JP2649251B2 - Substrate for mounting electronic components - Google Patents
Substrate for mounting electronic componentsInfo
- Publication number
- JP2649251B2 JP2649251B2 JP63115162A JP11516288A JP2649251B2 JP 2649251 B2 JP2649251 B2 JP 2649251B2 JP 63115162 A JP63115162 A JP 63115162A JP 11516288 A JP11516288 A JP 11516288A JP 2649251 B2 JP2649251 B2 JP 2649251B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- lead
- internal connection
- hole
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、電子部品搭載用基板に関し、特に基材上に
搭載した電子部品の接続部と基材から突出する各リード
とを電気的に接続した基板に関するものである。Description: TECHNICAL FIELD The present invention relates to an electronic component mounting substrate, and more particularly, to electrically connecting a connection portion of an electronic component mounted on a base material and each lead projecting from the base material. It relates to the connected substrate.
（従来の技術） 近年の高密度化された電子部品は、そのままでは各種
電子機器を構成することができないから、これを基板に
実装してから使用しなければならない。そのために、従
来より種々の形式の電子部品搭載用基板が開発され提案
されてきている。(Prior Art) In recent years, electronic components having a higher density cannot constitute various electronic devices as they are, and must be used after being mounted on a substrate. For this purpose, various types of electronic component mounting substrates have been conventionally developed and proposed.
電子部品と、リード等の外部に接続するための端子と
を、基板において接続する形式としては、例えば所定配
列にて植設した多数の導体ピンと基板上の導体回路を介
して電子部品とを接続する所謂PGA、基板上の導体回路
の一部を電子部品が直接搭載されるフィンガーリードと
する所謂TAB、リードと電子部品とをワイヤーボンディ
ングしてその全体をモールドする所謂DIP等がある。As a form of connecting an electronic component and an external connection terminal such as a lead on a substrate, for example, a number of conductor pins planted in a predetermined arrangement are connected to the electronic component via a conductor circuit on the substrate. There are a so-called PGA, a so-called TAB in which a part of a conductor circuit on a substrate is a finger lead on which an electronic component is directly mounted, and a so-called DIP in which the lead and the electronic component are wire-bonded and the whole is molded.
これらの内、例えば互いに電気的に独立した複数のリ
ードを基材から突出させるとともに、この基材上に搭載
した電子部品の接続部と各リードとを電気的に接続した
DIP形式の基板を例にとっても、特開昭60−194553号公
報等においてその具体化されたものが種々提案されてい
る。この特開昭60−194553号公報等において提案されて
いるのは、 「金属製のベースリボンのアイランド部にシリコン、
ポリイミド、アルミナ、エポキシ、ガラスエポキシから
選ばれた材料の回路基板を接着剤で接着し、前記回路基
板上に回路素子を装着して樹脂封止したことを特徴とす
る混成集積回路装置」 であるが、このような混成集積回路装置を代表とする従
来の電子部品搭載用基板の基本的構成としては、第８図
に示すように主として二つのものがある。すなわち、そ
の第一の基本構成は、電子部品が搭載される部分（アイ
ランド部）に位置する金属材（金属製のベースリボン）
が、リードとなるべき他の複数の部分とは全く独立した
ものとされていることである。また、第二の基本構成
は、第一の基本構成と関連するのであるが、電子部品が
搭載される部分に位置する金属材と、リードとなるべき
他の複数の部分とは互いに独立したものであることか
ら、両者はワイヤーボンディングしなければならない構
成となっていることである。Among them, for example, a plurality of leads electrically independent from each other were projected from the base material, and the connection portion of the electronic component mounted on the base material and each lead were electrically connected.
Even taking a DIP type substrate as an example, various concrete examples thereof have been proposed in Japanese Patent Application Laid-Open No. Sho 60-194553. Japanese Patent Application Laid-Open No. Sho 60-194553 and the like have proposed that "silicon,
A hybrid integrated circuit device, wherein a circuit board made of a material selected from polyimide, alumina, epoxy, and glass epoxy is adhered with an adhesive, and circuit elements are mounted on the circuit board and sealed with a resin. However, as shown in FIG. 8, there are mainly two basic configurations of a conventional electronic component mounting substrate typified by such a hybrid integrated circuit device. That is, the first basic configuration is such that a metal material (a metal base ribbon) located at a portion (island portion) on which an electronic component is mounted.
However, it is completely independent of other plural parts to be leads. The second basic configuration is related to the first basic configuration. However, the metal material located at the portion where the electronic component is mounted and the other plurality of portions to be the leads are independent from each other. Therefore, both have a configuration in which wire bonding is required.
