JPH1098127A - Semiconductor package for surface mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain superior heat radiation by providing heat conductors inside a through-hole plating metal layer, connected to through-holes exposed at a semiconductor element-mounting part through a wiring circuit among through- holes exposed at parts, except the mounting part. SOLUTION: Thermal conductors 22 located inside a plating metal layer 21 of first through-holes 13 exposed on a semiconductor element mounting part 12 of a substrate 10 to efficiently transfer the heat of a semiconductor element 2 to the opposite surface to the semiconductor element-mounting surface of the substrate 10 through the conductors 22 and metal layer 21, thereby radiating the heat through electrodes 15 to a mother board. Of second through-holes 14a, 14b, heat conductors 22 are disposed inside the plating metal layer 21 of the holes 14a, connected to the first through-holes 13 through a wiring circuit 11 to thereby efficiently transfer heat to the opposite surface to the semiconductor element 2 mounting surface and radiate to the mother board. Thus it is possible to radiate much heat to the mother board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package used for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art As a semiconductor device for surface mounting, a semiconductor element is bonded onto a metal lead frame, and then the lead frame and the semiconductor element are electrically connected using bonding wires. In addition, a semiconductor device manufactured by sealing a part of a lead frame or the like with a sealing material, or a semiconductor on which a semiconductor element 36 is to be mounted on one surface of an organic substrate 30 as shown in FIG. The element arrangement part 32, the semiconductor element 36 and the bonding wire 37
Bonding circuit 34 formed electrically connectable by
And an electrode 35 electrically connected to a bonding circuit 34 via through holes 33 a and 33 b formed through the substrate 30 and the wiring circuit 31 on the other surface of the substrate 30.
After the semiconductor element 36 is mounted using a semiconductor package having the following, the bonding circuit 34 and the semiconductor element 36 are connected using the bonding wires 37, and then sealed with the sealing material 38, and then the mother board is attached to the electrode 35. A semiconductor device manufactured by forming solder bumps 39 for mounting on a (printed wiring board on which the semiconductor device is mounted) is used.

[0003] In recent years, semiconductor devices have become more sophisticated, and the heat generated by semiconductor elements tends to increase. When the heat generated by the semiconductor element increases and the temperature of the semiconductor element increases, the operation of the semiconductor device becomes unstable, and the reliability is reduced. In particular, a semiconductor device in which a semiconductor element is mounted on an organic substrate has a lower heat radiation property than a semiconductor element using a lead frame, and the operation of the semiconductor device is likely to be unstable. Is desired.

For this reason, as shown in FIG. 3, an organic substrate 30 is formed penetrating from the front to the back, and a through hole 33b having a cylindrical plated metal layer at a portion in contact with the substrate 30 is formed.
It is formed on a portion of the surface of the substrate 30 that is exposed to the semiconductor element placement section 32, and transfers heat generated by the semiconductor element 36 to the semiconductor element placement section 3 of the substrate 30 through the through hole 33b.
A semiconductor device in which heat is efficiently transmitted to the surface opposite to the surface on which the substrate 2 is formed and the heat is radiated to the mother substrate;
A semiconductor device 3b in which a material having high thermal conductivity such as solder is filled inside the cylindrical plating metal layer 3b to further improve the heat dissipation is being studied.

However, through the through holes 33b formed in the portions exposed to the semiconductor element arrangement part 32, the semiconductor elements 3
Even in the case of a semiconductor device or the like in which the heat generated by 6 is radiated to the mother substrate, if the heat generated by the semiconductor element further increases, the heat dissipation becomes insufficient, and the operation of the semiconductor device becomes unstable. There was a case. Therefore, there is a need for a semiconductor package that can manufacture a semiconductor device having even better heat dissipation.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide a semiconductor package for surface mounting using an organic substrate, and An object of the present invention is to provide a surface-mount semiconductor package capable of manufacturing a surface-mount semiconductor device having excellent performance.

