CN108533986A - The packaging method and encapsulating mould of LED light source - Google Patents
The packaging method and encapsulating mould of LED light source Download PDFInfo
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- CN108533986A CN108533986A CN201810610188.XA CN201810610188A CN108533986A CN 108533986 A CN108533986 A CN 108533986A CN 201810610188 A CN201810610188 A CN 201810610188A CN 108533986 A CN108533986 A CN 108533986A
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- light source
- led light
- lower mold
- hole
- upper mold
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
This application discloses a kind of packaging method of LED light source and encapsulating mould, which includes：LED light source is fixed on to the upper edge of the sunk area of the lower mold of LED encapsulating moulds, wherein sunk area is used to house the electrical equipment of LED light source；At least one support portion is set in sunk area according to the layout of electrical equipment, to support LED light source；The upper mold of LED encapsulating moulds is fastened on lower mold, an enclosure space is formed with lower mold；Sealing space is evacuated by the both sides exhaust hole for being arranged in upper mold and lower mold opposite side, and exhaust hole is sealed by through-hole lid；Packaging plastic is filled to enclosure space by the hole for injecting glue of lower mold or/and upper mold；By packaging plastic curing molding.Damage when can effectively avoid fixing LED light source to component improves encapsulation yield.
Description
Technical field
The application LED display fields, more particularly to the packaging method and encapsulating mould of a kind of LED light source.
Background technology
The packaged type of LED light source on the market mainly has the direct insertion LED light of belt supporting frame, patch type SMD LED light at present
And integral LED module lamp.
Direct insertion LED light is made of luminescence chip, copper or iron material holder, epoxy resin, its main feature is that forming various, replacement
It is convenient, light emitting angle variation range is big, can do point light source, more whens, constitute die set light source or linear light source.Fixture LED lamp forms
Needed when module single inserting welding, install it is relatively complicated and of high cost.Patch type SMD LED light is a kind of packaging belt lead
Chip carrier, its main feature is that small, thin, application range is big；Encapsulation is secured, and good heat dissipation has higher reliability, thus obtains
Most commonly used application, such as by the LED light that encapsulates SMD on a display screen.But SMD LED light applies to display
It is directly exposed to outer when screen, therefore is inevitably likely to occur the case where being collided with, to solve the above-mentioned problems, mesh
The preceding method used is to carry out solidification sealing to SMD LED light to prevent single LED lamp from being collided with.
However, existing solidification sealing mode is that LED light source is being directly anchored on lower mold, it is easy to being mounted on
The component at the pcb board back side of the LED light source causes to damage.
Invention content
The application is mainly solving the technical problems that provide a kind of packaging method and encapsulating mould of LED light source, not only
Damage when can effectively avoid fixing LED light source to component improves encapsulation yield.
In order to solve the above technical problems, first technical solution that the application uses is：A kind of encapsulation of LED light source is provided
Method,
The packaging method includes：The LED light source is fixed on to the upper of the sunk area of the lower mold of LED encapsulating moulds
Edge, wherein the sunk area is used to house the electrical equipment of the LED light source；Existed according to the layout of the electrical equipment
At least one support portion of setting in the sunk area, to support the LED light source；By the upper mold of the LED encapsulating moulds
It is fastened on the lower mold, an enclosure space is formed with the lower mold；By being arranged in the upper mold and the lower die
The sealing space is evacuated by the both sides exhaust hole of tool opposite side, and is carried out to the exhaust hole by through-hole lid
Sealing；Packaging plastic is filled to the enclosure space by the hole for injecting glue of the lower mold or/and the upper mold；The wherein described note
Glue hole is arranged between the ambilateral exhaust hole of the upper mold；By the packaging plastic curing molding.
Wherein, at least one support portion is arranged in the sunk area in the layout according to the electrical equipment, with
The step of supporting the LED light source to carry out specifically includes：The support portion is passed through into any one of screw thread, magnet or buckle side
Formula is fixed on the sunk area bottom of the lower mold, to support the LED light source.
