JP2006108261A - Function element package and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To ensure a stable operation of a function element structure by sealing the structure, and miniaturize and make thin the structure, and further make a mounting process effective. <P>SOLUTION: The function element structure 3 is mounted on a package substrate 2 including thereon many electrodes 7 for external connection arranged in a frame shape by constituting a hollow space 11 kept in an airtight state by an insulating blade 5 and an adhesive resin frame layer 4. A via 18 is formed through the insulating plate 5 and the adhesive resin frame layer 4 formed in a frame shape striding the electrodes 7 for external connection, and a conductive bump 12 is provided on each via 18. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a functional element package in which various functional element bodies are mounted on a package substrate having external connection electrodes of substantially the same size, and a manufacturing method thereof, and more specifically, for example, a micro electromechanical component (MEMS: Micro) having a movable part. The present invention relates to a functional element package having a functional element body such as Electro Mechanical Systems), a piezoelectric thin film resonant element (FBAR) or a surface acoustic wave device (SAW), and a method for manufacturing the same.

  In recent years, various mobile electronic devices such as personal computers, mobile phones, video devices, audio devices, and the like have been reduced in size and weight, increased in functionality, increased in functionality, and increased in speed. In mobile electronic devices and the like, a mounting board in which a wiring layer having a fine wiring pattern is formed in multiple layers to achieve a high density wiring is used for this purpose. A predetermined circuit module is configured by mounting electronic components and various semiconductor devices with a surface mounting method such as a flip chip mounting method.

  In addition, for the circuit module, for example, a mounting method in which a semiconductor device directly mounts a so-called bare chip in a non-package state on a mounting substrate from a mounting method using a resin mold or a ceramic package is also employed. In the circuit module, connectors such as solder bumps are provided in advance on a large number of mounting electrodes formed on the mounting board, and the combined bare chips are soldered by reflow soldering or the like. The circuit module enables high-density mounting of electronic components and semiconductors by reducing the mounting area and increasing the number of pins by making the mounting area almost the same as the chip size, and also enables signal transmission. Speeding up is also realized. In the circuit module, the bare chip mounted on the mounting substrate is sealed with an insulating resin so that the circuit module can be insulated from other mounting components and mechanically protected.

  By the way, in a functional device such as MEMS, FBAR, or SAW having a functional surface provided with a mover or a vibrator, the functional element is surface-mounted on a mounting substrate and sealed with an insulating resin like the semiconductor device described above. If a structure that stops is used, there is a problem that the mover and the vibrator are fixed and cannot operate and cannot function. Therefore, these functional devices are provided as a functional element package 100 as shown in FIG. 13, for example, and are mounted on a mounting board or the like.

  In the functional element package 100, a recess 102 is formed in a package substrate 101 having a multilayer wiring layer, a bare SAW element 103 is mounted in the recess 102, and the recess 102 is closed by an insulating plate 104. It becomes. On the package substrate 101, a large number of electrodes 105 are formed along the inner peripheral wall on the bottom surface 102a of the recessed portion 102 opened to the first main surface 101a, and the second main surface 101b corresponding to each of these electrodes 105. A large number of external mounting electrodes 106 are formed on the side. The package substrate 101 is connected to a facing electrode 105 and an external mounting electrode 106 via a wiring pattern or via (not shown) in which an inner layer is formed. A bare SAW element 103 is die-bonded in the recess 102 in the package substrate 101, and each electrode 105 is connected to the opposite electrode 107 on the SAW element 103 side by a wire 108 by a wire bonding method.

  In the functional element package 100, the recess 102 is closed by the insulating plate 104 in a state where the SAW element 103 is mounted on the package substrate 101. The insulating plate 104 is fixed on the package substrate 101 with an adhesive resin 109 in a vacuum atmosphere or a reducing atmosphere. In the functional element package 100, the SAW element 103 is held in a movable state in the recess 102 of the package substrate 101, and is sealed in an airtight state.

  In the functional element package 100, since a glass substrate, a ceramic substrate, or the like is used, the cost increases because the recess 102 is formed in the package substrate 101 having poor processability, and the recess 102 has a large number of electrodes 105. The package substrate 101 is formed with an opening size and height larger than the outer shape of the SAW element 103 in order to secure the space to be formed and the space for drawing the wire 108. Accordingly, when the functional element package 100 is a so-called multichip module in which a plurality of functional elements are mounted on a mounting board, for example, the multichip module is enlarged by requiring a large mounting space and thickness. There was a problem such as.

  In the functional element package, in order to solve the above-described problem, various mounting methods for forming a hollow portion in which the functional element is arranged with an appropriate configuration on a package substrate or a mounting substrate have been studied. For example, in Patent Document 1, an insulating resin frame and a connection bump that surround an active surface of a chip to form an adhesive layer are provided, and the chip is face-down mounted on a mounting substrate (surface mounting) with the active surface as an opposing surface. A micropackage structure is disclosed.

  In such a micro package structure, a hollow portion surrounded by an insulating resin frame is formed between the active surface of the chip and the main surface of the mounting substrate. According to such a micro package structure, a chip having an active surface with respect to a mounting substrate can be face-down mounted in the same manner as other electronic components and bare chips. Therefore, according to such a micro package structure, the module is made thinner and the efficiency of the mounting process is improved. For example, Patent Document 2 and Patent Document 3 disclose similar mounting methods.

Japanese Patent No. 3514349 JP 2000-124767 A Japanese Patent No. 3196663

  By the way, in the functional element package, when a fine movable portion of the functional element body is exposed, the characteristics change due to an influence of a temperature change or an etching solution applied during the manufacturing process of the package or module. In the functional element package, the functional element body is easily affected by environmental resistance such as charging by static electricity and airtightness, and the electrical characteristics and functional characteristics (lifetime) are greatly changed.

  Therefore, the functional device package is preferably manufactured by a low temperature process from a series of device processes to a package process and a module process. In addition, the functional element package needs to be configured so that the functional element body is maintained in an airtight state that suppresses the influence from the various external factors described above and performs stable operation.

  The functional element package needs to keep the functional element body in an airtight state in a vacuum or a reducing atmosphere even during the device process or in use as described above, and the hollow portion as described in each of the above patent documents is opened. It is difficult to adopt the mounting technology. In Patent Document 1, as described above, it is effective to reduce the thickness. However, since a region for forming connection bumps and a region for forming a frame-shaped insulating resin layer are provided on the chip, the chip itself is increased in size. End up. In Patent Document 1, it is possible to mount a chip in a region substantially equal to the external dimension on the mounting substrate, but due to the increase in size of this chip, it cannot contribute so much to downsizing of the entire module. .

  SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a functional element package that seals a functional element body so that stable operation can be performed, and that achieves a reduction in size and thickness and efficiency of a mounting process, and a method for manufacturing the functional element package. .