[0007]

According to a first aspect of the present invention, there is provided a semiconductor package for surface mounting, which is exposed to a semiconductor element disposing portion formed on one surface of an organic substrate having a wiring circuit, and the substrate is mounted on both sides. A first through-hole formed through the first through-hole, the first through-hole having a cylindrical plated metal layer in a portion in contact with the substrate, and having a heat conductor inside the plated metal layer; A second through hole having a cylindrical plated metal layer in a portion exposed to a portion excluding the semiconductor element arrangement portion and penetrating the substrate from front to back and a surface in contact with the substrate, and the other of the substrate, On the surface,
In a surface-mount semiconductor package including a mother substrate and an electrode to be connected, formed by connecting to a plating metal layer provided in a second through hole, a first through hole of a second through hole is provided via a wiring circuit. A heat conductor is also provided inside the plated metal layer of the second through hole connected to the second through hole.

According to a second aspect of the present invention, there is provided a surface mounting semiconductor package according to the first aspect, wherein the heat conductor is a resin containing a metal powder.

According to a third aspect of the present invention, there is provided a semiconductor package for surface mounting according to the first aspect, wherein the heat conductor is a composite of a metal rod and a resin containing metal powder. I do.

According to a fourth aspect of the present invention, there is provided a semiconductor package for surface mounting according to any one of the first to third aspects, wherein the heat conductor is formed on a surface of the substrate. It is characterized by being formed so as to protrude from the circuit.

According to a fifth aspect of the present invention, there is provided a surface mounting semiconductor package according to any one of the first to fourth aspects, wherein a metal radiator is provided on the one surface of the substrate. Preferably, the second through hole is bonded to a portion where the second through hole is exposed.

According to the present invention, the heat conductor is provided inside the plating metal layer of the first through hole, and the second through hole of the second through hole connected to the first through hole via the wiring circuit is provided. Since the heat conductor is also provided inside the plated metal layer of the through hole, the heat generated by the semiconductor element can be efficiently transferred to the surface of the substrate opposite to the surface on which the semiconductor element is mounted through many heat conductors and the plated metal layer. Heat can be transferred and the heat can be radiated to the motherboard through electrodes and the like.

Therefore, as compared with the case where heat is transferred to the mother board only by the first through hole, a larger amount of heat can be transferred and heat can be dissipated to the mother board. A semiconductor device for mounting can be manufactured.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor package for surface mounting according to the present invention will be described with reference to the drawings. FIG. 1 is a cross-sectional view illustrating one embodiment of a semiconductor package for surface mounting according to the present invention, and FIG. 2 is a cross-sectional view illustrating another embodiment of a semiconductor package for surface mounting according to the present invention. .

The semiconductor package for surface mounting according to the present invention comprises:
As shown in FIG. 1, an organic substrate 1 having a wiring circuit 11
The substrate 1 is exposed to the semiconductor element disposition portion 12 formed on one surface of the substrate 1 and penetrates the substrate 10 from front to back.
A first through-hole 13 having a cylindrical plated metal layer 21 at a portion in contact with a portion 0 and a first through-hole 13 exposing a portion of the one surface of the substrate 10 excluding the semiconductor element disposing portion 12 and penetrating the substrate 10 from front to back. Second through holes 14a and 14b having a cylindrical plating metal layer 21 at a portion in contact with the substrate 10, and a plating metal layer 2 having the second through holes 14a and 14b on the other surface of the substrate 10.
Electrode 1 formed to be connected to mother substrate 1 and to be connected to mother substrate
5 is provided.

A heat conductor 22 is provided inside the plating metal layer 21 in the first through hole 13, and heat generated by the semiconductor element 2 is transferred to the substrate 10 through the heat conductor 22 and the plating metal layer 21. The heat is efficiently transferred to the surface opposite to the surface on which the semiconductor element 2 is mounted, and the heat is radiated to the mother board through the electrodes 15 and the like. Also, of the second through holes 14a and 14b, the second through hole 1 connected to the first through hole 13 via the wiring circuit 11 is provided.
4a, a heat conductor 22 is also provided inside the plated metal layer 21. The heat generated by the semiconductor element 2 is transferred to the semiconductor element 2 of the substrate 10 through the wiring circuit 11, the heat conductor 22, and the plated metal layer 21. Efficiently transfer heat to the surface opposite to
The heat is radiated to the mother board through the electrodes 15 and the like.