Wherein, the deep equality of the height of the support portion and the sunk area.
Wherein, the step of the upper edge of the sunk area of the lower mold that the LED light source is fixed on to LED encapsulating moulds
Further include before rapid：Judge the support portion whether is fixed in the sunk area；If be fixed in the sunk area
The support portion dismantles the support portion.
Wherein, the step of the upper edge of the sunk area of the lower mold that the LED light source is fixed on to LED encapsulating moulds
Suddenly it specifically includes：The LED light source is inserted into or is embedded in by the positioning column that will be arranged on the upper edge of the sunk area
In location hole, the LED light source is fixed on the lower mold of LED encapsulating moulds.
Wherein, the upper edge of the sunk area of the lower mold that the LED light source is fixed on to LED encapsulating moulds
The step of before further include：Non-sticking lining is coated in the inner surface of the upper mold or/and the lower mold.
Wherein, the non-sticking lining includes at least one of teflon coatings or ceramic coating.
Wherein, the upper mold by the LED encapsulating moulds is fastened on the lower mold, is formed with the lower mold
The step of one enclosure space, specifically includes：By the upper mold by being arranged in the ambilateral platform of the upper mold and the lower die
Tool contact is the upper mold to be fastened on the lower mold；It is described specifically to wrap the step of packaging plastic curing molding
It includes：The packaging plastic is heated by the heating through-hole on the lower mold by heating rod, so that the packaging plastic is solid
Chemical conversion type.
Wherein, the height of the platform of both sides is identical.
In order to solve the above technical problems, second technical solution that the application uses is：A kind of encapsulation of LED light source is provided
Mold,
The encapsulating mould includes upper mold and lower mold；The lower mold is used to place the middle part of the LED light source
It is formed with a sunk area, at least one support portion is provided in the sunk area, wherein the support portion removably connects
It is connected on the bottom of the sunk area, to be fixed on the lower mold LED light source described in rear support in the LED light source；
The both sides of the upper mold are provided with exhaust hole, and consistent with the exhaust hole size and quantity logical
Port lid, the upper mold at least partly fastens an envelope of formation with the lower mold completely when the exhaust hole is for injecting glue
Space is closed to vacuumize；The enclosure space is for housing the LED light source；The through-hole lid is used for after evacuation to the row
Vent hole is sealed；Be provided with hole for injecting glue between the ambilateral exhaust hole of upper mold, the hole for injecting glue for pair
The enclosure space fills packaging plastic；The side of the upper mold or/and the lower mold is provided with bottoming hole, for that will heat
Stick is inserted into the bottoming hole to be heated to the packaging plastic of injection.
The advantageous effect of the application is：It is different from the prior art, LED light source is fixed on LED encapsulation by present embodiment
The upper edge of the lower mold sunk area of mold, the electrical equipment of the LED light source is housed by the sunk area, can effectively be kept away
The electrical equipment at the pcb board back of hollow LED light source, lower mold is to above-mentioned electrical equipment after preventing upper mold from being fastened with lower mold
It causes to damage, at least one support portion is set in sunk area further according to the layout of the electrical equipment, to support LED light
Source can not only effectively avoid causing the pcb board of LED light source to deform the pressure of LED light source due to gravity or upper mold, and
The mode of fixed support portion again after LED light source fixes, the fixed position of support portion is more flexible, and it is electrical can to avoid setting
The position of element and the fixed position for flexibly selecting support portion, to avoid at least reducing the damage supported and brought to electrical equipment
Wound.
Description of the drawings
Fig. 1 is the flow diagram of one embodiment of the application packaging method；
Fig. 2 is the profile schematic diagram of one embodiment of the application encapsulating mould；
Fig. 3 is the structural schematic diagram that Fig. 2 encapsulating die encapsulatings complete latter embodiment；
Fig. 4 is the structural schematic diagram that one embodiment of LED light source after injecting glue is completed in Fig. 3；
Fig. 5 is the structural schematic diagram of LED light source depanning latter embodiment in Fig. 3.
