JP3629811B2 - Wiring board with connection terminal - Google Patents
Wiring board with connection terminal Download PDFInfo
- Publication number
- JP3629811B2 JP3629811B2 JP11343896A JP11343896A JP3629811B2 JP 3629811 B2 JP3629811 B2 JP 3629811B2 JP 11343896 A JP11343896 A JP 11343896A JP 11343896 A JP11343896 A JP 11343896A JP 3629811 B2 JP3629811 B2 JP 3629811B2
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- wiring board
- resin body
- molded resin
- connection terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は各種電子機器、特にインバータや電源回路などの電力回路に使用される接続端子付配線基板に関するものである。
【0002】
【従来の技術】
近年電子機器の小型化、高機能化、あるいは複合化などによる電子部品の高密度実装が要求されており、使用される電子部品の発熱がそれ自身あるいは周辺の電子部品の信頼性や寿命に影響を与えかねなくなっている。
【0003】
そのため、放熱を兼ねた熱伝導性の金属板を使用して電子部品を搭載した配線基板が使用されている。
【0004】
以下、従来の接続端子付配線基板を図面を用いて説明する。
図6は従来の接続端子付配線基板の斜視図、図7は同要部の断面図であり、図6,図7において、11は電子回路を形成するために実装された電子部品、12は電子回路を構成するための配線パターンを形成する導体箔、14は片面に放熱フィン16を設けた熱伝導性材料でなる板状のベース金属、13は導体箔12とベース金属14を分離絶縁して接着し一体化する樹脂材などでなる絶縁体層、15は外部回路と電気的接続用の金属材でなる導体ピンであり、配線パターンの導体箔12の上に半田付けなどにより電気的および機械的に固定されて、配線基板の外部接続端子となっている。
【0005】
【発明が解決しようとする課題】
しかしながら前記従来の接続端子付配線基板では、絶縁体層13が必要であり、外部接続端子をベース金属14の上の導体箔12に別部品の導体ピン15を半田付けなどにより構成することは、機械的強度が不充分で組立時の位置決めが難しく、部品コスト、組立コストなどの生産コストが高くなるという課題を有している。
【0006】
本発明は前記従来の課題を解決しようとするものであり、機械的強度と位置決め精度の優れた接続端子を持ち、生産コストの低減が図れる接続端子付配線基板を提供することを目的とする。
【0007】
【課題を解決するための手段】
前記課題を解決するために本発明は、電子回路を構成する配線パターンを形成した金属材でなる導体板と、フィラーを含有した樹脂材でなる成形樹脂体を形成して一体化し、電子部品を搭載接続してなる配線基板において、外部との接続端子を曲げ加工する部分の上面および両側面部を成形樹脂体と密着せずに露出させ、かつ、成形樹脂体の端面から所定絶縁に必要な沿面距離位置にて曲げ加工して電子部品搭載側に起こした、前記導体板の一部による一体化構造とした接続端子付配線基板とする。
【0008】
この本発明により、別部品が不要な機械的強度や位置決め精度の優れた接続端子が得られ、生産コストの低減を図ることが可能となる。
【0009】
【発明の実施の形態】
本発明の請求項1に記載の発明は、成形し一体化した成形樹脂体の端面から、所定絶縁に必要な沿面距離位置にて曲げ加工する部分の上面および両側面部を成形樹脂体と密着せずに露出させ曲げ加工して電子部品搭載側に起こした外部との接続端子とする接続端子付配線基板としたものであり、曲げ加工における位置精度が得られ、成形樹脂体への損傷がないという作用に加えて絶縁が保持されるという作用を有する。
【0012】
以下、本発明の一実施の形態について図面を用いて説明する。
図1は同実施の形態における接続端子付配線基板の斜視図、図2は同電子回路形成用加工導体板の斜視図、図3は同樹脂成形された配線基板の斜視図、図4は同接続端子曲げ加工の要部斜視図、そして図5は従来の接続端子曲げ加工の要部斜視図である。
【0013】
図1〜図3において、1は導体板であり、ニッケルや錫メッキなどの表面処理を行った銅あるいはその合金材やアルミ材でなり、本体などへの取付孔2、接続端子5となる接続端子部5a、必要な放熱に対応した形状と面積の搭載ランド10、そして枠部9などでなる電子回路を構成する配線パターン形状をプレス加工などにより形成している。
【0014】
4は成形樹脂体であり、熱伝導性のフィラーを含有した絶縁樹脂材料を使用して本体への取付ビスなどの逃げの取付欠け部3、電子部品8の外形面積よりやや大きいサイズの搭載穴部7、接続端子部5aを曲げ加工して接続端子5とする端子欠け部6を設けて射出成形などにより導体板1と一体成形している。
【0015】
電子部品8は電子回路を構成するためのチップ構造などの受動素子(抵抗、コンデンサ、インダクタ、機構部品など)や能動素子(トランジスタ、ダイオード、ICなど)あるいは複合素子であり、搭載穴部7の搭載ランド10に半田付けあるいは導電性で熱伝導性の接着剤により電気的かつ機械的に接続固定される。
【0016】
次に、製造方法について説明する。
まず、図2に示すように所定の配線パターン形状に加工し、また、取付孔2付近を完成した配線基板の下端面になるように同時あるいは後加工した導体板1を前記で説明した取付欠け部3、端子欠け部6、搭載穴部7を設けて成形樹脂体4で一体成形した後、図3に示すように不要な枠部9を切断分離する。
【0017】
次に、所定の電子部品8を所定の搭載穴部7の搭載ランド10に接続固定し、接続端子部5aを電子部品8側に所定角度、例えば90度などに曲げ加工して接続端子5とし配線基板を完成するものである。
【0018】
次に、接続端子5を製作する曲げ加工について説明する。図5は一般的な曲げ加工例を示したものであり、接続端子部5bをEの位置で矢印方向に所定角度曲げ加工する時、接続端子部5bの上面を除く両側面と下面が成形樹脂体4と密着しているために曲げ加工における抵抗が大きく、所定の形状や位置に精度良く曲げ加工して接続端子5とすることが困難であるが、本発明では図4に示すように、導体板1と成形樹脂体4との一体化射出成形時などに金型に設けた凸状部により、絶縁および絶縁耐圧に必要な沿面距離の距離Cと、接続端子部5aと成形樹脂体4との密着を防止する距離B(例えば接続端子部5aの幅の0.5〜2倍など)でなる端子欠け部6を設け、上記接続端子部5aを位置Aで矢印方向に所定角度(例えば90度)曲げ加工して端面距離Dを持つ接続端子5を形成するようにしているため、接続端子部5a付近に成形樹脂体4がなく、また、上面および両側面が成形樹脂体4と密着してないために接続端子部5a付近の成形樹脂体4のわれ、かけの発生がなく、曲げ加工の力も小さく、かつ、曲げ精度がよいものである。
【0019】
【発明の効果】
以上のように本発明によれば、別部品が不要で、かつ機械的強度や位置決め精度の優れた外部との接続端子が得られ、品質の向上、生産コストの低減を図ることが可能になるという有利な効果が得られる。
【図面の簡単な説明】
【図1】本発明の一実施の形態における接続端子付配線基板の斜視図
【図2】同電子回路形成用加工導体板の斜視図
【図3】同樹脂成形された配線基板の斜視図
【図4】同接続端子曲げ加工の要部斜視図
【図5】接続端子曲げ加工の一般的な例を示す要部斜視図
【図6】従来の接続端子付配線基板の斜視図
