JP2010141029A - Printed wiring board and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent a short circuit between electrodes of a chip component built into a printed wiring board. <P>SOLUTION: The printed wiring board 10 includes a chip component wiring base 20 including a wiring member 12 having an insulating resin plate 26 and a conductor circuit 28, an adhesion layer 14 provided to the wiring member 12, the chip component 16 laminated on the adhesion layer 14, and a resin sheet wiring member 18 laminated on the adhesion layer 14 and having a flexible insulating resin sheet 34 and a second conductor circuit 36; a wiring member 22 disposed oppositely to the chip component wiring base 20; and an insulating resin body 24 provided between the chip component wiring base 20 and wiring member 22. The chip component wiring base 20 includes a pair of bent portions 38a and 38b provided to the resin sheet wiring member and bent toward the wiring member 22 to insert the chip component, and the conductor circuit 36 provided to the pair of bent portions and a pair of electrodes 32a and 32b are connected with solders 40a and 40b respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a printed wiring board and a method for manufacturing the same, and more particularly to a printed wiring board in which chip components are incorporated and a method for manufacturing the same.

  2. Description of the Related Art In recent years, in portable electronic devices typified by mobile phones and digital cameras, products have been rapidly reduced in size and functionality. Along with this, parts mounted on these electronic devices are also required to be downsized, highly functional, large capacity, and the like. Also in the semiconductor package, from the above-mentioned flow, a system-in-packaging technique in which a plurality of electronic chip components such as an IC (Integrated Circuit) chip are included in one package to make a system is drawing attention.

In addition, Si wafer thinning technology has been developed from the viewpoint of thinning the package. Recently, in response to the fact that an IC can be thinned to a thickness of about 100 μm, a component-embedded substrate technology in which an IC chip or the like is embedded in a printed wiring board has attracted attention. This component-embedded substrate can have a relatively large mounting area as compared with the prior art by embedding a chip component such as an IC chip in the printed wiring board. For example, Patent Document 1 describes a circuit component built-in module in which circuit components made of electronic components are embedded.
JP 2004-103998 A

  By the way, in a printed wiring board manufactured by mounting a chip component such as an IC chip using solder and molding and laminating with an insulating resin, the printed wiring is heated by the reflow heat for mounting the chip component on the surface. In some cases, the solder that electrically connects the chip components built in the plate is remelted, and the electrodes of the built-in chip components are short-circuited.

  FIG. 8 is a cross-sectional view showing a configuration of a printed wiring board 80 incorporating a conventional chip component. A conventional printed wiring board 80 includes, for example, an insulating layer 82, an inner layer wiring layer 84 formed on one surface of the insulating layer 82, and a surface wiring layer 88 that is interlayer-connected by an inner layer wiring layer 84 and a through hole 86. And a laminated resin 90 provided between the inner wiring layer 84 and the surface wiring layer 88, and a built-in chip component 94 connected to the inner wiring layer 84 and the solder 92 and embedded in the laminated resin 90. Consists of.

  In the printed wiring board 80 in which the conventional chip component is built, a gap 96 is formed below the built-in chip component 94. Therefore, at the time of solder reflow when mounting the surface mounting chip component 98 on the surface of the printed wiring board 80, the solder 92 connecting the built-in chip component 94 is remelted, and the remelted solder 92 flows into the gap 96. The electrodes of the built-in chip component 94 may be short-circuited.

  Accordingly, an object of the present invention is to provide a printed wiring board capable of preventing a short circuit between electrodes in a built-in chip component and a method for manufacturing the same.