Specific implementation mode
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of embodiments of the present application, instead of all the embodiments.It is based on
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment belongs to the range of the application protection.
LED light source, that is, LED source, in order to describe aspect, LED source is all referred to as LED by full text
Light source.Due to its brightness is big, little power consumption and be used widely, specifically include pcb board, be arranged on the pcb board and pass through
The LED lamp bead of the pcb board and driving chip coupling.Under normal circumstances, electrical equipment such as driving chip is separately set with LED lamp bead
Set the two sides opposite in pcb board.Single LED lamp integument of SMD LED light collides in order to prevent, and the application uses following institute
The mold shown carries out encapsulating solidification to the LED light source, under the premise of preventing the electrical equipment of LED light source impaired, improve life
Produce efficiency.
Specifically, as shown in Figure 1, Fig. 1 is the flow diagram of one embodiment of packaging method of the application LED light source.
The packaging method of present embodiment includes the following steps：
Step 101：The LED light source is fixed on to the upper edge of the sunk area of the lower mold of LED encapsulating moulds,
In, the sunk area is used to house the electrical equipment of the LED light source.
For the component at the pcb board back of empty avoiding LED light source, to above-mentioned first device after preventing upper mold from being fastened with lower mold
Part causes to damage, and in present embodiment, a sunk area is formed in the middle part of the LED light source for placing in lower mold, will
The LED light source is fixed on the upper edge of the sunk area of lower mold, and the electrical equipment being arranged on the downside of LED board is housed in
It states in sunk area.
In a specific embodiment, what which was used to carry the LED light source is additionally provided with positioning on one side
Column, the location hole that the positioning column is used to be inserted into the LED light source position the LED light source.Pass through positioning column and LED
The location hole of the pcb board of light source corresponds engaging, and fixed, and LED light source is fixed in sunk area by the pcb board.
Step 102：At least one support portion is set in the sunk area according to the layout of the electrical equipment, with branch
Support the LED light source.
Specifically, which is fixed on this by any dismountable mode mode in screw thread or magnet or buckle
The bottom of sunk area, for supporting the LED light source.
By the way that again by way of fixed support portion, the fixed position of support portion is more flexible, can after fixing LED light source
The fixed position that support portion is flexibly selected to avoid the position of setting electrical equipment, to avoid at least reducing to electrical equipment
The damage supported and brought.
Wherein, the quantity of the support portion does not limit, and can only select one as needed, or and it is multiple, such as 4,
In practical applications, it can suitably be increased or decreased according to the layout of electrical equipment.
Preferably, when the quantity of support portion is multiple, the deep equality of the height of the support portion and the sunk area.
In other embodiments, sometimes before being fixed on LED light source on the lower mold, support portion has been fixed
In the bottom of sunk area, first the support portion in sunk area is dismantled at this time, then step 101 is being executed, to keep away
Exempt from the damage that support portion brings LED light source.
Step 103：The upper mold of the LED encapsulating moulds is fastened on the LED light source, is formed with the lower mold
One enclosure space.
By upper mold being fastened on the lower mould profile for fixing LED lamp source, then fixed support portion, then by upper mold
Tool fastens the mode of lower mold, can effectively improve production efficiency.
Further, in order to preferably place LED light source, so as not to cause when fastening upper mold to the LED light source
It damages, in present embodiment, platform is arranged in the both sides in the one side opposite with lower mold of upper mold.By the way that upper mold is set
It sets and is contacted with lower mold the upper mold to be fastened on the lower mold in the ambilateral platform of upper mold.
