JP4543316B2 - Electronic circuit module component and manufacturing method thereof - Google Patents

Description

  The present invention is provided in various electronic devices and the like. A predetermined wiring layer, a functional element, and the like are formed in a layer of a multilayer wiring board, and a chip component is mounted and used in an interposer or the like. The present invention relates to an electronic circuit module component which is intended to be mounted with a density and the like and a manufacturing method thereof.

  Various electronic devices have been reduced in size and weight, or have been multifunctional and highly functional. To achieve this, electronic circuit components have been miniaturized, thinned, and lightweight along with increased functionality and combination. Or high-density mounting. In electronic devices and the like, electronic circuit components are formed into modules by forming predetermined wiring layers and functional elements in the layers of a multilayer wiring board and mounting chip components, and flipping them against an interposer, mother board, etc. It is mounted with space saving by surface mounting technology such as chip mounting method.

For example, in a high-frequency electronic circuit component provided in a mobile phone or the like, a chip mounting recess is formed in a multilayer wiring board in which passive elements such as a capacitor element, an inductor element or a resistance element are formed in a wiring layer, and the chip mounting recess A high-frequency module component configured by mounting a semiconductor chip having a predetermined function is used. Such electronic circuit module components are disclosed in, for example, Patent Document 1 and Patent Document 2.
Japanese Patent Laid-Open No. 11-191605 Japanese Patent Laid-Open No. 2004-146818

  By the way, in the above-described conventional electronic circuit module component, the chip component loaded in the chip mounting recess of the multilayer wiring board is wired to the opposing connection terminals in which a large number of terminal electrodes are formed on the multilayer wiring substrate side. It was connected by the bonding method. In Patent Document 1, a connection terminal is formed on the bottom surface of the chip mounting recess, and wire bonding between the connection terminal and the terminal electrode of the chip component is performed in the chip mounting recess. In Patent Document 2, a connection terminal is formed along the opening edge of the chip mounting recess, and wire bonding between the connection terminal and the terminal electrode of the chip component is performed on the surface of the multilayer wiring board.

  In an electronic circuit module component, a so-called surface on which a chip component is mounted by forming a large number of connection terminals corresponding to each terminal electrode in a mounting region of the chip component, and providing solder bumps or the like on the connection terminals in advance. An implementation method is also adopted. The electronic circuit module component can be so-called chip-sized by directly mounting the chip component on a connection terminal formed on the main surface of the electronic circuit module component by a surface mounting method such as a flip chip method.

  The electronic circuit module component 100 shown in FIG. 6 and FIG. 7 is miniaturized by mounting the bare chip 102 on the multilayer wiring board 101 by the surface mounting method with respect to the wire bonding method described above. The electronic circuit module component 100 includes a multilayer wiring board 101 in which wiring layers are formed in multiple layers, and a bare chip 102 mounted on the multilayer wiring board 101. The module part which has a function is comprised.

The electronic circuit module component 100 is formed by laminating a number of wiring sheet bodies in which a multilayer wiring substrate 101 is formed with an appropriate wiring layer whose details are omitted on, for example, a sheet-like ceramic base material. The multilayer wiring board 101 includes a bare chip 102 on one main surface 101 a of the wiring board 101.
A chip mounting recess 103 having an opening dimension slightly larger than the outer dimension and a depth dimension slightly larger than the thickness of the bare chip 102 is formed. In the chip mounting recess 103, although not described in detail, a large number of connection terminals connected to the wiring layer as appropriate are formed on the bottom surface.

  The bare chip 102 is a chip body in which the chip element is not sealed with an insulating resin material as is well known, and a large number of terminal electrodes composed of input terminals, output terminals, etc. are appropriately provided on one main surface although details are omitted. It is arranged and formed. The bare chip 102 is loaded into the chip mounting recess 103 of the multilayer wiring board 101 described above with the terminal formation surface as the mounting surface.

  In the electronic circuit module component 100, solder bumps are bonded in advance to the respective connection terminals formed in the chip mounting recesses 103 of the multilayer wiring board 101, and the bare chip 102 faces the connection terminals facing each terminal electrode. And loaded into the chip mounting recess 103. In the electronic circuit module component 100, for example, reflow soldering or the like is performed to melt and harden each solder bump, thereby soldering the connecting terminal and the terminal electrode facing each other, thereby forming the chip mounting recess of the multilayer wiring board 101. A bare chip 102 is mounted in 103.