  A printed wiring board according to the present invention is a printed wiring board in which a chip component is incorporated, and includes a first insulating resin plate and a first conductor circuit provided on one surface of the first insulating resin plate. A first wiring member; an adhesive layer provided on the first wiring member; provided on the other surface of the first insulating resin plate; and disposed at a predetermined position of the adhesive layer; a chip component body; and the chip component A chip part having a pair of electrodes provided opposite to both ends of the main body; a flexible insulating resin sheet having flexibility; and a second formed on one surface of the flexible insulating resin sheet. A chip component wiring substrate including a conductor circuit, and a resin sheet wiring member laminated on the adhesive layer with the second conductor circuit side facing, and disposed opposite to the chip component wiring substrate, A second wiring member including two insulating resin plates; A chip component wiring base and an insulating resin material formed of an insulating resin material between the second wiring member and integrating the chip component wiring base and the second wiring member. The component wiring base is provided on the resin sheet wiring member, has a pair of bent portions that are bent toward the second wiring member and allows the chip component to pass therethrough, and the second wiring portion is provided in the pair of bent portions. The conductor circuit and the pair of electrodes of the chip component are each connected by solder.

  A method for manufacturing a printed wiring board according to the present invention is a method for manufacturing a printed wiring board with a built-in chip component, wherein a first conductor circuit is formed on one surface of a first insulating resin plate, and the first insulation is formed. An adhesive layer is laminated on the other surface of the resin plate, and a chip component having a chip component main body and a pair of electrodes provided opposite to both ends of the chip component main body is disposed at a predetermined position of the adhesive layer. Forming a first wiring substrate, forming a second conductor circuit on one surface of the flexible insulating resin sheet having flexibility, and being connected to the second conductor circuit. A resin sheet wiring base material forming step for forming a resin sheet wiring base material by forming a pair of foldable bent portions including the solder bumps, and forming the resin sheet wiring base material; The resin sheet wiring base and the adhesive layer The first wiring substrate is placed facing each other, the bent portion is bent to the opposite side of the first wiring substrate, the chip component is inserted, and each solder bump is brought into contact with each electrode of the chip component. Chip component wiring preliminary substrate assembly step for assembling the chip component wiring preliminary substrate, heating the chip component wiring preliminary substrate and reflowing the solder bumps, and providing each electrode of the chip component and the bent portion A chip component wiring substrate forming step for forming a chip component wiring substrate by soldering a second conductor circuit, and the chip component wiring substrate and a second wiring substrate including a second insulating resin plate are opposed to each other. And an insulating resin body forming step of forming an insulating resin body by filling the space between the chip component wiring base and the second wiring base material with an insulating resin material.

  In the method for manufacturing a printed wiring board according to the present invention, the resin sheet wiring base material forming step includes a first slit provided facing substantially parallel across the pair of solder bumps, and the pair of solder bumps. Preferably, the pair of bent portions are provided by forming a second slit that is provided in between and connected to the first slit provided oppositely.

  According to the printed wiring board having the above configuration and the manufacturing method thereof, the electrodes of the built-in chip components are soldered from the side, and no gap is formed on the lower surface of the chip components. Short circuit can be prevented.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a cross-sectional view showing the configuration of the printed wiring board 10. The printed wiring board 10 includes a first wiring member 12, an adhesive layer 14, a chip component 16, a chip component wiring base 20 including a resin sheet wiring member 18, a second wiring member 22, and an insulating resin body 24. And.

  The chip component wiring base 20 includes the first wiring member 12, the adhesive layer 14, the chip component 16, and the resin sheet wiring member 18.

  The first wiring member 12 includes a first insulating resin plate 26 and a first conductor circuit 28 provided on one surface of the first insulating resin plate 26. For the first insulating resin plate 26, for example, a polyimide resin film molded from a polyimide resin is used. For example, a film material having a thickness of 25 μm is used for the polyimide resin film. The synthetic resin for forming the first insulating resin plate 26 is not limited to polyimide resin, but is thermoplastic resin such as polyethylene terephthalate resin, bismaleimide triazine (BT) resin, epoxy resin, fluorine resin, phenol resin, or thermosetting. Can be used. Further, a liquid crystal polymer (LCP) or the like may be used as the synthetic resin for forming the first insulating resin plate 26. The first conductor circuit 28 is constituted by a lead wiring layer formed of, for example, a copper material or a silver material.

  The adhesive layer 14 is provided on the first wiring member 12 and is laminated on the surface of the first insulating resin plate 26 opposite to the first conductor circuit 28. For the adhesive layer 14, for example, an adhesive film formed of a thermoplastic resin or a thermosetting resin is used.