Preferably, the platform of the both sides is highly consistent, not tight to prevent upper mold and lower mold from fastening.The thickness of the platform
Degree adds the general thickness of LED lamp bead more than the pcb board of the LED light source.In one preferred embodiment, in order to reduce
Upper mold and lower mold fasten after overall volume, the thickness of the platform is not easy to blocked up, is slightly larger than the pcb board of the LED light source
In addition the general thickness of LED lamp bead, the i.e. thickness of platform and the pcb board of the LED light source and the difference of the general thickness of LED lamp bead
Value is less than preset value.The preset value can sets itself according to actual needs, do not limit herein.
In addition, the inner surface of upper mold or/and lower mold is also coated with the non-sticking linings such as teflon coatings or ceramic coating,
In other embodiments, function cannot can not also be realized viscously to the inner surface chromium plating process of upper mold or/and lower mold.
Step 104：It will be described in the both sides exhaust hole of the upper mold and the lower mold opposite side by being arranged
Sealing space is evacuated, and is sealed to the exhaust hole by through-hole lid；Wherein, the through-hole lid size and number
Amount is consistent with the exhaust hole.
In such a way that above-mentioned gas vent vacuumizes, follow-up injecting glue process and heating process is made all to carry out in a vacuum,
It can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.
Preferably, in order to be vented faster, also for the beauty for keeping the encapsulating mould, which is arranged at this
The downside of upper mold.It does not limit herein.In addition, diameter of the size of the exhaust hole also with general exhaust pipe matches.
In one preferred embodiment, the diameter of the exhaust hole is slightly larger than the diameter of vacuum tube.
In present embodiment, to the confined space carry out vacuum pumping after, by through-hole lid to all exhaust holes into
Row sealing.
Step 105：Packaging plastic is filled to the enclosure space by the hole for injecting glue of the upper mold；The wherein described hole for injecting glue
It is arranged between the ambilateral exhaust hole of the upper mold.
Wherein, which is liquid glue.
Specifically, the centre position of the ambilateral exhaust hole of upper mold is provided with hole for injecting glue, in order to improve the efficiency of injecting glue,
The quantity of the hole for injecting glue is also multiple, which can also arrange at line at array arrangement, also with the shape of the upper mold
Shape is at other regular or irregular figure arrangements.The diameter of the hole for injecting glue also match with the diameter of general injected rubber hose and
Slightly larger than the diameter of injected rubber hose, do not limit herein.
Step 106：By the packaging plastic curing molding.
After the completion of injecting glue, the packaging plastic is heated by the heating through-hole on the lower mold using heating rod, is made
The packaging plastic curing molding.
Specifically, since LED light source is in order to realize that encapsulation, the glue in general lower mold need to be maintained at heated condition,
And liquid is kept when not being packaged.And it is in the prior art lamp bead is fixed on pcb board, be inverted pcb board invade lower die
Tool is in the glue of heating and melting, and upper mold control fastening in pressure, after glue solidification, taking-up is demoulded again, completes filling
The mode of glue cannot freeze rapidly, not only time-consuming longer, but also deformation occur also due to expanding with heat and contract with cold.
To solve the above-mentioned problems, in present embodiment, upper mold or/and lower mold are additionally provided with multiple bottoming holes.It should
It is that packaging plastic heats that bottoming hole, which is for placing heating rod,.The depth of bottoming hole is generally determined with the length of corresponding heating rod
It is fixed.The diameter of the bottoming hole be not easy it is excessive, in order to avoid cause heating rod conduct the unbalanced situation of heat；Be not easy to it is too small, otherwise
The slightly larger heating rod of diameter may be failed to lay down, and the lower mold is caused not have the problem of versatility.
Patch is encapsulated in order to prevent draws component and occur by striker situation occurs when mounting can not by chip mounter
Therefore the case where completion, increases for auxiliary production plug-in unit limp on pcb board both sides or four sides, welds the technique edges of wave crest,
The width of the technique edges was not easy to money, usually 1.5~5 millimeters.Therefore it is to carry after the LED light source after solidification being taken out
The semi-finished product of technique edges, and accurate cutting is carried out to be molded to the LED light source after the solidification, that is, the technique edges are cut off, LED is obtained
Light source finished product.
