the annular wall. .

According to a fourth aspect of the present invention, there is provided a resin molded substrate.
Wherein the formation position of the supporting portion is substantially the same as or the same as the height of the upper surface of the electronic component connected to the electrode pattern. The electronic component-embedded resin-molded substrate according to claim 5, wherein the surface of the electrode pattern is covered with a synthetic resin, and at the component mounting position, a concave portion in which at least a part of the electronic component can be embedded is formed. A substrate having a part of the electrode pattern exposed is provided, and the electronic component disposed in the concave portion of the substrate is electrically connected between the electrode of the electronic component and the electrode pattern of the substrate with a conductive resin or an insulating resin filled in the concave portion. It is characterized in that it is fixed in the state in which it is made to be in a state where it is made to be.

According to a sixth aspect of the present invention, there is provided a resin molded substrate incorporating an electronic component, wherein the surface of the electrode pattern is covered with a synthetic resin, and at a component mounting position, at least a part of the electronic component can be embedded and an opening of the concave portion. An annular wall is formed surrounding the substrate, and a substrate is provided in which a part of the electrode pattern is exposed at the bottom of the concave portion. An electronic component arranged in the concave portion of the substrate is provided inside the conductive resin or the concave portion and the annular wall. The electrode of the electronic component and the electrode pattern of the substrate are fixed in a state where the electrodes are electrically connected by the filled insulating resin.

According to a seventh aspect of the present invention, there is provided a resin molded board incorporating an electronic component according to the fifth or sixth aspect, wherein the heat radiator disposed inside the opening of the concave portion of the substrate or the annular wall surrounding the opening of the concave portion. A part is thermally coupled to an electronic component at a component mounting position. An electronic component-embedded resin-molded substrate according to claim 8 is the electronic component-embedded resin molded substrate according to claim 7, wherein the height of the upper surface of the electronic component connected to the electrode pattern is formed inside the opening of the concave portion of the substrate or the annular wall surrounding the opening of the concave portion. And a support portion for supporting the radiator at substantially the same or the same position.

Hereinafter, embodiments of the present invention will be described with reference to FIGS.
This will be described with reference to FIG. Note that the same components as those in FIG. 5 showing the conventional example are denoted by the same reference numerals. (Embodiment 1) FIG. 1 shows (Embodiment 1) of the present invention.

FIG. 1A is a perspective view of a resin molded board, and FIG. 1B is a sectional view of the resin molded board on which an IC chip is mounted. As shown in FIG. 1A, a resin molded substrate 1 is formed by covering the surface of an electrode pattern 2 with a synthetic resin 3, and a concave portion 4 in which an IC chip can be embedded is provided at a component mounting position on a component mounting surface. Are formed.

A part of the electrode pattern 2 is exposed at the bottom 5 of the recess 4 and is configured to be connectable to the electrode of the IC chip 6 mounted in the recess 4. An IC chip 6 is arranged in the concave portion 4 and, as shown in FIG. 1B, the bump electrodes 7 and the electrode patterns 2 of the IC chip 6 are
To make electrical connection. The conductive resin 8 is not particularly limited, and a general bonding means for IC mounting can be used.

The thus obtained resin molded board with built-in electronic components can be mounted with the IC chip 6 while maintaining the reinforced insulation structure by the electrode pattern 2, and the electronic circuit can be downsized. In the above description, an example of the IC chip 6 is shown as a component to be mounted on the resin molded substrate 1, but the present invention is not limited to this, and the electronic component can be similarly mounted using general electronic components.

The following is a specific example of the first embodiment. Example 1 Using a copper plate having a thickness of 0.5 mm, a desired pattern was formed on the surface by etching, and a lead frame was formed. The lead frame was allowed to stand in a mold, and a resin molded substrate 1 was injection-molded by an injection molding machine using polyphenylene sulfide as a thermoplastic resin.

The thickness of the molded synthetic resin 3 was set to 1 mm on one side of the copper plate, and the concave portion 4 was provided at the mounting position of the IC chip 6 on the resin molded substrate 1. An inclined side is provided between the upper opening and the bottom of the recess 4 so that an angle formed with the surface of the electrode pattern 2 is 45 °, and the bottom 5 is provided with one side of the electrode pattern 2 so that the IC chip 6 can be mounted. Part was exposed. The bottom 5 has a square shape of 6 mm × 6 mm, and an IC chip 6 having a size of 4.5 mm × 4 mm and a thickness of 0.525 mm is arranged on the bottom 5.

