JP2523389Y2 - PC board device - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a PC board device in which a plurality of electrical components including a relay are mounted on a PC board.

[0002]

2. Description of the Related Art For example, when control of energization of a heater is performed via a relay, as shown in FIGS. 6 and 7, together with a relay 2 molded on a PC board 1 with an insulating member, for example, The control circuit is configured by attaching lead wires 3 and 3 as other electric components that are electrically connected to the power supply.

A plurality of pattern wirings 4 formed by etching are provided on the lower surface of the PC board 1. The connection terminals 5 provided on the relay 2 and the connection terminals 6 attached to the lead wires 3 are inserted into the PC board 1 from the upper surface side of the PC board 1, and these connection terminals 5. , 6 are connected to the ends of the pattern wirings 4...
And it is fixed by the solder dip, thereby forming a predetermined control circuit.

[0004]

In such a control circuit, for example, the pattern wirings 4a, 4a connecting the connection terminals 6, 6 of the lead wires 3, 3 and the connection terminals 5, 5, which are electrically connected to the relay contacts of the relay 2, are provided. In some cases, a large current of about 10 A or 15 A flows. In general, the pattern wirings 4a have a thickness of about several tens of μm, and the cross-sectional area of each part is extremely small. Therefore, when a large current of about 10A or 15A flows, the temperature rises excessively. There is a drawback that the rise raises great restrictions on the design of the PC board 1.

The present invention has been made in view of such a point. The purpose of the invention is to prevent an excessive temperature rise from occurring even when a large current flows, and to attach a lead plate to a PC board. Securely secures the work of connecting and fixing the connection terminals of relays and other electrical components to this lead plate easily and efficiently. Furthermore, the entire PC board device is made thin and easily installed even in the narrow space of electrical equipment. It is to provide a PC board device that can be incorporated.

[0006]

According to the present invention, in order to achieve such an object, a plurality of electric parts including a relay are arranged on the other side of a PC board having a plurality of pattern wirings on one side. Provided, these electrical components are connected to the predetermined pattern wiring via connection terminals,
On the other surface of the PC board corresponding to the pattern wiring for the relay of the pattern wiring, a lead plate sufficiently thicker than the pattern wiring is fixed by caulking and fixed on the lead plate. The relay is attached in close contact, and connection terminals of the relay and connection terminals of other electric components are connected to both ends of the lead plate, respectively, so that a large current flowing between these connection terminals flows through the lead plate. It was done.

[0007]

In such a configuration, a large current flows through the lead plate, and a large current does not flow through the pattern wiring. And since the lead plate is thick and has a large cross-sectional area,
Even if a large current flows through the lead plate, an excessive rise in temperature does not occur.

The lead plate is securely fixed to the PC board by crimping, so that the operation of connecting the connection terminals of the relay and other electric components to the lead plate can be performed easily and efficiently, and the relay is mounted on the lead plate. The PC board device is made thin,
The board device can be easily incorporated even in a narrow space of the electric equipment.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. Parts corresponding to those of the conventional configuration are denoted by the same reference numerals, and description thereof is omitted. PC
On the substrate 1, there are provided pattern wirings 4a, 4 through which a large current flows.
In portions corresponding to a, conductive lead plates 10, 10 formed of a metal such as copper or copper alloy, which is sufficiently thicker than the pattern wirings 4a, 4a, are provided. Eyelets 11, 11 are formed at both ends of the lead plate 10, and mounting holes 12, 12 corresponding to these eyelets 11, 11 are formed in the PC board 1.

When mounting the relay 2 and the lead wires 3 on the PC board 1, first, a lead plate 10 is arranged on the upper surface side of the PC board 1, and the eyelets 11, 1 of the lead plate 10 are arranged.
1 into the mounting holes 12, 12 and these eyelets 11, 1
The peripheral edge of the front end of the PC board 1 is expanded toward the outer peripheral side and is caulked to the lower surface of the PC board 1, thereby fixing the lead plate 10 to the PC board 1 and conducting to the pattern wiring 4a.