It is different from the prior art, LED light source is fixed on to the lower mold sunk area of LED encapsulating moulds in present embodiment
Upper edge, the electrical equipment of the LED light source is housed by the sunk area, is capable of the pcb board back of effectively empty avoiding LED light source
Electrical equipment, lower mold causes to damage to above-mentioned electrical equipment after preventing upper mold and lower mold from fastening, further according to described
At least one support portion is arranged in the layout of electrical equipment in sunk area, to support LED light source, can not only effectively avoid by
Cause the pcb board of LED light source to deform the pressure of LED light source in gravity or upper mold, and LED light source fix after it is solid again
Determine the mode of support portion, the fixed position of support portion is more flexible, can avoid the position of setting electrical equipment and flexibly select
The fixed position of support portion, to avoid at least reducing the damage supported and brought to electrical equipment.
In addition, by the way that the both sides exhaust hole in the upper mold and the lower mold opposite side is arranged by the sealing
Space is evacuated, and is sealed to the exhaust hole by through-hole lid, makes follow-up injecting glue process and heating process all
It carries out in a vacuum, can effectively avoid air bubble occur during packing colloid, improve encapsulation yield.Pass through the upper mold
Hole for injecting glue packaging plastic is filled to the enclosure space；The wherein described hole for injecting glue is arranged in the ambilateral exhaust of the upper mold
Between through-hole, keeps injecting glue process more convenient, further increase production efficiency.
Referring to Fig.2, Fig. 2 is the structural schematic diagram of one embodiment of the application encapsulating mould.As shown in Fig. 2, the application
Dies with epoxy compound includes upper mold 201 and lower mold 202.201 both sides of upper mold are provided with exhaust hole 2011.Preferably, it is
The exhaust hole is arranged in the side on 201 both sides of the upper mold also for the beauty for keeping the encapsulating mould for faster exhaust
Face does not limit herein.In addition, diameter of the size of the exhaust hole 2011 also with general exhaust pipe matches.It is excellent at one
In the embodiment of choosing, the diameter of the exhaust hole 2011 is slightly larger than the diameter of vacuum tube.
It is right after preventing upper mold 201 from being fastened with lower mold 202 for the electrical equipment at the pcb board back of empty avoiding LED light source
Above-mentioned electrical equipment causes to damage, and in present embodiment, in lower mold 202, for placing, that one is formed in the middle part of LED light source is recessed
Region 2022 is fallen into, is provided with support portion 2023 in the sunk area 2022, support portion 2023 is removably attachable to the recess
The bottom in region 2022, to be fixed on the lower mold 202 LED light source described in rear support in the LED light source.
Wherein, which is fixed on by any dismountable mode mode in screw thread or magnet or buckle
The bottom of the sunk area 2022, for supporting the LED light source.
In specific Application Example, LED light source is first fixed on to the depressed area of the lower mold 202 of LED encapsulating moulds
The upper edge in domain, it is at least one being arranged in the sunk area 2022 according to the layout of the electrical equipment on the downside of LED light source
Support portion 2023, to support the LED light source.
By the way that again by way of fixed support portion, the fixed position of support portion is more flexible, can after fixing LED light source
The fixed position that support portion is flexibly selected to avoid the position of setting electrical equipment, to avoid at least reducing to electrical equipment
The damage supported and brought.
Wherein, the quantity of the support portion 2023 does not limit, and can only select one as needed, or and it is multiple, such as 4
It is a, in practical applications, can suitably it be increased or decreased according to the layout of electrical equipment.
Preferably, when the quantity of support portion 2023 is multiple, the height of the support portion 2023 and the sunk area
Deep equality.
In any of the above-described embodiment, what which was used to carry the LED light source is additionally provided with positioning on one side
Column 2024, the location hole that the positioning column 2024 is used to be inserted into the LED light source position the LED light source.Wherein, should
The quantity of positioning column 2024 is 4.