基板上に搭載した電子部品の接続部と各リードとを電
気的に接続した形式の従来の基板が以上のような基本構
成を採らなければならない理由は、各リードは電気的に
独立したものとしなければならないからであり、そのた
めにはこれら各リードに電子部品の各端子をそれぞれ別
個独立に接続しなければならないからである。The reason that the conventional board of the type in which the connection parts of the electronic components mounted on the board are electrically connected to each lead must adopt the above basic configuration is that each lead is electrically independent. This is because, for that purpose, each terminal of the electronic component must be connected to each of these leads independently.
（発明が解決しようとする課題） ところが、以上のような基本構成を採ると、特に近年
の各種の電子部品搭載用基板において要求されている高
密度実装を行なう上で、次のような解決しなければなら
ない課題が発生するものである。すなわち、 電子部品が接続される基板上の導体回路と各リードと
を直接ワイヤーボンディングしなければならないため、
電子部品を実装した後の全体を樹脂封止しなければなら
ないことは勿論、短距離でワイヤーボンディングを行な
えるように回路端部（アイランド部の外周部）に電極を
引き出しておく必要があり、回路設計上の自由度が非常
に少なくなる。(Problems to be Solved by the Invention) However, when the above basic configuration is adopted, the following solutions are required especially for performing high-density mounting required for various electronic component mounting substrates in recent years. There are issues that must be addressed. That is, since the conductor circuit on the board to which the electronic component is connected and each lead must be directly wire-bonded,
After mounting the electronic components, the whole must be sealed with resin, and of course, electrodes must be drawn out to the circuit end (outer periphery of the island) so that wire bonding can be performed in a short distance. The degree of freedom in circuit design is greatly reduced.
また、各リードに対しては、ワイヤーボンディングを
確実に行なうための金または銀メッキを施すことが必須
条件となっている。Further, it is an essential condition that each of the leads is plated with gold or silver for securely performing wire bonding.
電子部品を搭載するに必要な導体回路を有する部分に
位置する金属材、すなわちアイランド部に位置する金属
製ベースリボンは、電子部品のベースとして使用される
外は単に電子部品を搭載する部分を形成または補強する
ために使用されているのであり、積極的に配線回路とし
て使用できるものではない。従って、アイランド部に位
置する金属製ベースリボンは、高密度実装には適さない
ものである。The metal material located at the portion having the conductor circuit necessary for mounting the electronic component, that is, the metal base ribbon located at the island portion, simply forms the portion where the electronic component is mounted except for being used as the base of the electronic component Or, it is used for reinforcement and cannot be used as a wiring circuit positively. Therefore, the metal base ribbon located at the island portion is not suitable for high-density mounting.
また、電子部品は、一般に通電すれば発熱するもので
あり、このような電子部品からの熱は外部に放散させな
ければならないものである。ところが、上述した従来の
電子部品搭載用基板にあっては、電子部品の直下に位置
する金属材は他の金属部分とはつながっておらず、しか
も基材中に埋設された状態にあるため、金属材という熱
伝導性に優れた材質のものが基板中に折角存在している
のに、これを放熱部材として積極的に利用できないもの
である。In general, electronic components generate heat when energized, and heat from such electronic components must be dissipated to the outside. However, in the conventional electronic component mounting board described above, the metal material located immediately below the electronic component is not connected to other metal parts, and is in a state buried in the base material, Although a material having excellent thermal conductivity, such as a metal material, is present in the substrate, it cannot be actively used as a heat dissipating member.
以上の課題を解決すべく本発明者等が鋭意研究してき
た結果、リードの内側に内部接続部を一体的に形成し、
これを基板を構成する基材中に埋設した状態とすること
が良い結果を生むことを新規に知見し、本発明を完成し
たのである。As a result of intensive research conducted by the present inventors to solve the above problems, an internal connection portion is integrally formed inside the lead,
The present inventors have newly found that it is possible to obtain a good result by embedding this in the base material constituting the substrate, and have completed the present invention.
そして、本発明の目的とするところは、回路設計がし
易く、電子部品を搭載する基板の導体回路と各リードと
の接続部の樹脂封止は必ずしも行なう必要がなく、かつ
接続信頼性に優れ、容易に放熱構造を取ることができる
電子部品搭載用基板を簡単な構成によって提供すること
にある。The object of the present invention is to facilitate circuit design, and it is not necessary to perform resin sealing at a connection portion between a conductor circuit of a board on which electronic components are mounted and each lead, and it is excellent in connection reliability. Another object of the present invention is to provide an electronic component mounting board which can easily have a heat dissipation structure with a simple configuration.
