JP2002359349A - Electrical unit for mounting on car, semiconductor relay module, and lead frame used for it - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a compact general-purpose electrical unit for mounting on a car. SOLUTION: In this electrical unit 1 for mounting on a car which controls load via semiconductor relays 22A-22F connected to a control board 10, the semiconductor relays 22A-22F are built in a semiconductor relay module 20 which is equipped with a plurality of leads 24, 24A and 24B for connectors and a plurality of leads for connection with a board, and this semiconductor relay module 20 is mounted on the control board 10.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vehicle-mounted electrical unit using a semiconductor relay such as an intelligent power switch (hereinafter referred to as IPS), a semiconductor relay module, and a lead frame used therefor.

[0002]

2. Description of the Related Art Conventionally, as an on-vehicle electrical unit using a semiconductor relay such as IPS, there is one in which a connector for connection and a semiconductor relay are mounted on a control board.
The connection connector connects, for example, a load such as a headlamp, a fog lamp, and various motors to the control board. Further, the semiconductor relay controls power supplied to a load. Such an in-vehicle electrical unit generally has a structure in which a heat radiating plate is provided on the back surface of the control board in order to release heat generated from a semiconductor relay such as an IPS.

[0003] In such a vehicle electrical unit, the number of load control circuits differs depending on standard specifications, optional specifications, and the like. Due to such an increase or decrease in the number of load controls, the semiconductor relay mounting space on the control board and the control circuit space of the semiconductor relay differ greatly. Therefore, in the conventional on-vehicle electrical unit, a control board is manufactured for each specification.

[0004]

In the above-mentioned electrical equipment unit for a vehicle, a wiring pattern of a power system through which a large current flows is routed. Therefore, in order to suppress the wiring resistance of the wiring pattern and to suppress the heat generation of the wiring pattern itself, it is necessary to increase the width of the wiring pattern. Therefore, there is a problem that the size of the control board is increased. Also,
In the above-mentioned onboard electrical unit, the IP
Since semiconductor relays such as S are mounted in accordance with the number of loads, a space for arranging the semiconductor relays and a space for arranging the routing wiring connected to the terminals of the semiconductor relays are also required, which is a factor of increasing the size.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a compact vehicle electrical unit having excellent heat dissipation.

Another object of the present invention is to provide a semiconductor relay module which is excellent in heat dissipation and has high versatility, and a lead frame used therefor.

[0007]

According to the first aspect of the present invention,
An in-vehicle electrical unit for controlling a load via a semiconductor relay mounted on a control board, wherein the semiconductor relay is a semiconductor relay module including a plurality of connector lead portions and a plurality of board connection lead portions. The semiconductor relay module is mounted on the control board.

According to the first aspect of the present invention, the semiconductor relay having a large heat value is provided separately from the control board, and the power supply system wiring to the semiconductor relay is eliminated from the control board. Can be prevented. That is,
Since it is not necessary to arrange a power system on the control board, it is not necessary to form a wide wiring pattern, and the control board can be made compact.

According to a second aspect of the present invention, there is provided the on-vehicle electrical unit according to the first aspect, wherein the semiconductor relay has a rear electrode electrically connected to a die pad portion made of a conductive metal for mounting a plurality of semiconductor relays. And the die pad portion is connected to a power supply through a part of the connector lead portion.

Therefore, according to the second aspect of the invention, in addition to the operation of the first aspect of the invention, by appropriately mounting a number of semiconductor relays on the die pad portion, load control according to specifications can be performed. Become.

[0011] Further, the invention according to claim 3 is based on claim 1.
Alternatively, the on-vehicle electrical unit according to claim 2, wherein the connector lead connects the semiconductor relay and the load.

Therefore, according to the third aspect of the present invention, in addition to the effects of the first and second aspects of the present invention,
Since the connector lead connects the semiconductor relay and the load, the power supply system can be connected without passing through the control board. According to the third aspect of the present invention, there is an effect of releasing heat from the semiconductor relay via the connector lead.