  The chip component 16 is disposed at a predetermined position on the adhesive layer 14. The chip component 16 includes a chip component main body 30 and a pair of electrodes 32 a and 32 b provided at both ends of the chip component main body 30. The chip component body 30 is formed in a substantially rectangular parallelepiped shape, for example. The pair of electrodes 32 a and 32 b are provided to face both ends that are outside the chip component body 30. The pair of electrodes 32a and 32b is provided at both ends in the longitudinal direction of the chip component body 30 formed in a substantially rectangular parallelepiped shape, for example. For the chip component 16, for example, an IC chip, a chip resistor, a chip capacitor, a chip inductor, or the like is used.

  The resin sheet wiring member 18 includes a flexible insulating resin sheet 34 having flexibility and a second conductor circuit 36 formed on one surface of the flexible insulating resin sheet 34. The flexible insulating resin sheet 34 is laminated with the second conductor circuit 36 side facing the adhesive layer 14. The flexible insulating resin sheet 34 is formed of a polyimide resin, a liquid crystal polymer (LCP), or the like and is flexible and bendable. The flexible insulating resin sheet 34 is not limited to a sheet shape, and includes an insulating resin film formed into a film shape. The second conductor circuit 36 is composed of a lead wiring layer formed of, for example, a copper material or a silver material.

  The resin sheet wiring member 18 has a pair of bent portions 38a and 38b which are bent to the opposite side to the first wiring member 12 side and form an opening through which the chip component 16 is inserted. The chip component 16 is inserted through an opening formed by bending the bent portions 38a and 38b. Since the resin sheet wiring member 18 is formed of a foldable flexible insulating resin sheet 34, the bent portions 38a and 38b can be easily bent. The second conductor circuit 36 formed in the pair of bent portions 38a and 38b and the pair of electrodes 32a and 32b provided at both ends of the chip component body 30 are electrically connected by solder 40a and 40b.

  The second wiring member 22 includes a second insulating resin plate 42 and is disposed to face the chip component wiring base 20. The second insulating resin plate 40 is formed of an insulating resin material such as polyimide resin or liquid crystal polymer (LCP), for example. The second wiring member 22 is provided with a conductor circuit composed of a lead wiring layer formed of, for example, a copper material or a silver material on the surface of the second insulating resin plate 40 opposite to the chip component wiring base 20. May be. Further, for example, a film adhesive 44 formed of a thermoplastic resin or a thermosetting resin may be provided on the chip component wiring base 20 side of the second insulating resin plate 40.

  The insulating resin body 24 is provided between the chip component wiring base 20 and the second wiring member 22 and is formed of an insulating resin material. The insulating resin body 24 has a function of sealing the chip component 16 by integrating the chip component wiring base 20 and the second wiring member 22. As the insulating resin material, a thermosetting resin such as a thermosetting polyimide resin is used.

  Next, a method for manufacturing the printed wiring board 10 will be described.

  The method for manufacturing the printed wiring board 10 includes assembling a first wiring base material forming step for forming a first wiring base material, a resin sheet wiring base material forming step for forming a resin sheet wiring base material, and a chip component wiring preliminary substrate. The chip component wiring preliminary substrate assembly step, the chip component wiring substrate molding step for molding the chip component wiring substrate, and the insulating resin body molding step for molding the insulating resin body are provided.

  In the first wiring substrate forming step, the first conductor circuit 28 is formed on one surface of the first insulating resin plate 26, the adhesive layer 14 is laminated on the other surface of the first insulating resin plate 26, and the adhesive layer 14 A step of forming the first wiring substrate 45 by disposing the chip component 16 having the chip component main body 30 and a pair of electrodes 32a and 32b provided opposite to both ends of the chip component main body 30 at predetermined positions. It is.

  FIG. 2 is a cross-sectional view showing a process of forming the first wiring substrate 45. The method of forming the first wiring substrate 45 includes a step of preparing a first laminated plate 48 in which a first conductor layer 46 is provided on one surface of the first insulating resin plate 26, and a first of the first laminated plate 48. The step of etching the conductor layer 46 to form the first conductor circuit 28, the step of laminating the adhesive layer 14 on the other surface of the first laminated plate 48, and the chip component 16 at a predetermined position of the adhesive layer 14 And a step of performing.

