JP3117688B2 - Semiconductor package for surface mounting - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor package for surface mounting, and more particularly to a semiconductor package for surface mounting in which external input / output terminals are formed on a substrate on which a semiconductor chip used in electric equipment is mounted.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG.
No. 36655 proposes a semiconductor package for surface mounting.

The semiconductor package for surface mounting shown in FIG. 8 has a metal substrate 9 of good thermal conductivity on which the semiconductor chip 1 is fixed on the upper surface, and an insulating thin layer 16 on the lower surface of the metal substrate 9. A heat sink 14 for dissipating heat of the semiconductor chip 1, a circuit portion 5 for electrical connection with a terminal portion of the semiconductor chip 1 on the upper surface, a metal substrate 9 on the lower surface, and the semiconductor chip 1 fixed thereto. The wiring board 1 having a through-hole 18 provided so as to open the upper side of the semiconductor chip 1 in the vicinity of the semiconductor chip 1.
7 are formed.

In such a semiconductor package for surface mounting, the semiconductor chip 1 is fixed to a metal substrate 9, and the semiconductor chip 1 and the circuit section 5 are bonded with bonding wires 11.
Electrical connection through. Then, the semiconductor chip 1 and the bonding wires 11 are hermetically sealed with a sealing resin or the like (not shown) for protecting the semiconductor wires, thereby finally forming a semiconductor device. Terminals 6 for connecting the semiconductor device to an external circuit board are formed on the circuit board 5 side of the wiring board 17 and are connected to the circuit board 5.

According to such a semiconductor package for surface mounting, a constant heat radiation is ensured by the metal substrate 9 directly supporting the semiconductor chip 1, and a heat sink is fixed to this through the insulating thin layer 16. As a result, insulation is ensured and a sufficiently high heat radiation effect is obtained.

[0006]

However, when a semiconductor device using the above-mentioned conventional surface mounting semiconductor package is mounted on an external circuit board and used, the position of the terminal 6 is higher than the upper surface of the sealing resin. Otherwise, the terminal 6 cannot be connected to the external circuit board due to the contact of the sealing resin with the external circuit board. Therefore, the position of the terminal 6 must be higher than the upper surface of the sealing resin. Therefore, since the bonding connection portion of the circuit portion 5 connected to the bonding wire 11 is covered with the sealing resin, it is necessary to change the height between the bonding connection portion and the connection portion of the terminal 6. As a method of changing the height, a step is provided on the upper surface of the wiring board 17, a bonding connection portion is provided on a side having a lower step, and the terminal 6 is provided on a side having a higher step. However, this method requires connection means for connecting the bonding connection portions having different heights to the terminals 6.

The present invention has been made in view of the above circumstances, and an object of the present invention is to form a semiconductor device which can be surface-mounted on an external circuit board with a semiconductor chip and a circuit portion sufficiently sealed. An object of the present invention is to provide a surface mounting semiconductor package in which terminals with improved connection reliability can be easily formed.

[0008]

In order to achieve the above object, according to the present invention, there is provided a semiconductor device comprising: a concave portion for mounting a semiconductor chip; a circuit portion provided on a shoulder portion surrounding the concave portion; Is formed, an insulating layer 8 having a through hole 7 is laminated on the circuit portion 5 of the circuit board 21, and a lower end portion is connected to the circuit portion 5 through the through hole 7 so as to be electrically connected. to form a through-hole conductive path 4 the upper end projects into the insulating layer 8 top, the through-hole conductive path 4 Oyo upper portion
And the lower end thereof are integrally formed.
Is formed on the surface mounting terminal 6 provided on the same side as the concave portion 2 and the shoulder 3 on the circuit board 21.

In such a semiconductor package for surface mounting, since the insulating layer 8 having the through-hole conductive path 4 is laminated on the circuit board 21 having the circuit portion 5 connected to the semiconductor chip 1, the through-hole conductive The upper end of the path 4 can be used as the terminal 6, and a sufficient thickness of the sealing resin for sealing the circuit part 5 connected to the lower end of the through-hole conductive path 4 and the semiconductor chip 1 can be ensured. A semiconductor device that can be surface-mounted by tightly fixing the device to an external circuit board can be formed.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A semiconductor package for surface mounting according to an embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 is a perspective view showing a semiconductor package for surface mounting according to an embodiment of the present invention. Also, FIG.
FIG. 3 is a longitudinal sectional view showing a semiconductor device using the same semiconductor package for surface mounting.