According to a fourth aspect of the present invention, there is provided the vehicle electrical unit according to the third aspect, wherein the connector lead portion has a fuse connection portion to which a fuse is connected.
The load is connected through the fuse connected to the fuse connection unit.

Therefore, according to the fourth aspect of the invention, in addition to the effect of the third aspect, the connector lead portion is connected to the load via the fuse connected to the fuse connection portion. The load and the semiconductor relay can be connected via the connector lead and the fuse.

According to a fifth aspect of the present invention, there is provided a semiconductor relay module for controlling respective loads connected to a semiconductor relay through a plurality of semiconductor relays connected to a control board, wherein the semiconductor relay module comprises: Are mounted on a die pad portion made of a conductive metal, a plurality of connector leads are disposed on one side of the die pad portion, and a plurality of substrate connection leads are disposed on the other side of the die pad portion. The semiconductor relay and the connector lead corresponding to the semiconductor relay are connected, the semiconductor relay and the board connection lead corresponding to the semiconductor relay are connected, and a die pad on which the semiconductor relay is mounted. A portion of the connector lead portion facing the die pad portion; and a die pad of the board connection lead portion. And the side portion facing the is characterized in that resin-sealed integrally.

According to the fifth aspect of the present invention, a semiconductor relay having a large amount of heat is mounted on the die pad portion and is sealed with a resin together with the connector lead portion and the board connection lead portion. A compact semiconductor relay module can be obtained.

The invention according to claim 6 is the semiconductor relay module according to claim 5, wherein an arbitrary number of semiconductor relays can be mounted on the die pad portion.

Therefore, in the invention according to claim 6, in addition to the effect of the invention described in claim 5, the number of semiconductor relays mounted on the die pad portion is arbitrarily set, so that the number of semiconductor relays according to the number of loads is adjusted. It becomes easy to manufacture semiconductor relay modules of various specifications. By mounting such a semiconductor relay module on a control board, a highly versatile vehicle-mounted electrical unit can be realized. For this reason, a common control board can be achieved.

Further, the invention described in claim 7 is the same as claim 5
7. The semiconductor relay module according to claim 6, wherein the connector lead is connected to a wiring connected to a load side, and the board connection lead is connected to a wiring pattern of the control board. It is characterized by that.

Therefore, according to the invention described in claim 7, in addition to the effects of the invention described in claims 5 and 6,
By connecting to the control board with the board connecting lead, a control signal or the like from the control board can be input to the semiconductor relay. Also, the power switched by the semiconductor relay can be supplied to the load by the connector lead portion.

The invention according to claim 8 is the semiconductor relay module according to claim 7, wherein the connector lead portion has a fuse connection portion to which a fuse is connected, and is connected to the fuse connection portion. And connected to the wiring connected to the load side via the fuse.

Therefore, according to the present invention, in addition to the function of the invention described in claim 7, the wiring for the connector lead portion is connected to the load side via the fuse connected to the fuse connection portion. Is connected, power can be supplied to the load via the connector lead portion and the fuse.

According to a ninth aspect of the present invention, there is provided a lead frame for use in a semiconductor relay module, wherein a die pad portion on which a plurality of semiconductor relays are mounted, and a plurality of connector leads arranged on one side of the die pad portion. And a plurality of substrate connection lead portions disposed on the other side of the die pad portion, wherein the die pad portion is a common electrode electrically connected to the back surface electrodes of the plurality of semiconductor relays. It is characterized by the following.

According to the ninth aspect of the present invention, a compact semiconductor relay module can be manufactured by resin molding with the semiconductor relay mounted on the die pad portion. In addition, it is possible to design the layout of the semiconductor relays according to the heat dissipation of the semiconductor relay mounted on the die pad portion.

The invention described in claim 10 is the same as the ninth invention.
2. The lead frame according to claim 1, wherein a current capacity of the connector lead portion is larger than a current capacity of the board connection lead portion.

Therefore, according to the tenth aspect of the present invention,
In addition to the effect of the invention according to claim 9, by mounting the back electrode of the semiconductor relay so as to be electrically connected to the die pad portion, a control signal can be input to the semiconductor relay via the board connection lead portion, A large current can flow to the connector lead via the connector connection lead.