  As shown in FIG. 2A, the first laminated plate 48 includes a first insulating resin plate 26 and a first conductor layer 46 laminated on one surface of the first insulating resin plate 26. . For example, a single-sided copper clad plate (CCL: Copper Clad Laminate) is used for the first laminated plate 48.

  As described above, the first insulating resin plate 26 is formed of an insulating resin material such as polyimide resin or liquid crystal polymer (LCP). The first conductor layer 46 is formed on one surface of the first insulating resin plate 26 with, for example, a 9 μm thick copper layer.

  For a single-sided copper-clad plate, a single-sided copper-clad plate formed by a so-called casting method, in which a polyimide varnish is applied to a copper foil and the varnish is cured, or a conductive seed layer is sputtered onto a polyimide resin film A single-sided copper-clad plate formed by forming a copper layer on the conductive seed layer by electrolytic copper plating or the like may be used, or a rolled copper foil or electrolytic copper foil and a polyimide resin film may be used as an adhesive You may use the single-sided copper clad board bonded together and shape | molded.

  As shown in FIG. 2B, the first conductor circuit 28 is formed by etching the first conductor layer 46 of the first laminated plate 48. Etching is performed by forming an etching resist on the surface of the first conductor layer 46 by photolithography and then chemically etching the first conductor layer 46 using an etchant.

  As shown in FIG. 2C, the adhesive layer 14 is provided on the other surface of the first insulating resin plate 26 opposite to the first conductor circuit 28. The adhesive layer 14 is formed of, for example, a thermosetting film adhesive such as an epoxy resin or a thermosetting polyimide resin, or a thermoplastic film adhesive such as a thermoplastic polyimide resin film adhesive. The thickness of the adhesive layer 14 is, for example, 25 μm. The adhesive layer 14 is not limited to being formed of a resin film adhesive, and may be provided by applying a varnish-like resin liquid to the surface of the first insulating resin plate 26.

  The chip component 16 is disposed at a predetermined position of the adhesive layer 14 as shown in FIG. The chip component 16 is provided on the adhesive layer 14 using, for example, a chip mounter. The chip component 16 is disposed such that the pair of electrodes 32 a and 32 b face each other in the plate direction of the first insulating resin plate 26. When the chip component 16 is disposed on the adhesive layer 14, the chip component 16 is disposed by heating the predetermined position where the chip component 16 is mounted to increase the adhesiveness of the adhesive. Misalignment can be suppressed. Further, in order to further improve the adhesiveness between the chip component 16 and the adhesive layer 14, a flux or the like may be applied to a predetermined position where the chip component 16 is placed.

  Next, the resin sheet wiring base material forming step for forming the resin sheet wiring base material will be described.

  In the resin sheet wiring substrate forming step, the second conductor circuit 36 is formed on one surface of the flexible insulating resin sheet 34, and a pair of solder bumps connected to the second conductor circuit 36 is formed. And forming a pair of foldable bent portions 38a and 38b to form a resin sheet wiring substrate.

  3 and 4 are cross-sectional views showing a process of molding the resin sheet wiring substrate 49. FIG. The resin sheet wiring substrate forming step includes a step of preparing a second laminated plate 52 provided with a second conductor layer 50 on one surface of a flexible insulating resin sheet 34 having flexibility, and a second conductor layer. 50 includes a step of forming a second conductor circuit 36 by etching 50, a step of forming a pair of solder bumps 54a and 54b connected to the second conductor circuit 36, and the solder bumps 54a and 54b. Forming the bent portions 38a and 38b.

  As illustrated in FIG. 3A, the second laminated plate 52 includes a flexible insulating resin sheet 34 and a second conductor layer 50 laminated on one surface of the flexible insulating resin sheet 34. ing. For the second laminate 52, a foldable single-sided copper-clad film or the like is used.

  As shown in FIG. 3B, the second conductor circuit 36 is formed by etching the second conductor layer 50 of the second laminated plate 52. The second conductor circuit 36 is formed by a method similar to that of the first conductor circuit 28, for example.