Thereafter, the relay 2 is arranged on the lead plate 10 and the connection terminal 5 of the relay 2 is pressed into one eyelet 11 of the lead plate 10 while the relay 2 is connected as shown in FIG. The plate is brought into close contact with the upper surface of the plate 10. The connection terminal 6 of the lead wire 3 is pressed into the other eyelet 11 of the lead plate 10. Then, the connection terminals 5 and 6 and the eyelets 11 and 11 are fixed to each other by a tag welding or a laser welding.

In such a configuration, the relay 2 is connected to the relay 2 in accordance with the closing of the relay contact of the relay 2.
A large current flows through the lead plate 10 to the connection terminal 5, and a large current does not flow to the pattern wiring 4a having a small sectional area.
Since the lead plate 10 is thick and has a sufficiently large cross-sectional area, even if a large current flows through the lead plate 10, an excessive rise in temperature does not occur.

When assembling the PC board device, first, a lead plate 10 is fixed to the PC board 1 by caulking, and in this state, the connection terminal 5 of the relay 2 and the connection terminal 6 of the lead wire 3 are connected.
Are pressed into the eyelets 11, 11 of the lead plate 10, and the connection terminals 5, 6 and the eyelets 11, 11 are connected and fixed by TIG welding, laser welding, or the like. Thus, it is reliably and stably supported by the PC board 1, and thus the connection and fixing work can be easily and efficiently performed.

Further, the relay 2 is mounted on the lead plate 10 in close contact, and as shown in FIG. 1, the height H from the upper surface of the PC board 1 to the upper surface of the relay 2 is minimized. It is possible to reduce the thickness of the PC board device while suppressing it, so that the PC board device can be easily incorporated even in a very limited narrow space of the electric equipment. Since the relay 2 is mounted, there is an advantage that the mounting state of the relay 2 is stable, and the careless drop-off or displacement can be reliably prevented.

The means for fixing the lead plate 10 to the PC board 1 is not limited to the case where the eyelets 11 and 11 are crimped, but may be the case where only the tongue piece is crimped. The connection terminals 5 for the lead plate 10
The connection and fixing of 6 may be performed by soldering, welding, or caulking.

[0016]

[Effect of the invention] As described above, according to the invention,
Since a large current flows through the lead plate having a larger sectional area than the pattern wiring, there is no excessive temperature rise,
Regulations in designing the C board are relaxed, so that the design can be easily performed.
Because it can be securely fixed to the board, the work of connecting and fixing the connection terminals of relays and other electrical components to this lead plate can be performed easily and efficiently, and the relay is mounted in close contact with the lead plate. Therefore, the PC board device can be configured to be thin, and this PC board device can be easily incorporated even in a narrow space of electric equipment, and the mounting state of the relay is stabilized to prevent the unintentional dropping or shifting movement. There are advantages that can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view of a PC board device according to an embodiment of the present invention.

FIG. 2 is a sectional view of the PC board device before assembly.

FIG. 3 is a perspective view of the PC board device.

FIG. 4 is a bottom view of the PC board device.

FIG. 5 is a plan view showing a lead plate in the PC board device.

FIG. 6 is a perspective view of a conventional PC board device.

FIG. 7 is a bottom view of the PC board device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... PC board 2 ... Relay 4a ... Pattern wiring 3 ... Lead wire (electric part) 5,6 ... Connection terminal 10 ... Lead plate

Claims (1)

(57) [Scope of request for utility model registration] 1. A plurality of electrical components including a relay are disposed on the other surface of a PC board having a plurality of pattern wirings on one surface, and these electrical components are connected to the predetermined pattern wiring via connection terminals. A lead plate, which is sufficiently thicker than the pattern wiring, is fixed to the other surface of the PC board by caulking corresponding to the pattern wiring for the relay of the pattern wiring. Then, the relay is closely attached to the lead plate, and the connection terminal of the relay and the connection terminal of another electric component are respectively connected to both ends of the lead plate, and a large current flowing between these connection terminals is provided. Flowing through the lead plate.