In addition, the inner surface of upper mold 201 or/and lower mold 202 is also coated with teflon coatings or ceramic coating etc. no
Adhesive coating layer in other embodiments can also realize the inner surface chromium plating process of upper mold 201 or/and lower mold 202
Do not glue function.
In addition, the centre position between the exhaust hole 2011 of 201 both sides of upper mold is provided with hole for injecting glue 2012, in order to carry
The quantity of the efficiency of high injecting glue, the hole for injecting glue 2012 is also multiple, which can also arrange at array arrangement at line,
Also with the upper mold 201 shape at other rule or irregular figure arrangement.The diameter of the hole for injecting glue 2012
Also match with the diameter of general injected rubber hose and slightly larger than the diameter of injected rubber hose, do not limit herein.
Since LED light source is in order to realize that encapsulation, the glue in general lower mold need to be maintained at heated condition when packaged,
And liquid is kept when not being packaged.And it is in the prior art lamp bead is fixed on pcb board, be inverted pcb board invade lower die
Tool is in the glue of heating and melting, and upper mold control fastening in pressure, after glue solidification, taking-up is demoulded again, completes filling
The mode of glue cannot freeze rapidly, not only time-consuming longer, but also deformation occur also due to expanding with heat and contract with cold.
To solve the above-mentioned problems, in present embodiment, the side that upper mold 201 or/and lower mold 202 are arranged is also set up
There is bottoming hole.In one preferred embodiment, to accelerate the speed of heating, upper mold 201 or/and lower mold 202 are set
The side set is respectively provided with bottoming hole.Further as shown in Fig. 2, lower mold 202 is additionally provided with multiple bottoming holes 2021, upper mold
201 side is provided with multiple bottoming holes 2014.The bottoming hole 2021 or 2014 is heated for packaging plastic for placing heating rod
's.The depth of bottoming hole is generally determined with the length of corresponding heating rod.The diameter of the bottoming hole be not easy it is excessive, in order to avoid cause
Heating rod conducts the unbalanced situation of heat；It is not easy to too small, otherwise may fail to lay down the slightly larger heating rod of diameter, and cause
The mold does not have the problem of versatility.
The mode that upper mold 201 in present embodiment mutually fastens compression molding with lower mold 202 can effectively improve
Production efficiency, and by the packaging plastic of bottoming hole pair heat mode of heating, can make packaging plastic rapidly be heated curing molding, one
As only a few minutes is needed to can be completed, compared to traditional naturally dry mode for needing hardening time a few houres, greatly shorten
Hardening time, further improve production efficiency.
Further, in order to preferably place LED light source, so as not to be caused when fastening upper mold 201 to the LED light source
Damage, in present embodiment, platform 2013 is arranged in the both sides in the one side opposite with lower mold 202 of upper mold 201.It is excellent
Selection of land, the platform 2013 of the both sides it is highly consistent, it is not tight to prevent upper mold 201 and lower mold 202 from fastening.The platform 2013
Thickness be more than the LED light source pcb board add LED lamp bead general thickness.In one preferred embodiment, in order to
Reduce the overall volume after upper mold 201 and lower mold 202 fasten, the thickness of the platform 2013 be not easy to it is blocked up, slightly larger than should
The pcb board of LED light source adds the general thickness of LED lamp bead, the i.e. pcb board and LED of the thickness of platform 2013 and the LED light source
The difference of the general thickness of lamp bead is less than preset value.The preset value can sets itself according to actual needs, do not limit herein.