（課題を解決するための手段） 以上の問題点を解決するために本発明では次のような
手段を採った。すなわち、 「互いに電気的に独立した複数のリード（２）の内側
に内部接続部（３）を一体的に形成し、この内部接続部
（３）の両側に基材（４）を一体的に設けることによ
り、基材（４）から各リード（２）を突出させるととも
に、基材（４）の少なくともいずれか一方に形成した導
体回路（６）とリード（２）とを電気的に接続した電子
部品搭載用基板であって、 少なくとも前記リード（２）の１つに連通するアイラ
ンド部（7a）と、 このアイランド部（7a）に設けられ該アイランド部
（7a）を貫通して前記導体回路（６）間に設けられたス
ルーホール（８）との間に間隙を形成する貫通孔（7b）
を設けるとともに、 基材（４）に、リード（２）の内部接続部（３）に到
達する穴（５）を少なくとも１箇所設け、この穴（５）
を通して基材（４）に形成した導体回路（６）と内部接
続部（３）とを電気的に接続したことを特徴とする電子
部品搭載用基板（１）」 である。(Means for Solving the Problems) In order to solve the above problems, the present invention employs the following means. That is, “an internal connection portion (3) is integrally formed inside a plurality of leads (2) electrically independent from each other, and a base material (4) is integrally formed on both sides of the internal connection portion (3). By providing, each lead (2) was made to protrude from the base material (4), and the conductor circuit (6) formed on at least one of the base materials (4) and the lead (2) were electrically connected. An electronic component mounting board, comprising: an island portion (7a) communicating with at least one of the leads (2); and the conductor circuit provided in the island portion (7a) and penetrating the island portion (7a). (6) A through hole (7b) that forms a gap between the through hole (8) provided therebetween.
And at least one hole (5) reaching the internal connection portion (3) of the lead (2) is provided in the base material (4).
An electronic component mounting board (1), wherein a conductive circuit (6) formed on the base material (4) and the internal connection portion (3) are electrically connected to each other.
以上の本発明が採った手段を図面に示した具体例に従
って以下詳細に説明する。The means adopted by the present invention will be described in detail below with reference to specific examples shown in the drawings.
第１図は本発明が採った手段によって実現された電子
部品搭載用基板（１）の一例を示す断面図である。この
図において、電子部品搭載用基板（１）は、これに搭載
する各電子部品を、その基材（４）から外部に突出する
各リード（２）によって他の大型基板等に実装する形式
のものであり、この電子部品搭載用基板（１）は、各リ
ード（２）として基材（４）内に埋設された状態の内部
接続部（３）をその内側に一体的に形成したものであ
る。また、内部接続部（３）間には、第１図及び第６図
に示すように内部接続部（３）及びリード（２）の１つ
に連通するアイランド部（7a）が設けられており、この
アイランド部（7a）に貫通孔（7b）が形成されている。
この貫通孔（7b）は、内部を導体回路（６）間に設けら
れスルーホール（８）が貫通するもので、スルーホール
（８）との間に間隙が形成されている。つまり、この電
子部品搭載用基板（１）にあっては、リード（２）と内
部接続部（３）とを一体化することにより構成した各金
属材（７）の内部接続部（３）の両面に樹脂等の材料か
ら成る基材（４）を一体的に設け、この基材（４）の少
なくとも一方の面に導体回路（６）を形成したものであ
る。そして、この導体回路（６）とリード（２）とは、
基材（４）に設けられ、リード（２）の内部接続部
（３）に到達する少なくとも１箇所の穴（５）を通して
電気的に接続されているものである。FIG. 1 is a cross-sectional view showing an example of an electronic component mounting board (1) realized by means of the present invention. In this figure, an electronic component mounting board (1) has a form in which each electronic component to be mounted is mounted on another large-sized substrate or the like by each lead (2) projecting outside from its base material (4). The electronic component mounting board (1) has an internal connection portion (3) buried in a base material (4) as each lead (2) and is integrally formed inside the substrate. is there. Further, between the internal connection portions (3), an island portion (7a) communicating with one of the internal connection portions (3) and one of the leads (2) is provided as shown in FIGS. A through hole (7b) is formed in the island portion (7a).