  The functional element package according to the present invention that achieves the above-described object includes a package substrate, a functional element body, an adhesive resin frame layer, and an insulating plate. In the functional element package, a package substrate forms a large number of external connection electrodes arranged in a frame-like region on the first main surface of a substrate made of, for example, a silicon substrate or a glass substrate, and these external electrodes A region surrounded by the connection electrodes is configured as a functional element body mounting region for mounting the functional element body. In the functional element package, the functional element body is, for example, a microelectromechanical component, a piezoelectric thin film resonant element, or a surface acoustic wave element having a movable portion on the functional surface, and the functional element body mounting region is formed on the first main surface of the package substrate. In addition, the electrode is mounted and connected to the external connection electrode. The functional element package is formed on the first main surface of the package substrate with the adhesive resin frame layer having an overall frame shape straddling each external connection electrode and having a thickness larger than that of the functional element body. In the functional element package, the insulating plate is formed of an insulating material so as to have an outer shape larger than the functional element body mounting region of the package substrate, and is opposed to the first main surface with respect to the package substrate via the adhesive resin frame layer. As a result, the functional element body mounting region on which the functional element body is mounted is closed to form a hollow space portion. The functional element package is formed by penetrating up to the external connection electrodes on the insulating plate and the adhesive resin frame layer facing the external connection electrodes. An opening that faces each other, a conductor layer that is connected to each external connection electrode in each of these openings and reaches the opening, and an external provided at each opening of each of the conductor layers Connection body.

  The functional element package according to the present invention includes, for example, a microelectromechanical component, a piezoelectric thin film resonant element, or a surface acoustic wave element in a hollow space formed by being closed by an insulating plate and an adhesive resin frame layer on a package substrate. A functional element body having a movable part on a functional surface such as the above is mounted. In the functional element package, the functional element body is mounted in a hollow space part that is kept airtight, thereby suppressing the influence from the external environment and performing a stable operation. In the functional element package, an adhesive resin frame layer constituting a hollow space is formed in a frame shape over a plurality of external connection electrodes, and a conductive layer is interposed on an insulating plate facing the adhesive resin frame layer. Since a large number of external connection bodies are provided to be electrically connected to the external connection electrodes and mounted on the mounting substrate or the like by the surface mounting method, the sealing portion of the functional element body and the mounting electrode section are almost The structure is formed at the same location. In the functional element package, it is almost the same shape as the functional element body, so that it can be miniaturized as a whole, and the mounting area can be narrowed to make the module smaller and thinner, and it can be mounted via an external connection body. By mounting on the substrate by the surface mounting method like other electronic components, the mounting process can be made efficient and the cost can be reduced.

  In addition, the functional element package manufacturing method according to the present invention that achieves the above-described object includes a package substrate manufacturing process, a functional element body mounting process, an adhesive resin frame layer forming process, an insulating plate bonding process, and an opening forming process. A process, a conductor layer forming process, and a conductive bump forming process. In the functional element package manufacturing method, the package substrate manufacturing process includes a plurality of external connection electrodes arranged in a frame-like region on the first main surface of a package substrate made of, for example, a silicon substrate or a glass substrate. A region surrounded by these external connection electrodes is formed as a functional element mounting region.

  In the functional element package mounting process, the functional element package manufacturing method includes an external connection in which the functional element body is die-bonded on the first main surface of the package substrate in the functional element body mounting region and the connection electrodes are opposed to each other. Connect with the electrode for mounting. A functional element body consists of a functional element body which has a movable part in functional surfaces, such as a micro electromechanical component, a piezoelectric thin film resonance element, or a surface acoustic wave element, for example. When the functional element body is a micro-electromechanical component, the functional element body mounting step leaves the sacrificial resin layer provided to seal and protect the movable part such as the movable electrode, Mount in the body mounting area. The sacrificial resin layer is removed from the microelectromechanical component in a subsequent process of the adhesive resin frame layer forming process.

  In the method of manufacturing a functional element package, in the adhesive resin frame layer forming step, an adhesive resin layer having a thickness larger than that of the functional element body is formed on the entire surface of the first main surface of the package substrate. On the other hand, a patterning process is performed, and an adhesive resin frame layer is formed leaving an entire frame-shaped portion straddling each external connection electrode. In the adhesive resin frame layer forming step, for example, an adhesive resin layer having a substantially uniform film thickness is formed from a photosensitive adhesive resin by a spin coating method, a printing method, or the like. In the adhesive resin frame layer forming step, for example, a photolithography process is performed on the adhesive resin layer, and patterning is performed in a frame shape across each external connection electrode to form an adhesive resin frame layer.

  In the method of manufacturing the functional element package, in the insulating plate bonding step, the insulating plate is opposed to the first main surface and bonded onto the package substrate via the adhesive resin frame layer. In the insulating plate joining process, the insulating plate has an outer shape equal to or slightly larger than that of the adhesive resin frame layer by an insulating material having heat resistance such as liquid crystal polymer and benzocyclobutene resin, moisture resistance, and gas barrier properties such as oxygen. Formed. In the insulating plate bonding step, a hollow space portion that closes the functional element mounting region is configured by the package substrate, the insulating plate, and the adhesive resin frame layer. In the insulating plate joining step, in order to configure the hollow space as a vacuum or an inert reducing atmosphere space, the insulating plate is joined in a vacuum chamber or a reducing gas bath.

  In the insulating plate joining step, a thermosetting adhesive resin having a curing temperature characteristic equal to or lower than the glass transition temperature (Tg) of the insulating plate is used as the adhesive resin for forming the above-described adhesive resin frame layer. In the insulating plate joining process, the insulating plate that is positioned and combined on the package substrate is fixed by heating the adhesive resin layer. Try to maintain a stable and airtight atmosphere.

  In the method of manufacturing the functional element package, in the opening forming process, the external connection electrodes of the insulating plate and the adhesive resin frame layer are respectively opposed to the external connection electrodes, and the external connection electrodes are respectively exposed outward. A large number of openings are formed. In the opening forming step, an opening (via hole) that reaches the external connection electrode through the insulating plate and the adhesive resin frame layer, for example, by laser irradiation or plasma irradiation from the surface of the insulating plate or by dry etching using both of them. ).

  In the method of manufacturing the functional element package, in the conductor layer forming step, a conductor layer that is connected to the external connection electrodes in each opening and reaches the opening is formed. In the conductor layer forming step, each opening is filled with a solder paste or a conductive paste by a printing method or selectively plated with a metal material such as copper, thereby penetrating the adhesive resin frame layer to the surface of the insulating plate. And vias for electrically connecting the external connection electrodes.