Therefore, as compared with the case where heat is transferred to the mother board only by the first through hole 13, a larger amount of heat can be transferred and heat can be radiated to the mother board. A semiconductor device for surface mounting can be manufactured.

The second through hole 14a, which is connected to the first through hole 13 via the wiring circuit 11 among the second through holes 14a and 14b,
If there is a second through hole (not shown) connected via the first through hole 1 and not directly connected to the first through hole 13, the plating metal layer of the second through hole It is preferable that the heat conductor 22 is also provided inside 21 so as to further improve heat dissipation.

The heat conductor 22 has a high thermal conductivity and can be filled inside the plated metal layer 21.
There is no particular limitation as long as it can withstand the soldering temperature and the like when the semiconductor device is mounted on the motherboard. For example, a resin containing metal powder such as silver paste and copper paste, or a metal rod as shown in FIG. 221 and a metal powder-containing resin. In the case of a resin containing metal powder, the plating metal layer 2
Even if the diameter of 1 is small, it can be easily filled into the inside, which is preferable. Further, after inserting the metal rod 221 inside the plating metal layer 21, the composite of the metal rod 221 and the metal powder-containing resin is filled with the metal powder-containing resin between the plating metal layer 21 and the metal rod 221. When filled, since the metal rod 221 generally has higher thermal conductivity than the metal powder-containing resin, the heat dissipation of the entire heat conducting body 22 is high, which is preferable.

When the heat conductor 22 is formed, as shown in FIG. 2, it is preferable to form the heat conductor 22 so as to protrude from the wiring circuit 11 formed on the surface of the substrate 10. When the heat conductor 22 is formed so as to protrude from the wiring circuit 11 at a portion where the first through hole 13 is exposed to the semiconductor element disposition portion 12, when the semiconductor element 2 is mounted, the protruding heat conductor 22 and the semiconductor element 2 Wiring circuit 11
Since a gap is formed between the semiconductor element 2 and the like, when sealing with a sealing material thereafter, the sealing material enters the gap, which is preferable because the reliability of the sealing can be improved. In the case where the heat conductor 22 is formed so as to protrude from the wiring circuit 11 at a portion where the second through hole 14a is exposed on the surface opposite to the surface on which the semiconductor element arrangement portion 12 is formed, the semiconductor package is manufactured. When the semiconductor device is mounted on the motherboard, an appropriate gap can be formed between the electrode 15 and the motherboard, so that the reliability of soldering can be improved, which is preferable. In addition, it is preferable that these protruding portions have excellent strength when formed with a metal rod 221.

The cylindrical plated metal layer 21 of the first through-hole 13 and the second through-holes 14a and 14b is formed by penetrating the substrate 10 from the front and back, and is formed by plating on the portion in contact with the substrate 10. The material is not particularly limited as long as it is formed, and may be formed by chemical copper plating, electrolytic copper plating, or the like.

The substrate 10 used in the present invention is not particularly limited as long as it is organic and has a wiring circuit 11 formed thereon. Examples thereof include epoxy resin and phenol resin. , Polyimide resin,
Unsaturated polyester resin type, thermosetting resin such as polyphenylene ether resin type, or a sheet in which a metal foil is stretched on one or both sides of a sheet of a sheet obtained by blending an inorganic filler or the like with these thermosetting resins, or glass Insulation of inorganic fibers such as polyester, polyester, polyamide, and organic fibers such as cotton, and a substrate such as paper, using a thermosetting resin or the like, and bonding a metal foil on one or both surfaces using a plate or the like. A wiring circuit 11 formed by etching a predetermined portion after performing metal plating, and a wiring circuit 11 formed by performing metal plating on a plate not covered with metal foil. . The metal forming the wiring circuit 11 is preferably copper or a metal formed with a gold plating layer on the surface of copper from the viewpoint of electrical reliability.

The wiring circuit 11 for connecting the first through hole 13 and the second through hole 14a may be connected by the wiring circuit 11 formed on the inner layer of the substrate 10, or may be formed on the surface of the substrate 10. Connected by the wiring circuit 11 may be used.