  In the electronic circuit module component 100, in order to fix the bare chip 102 in the chip mounting recess 103 and to protect the joint portion between the bare chip 102 or the connection terminal and the terminal electrode, a resin filling device is provided in the chip mounting recess 103. The insulating resin material 104 is formed by filling the insulating resin material from the dispenser. In the electronic circuit module component 100, a large number of mounting terminals appropriately connected by wiring layers and vias are formed on the other main surface of the multilayer wiring board 101. Other chip components 105 and electronic components 106 are mounted.

  In the electronic circuit module component 100, as described above, the insulating resin body 104 is formed by filling the chip mounting recess 103 with the molten insulating resin material from the needle (nozzle) of the resin filling device with the bare chip 102 mounted. It is formed. In the electronic circuit module component 100, the insulating resin material enters between the bottom surface of the chip mounting recess 103 and the mounting surface of the bare chip 102, and cures so as to wrap around the joint portion 107 between the connection terminal and the terminal electrode. To be.

  Therefore, in the electronic circuit module component 100, as shown in FIGS. 6 and 7, a sufficient gap W is formed over the entire circumference between the inner peripheral surface of the chip mounting recess 103 and the outer peripheral surface of the bare chip 102. The insulating resin material goes around the outer periphery of the bare chip 102. Accordingly, in the electronic circuit module component 100, the size becomes slightly large due to the formation of a large gap, and positioning of the bare chip 102 in the chip mounting recess 103 is troublesome. The electronic circuit module component 100 requires an insulating resin material that fills the chip mounting recess 103 as well, and the insulating resin material spilled from the needle during the filling operation causes the surface of the bare chip 102 and the first main wiring board 101 to be filled. May sag on the surface.

  The electronic circuit module component 110 shown in FIGS. 8 and 9 has a basic configuration similar to that of the electronic circuit module component 100 described above, but the chip mounting recess 112 formed in the wiring substrate 111 has an opening dimension that is the bare chip 102. The outer dimensions of the chip are slightly larger than the outer dimensions, and the space between the inner peripheral surface and the outer peripheral surface of the bare chip 102 is narrowed to reduce the size. The electronic circuit module component 110 has a feature in that the insulating resin material is efficiently filled also between the inner peripheral surface of the chip mounting recess 112 and the outer peripheral surface of the bare chip 102 whose intervals are narrowed. Yes.

In other words, in the electronic circuit module component 110, a resin-filling guide groove 113 that opens in the main surface of the multilayer wiring substrate 111 and communicates with the chip mounting recess 112 is formed in a part of the inner wall of the chip mounting recess 112. The resin filling guide groove 113 has a semicircular arc shape having an inner diameter sufficient to fit the needle 114 of the resin filling device, for example, and is formed with a depth reaching the bottom surface of the chip mounting recess 112.

  In the electronic circuit module component 110, with the bare chip 102 mounted in the chip mounting recess 112, the needle 114 is inserted into the resin filling guide groove 113, and the molten insulating resin material is filled. In the electronic circuit module component 110, the needle 114 is inserted into the vicinity of the bottom surface of the resin-filling guide groove 113 and the insulating resin material is supplied so that the inside of the chip mounting recess 103 in which the insulating resin material is narrowed. The space between the peripheral surface and the outer peripheral surface of the bare chip 102 is filled over the entire periphery.

  In the electronic circuit module component 110, the chip mounting recess 112 having a small opening size is formed in the multilayer wiring board 111, so that the size can be reduced, and the outer peripheral surface is restricted by the inner peripheral surface, thereby mounting the chip. The bare chip 102 is accurately positioned in the recess 112.

  Incidentally, also in the electronic circuit module component 110 described above, the multilayer wiring substrate 111 and the bare chip 102 connect 40 to 50 connection terminals and terminal electrodes in the chip mounting recess 112, and accordingly the wiring substrate 111. It is necessary to form a high-density wiring layer around the chip mounting recess 112. In the electronic circuit module component 110, the resin-filled guide groove 113 is formed in the chip mounting recess 112, thereby causing a problem that the formation density of the wiring layer and the like is lowered.

  Therefore, the present invention has been proposed for the purpose of providing an electronic circuit module component and a method for manufacturing the same that enable efficient filling of an insulating resin material and high-density wiring. .

  An electronic circuit module component according to the present invention that achieves the above-described object is provided with a multilayer wiring board having an opening in a first main surface and forming a chip mounting recess, and being loaded into the chip mounting recess and mounted on the multilayer wiring board. The chip component is constituted by an insulating resin material that is formed by curing an insulating resin material filled in the chip mounting recess and seals the chip component in the chip mounting recess. The electronic circuit module component is formed with a resin filling guide groove having a height from the first main surface to an intermediate position in the depth direction on the inner wall portion of the chip mounting recess, and is inserted through the opening of the resin filling guide groove. Then, an insulating resin body is formed by the insulating resin material supplied from the needle of the resin filling device facing the chip mounting recess.