  As shown in FIG. 3C, the pair of solder bumps 54a and 54b is provided on the second conductor circuit 36 side, and is connected to the lead wiring layer of the second conductor circuit 36. The pair of solder bumps 54a and 54b is formed in a substantially hemispherical shape at a predetermined position of the second conductor circuit 36 by screen-printing and reflowing solder paste or the like at predetermined intervals. The distance between the solder bump 54a and the solder bump 54b is determined based on the lateral width or the like, which is the length in the longitudinal direction from one electrode 32a to the other electrode 32b in the chip component 16.

  The pair of bent portions 38a, 38b includes the solder bumps 54a, 54b and is formed to be bendable. FIG. 4 is a diagram showing a configuration of the resin sheet wiring base material 49 in which the bent portions 38a and 38b are formed. FIG. 4 (a) is a plan view of the resin sheet wiring base material 49, and FIG. These are sectional drawings of the resin sheet wiring base material 49 in the AA direction in Fig.4 (a).

  The pair of bent portions 38a and 38b including the solder bumps 54a and 54b includes first slits 62a and 62b that are provided to face each other substantially in parallel with the pair of solder bumps 54a and 54b interposed therebetween, and the solder bump 54a and the solder bump 54b. Between the first slits 62a and 62b provided opposite to each other, and a second slit 64 that divides the solder bump 54a and the solder bump 54b is formed. For example, the second slit 64 is formed in a direction substantially orthogonal to the slit direction of the first slits 62a and 62b. Accordingly, the bent portion 38a including the solder bump 54a and the bent portion 38b including the solder bump 54b are formed so as to be bent into a substantially rectangular shape.

  The length of the first slits 62a and 62b and the width of the second slit 64 are the size of the chip component 16 so that the opening formed when the bent portions 38a and 38b are bent can be inserted into the chip component 16. It is determined based on.

  For example, the lengths of the first slits 62a and 62b are the width in the longitudinal direction from one electrode 32a to the other electrode 32b in the chip component 16, and the length of the solder bump 54a from the flexible insulating resin sheet 34. It is formed at a distance longer than the total length of the height of the solder bump 54a that is the distance to the apex and the height of the solder bump 54b that is the distance from the flexible insulating resin sheet 34 to the apex of the solder bump 54b. Further, the distance between the first slit 62 a and the first slit 62 b is longer than the depth width in the direction substantially orthogonal to the longitudinal direction of the chip component 16. Thereby, the chip component 16 can be inserted through the opening formed by bending the bent portions 38a and 38b.

  The width of the second slit 64 in the first slit direction is formed such that the height in the interlayer direction of the bent portions 38a and 38b is lower than the height of the chip component 16 when the bent portions 38a and 38b are bent. It is preferable. The first slits 62a and 62b and the second slit 64 are formed by processing the flexible insulating resin sheet 34 by, for example, mold processing, VIC processing, laser processing, drill router processing, or the like.

  Next, the chip component wiring preliminary substrate assembling step for assembling the chip component wiring preliminary substrate will be described.

  In the chip component wiring preliminary substrate assembling step, the resin sheet wiring substrate 49 and the first wiring substrate 45 are arranged facing each other with the second conductor circuit 36 side facing the adhesive layer 14, and the bent portions 38a and 38b are arranged in the first. 1 is a step of assembling a chip component wiring preliminary substrate by folding the chip component 16 through the side opposite to the wiring substrate 45 side and inserting the solder bumps 54a, 54b into the electrodes 32a, 32b of the chip component 16, respectively.

  FIG. 5 is a cross-sectional view showing a process of assembling the chip component wiring preliminary substrate 70, and FIG. 5A is a cross-sectional view showing a state in which the first wiring substrate 45 and the resin sheet wiring substrate 49 are aligned. FIG. 5B is a cross-sectional view showing a state in which the chip component wiring preliminary substrate 70 is assembled.

  The first wiring substrate 45 and the resin sheet wiring substrate 49 are aligned as shown in FIG. In the first wiring substrate 45 and the resin sheet wiring substrate 49, the chip component 16 provided on the first wiring substrate 45 and the solder bumps 54 a and 54 b provided on the resin sheet wiring substrate 49 face each other. Arranged in this way.