The semiconductor element disposing portion 12 may be formed in a concave shape on the substrate 10 as shown in FIG. 1, or formed on a surface having the same height as the surrounding portion as shown in FIG. May be.

A metal radiator 16 such as a copper plate is
0 of the one surface, the second through holes 14a, 1
In the case of a semiconductor package formed by bonding an exposed portion 4b with an adhesive such as an epoxy resin, the metal radiator 16
Since heat can also be dissipated, the heat dissipating property is further excellent and preferable. The second through hole 14 of the metal radiator 16
If the metal heat radiator 16 and the second through holes 14a and 14b are in direct contact with each other without applying an adhesive to the portions that come into contact with the holes a and 14b, the heat radiation properties are particularly excellent and preferable.

[0026]

The semiconductor package for surface mounting according to the present invention has a heat conductor inside the plated metal layer of the first through hole and the first through hole of the second through hole via the wiring circuit. Because it also has a heat conductor inside the plated metal layer of the second through hole connected to the through hole of
It is possible to efficiently transfer the heat generated by the semiconductor element through many heat conductors and plated metal layers to the surface opposite to the surface on which the semiconductor element is mounted on the substrate, and dissipate that heat to the mother substrate through electrodes and the like. As compared with the case where heat is transferred to the motherboard only by the first through hole, more heat can be transferred to the motherboard and heat can be radiated to the motherboard. A semiconductor device for mounting can be manufactured.

According to the semiconductor package for surface mounting according to claim 4 of the present invention, in addition to the above-described effects, the reliability of the sealing when the semiconductor element is mounted and then sealed with a sealing material is improved. In addition, the reliability of soldering when a semiconductor device manufactured using this semiconductor package is mounted on a motherboard is improved.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating one embodiment of a semiconductor package for surface mounting according to the present invention.

FIG. 2 is a cross-sectional view illustrating another embodiment of the semiconductor package for surface mounting according to the present invention.

FIG. 3 is a cross-sectional view illustrating a semiconductor device using a conventional semiconductor package.

[Explanation of symbols]

 2, 36 Semiconductor element 10, 30 Substrate 11, 31 Wiring circuit 12, 32 Semiconductor element arrangement part 13 First through hole 14a, 14b Second through hole 15, 35 Electrode 16 Metal radiator 21 Plated metal layer 22 Heat conductor 37 Bonding Wire 38 Sealant 39 Solder bump

Claims (5)

[Claims] A semiconductor element placement part (1) formed on one surface of an organic substrate (10) having a wiring circuit (11).
A first through hole (13) that is exposed to the substrate (2) and penetrates the substrate (10) from front to back,
0) has a cylindrical plated metal layer (21) at a portion in contact with the heat conductive body (22) inside the plated metal layer (21).
And a first through-hole (13) having a surface exposed on the one surface of the substrate (10) except for the semiconductor element disposing portion (12), and penetrating the substrate (10) from front to back. A second through hole (14a, 14a) having a cylindrical plated metal layer (21) at a portion in contact with the substrate (10).
b) and an electrode (15) which is formed on the other surface of the substrate (10) by being connected to the plated metal layer (21) provided in the second through holes (14a, 14b) and which is to be connected to the mother substrate.
In the semiconductor package for surface mounting provided with: the wiring circuit (1) in the second through holes (14a, 14b).
A semiconductor for surface mounting, comprising a heat conductor (22) also inside a plated metal layer (21) of a second through hole (14a) connected to a first through hole (13) via 1). package. 2. The semiconductor package for surface mounting according to claim 1, wherein the heat conductor is a resin containing metal powder. 3. The semiconductor package for surface mounting according to claim 1, wherein the heat conductor is a composite of a metal rod and a resin containing metal powder. 4. The heat conductor (22) is formed so as to protrude from a wiring circuit (11) formed on a surface of a substrate (10). 2. The semiconductor package for surface mounting according to 1. 5. A metal radiator (16) is provided on a second through hole (14a, 14a, 14a, 14a) of the one surface of the substrate (10).
The semiconductor package for surface mounting according to any one of claims 1 to 4, wherein the semiconductor package is bonded to a portion where b) is exposed.