  In the method of manufacturing the functional element package, in the external connection body forming step, an external connection body including conductive bumps or the like for connecting to a mounting substrate or the like is provided at each opening portion of each opening of each conductor layer. In the external connector formation process, a reflow process is performed by bonding a metal ball such as solder to the conductor layer of the opening portion of each opening opened on the surface of the insulating plate, or a conductive paste or solder paste is printed. Or an external connection body is provided by a plating method or a ball bonding method. Since the external connection body forming process is performed by a so-called low temperature process together with the above-described insulating plate joining process, the thermal load on the functional element mounted in the hollow space is reduced and the reliability is improved. To be able to.

  In addition, the second functional device package manufacturing method according to the present invention that achieves the above-described object includes forming a large number of external connection electrodes arranged in a frame-like region on the first main surface. A package substrate manufacturing process in which a region surrounded by the external connection electrodes is configured as a functional element body mounting region, and the functional element body is disposed in the functional element body mounting region on the first main surface of the package substrate. The main surface of the insulating plate formed in a plate shape having an outer shape larger than the functional element body mounting region of the package substrate by an insulating material, and mounting the functional element body mounting process for connecting each electrode to the opposing external connection electrode An adhesive resin frame layer forming step for forming an adhesive resin frame layer having an overall frame shape facing the frame-shaped region straddling each external connection electrode and having a thickness larger than that of the functional element body; and a package substrate In contrast, an insulating plate joining step for forming a hollow space portion for sealing the functional element body mounting region by joining the insulating plate via the adhesive resin frame layer, and each external connection electrode of the insulating plate and the adhesive resin frame layer; An opening forming step for forming a large number of openings that reach each external connection electrode to face each outward at the respective facing portions, and are connected to the external connection electrodes that are opposed to each other in each opening A conductor layer forming step of forming a conductor layer reaching the opening portion; and an external connector forming step of providing an external connection body at the opening portion of each opening of each conductor layer.

  The second functional element package manufacturing method is characterized in that an adhesive resin frame layer is formed on the insulating plate side, and the insulating plate is combined with the insulating plate positioned on the package substrate and fixed through the adhesive resin frame layer. is there. In the method of manufacturing a functional element package, for example, when a patterning process is performed on the adhesive resin layer to form the adhesive resin frame layer, a load may be applied to the functional element body mounted in the functional element body mounting region. Therefore, in the first method for manufacturing a functional element package, the load on the functional element body is suppressed by mounting the functional element in a state of being sealed with the sacrificial resin layer as described above. In the second functional element package manufacturing method, the load on the functional element is suppressed by performing the patterning process of the adhesive resin layer on the insulating plate side in advance.

  In the adhesive resin frame layer forming step, the adhesive resin layer formed on the surface of the insulating plate facing the package substrate is subjected to patterning to form an adhesive resin frame, which has a predetermined thickness using a thermosetting insulating resin or the like. Alternatively, the adhesive resin frame material formed in a frame shape may be formed by bonding to a package substrate or an insulating plate. The adhesive resin frame material has a sheet shape and is bonded to the package substrate or the insulating plate in a semi-cured state having an adhesive force.

  According to the present invention, the functional element body mounted in the hollow space portion closed by the insulating plate and the adhesive resin frame layer on the package substrate can be stably operated with the influence from the external environment being suppressed. The improvement of the property is achieved. According to the present invention, the external connection body is provided on the insulating plate so as to face the adhesive resin frame layer formed in a frame shape over the plurality of external connection electrodes, and the sealing portion and the mounting of the functional element body Since the electrode part for the device is formed in almost the same place, the whole is almost the same shape as the functional element body, and the mounting area can be narrowed to make the module small and thin, and via the external connection body By mounting on the mounting board by the surface mounting method like other electronic components, the mounting process can be made efficient and the cost can be reduced.

  Hereinafter, a functional element package 1 shown as an embodiment of the present invention and a manufacturing method thereof will be described in detail with reference to the drawings. As shown in FIG. 1, the functional element package 1 includes a package substrate 2, a functional element body 3, an adhesive resin frame layer 4, and an insulating plate 5. The functional element package 1 is mounted on a mounting substrate 6 through a large number of conductive bumps 12 constituting an external connection body provided on an insulating plate 5, and a high-frequency circuit module mounted on, for example, a mobile phone or a personal computer is mounted on the functional element package 1. Constitute. Although the functional element package 1 is shown as a single device, it is a matter of course that the functional element package 1 is manufactured through a manufacturing process described later even in a wafer state.

  In the functional element package 1, the package substrate 2 is formed into a rectangular body having a slightly larger outer dimension than the functional element body 3 using, for example, a silicon substrate or a glass substrate, and a large number of external parts are formed on the first main surface 2a. A connection electrode 7 is formed. The package substrate 2 is formed by arranging external connection electrodes 7 in a frame shape corresponding to a large number of input / output electrodes 8 formed in the functional element body 3. In the package substrate 2, a region surrounded by each external connection electrode 7 on the first main surface 2 a is configured as a functional element body mounting region 9 on which the functional element body 3 is mounted. The package substrate 2 may be a multilayer wiring substrate in which a wiring pattern is formed on the inner layer as necessary.

  The functional element package 1 is not described in detail as the functional element body 3, but has a movable part on the functional surface 3a, for example, a SAW element (surface acoustic wave element), MEMS (micro-electromechanical component), or FBAR element (piezoelectric thin film resonant element). Etc. are mounted on the package substrate 2. The functional element body 3 is used in a so-called bare chip state in which the element is not sealed with an insulating resin, and the mounting surface 3b is die-bonded on the functional element body mounting region 9 of the package substrate 2 with the functional surface 3a facing upward. . In the functional element body 3, a large number of input / output electrodes 8 formed on the functional surface 3a are connected to the opposing external connection electrodes 7 by wires 10 by wire bonding.

  The functional element package 1 may have a structure in which the functional element body 3 is mounted on the package substrate 2 by a surface mounting method. The functional element package 1 uses, for example, a package substrate 2 in which a large number of pads drawn out from the respective external connection electrodes 7 via lead patterns are formed in the functional element body mounting region 9. The functional element package 1 uses a functional element body 3 in which a large number of input / output electrodes 8 are formed on a mounting surface 3b. The functional element package 1 is mounted in a state where the functional element body 3 is positioned with respect to the package substrate 2 provided with solder balls or the like on each external connection electrode 7 and subjected to a reflow process.

  In the functional element package 1, an adhesive resin frame layer 4 is formed on the first main surface 2 a of the package substrate 2 on which the functional element body 3 is mounted. The adhesive resin frame layer 4 is formed of, for example, a thermosetting adhesive resin having a curing temperature characteristic equal to or lower than a glass transition temperature (Tg) of an insulating plate 5 described later. The adhesive resin frame layer 4 is subjected to a photolithography process on the adhesive resin layer formed on the first main surface 2a of the package substrate 2 with a uniform thickness larger than that of the functional element body 3 over the entire surface. As shown in FIG. 1 (B), the external connection electrodes 7 are covered and formed in an overall frame shape.