【図7】同要部の断面図
【符号の説明】
1 導体板
2 取付孔
3 取付欠け部
4 成形樹脂体
5 接続端子
5a,5b,5c 接続端子部
6 端子欠け部
6a 端子欠け部
7 搭載穴部
8 電子部品
9 枠部
10 搭載ランド[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a wiring board with connection terminals used in various electronic devices, particularly power circuits such as inverters and power supply circuits.
[0002]
[Prior art]
In recent years, high-density mounting of electronic components has been required due to the downsizing, high functionality, and combination of electronic devices, and the heat generated by the electronic components used affects the reliability and life of the electronic components in the vicinity. Can be given.
[0003]
Therefore, a wiring board on which electronic components are mounted using a heat conductive metal plate that also serves as heat radiation is used.
[0004]
Hereinafter, a conventional wiring board with connection terminals will be described with reference to the drawings.
6 is a perspective view of a conventional wiring board with connection terminals, FIG. 7 is a cross-sectional view of the main part thereof, and in FIGS. 6 and 7, 11 is an electronic component mounted to form an electronic circuit, and 12 is Conductor foil for forming a wiring pattern for constituting an electronic circuit, 14 is a plate-like base metal made of a heat conductive material provided with heat radiating fins 16 on one side, and 13 separates and insulates the
[0005]
[Problems to be solved by the invention]
However, in the conventional wiring board with connection terminals, the
[0006]
An object of the present invention is to provide a wiring board with connection terminals that has connection terminals with excellent mechanical strength and positioning accuracy and can reduce production costs.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention forms and integrates a conductive plate made of a metal material on which a wiring pattern constituting an electronic circuit is formed and a molded resin body made of a resin material containing a filler. In the wiring board that is mounted and connected, the upper surface and both side surfaces of the part to bend the connection terminal with the outside are exposed without being in close contact with the molded resin body, and the creepage necessary for the predetermined insulation from the end surface of the molded resin body The wiring board with connection terminals is formed into an integrated structure by a part of the conductor plate, which is bent at a distance position and raised on the electronic component mounting side.
[0008]
According to the present invention, a connection terminal having excellent mechanical strength and positioning accuracy that does not require a separate part can be obtained, and the production cost can be reduced.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
According to the first aspect of the present invention, the upper surface and both side surface portions of the portion to be bent at the creepage distance position required for predetermined insulation are brought into close contact with the molded resin body from the end surface of the molded and integrated molded resin body. It is a wiring board with connection terminals that is exposed and bent and is connected to the outside that is raised on the electronic component mounting side, providing positional accuracy in bending and no damage to the molded resin body In addition to this action , the insulation is maintained.