The through hole (7b) is provided between the conductor circuits (6) and penetrates the through hole (8), and a gap is formed between the through hole (8) and the through hole (8). That is, in the electronic component mounting board (1), the internal connection portion (3) of each metal material (7) formed by integrating the lead (2) and the internal connection portion (3). A substrate (4) made of a material such as resin is integrally provided on both surfaces, and a conductor circuit (6) is formed on at least one surface of the substrate (4). And this conductor circuit (6) and the lead (2)
It is provided on the base material (4) and is electrically connected through at least one hole (5) reaching the internal connection part (3) of the lead (2).
ここで、基材（４）としては上記の材料の他に種々な
材料を採用できるものである。すなわち、この基材
（４）の材料としては、シリコン、ポリイミド、アルミ
ナ、エポキシ、ガラスエポキシ、セラミック等、絶縁性
を有して金属性の内部接続部（３）に確実に密着するも
のであれば何でもよい。同様に金属材（７）を構成する
材料としても種々なものを適用できる。つまり、必要な
導電性を有した金属であれば何でも良く、銅系や鉄系は
勿論のこと、ステンレスや所謂42アロイ等でも充分であ
る。Here, as the base material (4), various materials other than the above-mentioned materials can be adopted. That is, as the material of the base material (4), any material such as silicon, polyimide, alumina, epoxy, glass epoxy, ceramic, etc. which has insulating properties and can be securely adhered to the metallic internal connection portion (3). Anything is fine. Similarly, various materials can be applied as a material constituting the metal material (7). In other words, any metal having the required conductivity may be used, and not only a copper-based or iron-based metal but also stainless steel or a so-called 42 alloy is sufficient.
さらに、導体回路（６）は、内部接続部（３）の両側
に一体的に形成された基材（４）の両面に形成されるの
は勿論のこと、第５図に示すごとく、基材（４）の片面
のみに形成されていてもよい。Further, the conductor circuit (6) is formed not only on both sides of the base material (4) integrally formed on both sides of the internal connection portion (3), but also as shown in FIG. It may be formed only on one side of (4).
加えて、基材（４）に設けたリード（２）の内部接続
部（３）に到達する穴（５）、つまり基材（４）に形成
された導体回路（６）と内部接続部（３）とを電気的に
接続するに用いられる穴（５）は、第１図に示すごとく
基材（４）の両面に形成されていても良いし、第２図の
ごとく片面のみでもよい。また、基材（４）に形成され
た導体回路（６）と内部接続部（３）との電気的接続
は、第１図のごとく内部接続部（３）の両面において行
なわれても良いし、第２図に示したごとく片面のみで行
なわれても良い。ここで、第３図のように導体回路
（６）と内部接続部（３）とを電気的に接続する穴
（５）は、基材（４）の両面に形成されるが、導体回路
（６）と内部接続部（３）との電気的な接続は、内部接
続部（３）の片面においてのみ行なわれるという方法も
あり、その形態は特に限定されるものではない。In addition, the hole (5) reaching the internal connection part (3) of the lead (2) provided on the base material (4), that is, the conductor circuit (6) formed on the base material (4) and the internal connection part ( The hole (5) used for electrically connecting the substrate (3) may be formed on both surfaces of the base material (4) as shown in FIG. 1 or may be formed on only one surface as shown in FIG. The electrical connection between the conductor circuit (6) formed on the base material (4) and the internal connection portion (3) may be made on both surfaces of the internal connection portion (3) as shown in FIG. , May be performed on only one side as shown in FIG. Here, as shown in FIG. 3, holes (5) for electrically connecting the conductor circuit (6) and the internal connection part (3) are formed on both sides of the base material (4). There is also a method in which the electrical connection between 6) and the internal connection portion (3) is made only on one side of the internal connection portion (3), and the form is not particularly limited.
最後に、内部接続部（３）と導体回路（６）との電気
的に接続方法であるが、内部接続部（３）及びこれに到
達する穴（５）の内面に、第１図及び第２図に示したよ
うに、メッキを施すことによって行なう方法、第４図及
び第５図に示したように、穴（５）内に導電性ペースト
（９）を充填することによって行なう方法、同様に穴
（５）内にクリーム半田を充填することによって行なう
方法、などが考えられるが、目的及び用途に適合した方
式を使用すれば良く、全く制限を受けない。Finally, the method of electrically connecting the internal connection part (3) and the conductor circuit (6) is described below. The internal connection part (3) and the inner surface of the hole (5) reaching the same are provided in FIG. As shown in FIG. 2, the method is performed by plating, and as shown in FIGS. 4 and 5, the method is performed by filling the conductive paste (9) in the hole (5). A method of filling the hole (5) with cream solder can be considered, but a method suitable for the purpose and application may be used, and there is no limitation.