Further, the invention according to claim 11 is the lead frame according to claim 9 or 10, wherein the stripe width of the connector lead portion is larger than the stripe width of the board connection lead portion. Is also large.

Therefore, according to the eleventh aspect of the present invention,
In addition to the effects of the inventions described in claims 9 and 10, in addition to increasing the current capacity of the connector lead portion, power can be supplied to the load while heat generation is suppressed.

[0029]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a vehicle-mounted electrical unit, a semiconductor relay module and a lead frame used therein according to the present invention will be described in detail based on embodiments.

FIG. 1 is a plan view showing an on-vehicle electrical unit 1 according to the present embodiment, and FIG. In FIG. 1, the cover is indicated by a broken line to show a state in which the inside of the vehicle-mounted electrical unit 1 can be seen.

(Electric Vehicle Unit) The electric vehicle unit 1 of this embodiment has a control board 10 and a semiconductor relay module 20 housed in a case body 2 having a substantially rectangular tray shape. 3 is roughly covered.

The case main body 2 is preferably formed of an insulating material having a high heat dissipation property, but may be made of metal as long as insulation from the control board 10 can be ensured. Also, cover 3
Is formed of a metal material having high heat conductivity and heat dissipation such as aluminum. And this cover 3
Is the resin mold part 21 of the semiconductor relay module 20
The semiconductor relay module 20 is covered with the case main body 2 so as to be in close contact with the semiconductor relay module 20 so as to radiate heat. The case body 2 and the cover 3 are
As shown in FIG. 2, the terminal receiving space 4 is formed on one side in the assembled state.

On the control board 10, well-known electronic components 11A and 11B, as well as a control microcomputer, are mounted. The control board 10 includes these electronic components 11A,
A wiring pattern (not shown) which is connected to 11B or the like and forms a circuit is formed. Further, on one side edge of the control board 10, a board-side connector 13 is provided which is provided with a plurality of board-side terminals 12 for supplying power to the control board 10 and taking out / in signals.

(Semiconductor Relay Module) As shown in FIGS. 3 and 4, the semiconductor relay module 20 includes a plurality of semiconductor relays 22A, 22B, 22C, 22D,
22E and 22F are mounted on the die pad portions 23A and 23B, and are resin-molded in a rectangular parallelepiped shape.
A plurality of connector leads 24 extending from one side surface of the resin mold portion 21;
And a plurality of substrate connection lead portions 25 extending from the other side surface of the substrate. Power supply leads 24A and 24B connected to the die pads 23A and 23B are provided on the sides of the plurality of connector leads 24 so as to be parallel to the adjacent connector leads 24.

A screw hole 26 is formed on both sides in the longitudinal direction of the resin mold portion 21 so as to penetrate in the vertical direction. A screw member for fixing the semiconductor relay module 20 on the board-side connector 13 provided on one side of the control board 10 is inserted into the screw hole 26. I have.

In the semiconductor relay module 20, the connector lead 24 and the power lead 24A,
In 4B, the width of the lead portion is set wide because a large current flows. The connector leads 24 are respectively connected to various loads such as a head lamp and a motor for driving a wiper. And
The semiconductor relays 22A, 22B, 22C, 22D,
Power is supplied to each load by the switching operation of each of 22E and 22F.

These semiconductor relays 22A, 22B, 22
In C, 22D, 22E, and 22F, drain electrodes (not shown) formed as back electrodes are electrically connected to the die pad portions 23A and 23B. And
Semiconductor relays 22A, 22B, 22C, 22D, 22
Source electrodes (not shown) formed as surface electrodes (bonding pads) of E and 22F are wire-bonded to connector lead portions 24 connected to loads corresponding to the respective switching operations. I have. These semiconductor relays 22A, 22A
Gate electrodes (not shown) formed as other surface electrodes (bonding pads) of B, 22C, 22D, 22E, and 22F are wire-bonded to the substrate connection lead portions 25. Board connection lead 2
5 transmits an H / L signal (control signal) output from an electronic component such as a control microcomputer, a current detection signal (status signal) on the semiconductor relay side, and the like. The bonding pad and the connector lead 24 on the semiconductor relay side, and the bonding pad and the board connection lead 25
And aluminum (Al) wire, gold (Au) wire, copper (Cu)
Or these ribbons may be used.