  In the electronic circuit module component, the needle of the resin filling device is inserted into the resin filling guide groove in a state where the chip component is loaded in the chip mounting recess and mounted by connecting the opposing connection terminal and the terminal electrode. The insulating resin material in a molten state is inserted and filled. In the electronic circuit module component, the insulating resin material is filled into the chip mounting recess through the resin filling guide groove and hardened to fix and protect the chip component in the chip mounting recess. In the electronic circuit module component, the insulating resin material penetrates and hardens in a very narrow gap between the bottom surface of the chip mounting recess and the mounting surface of the chip component by capillary action, so that the connection terminal and the terminal electrode Fix and protect the joints of

In an electronic circuit module component, even if the chip mounting recess is formed with an opening size substantially equal to the outer dimension of the chip component, an insulating resin body is formed over the entire chip mounting recess, so that the chip component, the connection terminal, and the terminal electrode are formed. The joint part and the like are protected, and the size can be reduced. In the electronic circuit module component, by forming the resin filling guide groove shallower than the depth of the chip mounting recess, a wiring layer is obtained by securing a space in the thickness direction in the inner layer of the multilayer wiring board corresponding to the resin filling guide groove. By forming, high-density wiring can be achieved.

  Moreover, the manufacturing method of the electronic circuit module component concerning this invention which achieves the objective mentioned above has a multilayer wiring board manufacturing process, a chip component mounting process, and a chip component sealing process. In the manufacturing method of the electronic circuit module component, the multilayer wiring board manufacturing process includes a step of forming a chip mounting recess opening in the first main surface of the multilayer wiring board, and an opening in the first main surface in the inner wall portion of the chip mounting recess. Forming a resin-filling guide groove having a height up to an intermediate position in the depth direction. In the manufacturing method of the electronic circuit module component, the chip component mounting step is performed by loading the chip component in the chip mounting recess and connecting the opposing connection terminal and the terminal electrode. The method of manufacturing an electronic circuit module component includes an insulating resin material in a chip mounting recess from a needle of a resin filling device in which a chip component sealing step is inserted through an opening of a resin filling guide groove and faces into a chip mounting recess. And the chip component is sealed in the chip mounting recess by an insulating resin material that cures after a predetermined curing time.

  In the method for manufacturing an electronic circuit module component, a chip component is loaded into the chip mounting recess of the multilayer wiring board formed by the multilayer wiring substrate manufacturing process, and the connection terminal and the terminal electrode facing each other are loaded in the chip component mounting process. The chip component is inserted into the chip mounting recess by connecting and mounting, and in the chip component sealing process, by inserting the resin filling device needle into the resin filling guide groove, filling the molten insulating resin material, and curing it. Manufactures an electronic circuit module component fixed and protected by an insulating resin body. In the method of manufacturing an electronic circuit module component, the insulating resin material penetrates and hardens even in a very narrow gap between the bottom surface of the chip mounting recess and the mounting surface of the chip component, so that the connection terminal and An electronic circuit component in which a joint portion with a terminal electrode is fixed and protected is manufactured.

  In the method of manufacturing an electronic circuit module component, the chip mounting recess is formed with an opening dimension substantially equal to the outer dimension of the chip component, and an insulating resin body is formed over the entire chip mounting recess, so that the chip component and the connection terminals and terminals The electronic circuit module component is manufactured in a miniaturized manner in which the joint portion with the electrode is fixed and protected. In the electronic circuit module component manufacturing method, by forming the resin filling guide groove shallower than the depth of the chip mounting recess, a space in the thickness direction is secured in the inner layer of the multilayer wiring board corresponding to the resin filling guide groove. Thus, an electronic circuit module component having a high density wiring is formed by forming a wiring layer.

  According to the present invention configured as described above, the opening size of the chip mounting recess is made substantially the same as the outer size of the chip component, so that the size can be reduced and the chip component or the connection terminal and the terminal electrode can be joined. It is possible to obtain an electronic circuit module component in which a part or the like is securely fixed and protected by an insulating resin body. According to the present invention, it is possible to obtain an electronic circuit module component in which a wiring layer is formed on the inner layer of the multilayer wiring board corresponding to the resin-filling guide groove to achieve high-density wiring.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The electronic circuit module component 1 shown in the drawings as an embodiment also has the same basic configuration as the electronic circuit module components 100 and 110 described above, and has insulating layers 3a to 3n inside as shown in FIGS. A multilayer wiring board 2 having wiring layers 4a to 4n formed in multiple layers via a chip, a bare chip 6 having a predetermined function mounted in a chip mounting recess 5 formed in the multilayer wiring board 2, and the bare chip 6 as a chip. The insulating resin body 7 is sealed in the mounting recess 5. In the electronic circuit module component 1, passive elements such as a capacitor element, an inductor element, or a resistance element are formed in the wiring layer 4 of the multilayer wiring board 2 by a thin film technique or the like. And the bare chip 4 are appropriately connected.