（発明の作用） 本発明が以上のような手段を採ることによって、以下
のような作用がある。(Effect of the Invention) The present invention has the following effects by adopting the above means.
電子部品が接続される基板上の導体回路（６）と各リ
ード（２）とは必ずしも直接ワイヤーボンディングする
必要がなく、そのため樹脂封止が必要とはなっていな
い。また、本発明の電子部品搭載用基板（１）において
は、従来の基板のように、短距離でワイヤーボンディン
グを行うべく回路端部に導体回路（６）を引き出してお
く必要はなく、回路設計上の自由度が非常に高くなって
いる。The conductor circuit (6) on the board to which the electronic component is connected and each lead (2) do not necessarily need to be directly wire-bonded, and therefore do not require resin sealing. Further, in the electronic component mounting board (1) of the present invention, unlike the conventional board, it is not necessary to draw out the conductor circuit (6) at the circuit end in order to perform wire bonding in a short distance. The degree of freedom above is very high.
また、電子部品が接続される基材（４）上の導体回路
（６）と各リード（２）とを直接ワイヤーボンディング
する必要がないことから、本発明の電子部品搭載用基板
（１）にあっては、各リード（２）にボンディング用の
金または銀メッキを施す必要はない。Further, since it is not necessary to directly wire-bond the conductor circuit (6) on the base material (4) to which the electronic component is connected and each lead (2), the electronic component mounting board (1) of the present invention can be used. Therefore, it is not necessary to apply gold or silver plating for bonding to each lead (2).
本発明による電子部品搭載用基板（１）においては、
金属材（７）のアイランド部（7a）を、電子部品を搭載
するに必要な導体回路（６）を有する部分に必ずしも形
成する必要はなく、従って金属材（７）を配線回路とし
て積極的に使用可能となっている。In the electronic component mounting board (1) according to the present invention,
The island portion (7a) of the metal material (7) does not necessarily need to be formed in a portion having a conductor circuit (6) necessary for mounting an electronic component. Therefore, the metal material (7) is actively used as a wiring circuit. It can be used.
金属材（７）のアイランド部（7a）を内部接続部
（３）及びリード（２）の１つに連通させたので、内部
接続部（３）が基材（４）中に埋設された状態にあって
も一体的なリード（２）が基材（４）の外部に突出して
いるため、金属材（７）という熱電導性に優れた材質の
ものを放熱部材として積極的に利用可能となっているの
である。Since the island portion (7a) of the metal material (7) is communicated with the internal connection portion (3) and one of the leads (2), the internal connection portion (3) is buried in the base material (4). However, since the integrated lead (2) protrudes outside the base material (4), a material having excellent thermal conductivity, such as a metal material (7), can be positively used as a heat dissipation member. It is becoming.
アイランド部（7a）に貫通孔（7b）が設けたので、導
体回路（６）間に設けられたスルーホール（８）がアイ
ランド部（7a）を貫通しても、貫通孔（7b）との間に間
隙が形成されているので、絶縁が確保できる。Since the through hole (7b) is provided in the island portion (7a), even if the through hole (8) provided between the conductor circuits (6) penetrates the island portion (7a), the through hole (7b) is not provided. Since a gap is formed between the electrodes, insulation can be secured.
（実施例） 次に、本発明を、図示に示した各実施例に従って詳細
に説明する。(Examples) Next, the present invention will be described in detail according to each example shown in the drawings.
第１実施例 第１図には本発明の第１実施例である電子部品搭載用
基板（１）が示してある。この電子部品搭載用基板
（１）の金属材（７）は銅系のものを使用し、リード
（２）及びこれの内側にこれと一体的な内部接続部
（３）を有している。また、第６図にも示すように、両
側の内部接続部（３）の中間には内部接続部（３）及び
リード（２）の１つに連通するアイランド部（7a）が設
けられている。この金属材（７）の両面にガラストシア
ジンプリプレグ及び、銅箔を配し加熱加圧硬化させた。
その後、この基材（４）に、導体回路（６）の形成に必
要なスルーホール穴（８）及び、リード（２）の内部接
続部（３）に到達する穴（５）を穴あけし、メッキ、エ
ッチング、座グリなどの加工により、第１図のごとく電
子部品搭載用基板（１）を得た。First Embodiment FIG. 1 shows an electronic component mounting board (1) according to a first embodiment of the present invention. A metal material (7) of the electronic component mounting board (1) is made of copper and has a lead (2) and an internal connection part (3) integrated with the lead (2). Also, as shown in FIG. 6, an island portion (7a) communicating with one of the internal connection portion (3) and one of the leads (2) is provided between the internal connection portions (3) on both sides. . Glass tothazine prepreg and copper foil were arranged on both surfaces of the metal material (7), and were cured by heating and pressing.