In the semiconductor relay module 20 having such a configuration, the semiconductor relays 22A, 22B, 22C, 22
Since the drain electrodes, which are the back electrodes of D, 22E, and 22F, are electrically connected to the die pad portion 23, the current capacity is relatively larger than each of the surface electrodes of the semiconductor relay, and the power supply lead portions 24A, A large current can flow through 24B. In particular, in the present embodiment, as shown in the equivalent circuit diagram of FIG.
The circuit configuration is such that loads L1, L2, L3, L4, L5, and L6 corresponding to 2B, 22C, 22D, 22E, and 22F are arranged on the high side.

(Lead Frame) Next, the lead frame 30 used in the above-described semiconductor relay module 20 will be described.
Will be described with reference to FIG. FIG. 6 shows the semiconductor relays 22A, 22B, 22C, 2
It is a top view showing the state where 2D, 22E, and 22F were mounted.

The lead frame 30 is a multiple continuous strip. As shown in FIG. 6, the portion where one semiconductor relay module 20 which is one unit in the lead frame 30 is formed includes three semiconductor relays 22A,
A substantially rectangular die pad portion 23A on which the semiconductor relays 22B and 22C are mounted, and three other semiconductor relays 22D and 22D
E and 22F are also mounted at predetermined intervals along the longitudinal direction of the lead frame 30 with the die pad 23B having a substantially rectangular shape. Die pad part 2
These die pad portions 2 are provided on both sides in the width direction of 3A and 23B.
Tie bars 31 and 32 are formed along the longitudinal direction of the lead frame 30 at positions away from 3A and 23B.
Both ends of the tie bars 31 and 32 are
Connecting bars 33, 3 formed in a direction orthogonal to 1, 32
4. Outside the tie bars 31, 32,
Frame bars 35 and 36 which are parallel to each other are formed. These frame bars 35 and 36 include a connecting bar 3
Both ends of 3, 34 are connected.

The tie bar 31 has a die pad portion 23A,
Power supply leads 24A, 24B so as to be continuous with 23B.
Are integrally formed. A plurality of connector leads 24 that are not continuous with the die pads 23A, 23B are integrally formed on the tie bars 31 on the sides of the die pads 23A, 23B at the same pitch (relatively wide interval). Is formed.

The tie bar 32 and the frame bar 36 are integrally formed with a plurality of substrate connection lead portions 25 which are not continuous with the respective die pad portions 23A and 23 so as to be parallel to each other at a relatively narrow pitch. . The tie bar 32 has support bars 37, 37 connected to the die pad portions 23A, 23B.

Further, the die pad portions 23A and 23B
The plate thickness is set to be thicker than other portions of the lead frame 30.

The lead frame 30 according to the present embodiment is
In any case, a metal plate material patterned into a predetermined shape by punching or etching, for example, aluminum (A
l), copper (Cu), Cu-Fe, Cu-Fe-P, Cu
-Copper alloys such as Cr, Cu-Ni-Si, Cu-Sn,
A nickel-iron alloy such as Ni-Fe or Fe-Ni-Co, or a composite material of copper and stainless steel can be used. In addition, nickel (N
i) A plated or silver (Ag) or gold (Au) plated material may be used.

In order to manufacture the semiconductor relay module 20 using such a lead frame 30, as shown in FIG. 6, a predetermined semiconductor relay is mounted on the die pad portions 23A and 23B, and wire bonding is performed. By performing transfer molding as shown in FIG. 7 and cutting the lead frame 30, the semiconductor relay module 20 as shown in FIG. 3 is completed. The board connection lead 25 may be bent at a predetermined position, as shown in FIG. When the board connecting lead portion 25 bent in this way is assembled to the vehicle-mounted electrical unit 1, the lead portion 25 is inserted into the control board 10 as shown in FIG. (Not shown)) and soldering is performed.