  In the multilayer wiring board 2, although not described in detail, a large number of vias 8 are appropriately formed through the insulating layer 3, and the wiring layers 4 are interlayer-connected through the vias 8. In the multilayer wiring board 2, chip mounting recesses 5 are formed by opening in the first main surface 2 a by, for example, photolithography and etching techniques. In the multilayer wiring board 2, a large number of first connection terminals 9 appropriately connected to the respective wiring layers 4 are formed on the bottom surface 5 a of the chip mounting recess 5 with a fine pitch. In the multilayer wiring board 2, a large number of mounting terminals 10 are formed on the first main surface 2 a, although details are omitted. In the multilayer wiring board 2, a large number of second connection terminals 11 are formed on the second main surface 2b opposite to the first main surface 2a, although details are omitted.

  As described later, the electronic circuit module component 1 has the bare chip 6 mounted in the chip mounting recess 5 by connecting the terminal electrodes 6a facing each of the first connection terminals 9 by the surface mounting method. The electronic circuit module component 1 is provided with a first main surface 2a as a mounting surface, for example, in a mobile phone or the like, by connecting each mounting terminal 10 to a facing mounting terminal by a surface mounting method, although details are omitted. It is mounted as a surface mounting component on a mounting substrate 12 such as an interposer or mother substrate.

  Although details are omitted, the electronic circuit module component 1 is mounted with other chip components 13, electronic components 14, and the like by connecting terminal electrodes facing each of the second connection terminals 11 by a surface mounting method. The The electronic circuit module component 1 is connected to an appropriate circuit in which the bare chip 6 and the passive element are formed on the mounting substrate 12 through the wiring layer 4 and the via 8, and is connected to the chip component 13 and the electronic component 14 to be a high frequency circuit or the like. The predetermined function is performed.

  Also in the electronic circuit module component 1, the multilayer wiring board 2 is formed by laminating a number of wiring sheet bodies in which appropriate wiring layers and functional elements whose details are omitted are formed on, for example, a sheet-like ceramic base material by a conductive paste. A ceramic multilayer substrate is used. Note that the multilayer wiring board 2 is not limited to such a ceramic substrate, and may be a multilayer wiring board in which the wiring layers 4 are formed in a multilayer by a conventional general printed wiring technique.

  The multilayer wiring substrate 2 can be formed not only by the photolithography technique described above after the wiring sheet body is laminated, but also by other appropriate methods. In the multilayer wiring board 2, for example, the chip mounting recess 5 may be formed by performing laser processing on the intermediate body, and the chip mounting recess 5 is formed by combining the wiring sheets having a predetermined shape. You may do it.

  The multilayer wiring board 2 has a rectangular opening having a size that allows the chip mounting recess 5 to be loaded in a state in which the bare chip 6 is fitted therein and having a depth slightly larger than the thickness of the bare chip 6. Formed as part. The multilayer wiring board 2 has an opening size such that the inner peripheral wall and the outer peripheral wall of the bare chip 6 are in a substantially contact state by combining the bare chip 6 in the chip mounting recess 5. The multilayer wiring board 2 can be reduced in size by forming the chip mounting recess 5 with an opening dimension substantially the same as the outer dimension of the bare chip 6.

  Therefore, the multilayer wiring board 2 is loaded so that the bare chip 6 is pushed into the chip mounting recess 5, and the loading operation is performed without using a positioning device or the like. The multilayer wiring board 2 is formed by mounting a bare chip 6 in a chip mounting recess 5 having an opening size limited by a surface mounting method such as a so-called chip size package (CSP) or a bare chip mounting method. Increase the density.

  The bare chip 6 is an element provided in a state where the chip element is not packaged by an insulating resin as is well known, and is formed by appropriately arranging a large number of terminal electrodes 6a on the bottom surface as shown in FIG. ing. As shown in the figure, the bare chip 6 is assembled in the chip mounting recess 5 of the multilayer wiring board 2 with the formation surface of the terminal electrode 6a as the mounting surface. In the multilayer wiring board 2, each first connection terminal 9 is arranged on the bottom surface 5 a of the chip mounting recess 5 so as to be positioned in the outer dimension region of the bare chip 6, and is opposed to the terminal electrode 6 a on the bare chip 6 side. Formed.