In conjunction with the encapsulating mould in Fig. 2, in a specific embodiment, positioning column 2024 and LED light source are first passed through
The location hole of pcb board correspond engaging, and it is fixed, which is fixed on LED light source in sunk area 2023, so
Afterwards, at least one support portion 2023 is arranged in sunk area 2022 according to the layout of the electrical equipment, to support the LED
Light source.Then upper mold 201 is fastened on lower substrate 202 and the LED light source and forms a confined space.Passing through gas vent
2011 are evacuated the confined space, and air is again introduced into order to prevent, in present embodiment, are carried out to the confined space
After vacuum pumping, all exhaust holes 2011 are sealed by through-hole lid.It is logical using the hole for injecting glue 2012 on upper mold 201
It crosses injecting glue conduit and is pressed into packaging plastic to above-mentioned confined space, until the confined space fills.Wherein, which is liquid
Glue.After the completion of injecting glue, is heated using heating rod by heating through-hole 2021 or/and 2014 pairs of packaging plastics, make this
Packaging plastic curing molding.As shown in figure 3, LED light shown in the dotted line frame being formed between upper mold 301 and lower mold 302
Source 40.
Further, as shown in figure 4, the LED light source includes pcb board 401, the LED lamp bead 402 in pcb board both sides is set
And control chip 404, and the packaging plastic 403 that is covered in the LED lamp bead 402.
There is nothing by patch is encapsulated in generation striker situation when chip mounter draws electrical equipment and mounts in order to prevent
Therefore the case where method is completed increases the technique for assisting production plug-in unit limp to weld wave crest on pcb board both sides or four sides
Side, the width of the technique edges be not easy to it is wide, usually 1.5~5 millimeters, technique edges 405 as shown in Figure 4, therefore will solidification
The semi-finished product with technique edges 405 after rear LED light source takes out, and to the LED light source after the solidification carry out accurate cutting with
Molding, that is, cut off the technique edges, obtain LED light source finished product, as shown in Figure 5.
It is different from the prior art, LED light source is fixed on the lower mold sunk area of LED encapsulating moulds by present embodiment
Upper edge houses the electrical equipment of the LED light source by the sunk area, is capable of the pcb board back of effective empty avoiding LED light source
Electrical equipment, lower mold causes to damage to above-mentioned electrical equipment after preventing upper mold from being fastened with lower mold, further according to the electricity
At least one support portion is arranged in the layout of gas element in sunk area, to support LED light source, can not only effectively avoid due to
Gravity or upper mold cause the pcb board of LED light source to deform the pressure of LED light source, and LED light source fix after fix again
The fixed position of the mode of support portion, support portion is more flexible, can avoid the position of setting electrical equipment and flexibly select to prop up
The fixed position of support part, to avoid at least reducing the damage supported and brought to electrical equipment.
In addition, the both sides of upper mold are provided with exhaust hole, can and with the exhaust hole size and quantity one
The through-hole lid of cause, the exhaust hole is for vacuumizing the enclosure space；The through-hole lid is used for after evacuation to institute
It states exhaust hole to be sealed, so that follow-up injecting glue process and heating process is all carried out in a vacuum, can effectively avoid packaging plastic
Occur air bubble during body, improves encapsulation yield.In addition, being provided with injecting glue between the ambilateral exhaust hole of upper mold
Hole, the hole for injecting glue keep injecting glue process more convenient, further increase production effect for filling packaging plastic to the enclosure space
Rate.
It these are only presently filed embodiment, be not intended to limit the scope of the claims of the application, it is every to utilize the application
Equivalent structure or equivalent flow shift made by specification and accompanying drawing content is applied directly or indirectly in other relevant technologies
Field includes similarly in the scope of patent protection of the application.
Claims (10)
1. a kind of packaging method of LED light source, which is characterized in that the packaging method includes：
The LED light source is fixed on to the upper edge of the sunk area of the lower mold of LED encapsulating moulds, wherein the depressed area
Domain is used to house the electrical equipment of the LED light source；
At least one support portion is set in the sunk area according to the layout of the electrical equipment, to support the LED light
Source；
The upper mold of the LED encapsulating moulds is fastened on the lower mold, an enclosure space is formed with the lower mold；
The sealing space is pumped by the both sides exhaust hole for being arranged in the upper mold and the lower mold opposite side
Vacuum, and the exhaust hole is sealed by through-hole lid；
Packaging plastic is filled to the enclosure space by the hole for injecting glue of the lower mold or/and the upper mold；The wherein described note
Glue hole is arranged between the ambilateral exhaust hole of the upper mold；
By the packaging plastic curing molding.