  That is, the adhesive resin frame layer 4 exhibits a frame-like standing wall portion that is higher than the functional element body 3 that trims the outer peripheral portion of the functional element body mounting region 9. The adhesive resin frame layer 4 is connected to the external connection electrode 7 of the wire 10 having one end connected to the input / output electrode 8 of the functional element body 3 and the other end connected to each external connection electrode 7. Fix the site.

  In the functional element package 1, the insulating plate 5 is combined with the package substrate 2 so as to face the first main surface 2 a and bonded by the adhesive resin frame layer 4. The insulating plate 5 has conventionally used an inorganic material such as a glass material or a silicon material with low workability. However, the insulating resin material has good workability and has heat resistance, moisture resistance, and gas barrier properties such as oxygen, For example, liquid crystal polymer (LCP) or benzocyclobutene resin (BCB) is used, and is formed in a plate shape that is larger than the functional element mounting region 9 and has an outer shape substantially equal to that of the package substrate 2. The insulating plate 5 only needs to have a thickness sufficient to close the hollow space portion 11 to be described later and maintain the internal atmosphere, and is formed thinner than the package substrate 2.

  In the functional element package 1, the insulating plate 5 is bonded to the package substrate 2 by the adhesive resin frame layer 4, so that the region corresponding to the functional element body mounting region 9 is vertically moved by the package substrate 2 and the insulating plate 5. The hollow space part 11 which is closed and closed in the outer peripheral direction by the adhesive resin frame layer 4 and held in an airtight state is configured. In the functional element package 1, the functional element body 3 is mounted in the hollow space portion 11.

  The functional element package 1 is configured so that the hollow space 11 is filled with a vacuum state or a reducing gas by performing a bonding process of the insulating plate 5 to the package substrate 2 in a vacuum tank or a reducing gas tank. In the functional element package 1, the functional element body 3 mounted in a bare chip state as described above is shielded from the external environment in the hollow space 11 and held in a vacuum or reducing gas atmosphere.

  In the functional element package 1, the sealing in the hollow space portion 11 causes an inadvertent force to be applied to the exposed minute movable portion of the functional element body 3 in the process, resulting in damage. Is prevented from occurring. In the functional element package 1, for example, sticking of the movable part to the movable part of the functional element body 3 is suppressed by charging due to a temperature change, an etching solution, or the like loaded during the manufacturing process, or an influence of static electricity. Thus, the electrical characteristics are maintained and stable operation is performed. In the functional element package 1, for example, oxidation and deterioration of a movable part and the like are suppressed, and a long life is achieved.

  In the functional element package 1, a large number of conductive bumps 12 are provided on the surface along the outer peripheral portion of the insulating plate 5 so as to face the external connection electrodes 7 of the package substrate 2. It is mounted on the mounting substrate 6 via In the functional element package 1, via holes 13 are formed so as to face the external connection electrodes 7 and penetrate the adhesive resin frame layer 4 from the surface side of the insulating plate 5 to reach the external connection electrodes 7. In the functional element package 1, a conductor layer 14 is formed by filling each via hole 13 with a solder paste by, for example, a printing method. In the functional element package 1, the conductive bumps 12 are constituted by solder balls bonded to the conductor layers 14 at the opening portions of the via holes 13 opened on the surface of the insulating plate 5.

  The conductive bumps 12 are not limited to the solder balls described above, and may be formed by printing a conductive paste or solder paste on the conductive layer 14 at the opening of each via hole 13 by, for example, a screen printing method or the like. . Further, the conductive bumps 12 may be configured by electrode terminals formed by applying, for example, gold plating or the like to the conductor layer 14 at the opening portions of the respective via holes 13, or conductive balls bonded by a ball bonding method.

  The via hole 13 is formed through the insulating plate 5 and the adhesive resin frame layer 4 by laser irradiation or plasma irradiation from the surface side of the insulating plate 5 or the so-called dry etching method that simultaneously irradiates them, and is connected to each external connection. The electrode 7 is exposed to the outside. As shown in FIG. 1A, the via hole 13 is formed as a tapered hole that gradually becomes smaller in diameter in the depth direction from the opening. By forming the via hole 13 in such a tapered hole, the conductor layer 14 filled therein has an anchor function with respect to the inner peripheral wall so that the drop-off is suppressed, and a large conductive bump 12 is provided. In this way, the mounting strength of the functional element package 1 with respect to the mounting substrate 6 is improved.

  The conductive layer 14 is not limited to the filling of the solder paste by the printing method described above, and may be formed by filling the via hole 13 with the conductive paste by a similar method. The conductive layer 14 may be selectively formed in the via hole 13 by, for example, an electroless copper plating method. The conductive layer 14 is electrically connected to the external connection electrode 7 at the bottom of the via hole 13 and is connected to the conductive bump 12 on the surface of the insulating plate 5 to form a via.

  The functional device package 1 configured as described above is mounted on the mounting substrate 6 by the surface mounting method with the insulating plate 5 side as a mounting surface in the same manner as other electronic components (not shown) to constitute a high frequency module. . The functional element package 1 is assembled by aligning the conductive bumps 12 on the opposing connection lands 15 on the mounting substrate 6 side. The functional element package 1 is subjected to a reflow process in this state, whereby each conductive bump 12 is melted and solidified to be electrically and mechanically connected to the opposing connection land 15 as shown in FIG. As shown, it is mounted on a mounting substrate 6.

  As described above, the functional element package 1 has a movable portion on the functional surface 3a in the hollow space portion 11 that is kept airtight by being closed by the adhesive resin frame layer 4 and the insulating plate 5 on the package substrate 2. The functional element body 3 having is mounted. In the functional element package 1, the functional element body 3 performs a stable operation while reducing the influence of the external environment in the hollow space 11, thereby improving the reliability.

  In the functional element package 1, as described above, the adhesive resin frame layer 4 constituting the hollow space portion 11 is formed in a frame shape across the multiple external connection electrodes 7, and faces the adhesive resin frame layer 4. A large number of conductive bumps 12 are provided on the surface of the insulating plate 5 via the conductor layer 14. Therefore, the functional element package 1 has a structure in which a portion for sealing the functional element body 3 and a mounting electrode portion for mounting on the mounting substrate 6 are formed in substantially the same place, and the outer shape of the functional element body 3 is larger. Although it has a slightly larger outer shape and thickness, the overall size is much smaller and thinner than conventional functional device packages.