  In the multilayer wiring board 2, the solder bumps 15 supplied on the first connection terminals 9 are pre-bonded after being subjected to a semi-melting process, and the solder bumps 13 are connected to the first connection terminals 9 via the solder bumps 13. The terminal electrode 6a to be opposed is positioned so that the bare chip 6 is loaded into the chip mounting recess 5. The multilayer wiring board 2 is soldered to the first connecting terminals 9 and the terminal electrodes 6a as shown in FIG. 3 by soldering the solder bumps 15 by, for example, performing reflow soldering or the like to melt and harden the solder bumps 15. The bare chip 6 is mounted in the mounting recess 5.

  The multilayer wiring board 2 is provided with a resin filling guide groove 17 into which the needle 16 of the resin filling apparatus shown in FIG. 4 is inserted, although details for filling the insulating resin material into the chip mounting recess 5 are omitted. Yes. As shown in FIG. 2, the resin-filling guide groove 17 is formed of a groove in the depth direction formed in a part of the inner peripheral wall of the chip mounting recess 5 that opens in the first main surface 2 a of the multilayer wiring board 2. . The resin filling guide groove 17 is formed of a semicircular arc-shaped concave groove having an opening dimension into which the needle 16 can be inserted into the bottom part.

  As shown in FIGS. 1 and 3, the resin filling guide groove 17 is formed as a groove that is shallower than the depth dimension of the chip mounting recess 5, and its bottom surface 17 a is formed with respect to the bottom surface 5 a of the chip mounting recess 5. The step portion 18 is formed by increasing the thickness from the second main surface 2b. In the multilayer wiring board 2, a wiring layer 19 and a via 20 are also formed in the inner layer of the step portion 18 formed on the side of the chip mounting recess 5 as shown in FIG. 3.

  In the multilayer wiring board 2, the number of wirings with the bare chip 6 is extremely large, for example, 40 to 50, and a large number of wiring patterns are formed in the vicinity of the inner peripheral wall of the chip mounting recess 5. In the multilayer wiring board 2, as described above, the chip mounting recess 5 is formed with a small opening size whose opening size is substantially equal to the outer size of the bare chip 6. In the multilayer wiring board 2, by forming the wiring layer 19 and the via 20 in the inner layer of the step portion 18, it is possible to reduce the size by forming many wiring patterns in the vicinity of the inner peripheral wall of the chip mounting recess 5. It is said.

  On the multilayer wiring board 2, the bare chip 6 mounted in the chip mounting recess 5 is sealed with an insulating resin body 7. As will be described later, the insulating resin body 7 is formed by curing the insulating resin material filled in the chip mounting recess 5 from the needle 16 of the resin filling device. As the insulating resin material, for example, a thermosetting insulating resin material such as an epoxy resin is used, and the chip mounting recess 5 is filled from the needle 16 by being melted in a resin filling device. The insulating resin material penetrates and fills in a slight gap formed between the inner peripheral wall of the chip mounting recess 5 and the outer peripheral portion of the bare chip 6 by capillary action. The insulating resin material 7 constitutes the insulating resin body 7 by being baked and cured while being sufficiently filled in the chip mounting recess 5.

  The insulating resin body 7 seals the bare chip 6 in the chip mounting recess 5, thereby fixing the bare chip 6 and protecting it from an external mechanical and electrical load. The insulating resin body 7 penetrates between the bottom surface 5a of the chip mounting recess 5 and the bottom surface of the bare chip 6 and hardens the insulating resin body 7 so that a soldered portion between the first connection terminal 9 and the terminal electrode 6a is formed. Enclose and protect.

  The electronic circuit module component 1 is mounted on the mounting substrate 12 by a surface mounting method using the first main surface 2a of the multilayer wiring board 2 as a mounting surface. On the multilayer wiring board 2, a large number of mounting terminals 10 are formed on the first main surface 2 a surrounding the opening of the chip mounting recess 5 as described above. As shown in FIG. 3, the multilayer wiring board 2 is combined with the mounting board 12 by aligning the mounting terminals 10 with the opposing connection terminals 21. The multilayer wiring board 2 is mounted on the mounting substrate 12 by connecting the mounting terminals 10 and the connection terminals 21 by solder bumps 22 previously bonded to the connection terminals 21 by, for example, reflow soldering. Is done.