Thereafter, a through hole (8) necessary for forming the conductor circuit (6) and a hole (5) reaching the internal connection part (3) of the lead (2) are formed in the base material (4). By processing such as plating, etching, and spot facing, an electronic component mounting board (1) was obtained as shown in FIG.
この電子部品搭載用基板（１）においては、リード
（２）の内部接続部（３）と導体回路（６）との電気的
接続を、基材（４）に設けられた穴（５）を通して形成
したメッキからなる導体により実現した。In the electronic component mounting board (1), the electrical connection between the internal connection portion (3) of the lead (2) and the conductor circuit (6) is established through a hole (5) provided in the base material (4). This was realized by the conductor made of the formed plating.
また、本実施例においては、穴（５）は、一本のリー
ド（２）に対し、その両面からあけられており、つまり
電気的接続は、リード（２）の両面において実現されて
おり、片面のみにおいて実現されるものより、電気的接
続の接続信頼性は大幅に向上した構造となっている。Further, in this embodiment, the hole (5) is opened from both sides of one lead (2), that is, the electrical connection is realized on both sides of the lead (2). The connection reliability of the electrical connection is significantly improved as compared with the structure realized on only one side.
第２実施例 第２図は本発明による電子部品搭載用基板（１）の第
二実施例である。実施例１と同様に金属材（７）として
銅系のものを使用している。Second Embodiment FIG. 2 shows a second embodiment of the electronic component mounting board (1) according to the present invention. As in the first embodiment, a copper-based material is used as the metal material (7).
また、第６図は本実施例に使用される金属材（７）の
上面図であり、金属材（７）は配線回路として積極的に
利用されていると同時に、電子部品が搭載される部分の
金属材（７）のアイランド部（7a）はリード（２）と一
体的にしてあり、放熱部材として積極的に利用されてい
る。以後は実施例１と同様な工程により、本発明による
電子部品搭載用基板（１）が完成した。なお、リード
（２）の内部接続部（３）と導体回路（６）との電気的
接続は、基材（４）にあけられた内部接続部（３）に到
達する穴（５）に、メッキにより形成された導体によっ
て実現されるが、この実施例においては、この電気的接
続はリード（２）の片面のみによって行なわれている。
片面のみにより接続が完了すると、その反対面は何の制
限も受けずに導体回路（６）を形成することができ、高
密度化に適する。また、この第２図において、導体回路
（６）と内部接続部（３）との接続は、金属材（７）の
上側の面で行なわれているが、第３図、第７図（第３図
のVII−VII断面図）のごとくどちらの面を使用してもよ
い。FIG. 6 is a top view of a metal material (7) used in the present embodiment. The metal material (7) is actively used as a wiring circuit and a portion on which electronic components are mounted. The island portion (7a) of the metal material (7) is integrated with the lead (2) and is actively used as a heat radiating member. Thereafter, through the same steps as in Example 1, the electronic component mounting substrate (1) according to the present invention was completed. The electrical connection between the internal connection portion (3) of the lead (2) and the conductor circuit (6) is made in a hole (5) reaching the internal connection portion (3) formed in the base material (4). Although this is realized by a conductor formed by plating, in this embodiment, this electrical connection is made only by one side of the lead (2).
When the connection is completed by only one surface, the opposite surface can form the conductor circuit (6) without any limitation, and is suitable for high density. In FIG. 2, the connection between the conductor circuit (6) and the internal connection portion (3) is made on the upper surface of the metal material (7). Either surface may be used as shown in FIG. 3 (VII-VII sectional view).
第３実施例 第４図及び第５図は本発明による電子部品搭載用基板
（１）の第３実施例である。本実施例では、基材（４）
の内部接続部（３）に到達する穴（５）を通しての導体
回路（６）と、リード（２）の内部接続部（３）との電
気的接続は、導電性樹脂（９）を充填することにより実
現されており、第４図は導体回路（６）が電子部品搭載
用基板（１）の両面にある場合、そして第５図は片面に
ある場合である。Third Embodiment FIGS. 4 and 5 show a third embodiment of an electronic component mounting board (1) according to the present invention. In this embodiment, the base material (4)
The electrical connection between the conductor circuit (6) through the hole (5) reaching the internal connection part (3) and the internal connection part (3) of the lead (2) is filled with a conductive resin (9). FIG. 4 shows the case where the conductor circuit (6) is on both sides of the electronic component mounting board (1), and FIG. 5 shows the case where it is on one side.