  Further, since the functional element package 1 is mounted on the mounting substrate 6 by the same surface mounting method as that of general electronic components and the like as described above without depending on the original mounting method, the high-frequency module mounting is performed. Streamline the process. The functional element package 1 is configured to be small and thin, and by narrowing the mounting area on the mounting substrate 6, it is possible to obtain a small and thin high-frequency module.

  The manufacturing process of the functional element package 1 configured as described above will be described with reference to FIGS. The manufacturing process of the functional element package 1 includes a manufacturing process of the package substrate 2 and a functional element body mounting process of mounting the functional element body 3 on the package substrate 2. The manufacturing process of the functional element package 1 includes an adhesive resin frame layer forming process for forming the adhesive resin frame layer 4 on the package substrate 2 and an insulating plate bonding process for bonding the insulating plate 5 to the package substrate 2. The manufacturing process of the functional element package 1 includes a via hole forming process for forming a large number of via holes 13 penetrating the insulating plate 5 and the adhesive resin frame layer 4, and a conductor layer forming process for forming a conductor layer 14 in the via holes 13. And a conductive bump forming step of forming the conductive bump 12 on each conductor layer 14.

  In the package substrate manufacturing process, the functional element package 1 is manufactured in the form of a frame by a conductive pattern forming method which is generally performed on the first main surface 2a of the package substrate 2 made of, for example, a silicon substrate or a glass substrate. A large number of external connection electrodes 7 are formed. In the package substrate manufacturing process, for example, a copper thin film layer is formed over the entire surface of the first main surface 2a by sputtering or the like, and after applying a photoresist on the copper thin film layer, a photolithographic process is performed for patterning. Then, the external connection electrode 7 is formed by removing an unnecessary copper thin film layer by a dry etching method or the like, and a region surrounded by these external connection electrodes 7 is configured as a functional element body mounting region 9.

  In the method of manufacturing the functional element package 1, the functional element body 3 is bonded to the first main surface 2 a of the package substrate 2 in the functional element body mounting region 9 in the functional element body mounting step. The functional element body mounting step is shown in FIG. 2 by connecting the input / output electrode 8 formed on the functional surface 3a of the functional element body 3 and the external connection electrode 7 facing each other by the wire 10 by the wire bonding method. Thus, the functional element body 3 is mounted on the first main surface 2 a of the package substrate 2.

  The functional element body mounting step is not limited to the wire bonding method described above, and the functional element body 3 may be mounted on the functional element body mounting region 9 of the package substrate 2 by another appropriate method. The functional element body mounting step is generally adopted as a conventional method for mounting a semiconductor chip or the like on the functional element body mounting region 9 in which a large number of pads for connection respectively connected to the external connection electrodes 7 are formed. For example, the functional element body 3 may be mounted by a surface mounting method such as a reflow soldering method, a flip chip bonding method, a TAB (Tape Automated Bonding) method or a beam lead bonding method.

  When the functional element package 1 is, for example, the MEMS switch 20 shown in FIG. 3 constituting an antenna switch as the functional element body 3, the sacrificial layer 21 removed from the MEMS switch 20 in the manufacturing process is left. It is mounted on the functional element body mounting area 9. In the MEMS switch 20, a first fixed contact 23, a second fixed contact 24, and a third fixed contact 25 are generally formed on a substrate 22. In the MEMS switch 20, the movable contact piece 26 having a small beam shape is cantilevered by the first fixed contact 23, and the free end side is opposed to the third fixed contact 25 via the second fixed contact 24.

  The MEMS switch 20 is provided with a capacitive contact 27 facing the second fixed contact 24 in the middle of the movable contact piece 26. When a drive voltage is supplied to the first fixed contact 23 and the second fixed contact 24, the MEMS switch 20 causes the movable contact piece 26 to move to the first due to the capacitance generated between the second fixed contact 24 and the capacitive contact 27. The second fixed contact 24 is driven, and the free end comes into contact with the third fixed contact 25. Note that the MEMS switch 20 described above is a representative example and is not limited to such a configuration. When the MEMS switch 20 is formed on the above-described package substrate 2, the package substrate 2 constitutes the substrate 22.

  In the MEMS switch 20, a sacrificial layer 21 made of an insulating resin having a predetermined thickness is formed on each fixed contact in order to form a movable contact piece 26 that is opposed to each fixed contact. In the MEMS switch 20, the movable contact piece 26 is formed through processes such as performing a patterning process on the sacrificial layer 21, further forming a metal layer, and performing a predetermined etching process on the metal layer. In the MEMS switch 20, the sacrificial layer 21 remaining between the fixed contacts after the movable contact piece 26 is formed is removed by an etching method or the like. The MEMS switch 20 includes the minute movable contact piece 26 facing each fixed contact as described above, and performs a switch operation by a slight change in capacitance. The MEMS switch 20 generally protects the movable contact piece 26 and other parts and is sealed with the above-described contact structure with a silicon cover so as not to be affected by the external environment.

  In the manufacturing method of the functional element package 1, the sacrificial layer 21 described above with respect to the MEMS switch 20 is focused, and the sacrificial layer 21 is left and mounted on the mounting substrate 6 or the like without a silicon cover. May be. In the method of manufacturing the functional element package 1, the adhesive resin frame layer 4 is formed by preventing the movable contact piece 26 from being deformed or damaged while leaving the sacrificial layer 21 until the adhesive resin frame layer forming step described later. In the state, the sacrificial layer 21 is removed. In the manufacturing method of the functional element package 1, the mounting area is narrowed by mounting the MEMS switch 20 on the mounting substrate 6 in a bare chip state, and between the mounting process on the package substrate 2 and the adhesive resin frame layer forming process. In this manner, the MEMS switch 20 is prevented from being damaged. In addition, the manufacturing method of the functional element package 1 may be such that another functional element body in which a sacrificial layer is similarly formed is mounted with the sacrificial layer remaining and subjected to an adhesive resin frame layer forming step. Good.

  In the adhesive resin frame layer forming step, the adhesive resin layer 16 is formed with a uniform thickness on the first main surface 2a of the package substrate 2 on which the functional element body 3 is mounted as shown in FIG. In the adhesive resin frame layer forming step, a photosensitive curable adhesive resin is applied on the package substrate 2 in an uncured state by a spin coat method, a printing method, or the like, and has a thickness larger than the thickness of the functional element body 3. Layer 16 is formed. The adhesive resin layer 16 is formed with a thickness of 3 μm to 10 μm, although the thickness varies somewhat depending on the thickness of the functional element body 3. As the adhesive resin, a thermosetting adhesive resin having a curing temperature characteristic equal to or lower than the glass transition temperature (Tg) of the insulating plate 5 is used.