  In the electronic circuit module component 1, the chip component 13 and the electronic component 14 are mounted on the second main surface 2 b of the multilayer wiring board 2 by the surface mounting method as described above. In the multilayer wiring board 2, second connection terminals 11 are formed on the second main surface 2 b, and solder bumps 23 are bonded on the second connection terminals 11 in advance. The multilayer wiring board 2 is mounted with the chip component 13 and the electronic component 14 on the second main surface 2b by melting and curing the solder bumps 23, for example, by performing a reflow soldering process.

  As described above, the electronic circuit module component 1 is configured such that the bare chip 6 is sealed with the insulating resin body 7 in the chip mounting recess 5 having an opening dimension substantially equal to the outer dimension of the bare chip 6 as described above. At the same time, the joint portion between the first connection terminal 9 and the terminal electrode 6a is securely fixed and protected, thereby reducing the size and improving the reliability. In the electronic circuit module component 1, the resin filling guide groove 17 into which the needle 16 is inserted and the insulating resin material is supplied is shallower than the depth of the chip mounting recess 5 to form the step portion 18. A wiring layer 19 and a via 20 are formed by securing a space in the thickness direction in the inner layer. The electronic circuit module component 1 is miniaturized by achieving high-density wiring, particularly in the vicinity of the chip mounting recess 5 where a large number of wiring patterns are formed.

  In the manufacturing process of the electronic circuit module component 1 configured as described above, the multilayer wiring board 2 described above is manufactured by the multilayer wiring board manufacturing process. In the multilayer wiring board manufacturing process, as described above, a large number of wiring sheet bodies are stacked to manufacture an intermediate body made of a ceramic multilayer board. In the multilayer wiring board manufacturing process, the intermediate body is subjected to, for example, an etching process or a laser processing process to form a chip mounting recess forming process for forming the chip mounting recess 5 to open the first main surface 2a of the multilayer wiring board 2. The chip mounting recess 5 to be formed is formed.

  In the multilayer wiring board manufacturing process, the resin filling guide groove 17 is formed along the inner peripheral wall of the chip mounting recess 5 in the chip mounting recess forming process. In the multilayer wiring board manufacturing process, the resin filling guide groove 17 shallower than the chip mounting recess 5 is formed as described above by controlling the etching process and the laser processing.

  In the multilayer wiring board manufacturing process, a conductor portion corresponding to the first connection terminal portion 9 formed on a part of the wiring layer 4 exposed on the bottom surface 5a of the chip mounting recess 5 by performing an etching process or the like. Or a conductor corresponding to the mounting terminal 10 formed on a part of the wiring layer 4 exposed on the first main surface 2a or formed on a part of the wiring layer 4 exposed on the second main surface 2b. Terminal processing is performed on the conductor portion corresponding to the second connection terminal portion. The terminal treatment imparts solderability by, for example, applying gold plating to each conductor portion.

  In the manufacturing process of the electronic circuit module component 1, a bare chip mounting process is performed in which the bare chip 6 is loaded into the chip mounting recess 5 opened in the first main surface 2a of the multilayer wiring board 2 manufactured through the above-described processes. Is done. In the bare chip mounting step, solder bumps 15 are bonded to the first connection terminals 9 formed on the bottom surface 5 a of the chip mounting recess 5 with respect to the multilayer wiring board 2. In the bare chip mounting step, the bare chip 6 is loaded into the chip mounting recess 5 with the main surface on which the terminal electrodes 6a are formed as the mounting surface.

  In the bare chip mounting process, as described above, the external dimensions of the bare chip 6 and the opening dimensions of the chip mounting recess 5 are made substantially equal to each other, so that the positioning is not performed and the combination is performed in a state where the bare chip 6 is positioned by pushing. It is possible. Further, in the bare chip mounting step, no holding means for holding the bare chip 6 in the chip mounting recess 5 is required. In the bare chip mounting process, the bare chip 6 can be precisely assembled in the chip mounting recess 5 by simple operation and simple equipment. In the bare chip mounting step, the solder bumps 15 are melted and hardened, for example, by performing a reflow soldering process, and the first connection terminals 9 and the terminal electrodes 6a facing each other are connected and fixed.

  In the manufacturing process of the electronic circuit module component 1, a bare chip sealing process for sealing the bare chip 6 with the insulating resin body 7 in the chip mounting recess 5 is performed. In the bare chip sealing step, the needle 16 of the resin filling device is inserted from the resin filling guide groove 17 opened in the first main surface 2a of the multilayer wiring board 2 as shown in FIG. In the bare chip sealing step, a molten insulating resin material is supplied from the needle 16 facing the chip mounting recess 5 from the resin filling guide groove 17 as shown by the arrow in FIG. In the bare chip sealing step, the insulating resin material permeates between the inner peripheral wall of the chip mounting recess 5 and the outer peripheral wall of the bare chip 6 forming a slight gap.