As shown in FIGS. 1 and 2, a semiconductor package for surface mounting includes a recess 2 on which a semiconductor chip 1 is mounted.
And a circuit portion 21 provided on the shoulder portion 3 around the concave portion 2 to form a circuit portion 21 of the circuit portion 21.
An insulating layer 8 having a through hole 7 is laminated thereon. A through hole conductive path 4 penetrating through the through hole 7 and having a lower end connected to the circuit portion 5 and having an upper end protruding above the upper surface of the insulating layer 8 is formed. And the upper end of the through-hole conductive path 4 is connected to the circuit board 2.
1 are formed on the surface mounting terminals 6 provided on the same side as the concave portion 2 and the shoulder portion 3.

The metal substrate 9 is made of a good heat conductive metal, such as copper or aluminum, and has a concave portion 2 for mounting the semiconductor chip 1 at substantially the center of the upper surface. The periphery of the recess 2 on the upper surface of the metal base 9 is defined as a shoulder 3, and a substrate insulating layer 10 is formed on the shoulder 3. The material of the substrate insulating layer 10 is an epoxy resin adhesive, and is formed by a screen printing method. The circuit section 5 is formed on the substrate insulating layer 10. The method of forming the circuit portion 5 is a method of performing electroplating in a required pattern on a stainless steel plate and thermally transferring the circuit portion 5 formed by the electroplating onto the substrate insulating layer 10.

Then, as shown in FIG. 2, terminals 6 are formed on the circuit section 5 to form a semiconductor package for surface mounting.

First, an insulating layer 8 is formed on the circuit section 5. The material of the insulating layer 8 is the substrate insulating layer 1 on the metal base 9.
It is an epoxy resin adhesive like 0, and is formed by a screen printing method. The insulating layer 8 needs to be formed thick so that the semiconductor chip 1 to be incorporated later can be easily sealed with resin. For this reason, it is necessary to take measures such as mixing the material with a large amount of the inorganic filler or forming a layer with a large amount of the inorganic filler on the underlayer and overlaying a material with a small amount of the inorganic filler thereon. is there. Next, electroless plating is applied to the entire surface of the insulating layer 8, a pattern is formed thereon with a plating resist, and electroplating is performed from above. Thereafter, the resist is removed, the entire surface is thinly etched, and the exposed electroless plating is removed to form a through-hole conductive path 4. This through-hole conductive path 4 is a terminal 6.

Further, as shown in FIG. 2, a method for forming a semiconductor device by using the above surface-mount semiconductor package will be described. The semiconductor chip 1 is placed in close contact with the recess 2 on the metal base 9. Next, the semiconductor chip 1 and the circuit section 5 are connected by wire bonding. As the bonding wire 11, a gold wire, an aluminum wire, a copper wire, or the like is used.
Thereafter, the semiconductor chip 1 and the bonding wires 11 are sealed and protected by the silicon resin. Further, sealing with an epoxy resin is performed from above. In some cases, only one of these sealing resins 12 may be used.

The semiconductor device thus obtained is surface-mounted as a leadless package on an external circuit board. The sealing resin 12 is disposed in a space surrounded by the semiconductor chip 1, the external circuit board, and the insulating layer 8, so that the semiconductor device can be surface-mounted on the external circuit board.
Further, a heat sink (not shown) is tightly fixed on the surface of the metal base 9 opposite to the semiconductor chip 1. With this heat sink, heat generated from the semiconductor chip 1 is transmitted through the metal base material 9 and is radiated to the external space.

FIG. 3 is a longitudinal sectional view showing a semiconductor device using a semiconductor package for surface mounting different from the above embodiment of the present invention. The difference from the above is the method of forming the insulating layer 8 and the terminals 6, and the steps up to the formation of the circuit section 5 on the metal base 9 are performed in the same manner as the surface mounting semiconductor package shown in FIG.