  In addition, a laminating jig 72 for laminating the resin sheet wiring substrate 49 on the first wiring substrate 45 is prepared. The stacking jig 72 has an opening 74 larger than the chip component 16. The opening 74 is larger than a region formed by a lateral width in the longitudinal direction from one electrode 32 a to the other electrode 32 b in the chip component 16 and a depth width in a direction substantially orthogonal to the longitudinal direction of the chip component 16. Formed by area. Further, the opening 74 of the stacking jig 72 is such that when the bent portions 38a and 38b are bent and the flexible insulating resin sheet 34 is brought into contact with the inner surface of the opening 74, the top portions of the solder bumps 54a and 54b are chip components. It is preferable to be formed in such a size as to contact the 16 electrodes 32a and 32b.

  The stacking jig 72 is aligned so that the chip component 16 is positioned inside the opening 74. The lamination jig 72 is formed into a predetermined shape using, for example, stainless steel. The stacking jig 72 is not limited to a single unit, and may have a divided structure. In order to further improve the solder wettability during reflow of solder bumps 54a and 54b, which will be described later, it is preferable to transfer a flux or the like to the solder bumps 54a and 54b.

  The resin sheet wiring substrate 49 is laminated on the first wiring substrate 45 as shown in FIG. The resin sheet wiring base material 49 is laminated on the first wiring base material 45 in a state where the bent portions 38 a and 38 b of the resin sheet wiring base material 49 are bent to the side opposite to the first wiring base material 45 side. The chip component 16 provided in the first wiring substrate 45 is inserted into the opening formed by bending the bent portions 38a and 38b.

  Next, in a state where the resin sheet wiring substrate 49 is pressed against the first wiring substrate 45 by the laminating jig 72, a vacuum heat laminating process is performed for temporary bonding. Thereby, the 1st wiring base material 45 and the resin sheet wiring base material 49 are temporarily bonded in the state which suppressed the bubble. Then, the bent portions 38a and 38b of the resin sheet wiring base material 49 are bent to the opposite side of the first wiring base material 45 in accordance with the opening 74 of the stacking jig 72, and are provided in the bent portions 38a and 38b. The solder bumps 54a and 54b are in contact with the electrodes 32a and 32b of the chip component 16, respectively. In addition, it differs by adjusting the opening area of the opening 74 in the stacking jig 72, the size of the chip component 16, the height of the solder bumps 54a and 54b, and the size of the bent portions 38a and 38b of the resin sheet wiring substrate 49. Even when a chip component 16 having a size is used, it can be molded.

  Next, a chip component wiring substrate forming process for forming the chip component wiring substrate 20 will be described.

  In the chip component wiring substrate forming step, the chip component wiring preliminary substrate 70 is heated to reflow the solder bumps 54a and 54b, and the second conductors provided on the respective electrodes 32a and 32b and the bent portions 38a and 38b of the chip component 16. This is a step of forming the chip component wiring base 20 by soldering the circuit 36.

  FIG. 6 is a cross-sectional view showing a process of forming the chip component wiring base 20. As shown in FIG. 6, the chip component wiring preliminary substrate 70 is heated to reflow the solder bumps 54a and 54b. As a result, the second conductor circuit 36 formed in the bent portions 38a and 38b of the resin sheet wiring substrate 49 and the electrodes 32a and 32b of the chip component 16 are connected by the solders 40a and 40b.

  At the time of reflow, the bent portions 38a and 38b are inclined and solder-connected to the electrodes 32a and 32b of the chip component 16 due to the rigidity of the resin sheet wiring substrate 49 and the surface tension of the solders 40a and 40b. When a thermosetting film adhesive is used for the adhesive layer 14 by heating the chip component wiring preliminary substrate 70, the first wiring substrate 45 and the resin sheet wiring substrate 49 are heated by the adhesive. And are joined. Then, the stacking jig 72 is removed from the chip component wiring base 20.

  Next, an insulating resin body molding process for molding the insulating resin body 24 will be described.