  In the bare chip sealing step, when a predetermined amount of the insulating resin material is supplied from the needle 16, the needle 16 is removed from the resin filling guide groove 17. In the bare chip sealing step, an insulating resin material 7 is formed by curing the insulating resin material by performing a heat treatment after an appropriate time for the insulating resin material to fill between the chip mounting recess 5 and the bare chip 6. . In the bare chip sealing step, as described above, the insulating resin body 7 seals the bare chip 6 in the chip mounting recess 5 to manufacture the electronic circuit module component 1.

  In the manufacturing process of the electronic circuit module component 1, the chip component 13 and the electronic component 14 are formed on the second main surface 2 b of the multilayer wiring board 2 with respect to the electronic circuit module component 1 manufactured through the above-described steps. A mounting process is performed. In the manufacturing process of the electronic circuit module component 1, the mounting process of the electronic circuit module component 1 is performed on the mounting substrate 12.

  In the manufacturing process of the electronic circuit module component 1, the highly accurate electronic circuit module component 1 is efficiently manufactured by using almost the same processes and equipment as those in the past. In the manufacturing process of the electronic circuit module component 1, the bare chip 6 or the first connection is formed by sealing the bare chip 6 with the insulating resin body 7 in the chip mounting recess 5 having an opening dimension substantially equal to the outer dimension of the bare chip 6. The electronic circuit module component 1 is manufactured in which the joint portion between the service terminal 9 and the terminal electrode 6a is fixed and protected to reduce the size. In the manufacturing method of the electronic circuit module component 1, the resin filling guide groove 17 into which the needle 16 is inserted and supplied with the insulating resin material is shallower than the depth of the chip mounting recess 5 to form the stepped portion 18. The electronic circuit module component 1 is manufactured with a high density wiring by securing a space in the thickness direction in the inner layer of the step portion 18 and forming the wiring layer 19 and the via 20.

  In the electronic circuit module component 30 shown in FIG. 5 as the second embodiment, the chip mounting recess 32 is formed in the multilayer wiring board 31, and the bare chip 6 is sealed with the insulating resin body 7 in the chip mounting recess 32. The basic configuration is the same as that of the electronic circuit module component 1 described above. The electronic circuit module component 30 is characterized in that a resin-filled guide groove 33 is formed in a corner portion 32 a of the chip mounting recess 32.

In the electronic circuit module component 1, the bare chip 6 is mounted with the inner peripheral wall and the outer peripheral wall facing each other with respect to the chip mounting recess 32, thereby forming the chip mounting recess 32 with a minimum opening size. In the electronic circuit module component 1, although not described in detail, the mounting terminal 10 formed in the chip mounting recess 32 and connected to the terminal electrode 6 a of the bare chip 6 is connected to the inner peripheral wall of the chip mounting recess 32 in the multilayer wiring board 31. The wiring pattern is formed in a direction parallel to or orthogonal to the wiring pattern.

  Therefore, in the electronic circuit module component 1, the multilayer wiring board 31 does not need to form a wiring pattern with a very high density at a portion corresponding to the corner portion 32 a of the chip mounting recess 32. In the electronic circuit module component 1, the resin wiring guide groove 33 is formed in the corner portion 32 a as described above, whereby the multilayer wiring board 31 can form a high-density wiring pattern around the chip mounting recess 32. It becomes possible, and further miniaturization will be achieved.

  In the electronic circuit module component 1, the resin filling guide grooves 33 a and 33 b are formed in the plurality of corner portions 32 a and 32 b of the chip mounting recess 32, and the needles 16 fitted into the resin filling guide grooves 33 a and 33 b are inserted. Alternatively, the insulating resin material may be filled. In the electronic circuit module component 1, the insulating resin material is efficiently filled in the chip mounting recess 32 and the entire filling is performed.

It is a longitudinal cross-sectional view of the electronic circuit module component shown as embodiment. It is a partially notched top view of the same electronic circuit module component. It is a principal part longitudinal cross-sectional view of the same electronic circuit module component. It is explanatory drawing of the filling process of an insulating resin material. It is a horizontal sectional view of an electronic circuit module component shown as a second embodiment. It is a longitudinal cross-sectional view of the electronic circuit module component used as the premise of this invention. It is a horizontal sectional view of the electronic circuit module component. It is a longitudinal cross-sectional view of another electronic circuit module component. It is a horizontal sectional view of the electronic circuit module component.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic circuit module component 2 Multilayer wiring board 3 Insulating layer 4 Wiring layer 5 Chip mounting recessed part 6 Bare chip 7 Insulating resin body 9 1st connection terminal 10 Mounting terminal 11 2nd connection terminal 12 Mounting board 13 Chip component 14 Electronic component 15 Solder bump 16 Needle 17 Guide groove for resin filling 18 Step portion 19 Wiring layer 20 Via