In the above-described lead frame 30, three semiconductor relays can be mounted on the die pad portions 23A and 23B, respectively. However, according to the number of load controls, semiconductor relays according to the standard specifications and optional specifications can be mounted. The number of mounts can be increased or decreased. In the present embodiment, since the semiconductor relay module 20 manufactured using such a lead frame 30 has a transfer-molded thin structure, as shown in FIGS.
Even if it is mounted on a, there is no increase in size.

Further, since the lead frame 30 itself has versatility, one type of lead frame 30 can support standard specifications and optional specifications. At this time, since there is no need to change the control board 10, the control board 10 can be shared, and the cost can be significantly reduced.

Further, a semiconductor relay which generates a relatively large amount of heat in the on-vehicle electrical unit 1 is connected to the lead frame 30.
And the semiconductor relay module 20 is manufactured as a separate body, so that it is not necessary to form a wiring pattern in consideration of heat generation on the control board 10 side, and it is possible to suppress an increase in the size of the control board 10 itself. In particular, in the present embodiment, the power supply line and the source line go directly to the outside from the semiconductor relay module 20, so that such a power system line is not required on the control board 10, and This has the advantage of eliminating heat generation and wiring.

In the lead frame 30 of this embodiment, as shown in FIGS. 3 and 6, the layout of the semiconductor relays is designed in accordance with the amount of heat generated by each semiconductor relay, so that the shape and size of the lead frame are reduced. In addition, the mounting position and the mounting interval of each semiconductor relay can be determined. By manufacturing the semiconductor relay module 20 using such a lead frame 30, a plurality of different loads can be easily controlled.

Although the present embodiment has been described above, the present invention is not limited to this, and various design changes accompanying the gist of the configuration are possible. For example, in the above-described embodiment, the lead frame 30 having the two die pad portions 23A and 23B, the semiconductor relay module 20
However, the number of die pads may be singular or three or more. Further, the number of semiconductor relays mounted on each die pad portion can be changed as appropriate.

In the above-described embodiment, the circuit is designed such that the semiconductor relay is arranged on the high side with respect to the load. However, it is of course possible to adopt the low side design.

Hereinafter, another embodiment of the vehicle electrical unit according to the present invention will be described with reference to FIG. FIG.
FIG. 5 is a perspective view showing another embodiment of the vehicle electrical unit according to the present invention.

As shown in FIG.
In the same manner as in the above embodiment, the control circuit board 39 and the semiconductor relay module 40 are housed in a case body (not shown), and the case body is covered with a cover (not shown). The connector connecting portion 41A is provided with a fuse connecting portion 41A to which a fuse 42 is connected.

The control board 39 is provided on an insulating plate 43 on which a wiring pattern (not shown) constituting a circuit is formed, and includes well-known electronic components 44A, 44B, 44 including a control microcomputer.
C, 44D, 44E, 44F, a radiating fin 45 for radiating heat from the insulating plate 43, and a mechanical relay 46 having a small capacity are mounted. Also, the control board 39
The connector 47 and the electronic component 4
A terminal 48 is provided on the 4F, and power is supplied through the connector 47 and the terminal 48. A semiconductor relay module 40 is mounted on the control board 39.

The semiconductor relay module 40 has a plurality of semiconductor relays 49, 49... Mounted on a die pad 50 and resin-sealed therein, and extends from one side of the resin mold 51. A plurality of connector lead portions 41 and a plurality of board connection lead portions 52 extending from the other side surface of the resin mold portion 51.

The resin mold portion 51 includes a die pad portion 50.
Has a power supply connection portion 51A which is pulled out to the outside and connected to a power supply, and the power supply connection portion 51A is fixed to the insulating plate 43 by bolts. In addition, the resin molded portion 51 is, similarly to the above embodiment, provided with the semiconductor relay 4.
Are electrically connected to the die pad portion 50, and the surface electrodes of the semiconductor relays 49, 49 are wire-bonded to the connector lead portion 41 and the board connection lead portion 52.