  The adhesive resin frame layer forming step is a photolithography process in which a photosensitive process is performed in a state where a predetermined pattern is masked on the adhesive resin layer 16, and the adhesive resin layer 16 in unnecessary portions is removed by etching. Applied. In the adhesive resin frame layer forming step, as shown in FIG. 5, the adhesive resin layer 16 is left in a frame shape across the external connection electrodes 7, and the adhesive resin frame layer is formed on the first main surface 2 a of the package substrate 2. Layer 4 is formed. In the adhesive resin frame layer forming step, when the functional element body 3 is mounted with the sacrificial layer 21 left as described above, the sacrificial layer 21 is removed together with the unnecessary adhesive resin layer 16.

  The adhesive resin frame layer forming step is not limited to the step of forming the adhesive resin frame layer 4 by performing the patterning process on the adhesive resin layer 16 formed on the package substrate 2 as described above. In the adhesive resin frame layer forming step, for example, a resin film material that is formed in a predetermined frame shape and that maintains adhesiveness in an uncured state may be used. As the resin film material, for example, an anisotropic conductive film (ACF) used in a semiconductor chip manufacturing process or the like is used. The adhesive resin frame member is bonded to the first main surface 2a of the package substrate 2 in a semi-cured state so as to cover each external connection electrode 7.

  In the manufacturing method of the functional element package 1, the insulating plate 5 is positioned and combined with the first main surface 2a by the insulating plate bonding step, and the package substrate 2 is bonded via the adhesive resin frame layer 16 as shown in FIG. Join on top. The insulating plate joining step is performed in a vacuum tank or a reducing gas tank, and the hollow space portion 11 is configured as a space portion in a vacuum or an inert reducing atmosphere. In the insulating plate joining step, for example, a heat pressing device that performs a heat pressing process on the insulating plate 5 in a state where the intermediate body that has undergone the adhesive resin frame layer forming step is placed on the bed is used.

  In the insulating plate joining step, the head of the heating and pressing device is applied from the surface side of the insulating plate 5 to the outer peripheral portion facing the adhesive resin frame layer 16 and the temperature of the head is set to be equal to or higher than the curing temperature of the adhesive resin. Then, a heating and pressing operation is performed on the intermediate. In the insulating plate bonding step, the adhesive resin frame layer 16 is cured and the insulating plate 5 is bonded onto the package substrate 2. In the insulating plate joining step, as described above, the adhesive resin frame layer 16 is formed of a thermosetting adhesive resin having a curing temperature characteristic equal to or lower than the glass transition temperature (Tg) of the insulating plate 5, thereby insulating by the heat pressing process. The deformation and dimensional change of the plate 5 are suppressed and the hollow space portion 11 is maintained in a stable airtight atmosphere.

  In the method of manufacturing the functional element package 1, in the via hole forming step, the external connection electrodes 7 as shown in FIG. 7 are provided at portions facing the external connection electrodes 7 of the insulating plate 5 and the adhesive resin frame layer 4. A large number of via holes 13 are formed so as to reach the outside. The via hole forming step penetrates the insulating plate 5 and the adhesive resin frame layer 4 from the surface side of the insulating plate 5 to the portion facing the external connection electrode 7 by laser irradiation, plasma irradiation or a dry etching method using these in combination, By drilling with the external connection electrode 7 as a stopper, a via hole 13 reaching the external connection electrode 7 is formed. In the via hole forming step, when the functional element package 1 has the relatively large external connection electrode 7, the via hole 13 can be formed by drilling with a drill, for example.

  In the method of manufacturing the functional element package 1, in the conductor layer forming step, as shown in FIG. 8, each of the via holes 13 is connected to the corresponding external connection electrode 7 at the bottom and reaches the opening portion of the insulating plate 5. The conductor layer 14 is formed. In the conductor layer forming step, the desmear process is performed on each via hole 13 drilled in the via hole forming step, and then the via hole 13 is filled with a solder paste or a conductive paste by a printing method to form the conductor layer 14. . In the conductor layer forming step, the conductor layer 14 may be formed by selectively plating a metal material such as copper by an electroless plating process, for example.

  In the conductor layer forming step, as shown in FIG. 8A, for example, copper electroless plating is selectively applied to the surface of the conductor layer 14 on the surface portion of the insulating plate 5 to form a lid 17 made of a copper layer. Then, vias 18 are formed for electrically connecting the external connection electrodes 7 to the surface of the insulating plate 5. In the conductor layer forming step, each lid 17 is further subjected to, for example, nickel-gold plating to form an electrode.

  In the method of manufacturing the functional element package 1, in the conductive bump forming step, the connection lands 15 on the mounting substrate 6 side are respectively formed on the electrodes formed in the respective opening portions opened on the surface of the insulating plate 5 of the respective conductor layers 14. Conductive bumps 12 are formed that are soldered together. In the conductive bump forming step, for example, solder balls are supplied in a state where a conductive paste or the like is applied on the electrode of each conductor layer 14. In the conductive bump forming step, a reflow process is performed, and each solder ball is melted and combined with the conductor layer 14 to complete the functional element package 1 shown in FIG.

  In the conductive bump forming step, not only the above-described solder ball but also a conductive pace or a solder paste may be formed by a printing method. Moreover, in the manufacturing method of the functional element package 1, it is possible to omit the step of forming the conductive bumps 12 by forming electrodes on each conductor layer 14 described above. The functional element package 1 is mounted by performing a reflow process on the mounting substrate 6 in which the solder balls are bonded to the connection lands 15.

  In the method of manufacturing the functional element package 1, the conductive bump forming process is performed by a so-called low temperature process together with the above-described insulating plate joining process, so that the thermal load applied to the functional element body 3 mounted in the hollow space 11 is reduced. The functional element package 1 which is reduced to improve the reliability is manufactured. In the method of manufacturing the functional element package 1, the adhesive resin frame layer 16 is formed of an adhesive resin having a curing temperature characteristic equal to or lower than the glass transition temperature (Tg) of the insulating plate 5. Generation | occurrence | production of a deformation | transformation and a dimensional change is suppressed, the hollow space part 11 is hold | maintained in the stable airtight atmosphere, and the improvement of a yield is achieved.

  In the manufacturing method of the functional element package 1, the adhesive element frame layer 4 that constitutes the hollow space portion 11 that seals the functional element body 3 is opposed to the position directly above the external connection electrode 7 formed on the package substrate 2. Thus, the functional element package 1 in which the conductive bumps 12 are formed on the surface of the insulating plate 5 is manufactured. In the method of manufacturing the functional element package 1, the functional element package 1 having an outer shape and a thickness slightly larger than the outer shape of the functional element body 3 as a whole and making the high-frequency circuit module small and thin is efficiently manufactured.