Here, the IC chip 6 is specifically a four-terminal diode bridge. In the IC chip 6, all terminals are formed on one surface of the IC, and bonding bump electrodes 7 are formed on the electrode surfaces of the IC using gold wires. The IC chip 6 with the bump electrodes 7 facing down
Is aligned with the electrode pattern 2 and joined via a conductive resin.

As the conductive resin 8, an anisotropic conductive sheet (hereinafter referred to as "ACF") 8 was used. The ACF 8 was temporarily pressed to the bottom 5 of the recess 4. The temporary compression bonding was performed by attaching the ACF8 onto the substrate, and then pressing the heated iron and heating at a temperature of 80 ° C. for 30 seconds.

Thereafter, the IC chip 6 is aligned, and AC
After being placed on the substrate via F8, the same iron as above was pressed to perform full pressure bonding. ACF8 is 20 for final compression
Crimping was performed for 20 seconds under the condition of 0 ° C. With this IC
The joining of the chip 6 is completed. The obtained electronic component-embedded resin molded substrate was able to mount the IC chip 6 while maintaining the reinforced insulation structure, and thus the electronic circuit could be downsized.

(Embodiment 2) FIG. 2 shows (Embodiment 2) of the present invention. This (Embodiment 2) differs in that a heat radiator is provided on the upper surface of the IC chip 6 in order to improve the heat radiation efficiency of the IC chip 6, but the other points are the same as those of the above (Embodiment 1). The configuration is almost the same.

More specifically, a step is formed inside the opening of the concave portion 4 to constitute a supporting portion 9 on which a heat radiator 11 for efficiently radiating heat of the IC chip 6 is mounted. This support 9
The adhesive 10 is applied to the IC chip 6 and the resin 12 having heat conductivity is applied to the upper surface of the IC chip 6 mounted in the concave portion 4 in the same manner as in the first embodiment.

The radiator 1 is placed inside the opening of the recess 4.
1, a part of the heat radiator 11 is placed on the support portion 9 via the adhesive 10, and the upper surface of the IC chip 6 and the heat radiator 11 are thermally coupled via the resin 12 having heat conductivity. The radiator 11 is pressurized and heated to fix a part of the radiator 11 to the support portion 9. With such a configuration, heat radiation of the IC chip 6 can be efficiently performed.

When the step formed inside the opening of the recess 4 is formed at the same or almost the same height as the upper surface of the IC chip 6 mounted on the recess 4, the IC chip 6 and the IC chip 6 dissipate heat. The body 11 is in close contact with the body and heat is efficiently radiated without interposing the heat transfer resin 12 between the heat radiator 11 and the upper surface of the IC chip 6, and the resin 12 is applied to the upper surface of the IC chip 6. This is preferable because the step of performing the step can be omitted.

In the above description, the support portion 9 of the radiator 11
Although the thermosetting adhesive 10 was used for fixing to the heat sink, the present invention is not limited to this.
Any resin may be used as long as the resin is integrally bonded. Alternatively, it is also effective to provide a through hole in the support portion 9 and a part of the resin 3 around the support portion 9 and the heat radiator 11, and to perform mechanical fixing with screws or the like.

In the above description, an example was shown in which a diode bridge having a junction terminal on one side was used as the IC chip 6, but an IC having terminals on both sides, such as a transistor, was used.
In the case of the C chip 6, an insulating layer and a conductive pattern are provided on the surface of the heat radiator 11 which is in contact with the IC chip 6, and the conductive pattern and the electrode pattern 2 of the resin molded substrate 1 are joined to form the same heat dissipation. The effect is obtained.

Further, since the heat radiator 11 can be attached only to the heat generating portion, the size of the heat radiator can be reduced.
Not only can the area of the electronic circuit be reduced by the resin molded substrate 1, but also the size can be reduced. Hereinafter, a specific example of this (Embodiment 2) will be described. Example 2 A step was formed at a position of 0.6 mm from the substrate surface on the slope from the opening of the recess 4 to the bottom 5 to form the support 9 of the radiator 11.

An adhesive 10 was applied to the support 9 and a silicon resin for heat transfer was applied to the upper surface of the IC chip 6. Then, a heat radiator 11 formed of a copper plate and having its surface plated with nickel for preventing oxidation is placed on the support portion 9, and the heat radiator 11 is coated with an adhesive 10 previously applied.
Was fixed to the resin molded substrate 1.

The obtained resin-molded board with built-in electronic parts was subjected to the I / O with the reinforced insulation structure maintained by the electrode pattern 2.
The C chip 6 can be mounted, and not only can the electronic circuit be reduced in size, but also the heat dissipation is good. The silicon resin applied to the upper surface of the IC chip 6 is used for bringing the heat radiator 11 and the IC chip 6 into complete close contact with each other and for reliably transmitting the heat generated from the surface of the IC chip 6 to the heat radiator 11. Other resins or means may be used as long as they have the same effect.