The connector lead portion 41 has the fuse connection portion 41A as described above. The fuse connecting portion 41A is provided at the tip of the connector lead portion 41, and is arranged in a fuse mounting portion (not shown) provided on the cover. The fuse mounting portion 41A holds one terminal portion of the fuse 42, and connects and fixes the fuse 42 to the connector lead portion 41 by holding the one terminal portion.

In such a connector lead portion 41, a wire connected to the load side by a connector or the like is connected to the other terminal portion of the fuse 42 in which one terminal portion is connected to the fuse connection portion 41A. To electrically connect the load to each semiconductor relay 49 via the fuse 42.

Therefore, the semiconductor relay module 40
The power supply from the power supply is supplied to the load via the connector lead portion 41 and the fuse 42 by the switching operation of the semiconductor relay 49.

The vehicle-mounted electrical unit 3 configured as described above
When the fuse 8 is mounted on a vehicle or the like, the fuse 42 is previously mounted on the fuse mounting portion of the cover, and the fuse 4 is mounted.
The fuse 42 is mounted on the in-vehicle electrical unit 38 by connecting one of the terminal portions 2 to the fuse connection portion 41A of the connector lead portion 41.

Thereafter, when a connector or the like of the wiring connected to the load is connected to the other terminal of the fuse 42, the load is electrically connected to the semiconductor relay 49 via the connector lead 41 and the fuse 42. Then, the mounting of the vehicle-mounted electrical unit 38 is completed.

In the in-vehicle electrical unit 38, the connector lead 41 is connected to the load via the fuse 42 connected to the fuse connecting portion 41A, so that the load is connected to the load via the connector lead 41 and the fuse 42. Can be connected to the semiconductor relays 49.49. For this reason, in the vehicle-mounted electrical unit 38, the semiconductor relay 49,
.. Can be omitted, and the work of attaching to a vehicle or the like can be easily performed.

Further, in the on-vehicle electrical unit 38, the installation to the vehicle or the like is completed only by connecting the wiring connected to the load side to the fuse 42 mounted in advance, so that the installation work to the vehicle or the like can be made easier. Can be done.

The other embodiment of the vehicle electrical unit has been described above. However, the present invention is not limited to this, and various design changes accompanying the gist of the configuration are possible. For example, the semiconductor relay module 40 of the above embodiment can have a structure as shown in FIGS.

This semiconductor relay module 53 has the structure shown in FIG.
As shown in FIG. 10, a die pad portion 55 on which semiconductor relays 49, 49... Are mounted is pulled out from the resin mold portion 54 from both sides in the longitudinal direction.
A, 56B.

The one drawer portion 56A (on the front side of the drawing) is provided to be biased toward the connector lead portion 41 with respect to the die pad portion 55, and has a central portion through which a bolt (not shown) is inserted. It has a hole 57. The one lead-out portion 56A is fastened to an insulating plate (not shown) of a control board (not shown) together with a bus bar from a power source through a bolt insertion hole 57 and used for power supply connection.

The other (on the other side of the drawing) of the drawing portion 56B
It is provided so as to be biased toward the substrate connection lead portion 52 with respect to the die pad portion 55, and has a bolt insertion hole 57 for inserting a bolt at the center. The other drawer 56
B is fastened to the insulating plate of the control board by bolts through the bolt insertion holes 57.

Further, the semiconductor relay module 53 shown in FIGS. 9 and 10 can be structured as shown in FIGS. 11 and 12. In this semiconductor relay module 58, as shown in FIGS. 11 and 12, a resin mold portion 59 has a plurality of semiconductor relays 49, 49... Mounted on a plurality of connector lead portions 41, respectively. It was done.

The resin mold portion 59 is provided with the semiconductor relay 4
Are electrically connected to the respective connector lead portions 41, and the semiconductor relays 49, 49
Are wire-bonded to the die pad portion 55 and the substrate connection lead portion 52.