In order to form the terminals 6, first, as shown in FIG. 4, the through holes 20 are formed by arranging the terminals 6 and stamping out the required shapes. As shown in FIG. 3, the through-hole board 20 is attached on the circuit section, and the circuit section 5 and the terminal 6 are connected. For this purpose, both surfaces of the through-hole substrate 20 are plated with solder. In the solder plating, a material having a composition having a relatively high melting point is coated on the side of the terminal 6 to be connected to the circuit portion 5.
A bonding material having a low melting point is plated on the connection side with the external circuit board. Then, when the external circuit board and the terminal 6 are joined, there is no problem that the already joined terminal 6 and the circuit portion 5 are disconnected.

FIG. 5 is a longitudinal sectional view showing a semiconductor device using a semiconductor package for surface mounting different from that of the embodiment of the present invention. The difference from the above is the method of forming the insulating layer 8 and the terminals 6, and the steps up to the formation of the circuit section 5 on the metal base 9 are performed in the same manner as the surface mounting semiconductor package shown in FIG. FIG. 6 is a perspective view showing the insulating layer 8 used in the semiconductor package for surface mounting shown in FIG.

As shown in FIG. 6, a plate-like insulating layer 8 in which a through hole 7 is formed in advance in a portion where a terminal 6 is to be formed is adhered on the circuit section 5. Thereafter, as shown in FIG.
Install. Here, the spherical terminal 6 is shown. The terminal 6 is, for example, a copper ball whose surface is plated with a composite material such as solder.

Further, instead of pasting the plate-like insulating layer 8 as shown in FIG. 6 to form the insulating layer 8, there is also a method of forming the insulating layer 8 by printing as shown in FIG. Subsequent mounting of the semiconductor chip 1 and resin sealing are the same as those of the semiconductor package for surface mounting shown in FIG.

[0023]

According to the first aspect of the present invention, since the insulating layer having the through-hole conductive path is laminated on the circuit board having the circuit part connected to the semiconductor chip, the upper end of the through-hole conductive path is connected to the terminal. As a result, the thickness of the sealing resin sufficient to seal the circuit portion connected to the lower end of the through-hole conductive path and the semiconductor chip can be ensured, and the terminals can be fixed to an external circuit board and surface mounted. A semiconductor device can be formed. Furthermore, since the periphery is closely covered with the insulating layer, the connection reliability of the terminals is improved. Further, since the terminals are provided on the same side as the semiconductor chip on the substrate, a heat sink for cooling the semiconductor chip can be provided on the lower surface of the substrate. Therefore, a highly reliable semiconductor device having excellent heat dissipation properties can be formed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a semiconductor package for surface mounting according to an embodiment of the present invention.

FIG. 2 is a longitudinal sectional view showing a semiconductor device using the semiconductor package for surface mounting according to the first embodiment;

FIG. 3 is a longitudinal sectional view showing a semiconductor device using a semiconductor package for surface mounting different from the above according to the embodiment of the present invention.

FIG. 4 is a perspective view showing a main part of the semiconductor package for surface mounting according to the first embodiment;

FIG. 5 is a longitudinal sectional view showing a semiconductor device using a semiconductor package for surface mounting different from the above according to the embodiment of the present invention.

FIG. 6 is a perspective view showing a main part of the semiconductor package for surface mounting according to the first embodiment;

FIG. 7 is a longitudinal sectional view showing a semiconductor device using a conventional semiconductor package for surface mounting.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip 2 Depression 3 Shoulder part 4 Through-hole conductive path 5 Circuit part 6 Terminal 7 Through hole 8 Insulating layer 9 Metal substrate 10 Substrate insulating layer 11 Bonding wire 12 Sealing resin 13 External circuit board 14 Heat sink 16 Insulating thin layer 17 Wiring Board 18 Through Hole 19 Adhesive 20 Through Hole Board 21 Circuit Board

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/12

Claims (1)

(57) [Claims] 1. A circuit board having a recess for mounting a semiconductor chip and a circuit section provided on a shoulder around the recess is formed, and an insulating layer having a through hole is laminated on the circuit section of the circuit board. The lower end portion penetrates the through-hole to connect and conduct with the circuit portion, and the upper end portion forms a through-hole conductive path protruding from the upper surface of the insulating layer .
And a lower end portion are integrally formed, and an upper end portion of the through-hole conductive path is formed on a surface mounting terminal provided on the same side as the concave portion and the shoulder portion on the circuit board. Semiconductor package.