(Embodiment 3) FIG. 3 shows (Embodiment 3) of the present invention. This (Embodiment 3) is different in that an insulating resin 13 is sealed in the concave portion 4 in order to improve the insulating property, but the other basic configuration is almost the same as the above (Embodiment 1). .

More specifically, first, a conductive paste containing silver as a main compound is applied to the bump electrodes 7 of the IC chip 6, and the IC chip 6 is mounted by being aligned with the electrode pattern 2 exposed at the bottom 5 of the recess 4. Then, the conductive paste is cured by heating. Since the space between the IC chip 6 and the substrate surface of the resin molded substrate 1 is insulated by air, the insulation distance is insufficient according to the circuit configuration. In particular, the insulation distance of the power supply IC chip 6 is insufficient. Therefore, it is necessary to seal the bonding surface of the IC chip 6 with the insulating resin 13.

In this (Embodiment 3), the insulating resin 13
The liquid silicon resin is sealed up to the upper surface of the concave portion 4, and is heated and cured at a temperature of 80 ° C. to secure the insulation of the bump electrodes 7 of the IC chip 6 and the IC chip. 6 and the insulation of the surface is ensured. Since the electronic component-embedded resin molded board configured as described above does not need a case for enclosing the insulating resin 13 and does not need to coat the entire board,
The size of the electronic circuit can be reduced while ensuring the insulation of the IC portion.

Although a silicon resin is used as the insulating resin 13 in the above description, the present invention is not limited to this, and a similar effect can be obtained with an encapsulating material having an insulating property. (Embodiment 4) FIG. 4 shows (Embodiment 4) of the present invention.

This (Embodiment 4) is different in that an annular wall 14 surrounding the opening of the recess 4 is provided on the outer peripheral edge of the recess 4, but the other basic configuration is the same as that of the above (Embodiment 4). It is almost the same as 3). By providing such an annular wall 14, even when the position of the electrode pattern 2 is close to the surface of the substrate, the IC chip 6 can be mounted. In particular, when fixing the IC chip 6 and the electrode pattern 2, a liquid insulating resin is used. Since a special case is not required, the size of the electronic circuit can be reduced.

Further, the concave portion 4 provided on the resin molded substrate 1
Of the insulating sealing material 13 having a small thickness and a sufficient amount
In the case where it is not possible to inject the insulating sealing material 13 or the electrode is formed on the surface of the substrate,
There is no need to provide a case on the substrate and enclose the insulating resin or coat the entire substrate, so that the insulation of the IC portion can be secured and the electronic circuit can be miniaturized.

In the above description, a silicone resin is used as the liquid resin. However, the present invention is not limited to this, and similar effects can be obtained with an insulating resin. Specific examples are shown below. Example 3 The thickness of the resin was 0.5 mm on one side from the lead frame surface.
The concave portion 4 was provided at a predetermined position on the substrate.

An annular wall 14 surrounding the opening of the recess 4 was provided on the outer peripheral edge of the recess 4. The annular wall 14 protruded from the surface of the resin molded substrate 1 by 0.5 mm. The IC chip 6 is mounted on the resin molded substrate 1 configured as described above, and liquid silicon resin is sealed up to the upper surface of the annular wall 14.
The resin was cured by heating to ° C., and the insulation of the IC chip 6 was secured.

The obtained resin-molded board with built-in electronic components does not require a special case even if a liquid insulating resin is used for fixing the electronic components and the electrode patterns, and therefore, the electronic circuit can be miniaturized. there were. In the above (Embodiment 3) and (Embodiment 4),
The heat radiator 11 may be mounted on the upper surface of the IC chip 6 as in the second embodiment.

Further, in each of the above-described embodiments, the example in which the entirety of the IC chip 6 is embedded in the concave portion 4 has been described. However, the present invention is not limited to this, and the IC chip 6 may be embedded in the concave portion 4. The same applies to an example in which at least a part is buried.

[0056]

As described above, according to the present invention, there is provided a resin-molded substrate in which the surface of an electrode pattern is covered with a synthetic resin, and a recess in which an electronic component can be embedded is formed at a component mounting position on a component mounting surface. Then, by using a resin molded substrate by exposing a part of the electrode pattern at the bottom of the concave portion, the electronic component built-in resin molded substrate having the electronic component mounted in the concave portion has a reinforced insulating structure by the electrode pattern. Electronic components can be mounted as they are, and downsizing of electronic circuits can be realized.