[0070]

As is apparent from the above description, according to the first aspect of the present invention, a semiconductor relay having a large heat value is provided separately from the control board, and the wiring of the power supply system to the semiconductor relay is provided on the control board. Is eliminated, which has the effect of preventing the control board from increasing in size. In particular, since it is not necessary to arrange a power system on the control board, it is not necessary to form a wide wiring pattern, and the control board can be made compact.

According to the second aspect of the present invention, in addition to the effect of the first aspect of the present invention, by mounting an appropriate number of semiconductor relays on the die pad portion, the load can be controlled in accordance with the specifications. This has the effect of increasing the versatility of the vehicle electrical unit.

According to the third aspect of the present invention, in addition to the effects of the first and second aspects of the present invention, since the connector lead connects the semiconductor relay and the load, the control board side is connected. The power supply system can be connected without passing through. In addition, since heat generated from the semiconductor relay can be released through the connector lead portion, there is an effect of improving heat dissipation.

According to the invention described in claim 4, in addition to the effect of the invention described in claim 3, the connector lead portion is connected to the load via the fuse connected to the fuse connection portion. The load and the semiconductor relay can be connected via the connector lead and the fuse. Therefore, the work of connecting the semiconductor relay to another circuit having a fuse or the like can be omitted, and the work of attaching the vehicle-mounted electrical unit to a vehicle or the like can be easily performed.

According to the fifth aspect of the present invention, a semiconductor relay having a large amount of heat is mounted on the die pad portion and is sealed with resin together with the connector lead portion and the board connection lead portion. Thin and low-impact
A compact semiconductor relay module can be realized.

According to the invention described in claim 6, in addition to the effect of the invention described in claim 5, the number of semiconductor relays mounted on the die pad portion is arbitrarily set, so that the number of semiconductor relays according to the number of loads can be adjusted. Semiconductor relay modules of various specifications can be realized. By mounting such a semiconductor relay module on a control board, a highly versatile vehicle-mounted electrical unit can be realized. For this reason, a common control board can be achieved.

According to the seventh aspect of the present invention, in addition to the effects of the fifth and sixth aspects of the present invention, by connecting to the control board side by the board connecting lead portion, the control board side And the like can be input to the semiconductor relay, and power can be supplied to the load via the connector lead portion based on the switching operation of the semiconductor relay in response to the control signal.

According to the eighth aspect of the invention, in addition to the effect of the seventh aspect of the present invention, the wiring in which the connector lead portion is connected to the load side via the fuse connected to the fuse connection portion is provided. By being connected, power can be supplied to the load via the connector lead and the fuse. Therefore, the work of connecting the semiconductor relay to another circuit having a separate fuse can be omitted.

According to the ninth aspect of the present invention, a compact semiconductor relay module can be manufactured by resin molding with the semiconductor relay mounted on the die pad portion. In addition, it is possible to design the layout of the semiconductor relays according to the heat dissipation of the semiconductor relay mounted on the die pad portion.

According to the tenth aspect, the ninth aspect is provided.
In addition to the effects of the invention described above, by mounting the rear surface electrode of the semiconductor relay so as to be electrically connected to the die pad portion, a control signal can be input to the semiconductor relay via the board connection lead portion and the connector connection can be performed. A large current can flow to the connector lead via the lead. For this reason,
By flowing a large current through the semiconductor relay module manufactured using the lead frame, there is an effect that the heat dissipation structure on the control board side on which the semiconductor relay module is mounted and the measures against heat generation can be omitted.

According to the eleventh aspect, according to the ninth aspect,
In addition to the effects of the invention described in claim 10, the current capacity of the connector lead portion can be increased to supply power to the load side while suppressing heat generation.

[Brief description of the drawings]

FIG. 1 is a plan view showing an embodiment of a vehicle electrical unit according to the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a plan view showing an embodiment of a semiconductor relay module according to the present invention.

FIG. 4 is a side view of the semiconductor relay module of the embodiment.

FIG. 5 is an equivalent circuit diagram of the vehicle electrical unit according to the embodiment.