  In the insulating resin body molding step, the chip component wiring substrate 20 and the second wiring substrate 76 including the second insulating resin plate 42 are arranged to face each other, and the chip component wiring substrate 20 and the second wiring substrate 76 are arranged. This is a step of forming the insulating resin body 24 by filling the gap with an insulating resin material.

  FIG. 7 is a cross-sectional view showing a process of molding the insulating resin body 24. FIG. 7A shows the positioning of the chip component wiring base 20, the second wiring base 76, and the insulating resin material 78. It is sectional drawing which shows a state, FIG.7 (b) is sectional drawing which shows the state which shape | molded the insulating resin body 24. FIG.

  The second wiring substrate 76 includes the second insulating resin plate 42. For the second insulating resin plate 42, for example, an insulating resin plate formed of polyimide resin or the like can be used. The second wiring substrate 76 is preferably provided with a film adhesive 44 on one surface of the second insulating resin plate 42. The second wiring substrate 76 may be provided with a conductor circuit on the other surface of the second insulating resin plate 42.

  For the insulating resin material 78, for example, a thermosetting resin precursor such as a thermosetting resin prepreg prepared in a semi-cured state can be used. The thermosetting resin prepreg and the like are laminated on the resin sheet wiring substrate 49 of the chip component wiring base 20. The thermosetting resin prepreg or the like is laminated, for example, around a pair of bent portions 38a and 38b. The thickness in the interlayer direction of the prepreg laminate formed by stacking thermosetting resin prepregs or the like is preferably substantially the same as the height in the interlayer direction of the chip component 16.

  Next, after positioning the chip component wiring substrate 20, the second wiring substrate 76, and the insulating resin material 78, vacuum hot pressing is performed. When the insulating resin material 78 is heated, the resin viscosity decreases, and the insulating resin material 78 flows into the gap between the chip component wiring base 20 and the second wiring base 76 and is filled. Thereafter, the insulating resin material 78 is heat-cured and molded into the insulating resin body 24, the chip component 16 is sealed, and the printed wiring board 10 is manufactured. In order to obtain interlayer conduction, a through hole, a laser via hole, or the like may be further formed in the interlayer direction of the printed wiring board 10.

  As described above, according to the printed wiring board having the above-described configuration, the chip component wiring base is provided on the resin sheet wiring member, and has a pair of bent portions that are bent toward the second wiring member and inserted into the chip component. Since the second conductor circuit provided in the bent portion and the pair of electrodes of the chip component are each connected by solder, the electrodes of the chip component are solder-connected from the side, and are bonded to the lower surface of the chip component. A layer is provided. As a result, no gap is formed on the lower surface of the chip component, so that even if the solder connected to the electrode of the chip component is remelted during surface mounting of an electronic component or the like, a short circuit between the electrodes of the chip component is prevented. Can do.

  According to the printed wiring board having the above configuration, for example, a structure in which the electrode part of the solder connection is covered with a solder resist or the like to prevent a short circuit between the electrodes in the chip part by soldering to the electrode of the chip part from the side. In addition, since the printed wiring board can be formed with substantially the same thickness as the thickness of the chip component in the interlayer direction, the printed wiring board can be formed thinner.

In embodiment of this invention, it is sectional drawing which shows the structure of a printed wiring board. In embodiment of this invention, it is sectional drawing which shows the process of shape | molding a 1st wiring base material. In embodiment of this invention, it is sectional drawing which shows the process of shape | molding the resin sheet wiring base material. In embodiment of this invention, it is sectional drawing which shows the process of shape | molding the resin sheet wiring base material. In embodiment of this invention, it is sectional drawing which shows the process of assembling the chip | tip component wiring preliminary | backup base | substrate. In embodiment of this invention, it is sectional drawing which shows the process of shape | molding a chip component wiring base | substrate. In embodiment of this invention, it is sectional drawing which shows the process of shape | molding an insulating resin body. It is sectional drawing which shows the structure of the printed wiring board with which the conventional chip component was incorporated.