  The functional device package 1 can be manufactured not only by the manufacturing method described above but also by the second manufacturing method shown in FIGS. The second manufacturing method includes a step of forming an adhesive resin frame layer 31 in advance on the insulating plate 30 side, and the insulating plate 30 is bonded to the package substrate 2 on which the functional element body 3 is mounted. To do. In the second manufacturing method, the package substrate manufacturing process, the functional element body mounting process, the via hole forming process, the conductor layer forming process, and the conductive bump forming process are the same as the first manufacturing method described above, and thus the description thereof is omitted. To do.

  In the first manufacturing method of the functional element package 1 described above, when the adhesive resin frame layer 4 is formed by performing the patterning process on the adhesive resin layer 16 formed on the package substrate 2, the functional element package 1 is mounted on the functional element body mounting region 9. In some cases, a load is applied to the functional element body 3 formed. In the first manufacturing method, the sacrificial layer 21 is formed after the formation process of the adhesive resin layer 16 and the patterning process of the adhesive resin frame layer 4 while leaving the sacrificial layer 21 that seals the movable portion in the functional element body 3. By adopting the removal process, the yield and productivity are improved. Therefore, in the first manufacturing method, the functional element body 3 having a special form in which the sacrificial layer 21 is left is used.

  In the second manufacturing method of the functional element package 1, even if the functional element body 3 that does not have the sacrificial layer 21 in a general supply form is used for the user, the load on the functional element body 3 is suppressed and the yield or Improve productivity. The second manufacturing method includes an adhesive resin layer forming step for forming the adhesive resin layer 32 on the insulating plate 30 and an adhesive for forming a whole frame-shaped adhesive resin frame layer 31 by performing a predetermined patterning process on the adhesive resin layer 32. A resin frame layer forming step and an insulating plate bonding step for bonding the insulating plate 30 to the package substrate 2 are included.

  The insulating plate 30 is made of a plate member formed in the same manner as the insulating plate 5 described above, and is made of a liquid crystal polymer (LCP) or benzocyclobutene resin (BCB) material as shown in FIG. It is formed in a plate shape having an outer shape that is substantially larger than that of the package substrate 2. A large number of external connection electrodes 7 are arranged in a frame shape on the package substrate 2, and a region surrounded by these external connection electrodes 7 constitutes a functional element body mounting region 9 to form a functional element. The body 3 is mounted.

  In the second manufacturing method, in the adhesive resin layer forming step, the adhesive resin layer 32 is formed on the bonding surface 30a of the insulating plate 30 facing the package substrate 2 as shown in FIG. Similarly to the adhesive resin layer 16 described above, the adhesive resin layer 32 is also formed by applying an uncured photosensitive curable adhesive resin on the insulating plate 30 with a uniform thickness by a spin coating method or a printing method, The functional element body 3 has a thickness larger than that of the functional element body 3. Of course, a thermosetting adhesive resin having a curing temperature characteristic equal to or lower than the glass transition temperature (Tg) of the insulating plate 30 is used as the adhesive resin.

  In the second manufacturing method, in the step of forming the adhesive resin frame layer, a photosensitive process is performed in a state where a predetermined pattern is masked on the adhesive resin layer 32, and an unnecessary portion of the adhesive resin layer 32 is removed by etching. Photolithographic processing for performing the process is performed. In the adhesive resin frame layer forming step, as shown in FIG. 11, the adhesive resin layer 32 is left in a frame shape along the outer peripheral portion of the insulating plate 30 to form the adhesive resin frame layer 31. The adhesive resin frame layer 31 is also formed on the bonding surface 30 a of the insulating plate 30 so as to cover the external connection electrodes 7 on the package substrate 2 side and to have an overall frame shape sufficient to straddle them.

  In the second manufacturing method, in the insulating plate joining step, the insulating plate 30 on which the adhesive resin frame layer 31 is formed through the above-described adhesive resin frame layer forming step is joined to the package substrate 2. In the insulating plate joining step, the insulating plate 30 is positioned and combined with the package substrate 2 so as to oppose the first main surface 2a, and is pressed and pressed by a heat pressing device, thereby forming an adhesive resin frame as shown in FIG. Bonding is performed on the package substrate 2 through the layer 31. Also in the second manufacturing method, the insulating plate joining step is performed in a vacuum tank or a reducing gas tank, and the hollow space portion 11 is configured as a space portion in a vacuum or an inert reducing atmosphere.

  In the insulating plate joining step, the head of the heating and pressing device is applied from the surface side of the insulating plate 30 to the outer peripheral portion facing the adhesive resin frame layer 31, and the temperature of the head is set to be equal to or higher than the curing temperature of the adhesive resin. Then, a heating and pressing operation is performed on the intermediate. In the insulating plate bonding step, the adhesive resin frame layer 31 is cured and the insulating plate 30 is bonded onto the package substrate 2. In the insulating plate joining step, the adhesive resin frame layer 31 is formed of a thermosetting adhesive resin having a curing temperature characteristic equal to or lower than the glass transition temperature (Tg) of the insulating plate 30, so that the insulating plate 30 can be deformed by the heat pressing process. The occurrence of dimensional change is suppressed, and the hollow space 11 is maintained in a stable airtight atmosphere.

  In the second manufacturing method, as in the first manufacturing method described above, via holes 13 that form the via holes 13 reaching the external connection electrodes 7 from the surface side of the insulating plate 30 to the corresponding portions with the adhesive resin frame layer 31 are formed. The functional element package 1 is manufactured by performing a process, a conductive layer forming process for forming the conductive layer 14 filled in the via hole 13, and a conductive bump forming process for forming the conductive bump 12 for external connection on each conductive layer 14. To do.

  In the second manufacturing method of the functional element package 1, since the adhesive resin frame layer 31 is formed on the insulating plate 30 side as described above, the bare functional element body 3 mounted on the package substrate 2 side is provided. Thus, no load is applied to the movable part or the like in the process of forming the insulating resin layer 32 or the patterning process. In the second manufacturing method, breakage, deformation or sticking of minute movable parts of the functional element body 3 is reliably prevented.

  The adhesive resin frame layer 31 is formed by forming an insulating resin layer 32 on the insulating plate 30 and performing patterning into a frame shape by performing a photolithography process, but for example, an insulating resin body formed in a frame shape is used. It may be formed by bonding.