FIG. 6 is a plan view showing an embodiment of a lead frame according to the present invention.

FIG. 7 is an explanatory side view showing a state in which transfer molding has been performed on the lead frame of the embodiment.

FIG. 8 is a perspective view showing an in-vehicle electrical unit according to another embodiment.

FIG. 9 is a perspective view showing a modification of the semiconductor relay module of another embodiment.

FIG. 10 is a partially cutaway perspective view of the semiconductor relay module shown in FIG. 9;

FIG. 11 is a perspective view showing a modification of the semiconductor relay module of another embodiment.

12 is a partially cutaway perspective view of the semiconductor relay module shown in FIG.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 In-vehicle electrical unit 10 Control board 20 Semiconductor relay module 21 Resin molded part 22A, 22B, 22C, 22D, 22E, 22F Semiconductor relay 23A, 23B Die pad part 24, 24A, 24B Connector connection lead part 25 Board connection lead part 30 Lead frame L1, L2, L3, L4, L5, L6 Load

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Katsuya Suzuki 1500 Onjuku Yasushi Parts Co., Ltd., Susono City, Shizuoka Prefecture (72) Inventor Hiroaki Sakata 1500 Onjuku 1500 Susono City, Shizuoka Prefecture Yazaki Parts Co., Ltd. F term (reference) 5E024 CA22 CB07

Claims (11)

[Claims] 1. An on-vehicle electrical unit for controlling a load via a semiconductor relay mounted on a control board, comprising: a plurality of connector leads and a plurality of board connection leads. An in-vehicle electrical unit which is built in a semiconductor relay module provided, and wherein the semiconductor relay module is mounted on the control board. 2. The on-vehicle electrical unit according to claim 1, wherein the semiconductor relay is mounted with a back electrode electrically connected to a die pad made of a conductive metal, and the die pad is connected to the connector. An in-vehicle electrical unit, which is connected to a power supply via a part of a lead for a vehicle. 3. The in-vehicle electrical unit according to claim 1, wherein the connector lead connects the semiconductor relay and the load. . 4. The on-vehicle electrical unit according to claim 3, wherein the connector lead portion has a fuse connection portion to which a fuse is connected, and via the fuse connected to the fuse connection portion. An on-vehicle electrical unit to which the load is connected. 5. A semiconductor relay module for controlling respective loads connected to a semiconductor relay via a plurality of semiconductor relays connected to a control board, wherein the semiconductor relay is a die pad made of a conductive metal. A plurality of connector leads are arranged on one side of the die pad section, and a plurality of board connection leads are arranged on the other side of the die pad section. A connector lead corresponding to the semiconductor relay is connected, the semiconductor relay and a board connection lead corresponding to the semiconductor relay are connected, and the die pad and the die pad of the connector lead are opposed to each other. And a portion of the substrate connection lead portion facing the die pad portion is integrally resin-sealed. Semiconductor relay module. 6. The semiconductor relay module according to claim 5, wherein an arbitrary number of semiconductor relays can be mounted on the die pad portion. 7. The semiconductor relay module according to claim 5, wherein the connector lead is connected to a wiring connected to a load side, and the board connection lead is connected to the wiring. A semiconductor relay module connected to a wiring pattern of a control board. 8. The semiconductor relay module according to claim 7, wherein the connector lead portion has a fuse connection portion to which a fuse is connected, and the connector lead portion is connected via the fuse connected to the fuse connection portion. A semiconductor relay module connected to the wiring connected to a load side. 9. A die pad portion on which a plurality of semiconductor relays are mounted, a plurality of connector leads disposed on one side of the die pad portion, and a plurality of board connections disposed on the other side of the die pad portion. And a lead electrode, wherein the die pad is a common electrode electrically connected to the back electrodes of the plurality of semiconductor relays. 10. The lead frame according to claim 9, wherein a current capacity of the connector lead portion is larger than a current capacity of the board connection lead portion. 11. The lead frame according to claim 9, wherein a stripe width of the connector lead portion is larger than a stripe width of the board connection lead portion. flame.