Explanation of symbols

10 Printed wiring board A
12 First Wiring Member 14, 44 Adhesive Layer 16 Chip Component 18 Resin Sheet Wiring Member 20 Chip Component Wiring Base 22 Second Wiring Member 24 Insulating Resin Body 26 First Insulating Resin Board 28 First Conductor Circuit 30 Chip Component Main Body 32a, 32b Electrode 34 Flexible insulating resin sheet 36 Second conductor circuit 38a, 38b Bending portion 40a, 40b Solder 42 Second insulating resin plate 44 Film adhesive 45 First wiring substrate 46 First conductor layer 48 First laminated plate 49 Resin Sheet wiring substrate 50 Second conductor layer 52 Second laminated plate 54a, 54b Solder bump 62a, 62b First slit 64 Second slit 70 Chip component wiring preliminary substrate 72 Lamination jig 74 Opening portion 76 Second wiring substrate 78 Insulation Resin material 80 Printed wiring board 82 Insulating layer 84 Inner layer wiring layer 86 Through hole 88 Surface wiring 90 laminating resin 92 solder 94 built-in chip component 96 surface mounted chip component 98 gap

Claims (3)

A printed wiring board with built-in chip parts,
A first wiring member having a first insulating resin plate and a first conductor circuit provided on one surface of the first insulating resin plate;
An adhesive layer provided on the first wiring member and provided on the other surface of the first insulating resin plate;
A chip component that is disposed at a predetermined position of the adhesive layer and includes a chip component body and a pair of electrodes provided opposite to both ends of the chip component body;
A flexible insulating resin sheet having flexibility, and a second conductor circuit formed on one surface of the flexible insulating resin sheet, with the second conductor circuit side facing the adhesive layer A laminated resin sheet wiring member;
A chip component wiring substrate including:
A second wiring member disposed opposite to the chip component wiring substrate and including a second insulating resin plate;
An insulating resin body formed of an insulating resin material between the chip component wiring base and the second wiring member, and integrating the chip component wiring base and the second wiring member;
With
The chip component wiring base is provided on the resin sheet wiring member, has a pair of bent portions that are bent toward the second wiring member side and allows the chip component to be inserted, and the chip component wiring base is provided on the pair of bent portions. A printed wiring board, wherein the second conductor circuit and the pair of electrodes of the chip component are each connected by solder. A method of manufacturing a printed wiring board with built-in chip parts,
A first conductor circuit is formed on one surface of the first insulating resin plate, an adhesive layer is laminated on the other surface of the first insulating resin plate, and a chip component body and the chip are disposed at predetermined positions of the adhesive layer. A first wiring base material forming step of forming a first wiring base material by arranging a chip part having a pair of electrodes provided opposite to both ends of the part main body;
A second conductor circuit is formed on one surface of a flexible insulating resin sheet having flexibility, a pair of solder bumps connected to the second conductor circuit is formed, includes the solder bumps, and can be bent A resin sheet wiring base material forming step of forming a pair of bent portions to form a resin sheet wiring base material;
The resin sheet wiring base and the first wiring base are disposed facing the second conductor circuit toward the adhesive layer, and the bent portion is bent to the side opposite to the first wiring base. A chip component wiring preliminary substrate assembly step of assembling a chip component wiring preliminary substrate by inserting the chip component and bringing each solder bump into contact with each electrode of the chip component;
The chip component wiring preliminary substrate is heated to reflow the solder bumps, and each electrode of the chip component and the second conductor circuit provided in the bent portion are soldered to form a chip component wiring substrate. Chip component wiring substrate molding process to
The chip component wiring substrate and a second wiring substrate including a second insulating resin plate are arranged to face each other, and the space between the chip component wiring substrate and the second wiring substrate is filled with an insulating resin material. An insulating resin body molding step for molding the insulating resin body,
A method for producing a printed wiring board, comprising: It is a manufacturing method of the printed wiring board according to claim 2,
The resin sheet wiring base material forming step is provided between the first slits provided to face each other substantially in parallel with the pair of solder bumps therebetween, and the pair of solder bumps, and provided to face each other. A method of manufacturing a printed wiring board, wherein a second slit connected to the first slit is formed to provide the pair of bent portions.

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