[0012]
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 is a perspective view of a wiring board with connection terminals in the same embodiment, FIG. 2 is a perspective view of a processed conductor plate for forming an electronic circuit, FIG. 3 is a perspective view of the resin-molded wiring board, and FIG. FIG. 5 is a perspective view of the main part of the connecting terminal bending process, and FIG. 5 is a perspective view of the main part of the conventional connecting terminal bending process.
[0013]
1 to 3, reference numeral 1 denotes a conductor plate, which is made of copper or its alloy material or aluminum material subjected to surface treatment such as nickel or tin plating, and is connected to a mounting hole 2 and a connection terminal 5 to the main body. A wiring pattern shape constituting an electronic circuit including the
[0014]
4 is a molded resin body, which uses an insulating resin material containing a thermally conductive filler, and has a mounting hole 3 that is slightly larger than the outer area of the electronic component 8 and the mounting missing portion 3 of the escape screw such as a mounting screw to the main body. The part 7 and the
[0015]
The electronic component 8 is a passive element (resistor, capacitor, inductor, mechanism component, etc.) such as a chip structure for constituting an electronic circuit, an active element (transistor, diode, IC, etc.) or a composite element. The mounting
[0016]
Next, a manufacturing method will be described.
First, as shown in FIG. 2, the conductor plate 1 processed into a predetermined wiring pattern shape and simultaneously or post-processed so that the vicinity of the mounting hole 2 becomes the lower end surface of the completed wiring board is not attached as described above. After providing the part 3, the terminal chip part 6, and the mounting hole part 7 and integrally molding with the molded
[0017]
Next, the predetermined electronic component 8 is connected and fixed to the mounting
[0018]
Next, the bending process for manufacturing the connection terminal 5 will be described. FIG. 5 shows an example of a general bending process. When the
[0019]
【The invention's effect】
As described above, according to the present invention, it is possible to obtain an external connection terminal that does not require a separate part and has excellent mechanical strength and positioning accuracy, and can improve quality and reduce production costs. The advantageous effect is obtained.
[Brief description of the drawings]
FIG. 1 is a perspective view of a wiring board with connection terminals according to an embodiment of the present invention. FIG. 2 is a perspective view of a processed conductive board for forming an electronic circuit. FIG. 4 is a perspective view of a main part of the connection terminal bending process. FIG. 5 is a perspective view of a main part showing a general example of the connection terminal bending process. FIG. 6 is a perspective view of a conventional wiring board with connection terminals. Sectional view of the same part [Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Conductor plate 2 Mounting hole 3
Claims (1)
成形し一体化した成形樹脂体の端面から、所定絶縁に必要な沿面距離位置にて曲げ加工する部分の上面および両側面部を成形樹脂体と密着せずに露出させた外部との接続端子とする接続端子付配線基板。A conductor plate made of a metal material on which a wiring pattern constituting an electronic circuit is formed and a molded resin body made of a filler and a resin material are molded and integrated, and an external connection terminal is integrated by a part of the conductor plate. In the wiring board with connection terminals ,
From the end surface of the molded and integrated molded resin body, the upper surface and both side surfaces of the portion to be bent at the creepage distance position required for predetermined insulation are used as external connection terminals that are exposed without being in close contact with the molded resin body. Wiring board with connection terminals.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11343896A JP3629811B2 (en) | 1996-05-08 | 1996-05-08 | Wiring board with connection terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11343896A JP3629811B2 (en) | 1996-05-08 | 1996-05-08 | Wiring board with connection terminal |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH09298344A JPH09298344A (en) | 1997-11-18 |
JP3629811B2 true JP3629811B2 (en) | 2005-03-16 |
Family
ID=14612236
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11343896A Expired - Lifetime JP3629811B2 (en) | 1996-05-08 | 1996-05-08 | Wiring board with connection terminal |
Country Status (1)
Country | Link |
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JP (1) | JP3629811B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6870244B2 (en) | 2000-12-27 | 2005-03-22 | Matsushita Electric Industrial Co., Ltd. | Lead frame and production process thereof and production process of thermally conductive substrate |
KR101537319B1 (en) * | 2009-05-20 | 2015-07-16 | 한국단자공업 주식회사 | Metal core PCB |
JP2011187777A (en) * | 2010-03-10 | 2011-09-22 | Panasonic Corp | Insulated heat dissipating substrate |
JP5590713B2 (en) * | 2010-06-03 | 2014-09-17 | 矢崎総業株式会社 | Wiring board and manufacturing method thereof |
JP5848890B2 (en) * | 2010-06-03 | 2016-01-27 | 矢崎総業株式会社 | Multilayer wiring board and manufacturing method thereof |
CN102271459B (en) | 2010-06-03 | 2014-09-24 | 矢崎总业株式会社 | Wiring substrate and manufacturing method thereof |
JP6464697B2 (en) * | 2014-11-27 | 2019-02-06 | 東芝ライテック株式会社 | LIGHTING DEVICE FOR VEHICLE AND LIGHT |
-
1996
- 1996-05-08 JP JP11343896A patent/JP3629811B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH09298344A (en) | 1997-11-18 |
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