2. packaging method according to claim 1, which is characterized in that the layout according to the electrical equipment is described
At least one support portion of setting in sunk area, to be specifically included the step of supporting the LED light source to carry out：
The support portion is fixed on to the sunk area bottom of the lower mold by any one of screw thread, magnet or buckle mode
Portion, to support the LED light source.
3. packaging method according to claim 1 or 2, which is characterized in that the height of the support portion and the depressed area
The deep equality in domain.
4. packaging method according to claim 1 or 2, which is characterized in that described that the LED light source is fixed on LED envelopes
Further include before the step of upper edge of the sunk area of the lower mold of die-filling tool：
Judge the support portion whether is fixed in the sunk area；
If being fixed with the support portion in the sunk area, the support portion is dismantled.
5. packaging method according to claim 1 or 2, which is characterized in that described that the LED light source is fixed on LED envelopes
The step of upper edge of the sunk area of the lower mold of die-filling tool, specifically includes：
Pass through the location hole of the positioning column insertion or the embedded LED light source that will be arranged on the upper edge of the sunk area
In, the LED light source is fixed on the lower mold of LED encapsulating moulds.
6. packaging method according to claim 1 or 2, which is characterized in that described to be fixed on the LED light source
Further include before the step of upper edge of the sunk area of the lower mold of LED encapsulating moulds：
Non-sticking lining is coated in the inner surface of the upper mold or/and the lower mold.
7. packaging method according to claim 6, which is characterized in that the non-sticking lining includes teflon coatings or ceramics
At least one of coating.
8. packaging method according to claim 1 or 2, which is characterized in that the upper mold by the LED encapsulating moulds
The step of being fastened on the lower mold, an enclosure space is formed with the lower mold specifically includes：
The upper mold is contacted with the lower mold in the ambilateral platform of the upper mold with by the upper mold by setting
It is fastened on the lower mold；
It is described to specifically include the step of packaging plastic curing molding：
The packaging plastic is heated by the heating through-hole on the lower mold by heating rod, so that the packaging plastic is solid
Chemical conversion type.
9. packaging method according to claim 8, which is characterized in that the height of the platform of both sides is identical.
10. a kind of encapsulating mould of LED light source, which is characterized in that the encapsulating mould includes upper mold and lower mold；It is described
Lower mold is formed with a sunk area for placing in the middle part of the LED light source, be provided in the sunk area at least one
Support portion, wherein the support portion is removably attachable to the bottom of the sunk area, to be fixed on institute in the LED light source
State LED light source described in rear support on lower mold；
The both sides of the upper mold are provided with exhaust hole, and the through-hole consistent with the exhaust hole size and quantity
Lid, the upper mold at least partly fastens a closing of formation with the lower mold completely when the exhaust hole is for injecting glue
Space vacuumizes；The enclosure space is for housing the LED light source；The through-hole lid is used for after evacuation to the exhaust
Through-hole is sealed；Hole for injecting glue is provided between the ambilateral exhaust hole of upper mold, the hole for injecting glue is used for institute
It states enclosure space and fills packaging plastic；The side of the upper mold or/and the lower mold is provided with bottoming hole, is used for heating rod
The bottoming hole is inserted into be heated to the packaging plastic of injection.
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| CN201810610188.XA CN108533986A (en) | 2018-06-13 | 2018-06-13 | The packaging method and encapsulating mould of LED light source |
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| CN201810610188.XA CN108533986A (en) | 2018-06-13 | 2018-06-13 | The packaging method and encapsulating mould of LED light source |
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| WO2021057323A1 (en) * | 2019-09-27 | 2021-04-01 | 王定锋 | Long lamp strip assembled from wavy led short lamp strips and manufacturing method |
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