この実施例３に係る電子部品搭載用基板（１）は、実
施例１及び実施例２と同様に、金属材（７）の両面にガ
ラストリアジンプリプレグ及び銅箔を配し、加熱加圧硬
化させた後、穴あけ、メッキ、エッチング、座ぐり等の
工程により第４図あるいは第５図のようにして完成され
る。ここで、第４図に示すごとく、導体回路（６）が基
板の両面に形成されている場合、導電性樹脂（９）によ
って基板両面の導通を得れば、スルーホールメッキを行
なう必要はなくなり、製造コストを低く押えることが可
能である。The electronic component mounting board (1) according to the third embodiment has a glass triazine prepreg and a copper foil disposed on both surfaces of a metal material (7) in the same manner as the first and second embodiments, and is cured by heating and pressing. After that, it is completed as shown in FIG. 4 or FIG. 5 by processes such as drilling, plating, etching, and spot facing. Here, as shown in FIG. 4, when the conductive circuit (6) is formed on both sides of the substrate, if the conductive surface of the substrate is obtained by the conductive resin (9), it is not necessary to perform through-hole plating. In addition, the manufacturing cost can be kept low.
また、電気的接続法として導電性樹脂（９）による方
法と同様な方法に、クリーム半田を印刷し、リフローさ
せるという安価に達成できる方法もある。In addition, there is an inexpensive method of printing cream solder and reflowing the same method as the method using the conductive resin (9) as the electrical connection method.
（発明の効果） 以上詳述したように、本発明によれば、回路設計が容
易でしかも樹脂封止を行なわずとも接続信頼性に優れ、
放熱効果も充分に得られる電子部品搭載用基板（１）
を、簡単な構成により提供することができるのである。(Effects of the Invention) As described in detail above, according to the present invention, circuit design is easy, and connection reliability is excellent without resin sealing.
Electronic component mounting board (1) with sufficient heat radiation effect
Can be provided by a simple configuration.
すなわち、本発明の電子部品搭載用基板（１）におい
ては、次のような具体的効果を有するのである。That is, the electronic component mounting board (1) of the present invention has the following specific effects.
電子部品が接続される基板上の導体回路（６）と各リ
ード（２）とをワイヤーボンディングする必要はない。
そのため必ずしも樹脂封止が必要でない。また、ワイヤ
ーボンディングのために、回路端部に導体回路（６）を
引き出す必要はなく設計の自由度が高くなる。It is not necessary to wire-bond the conductor circuit (6) on the substrate to which the electronic component is connected and each lead (2).
Therefore, resin sealing is not necessarily required. In addition, it is not necessary to draw out the conductor circuit (6) at the circuit end for wire bonding, so that the degree of freedom in design is increased.
また、ワイヤーボンディングのための各リード（２）
上の金メッキあるいは銀メッキが必要でなく、従ってこ
の電子部品搭載用基板（１）は低コストによって形成す
ることができるのである。Each lead for wire bonding (2)
No gold plating or silver plating is required, so that the electronic component mounting substrate (1) can be formed at low cost.
金属材（７）を、電子部品を搭載するに必要な導体回
路（６）を有する部に必ずしも設ける必要はない。従っ
て、この部分には金属材（７）による配線回路を形成す
ることができて、電子部品搭載用基板（１）の高密度化
を達成することができる。It is not always necessary to provide the metal material (7) in a portion having a conductor circuit (6) necessary for mounting an electronic component. Therefore, a wiring circuit made of the metal material (7) can be formed in this portion, and the density of the electronic component mounting substrate (1) can be increased.
金属材（７）のアイランド部（7a）を内部接続部
（３）及びリード（２）の１つに連通させたので、内部
接続部（３）が基材（４）中に埋設された状態にあって
も一体的なリード（２）が基材（４）の外部に突出して
いるため、金属材（７）という熱電導性に優れた材質の
ものを放熱部材として積極的に利用できる。Since the island portion (7a) of the metal material (7) is communicated with the internal connection portion (3) and one of the leads (2), the internal connection portion (3) is buried in the base material (4). However, since the integrated lead (2) protrudes outside the base material (4), a metal material (7) having excellent heat conductivity can be positively used as a heat radiating member.
アイランド部（7a）に貫通孔（7b）が設けたので、導
体回路（６）間に設けられたスルーホール（８）がアイ
ランド部（7a）を貫通しても、貫通孔（7b）との間に間
隙が形成されているので、絶縁が確保できる。Since the through hole (7b) is provided in the island portion (7a), even if the through hole (8) provided between the conductor circuits (6) penetrates the island portion (7a), the through hole (7b) is not provided. Since a gap is formed between the electrodes, insulation can be secured.