Further, by using a resin molded substrate in which an annular wall surrounding the opening is formed at the outer peripheral edge of the recess, electronic components can be mounted even when the position of the electrode pattern is close to the substrate surface. Even when a liquid insulating resin is used for fixing the electrode pattern and the electrode pattern, a special case is not required, so that the size of the electronic circuit can be reduced. In addition, by using a resin molded substrate provided with a support portion of a radiator disposed in an opening at a portion from the substrate surface to the bottom surface of the concave portion, an electronic component is arranged in the concave portion and an electrode of the electronic component is provided. The resin-molded board with the electronic component connected to the electrode pattern of the resin-molded board via the conductive resin can be mounted with the heat-generating surface of the electronic component facing up while maintaining the reinforced insulation structure, and the radiator is used for the electronic component. It can be attached to the joint without stress.

Further, by setting the position of the supporting portion to be substantially the same as the height of the upper surface of the electronic component connected to the wiring pattern, the upper surface of the electronic component and the heat radiator can be bonded with an adhesive or an insulating resin. The electronic component-embedded resin molded substrate connected by the above-mentioned method can securely bring the electronic component and the heat radiator into close contact with each other.

[Brief description of the drawings]

FIG. 1 shows an IC of a resin molded substrate in (Embodiment 1).
Sectional view showing mounting part and perspective view showing recess

FIG. 2 is a cross-sectional view illustrating a configuration of a resin molded substrate according to (Embodiment 2).

FIG. 3 is a cross-sectional view illustrating a configuration of a resin molded substrate in (Embodiment 3).

FIG. 4 is a cross-sectional view illustrating a configuration of a resin molded substrate in (Embodiment 4).

FIG. 5 is a cross-sectional view showing a conventional IC mounting structure of a metal substrate.

FIG. 6 is a view showing a configuration of a conventional resin molded substrate.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Resin molding board 2 Electrode pattern 3 Synthetic resin 4 Concave part 5 Bottom part 6 IC chip 7 Bump electrode 8 Conductive resin 9 Support part 10 Adhesive 11 Heat radiator 12 Silicon resin 13 Insulating sealing material 14 Ring wall

Claims (8)

[Claims] 1. A resin-molded substrate in which the surface of an electrode pattern is covered with a synthetic resin, wherein a concave portion capable of burying at least a part of an electronic component is formed at a component mounting position on a component mounting surface, and a bottom portion of the concave portion is formed. A resin molded substrate having a portion of the electrode pattern exposed so that the electrode pattern can be connected to an electrode of an electronic component. 2. The resin molded substrate according to claim 1, wherein an annular wall surrounding the opening of the recess is formed at the outer peripheral edge of the recess. 3. The resin-molded substrate according to claim 1, wherein a support portion for supporting a heat radiator is provided in a portion of the recess from the substrate surface to the bottom surface or inside the annular wall. 4. The resin-molded substrate according to claim 3, wherein the position where the supporting portion is formed is substantially the same as or the same as the height of the upper surface of the electronic component connected to the electrode pattern. 5. A concave portion capable of covering at least a part of an electronic component at a component mounting position while covering a surface of the electrode pattern with a synthetic resin, and exposing a part of the electrode pattern at a bottom of the concave portion. An electronic component in which an electronic component arranged in the concave portion of the substrate is fixed by electrically connecting the electrode of the electronic component and the electrode pattern of the substrate with a conductive resin or an insulating resin filling the concave portion. Embedded resin molded substrate. 6. A concave portion capable of burying at least a part of an electronic component and an annular wall surrounding an opening of the concave portion are formed at the component mounting position while covering the surface of the electrode pattern with a synthetic resin. A substrate having a part of the electrode pattern exposed at the bottom is provided, and the electronic component disposed in the concave portion of the substrate is made of a conductive resin or an insulating resin filled inside the concave portion and the annular wall. A resin molded board incorporating an electronic component, which is fixed in a state where the electrode pattern of the board is electrically connected to the board. 7. An electronic component at a component mounting position, wherein a part of a heat radiator disposed inside an opening of a concave portion of the substrate or an annular wall surrounding the opening of the concave portion is thermally coupled. 7. The resin-molded substrate incorporating the electronic component according to 6. 8. A radiator is supported at a position substantially equal to or the same as the height of the upper surface of the electronic component connected to the electrode pattern inside the opening of the concave portion of the substrate or inside the annular wall surrounding the opening of the concave portion. The resin molded board according to claim 7, further comprising a support portion.