The high-frequency circuit module which mounts the functional element package concerning this invention is shown, The figure (A) is a principal part longitudinal cross-sectional view, The figure (B) is a principal part top view. It is manufacturing process explanatory drawing of a functional element package, and shows the package board | substrate which mounted the functional element body through the functional element body mounting process, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. It is a longitudinal cross-sectional view of the MEMS switch shown as a functional element body. It is a longitudinal cross-sectional view of the package substrate which passed through the insulating resin layer formation process. The package substrate which passed the insulating resin frame layer formation process is shown, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. The intermediate body which passed the insulating plate joining process is shown, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. The intermediate body which passed the via-hole formation process is shown, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. The intermediate body which passed the conductor layer formation process is shown, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. It is 2nd manufacturing process explanatory drawing of a functional element package, The figure (A) is a longitudinal cross-sectional view of an insulating plate, The figure (B) is a top view. It is a longitudinal cross-sectional view of the insulating plate which passed through the insulating resin layer formation process. The insulating plate which passed the insulating resin frame layer formation process is shown, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. The intermediate body which passed the insulating plate joining process is shown, The figure (A) is a longitudinal cross-sectional view, The figure (B) is a top view. It is a longitudinal cross-sectional view of the conventional functional element package.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Functional element package, 2 Package board, 3 Functional element body, 4 Adhesive resin frame layer, 5 Insulating plate, 6 Mounting board, 7 External connection electrode, 8 Input / output electrode, 9 Functional element body mounting area, 11 Hollow space part , 12 Conductive bump, 13 Via hole, 14 Conductor layer, 16 Connection resin layer, 18 Via, 20 MEMS switch, 21 Sacrificial layer, 6 Movable contact piece, 30 Insulating plate, 31 Adhesive resin frame layer, 32 Adhesive resin layer

Claims (14)

A large number of external connection electrodes arranged in a frame-like region are formed on the first main surface, and a region surrounded by these external connection electrodes is configured as a functional element body mounting region. A package substrate;
The external connection provided with a plurality of connection electrodes and having a movable part on a functional surface, and disposed in the functional element body mounting region on the first main surface of the package substrate and facing the connection electrodes Functional element bodies connected to the electrodes for mounting, and
While presenting an overall frame shape straddling each external connection electrode, an adhesive resin frame layer having a thickness larger than the functional element body,
Formed by an insulating material having an outer shape larger than the functional element body mounting region of the package substrate, and bonded to the package substrate opposite to the first main surface through an adhesive resin frame layer. The functional element body mounting region on which the functional element body is mounted is closed, and an insulating plate that forms an airtight hollow space portion is provided.
The insulating plate and the adhesive resin frame layer are formed so as to penetrate to the external connection electrodes at the portions facing the external connection electrodes, respectively, and the external connection electrodes are exposed to the outside. Openings, conductor layers filled in the openings and connected to the external connection electrodes and formed so as to reach the openings, and provided in the openings of the openings of the conductor layers, respectively. And a functional device package.   2. The functional element package according to claim 1, wherein the functional element body is a microelectromechanical component having a movable part on a functional surface, a piezoelectric thin film resonant element, or a surface acoustic wave element.   The functional element package according to claim 1, wherein the adhesive resin frame layer is formed on the first main surface of the package substrate across the external connection electrodes.   The said adhesive resin frame layer is formed in the opposing surface with the said 1st main surface of the said package substrate by the side of the said insulating plate facing each said external connection electrode. Functional device package.   The functional element package according to claim 1, wherein a thermosetting adhesive resin having a curing temperature equal to or lower than a glass transition temperature of the insulating plate is used for the adhesive resin frame layer.   The functional device package according to claim 1, wherein the hollow space is maintained in a vacuum or a reducing atmosphere.   2. The functional element according to claim 1, wherein the external connection body is a solder bump or a conductive bump formed of a conductive paste or a solder paste, and is connected to a connection terminal formed on a mounting substrate. package. A package substrate in which a large number of external connection electrodes arranged in a frame-like region are formed on the first main surface, and a region surrounded by each external connection electrode is configured as a functional element assembly mounting region Production process,
The package substrate is provided with a functional element body provided with a large number of connection electrodes and having a movable portion on the functional surface in the functional element body mounting region, and the connection electrodes are connected to the opposed external connection electrodes. A functional element body mounting step of mounting on the first main surface of
An adhesive resin frame having an overall frame shape extending from the adhesive resin layer to the external connection electrodes is formed on the first main surface of the package substrate. An adhesive resin frame layer forming step for forming a layer;
By bonding an insulating plate formed in a plate shape having an outer shape larger than the functional element body mounting region of the package substrate with an insulating material to the package substrate via the adhesive resin frame layer, the functional element An insulating plate joining step that constitutes a hollow space that closes the body mounting region;
Openings that form a large number of openings that reach the external connection electrodes and face each of the external connection electrodes at positions facing the external connection electrodes of the insulating plate and the adhesive resin frame layer, respectively. Forming process;
A conductor layer forming step of forming a conductor layer connected to the external connection electrodes facing each other in the openings and reaching an opening;
An external connection body forming step of providing an external connection body at each opening portion of each opening of each conductor layer. A package substrate in which a large number of external connection electrodes arranged in a frame-like region are formed on the first main surface, and a region surrounded by each external connection electrode is configured as a functional element assembly mounting region Production process,
On the first main surface of the package substrate, a functional element body mounting step of disposing a functional element body in the functional element body mounting region and connecting and mounting the external connection electrodes facing each electrode;
An overall frame facing the frame-shaped region straddling each external connection electrode on the main surface of the insulating plate formed in a plate shape having an outer shape larger than the functional element body mounting region of the package substrate by an insulating material An adhesive resin frame layer forming step for forming an adhesive resin frame layer having a shape and having a thickness larger than that of the functional element body;
An insulating plate bonding step for forming a hollow space portion for bonding the insulating plate to the package substrate via the adhesive resin frame layer to close the functional element body mounting region;
Openings that form a large number of openings that reach the external connection electrodes and face each of the external connection electrodes at positions facing the external connection electrodes of the insulating plate and the adhesive resin frame layer, respectively. Forming process;
A conductor layer forming step of forming a conductor layer connected to the external connection electrodes facing each other in the openings and reaching an opening;
An external connection body forming step of providing an external connection body at each opening portion of each opening of each conductor layer.   10. The method of manufacturing a functional element package according to claim 8, wherein the functional element body is a microelectromechanical component having a movable part, a piezoelectric thin film resonant element, or a surface acoustic wave element.   The method for manufacturing a functional element package according to claim 8 or 9, wherein a thermosetting adhesive resin having a curing temperature equal to or lower than a glass transition temperature of the insulating plate is used for the adhesive resin layer.   10. The method for manufacturing a functional element package according to claim 8, wherein the insulating plate bonding step is performed in a vacuum or a reducing atmosphere. The functional element body is a micro-electromechanical component mounted in the functional element body mounting region with the movable part sealed with a sacrificial resin layer,
The method for manufacturing a functional element package according to claim 8 or 9, wherein the sacrificial resin layer is removed in a subsequent step of the adhesive resin frame layer forming step.   The external connection body is a solder bump or a conductive bump formed of a conductive paste or a solder paste, and the functional element package is surface-mounted on the mounting board by being connected to a connection terminal formed on the mounting board. The method of manufacturing a functional element package according to claim 8 or 9, wherein the method is performed.

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