第１図〜第５図のそれぞれは本発明に係る電子部品搭載
用基板の様々な実施例を示す縦断面図、第６図は本発明
に用いる金属材の平面図、第７図は第３図のVII−VII線
に沿って見た断面図である。 なお、第８図は従来例を示す断面図である。 符号の説明 １……電子部品搭載用基板、２……リード、３……内部
接続部、４……基材、５……内部接続部に到達する穴、
６……導体回路、７……金属材、7a……アイランド部、
7b……貫通孔、８……導体回路の形成に必要なスルーホ
ール穴、９……導電性樹脂。1 to 5 are longitudinal sectional views showing various embodiments of the electronic component mounting board according to the present invention, FIG. 6 is a plan view of a metal material used in the present invention, and FIG. It is sectional drawing seen along the VII-VII line of the figure. FIG. 8 is a sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 1 ... Electronic component mounting board, 2 ... Lead, 3 ... Internal connection part, 4 ... Base material, 5 ... Hole reaching internal connection part,
6: Conductor circuit, 7: Metal material, 7a: Island part,
7b: through-hole, 8: through-hole required for forming conductive circuit, 9: conductive resin.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 武山 武 岐阜県大垣市青柳町300番地 イビデン 株式式社青柳工場内 (56)参考文献 特開 平１−286339（ＪＰ，Ａ) 特開 昭63−177545（ＪＰ，Ａ) 特開 平１−286336（ＪＰ，Ａ) 特開 平１−286344（ＪＰ，Ａ) 特開 平１−199497（ＪＰ，Ａ) 特開 平１−286352（ＪＰ，Ａ) 特開 昭62−101064（ＪＰ，Ａ) 特開 昭63−29566（ＪＰ，Ａ) ────────────────────────────────────────────────── ─── Continuing from the front page (72) Inventor Takeyama Takeshi 300 Aoyagi-cho, Ogaki-shi, Gifu Pref. 177545 (JP, A) JP-A-1-286336 (JP, A) JP-A-1-286344 (JP, A) JP-A-1-199497 (JP, A) JP-A-1-286352 (JP, A) JP-A-62-101064 (JP, A) JP-A-63-29566 (JP, A)
Claims (1)
側に内部接続部を一体的に形成し、この内部接続部の両
側に基材を一体的に設けることにより、前記基材から前
記各リードを突出させるとともに、前記基材の少なくと
もいずれか一方に形成した導体回路と前記リードとを電
気的に接続した電子部品搭載用基板であって、 少なくとも前記リードの１つに連通するアイランド部
と、 このアイランド部に設けられ該アイランド部を貫通して
前記導体回路間に設けられたスルーホールとの間に間隙
を形成する貫通孔を設けるとともに、 前記基材に、前記リードの内部接続部に到達する穴を少
なくとも１箇所設け、この穴を通して前記基材に形成し
た導体回路と前記内部接続部とを電気的に接続したこと
を特徴とする電子部品搭載用基板。An internal connection portion is integrally formed inside a plurality of leads electrically independent from each other, and a base material is integrally provided on both sides of the internal connection portion, so that each of the internal connection portions is separated from the base material. An electronic component mounting board in which a lead is projected and a conductive circuit formed on at least one of the bases and the lead are electrically connected, and an island portion communicating with at least one of the lead is provided. A through hole that is provided in the island portion and penetrates through the island portion and forms a gap between the through hole provided between the conductor circuits; An electronic component mounting board, characterized in that at least one reaching hole is provided, and a conductor circuit formed in the base material and the internal connection portion are electrically connected through the hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63115162A JP2649251B2 (en) | 1988-05-12 | 1988-05-12 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63115162A JP2649251B2 (en) | 1988-05-12 | 1988-05-12 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01286338A JPH01286338A (en) | 1989-11-17 |
| JP2649251B2 true JP2649251B2 (en) | 1997-09-03 |
Family
ID=14655870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63115162A Expired - Lifetime JP2649251B2 (en) | 1988-05-12 | 1988-05-12 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2649251B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0412561A (en) * | 1990-05-02 | 1992-01-17 | Toshiba Corp | Lead frame for ic |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62101064A (en) * | 1985-10-26 | 1987-05-11 | Sumitomo Electric Ind Ltd | High density integrated circuit device |
-
1988
- 1988-05-12 JP JP63115162A patent/JP2649251B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01286338A (en) | 1989-11-17 |
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