Claims (10)

The multilayer wiring board having an opening in the first main surface and forming a chip mounting recess, the chip component loaded and mounted in the chip mounting recess, and the insulating resin material filled in the chip mounting recess are cured. In an electronic component that is formed by an insulating resin body that is formed by sealing the chip component in the chip mounting recess,
The multilayer wiring board has a height from the first main surface to an intermediate position in the depth direction along the inner wall portion of the chip mounting recess, and opens a needle of a resin filling device that supplies the insulating resin material Forming a resin-filled guide groove to be inserted from the portion and face the chip mounting recess,
A wiring layer is also formed in the step in the thickness direction formed between the bottom of the resin filling guide groove and the bottom of the chip mounting recess,
The chip component that is mounted in the chip mounting recess by connecting terminal electrodes opposed to a large number of connection terminals formed on the bottom surface of the chip mounting recess,
An electronic circuit module component, wherein the insulating resin material supplied from the needle inserted into the resin-filling guide groove is sealed in the chip mounting recess when cured. The multi-layer wiring board has a plurality of connection terminals corresponding to a large number of terminal electrodes formed on the mounting surface of the chip component located in the outer dimension region of the chip component on the bottom surface of the chip mounting recess. A terminal is formed, and a plurality of mounting terminals connected to each of the connection terminals and vias are formed on the second main surface facing the first main surface,
2. The electronic circuit module component according to claim 1, wherein the chip component is mounted in the chip mounting recess by a surface mounting method in which the terminal electrodes are connected to the connection terminals facing each other. 3. The chip mounting recess is formed with an opening dimension sufficient to allow the outer peripheral wall of the chip component to be loaded in a substantially contact state with the inner peripheral wall of the chip component. The electronic circuit module component described.   The chip mounting recess is formed as a substantially rectangular opening in the first main surface of the multilayer wiring board, and the resin-filling guide groove is located at any one corner of the chip mounting recess. The electronic circuit module component according to any one of claims 1 to 3, wherein the electronic circuit module component is formed. The multilayer wiring board is a ceramic in which a wiring sheet body in which appropriate wiring layers and functional elements are formed on a sheet-like ceramic base material is laminated in multiple layers, and interlayer connection is made through vias in which the wiring layers of each layer are appropriately formed The electronic circuit module component according to any one of claims 1 to 4 , wherein the electronic circuit module component comprises a multilayer wiring board. Wherein the multilayer wiring board, the first main surface surrounding the opening of the chip mounting recess, to any one of claims 1 to 5, characterized in that a plurality of mounting terminals are formed The electronic circuit module component described. The chip component is connected to an electronic component mounted via the mounting terminals formed on the second main surface of the multilayer wiring board via the via. 6 electronic circuit module component according to any one of. A step of forming a chip mounting recess opening in the first main surface of the multilayer wiring board; and a resin-filling guide groove having a height from the first main surface to an intermediate position in the depth direction on the inner wall of the chip mounting recess. Forming a wiring layer also in a step in the thickness direction formed between the bottom of the resin-filling guide groove and the bottom of the chip mounting recess, and a multilayer wiring board manufacturing process,
A chip component mounting step of loading and mounting a chip component in the chip mounting recess,
The insulating resin material is filled into the chip mounting recess from the needle of the resin filling device that is inserted through the opening of the resin filling guide groove and faces the chip mounting recess, and is cured after a predetermined curing time. And a chip component sealing step of sealing the chip component in the chip mounting recess with an insulating resin material. A large number of connection terminals are formed corresponding to the large number of terminal electrodes formed in the mounting surface of the chip component located in the region, and the respective second main surfaces opposed to the first main surface The chip component is mounted by connecting the terminal electrodes to the respective connection terminals facing each other on the multilayer wiring board on which a plurality of mounting terminals connected to the connection terminals by vias are formed. The method of manufacturing an electronic circuit module component according to claim 8 , wherein the method is performed by a surface mounting method. The multilayer wiring board manufacturing process includes a wiring sheet body forming process in which appropriate wiring layers and functional elements are formed on a sheet-like ceramic substrate, and the wiring sheet bodies are laminated in multiple layers and appropriately connected between the wiring layers. a step of fabricating a multilayer substrate having a via, electronic circuit according to claim 8 or claim 9, characterized in that a step of forming the chip mounting recess which is open to the first main surface of said multilayer substrate Manufacturing method of module parts.

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