CN107450692B - A kind of radiating structure of computer - Google Patents
A kind of radiating structure of computer Download PDFInfo
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- CN107450692B CN107450692B CN201710583472.8A CN201710583472A CN107450692B CN 107450692 B CN107450692 B CN 107450692B CN 201710583472 A CN201710583472 A CN 201710583472A CN 107450692 B CN107450692 B CN 107450692B
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- heat
- radiation rack
- heat radiation
- computer
- heat dissipation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention provides a kind of radiating structure of computer, it improves current simple copper pipe circulating type radiator structure, it can effectively improve heat dissipation effect, its heat radiation rack that three special construction shapes are set around fan, these three heat radiation racks heat exchange can the heat transfer by computer heat source device rapidly and efficiently gather at radiator fan, radiator fan can use high speed rotation and computer be discharged in air-flow, and special heat absorption component is set at computer heat source device, quickly the heat absorption of heat source device can be taken away, heat is discharged using fan, the cooling fan being adapted to therewith has also been devised in the present invention, radiator shutter can assist quickly absorbing and take away heat, it can guarantee heat dissipation effect.
Description
Technical field
The present invention relates to area of computer aided parts technical field, specially a kind of radiating structure of computer belongs to calculating
Machine hardware device technical field.
Background technique
Integrated circuit is largely used in machine element, it is well known that cause the heat of high temperature to be not from outside computer,
But computer-internal, or perhaps IC interior.Currently, computer radiator is exactly to pass through to connect with heat generating components surface
Touching absorbs heat, then transfers heat to by various methods, then cabinet by these
Hot-air passes to outside cabinet, completes the heat dissipation of computer.Wherein, due to the brain that CPU is computer, most common is exactly CPU
Radiator.According to the mode for taking away heat from radiator, radiator can be divided into active heat removal and passive heat dissipation.The former is often
What is seen is air-cooled radiator, and the latter it is common be exactly cooling fin.Radiating mode is further segmented, air-cooled, heat pipe can be divided into,
Liquid cooling, semiconductor refrigerating, compressor refrigeration etc..But at present for general common computer, wind-cooling heat dissipating is most
Common, and it is very simple, it is the heat taking away radiator using fan and being absorbed.This radiator has price opposite
It is lower, it installs the advantages that simple, but relatively high to condition depended, such as its heat dissipation performance will be big when temperature raising and overclocking
It is impacted.
Meanwhile the computation rate of computer steps up at present, this heat dissipation performance of computer is also required it is higher and higher,
And liquid cooling, the mode of refrigeration radiate that will lead to route sufficiently complex, increase computer volume, and current air-cooled heat dissipation is only
Using the simple structure of conventional fan and copper pipe, this radiator structure is too simple, and heat dissipation effect is very bad, seriously affects meter
Therefore calculation machine service life and computation rate in order to meet the cooling requirements of modern computer, need the radiator to computer
Structure into improvement, to improve its heat dissipation effect.
Based on the above technical problem, the present invention provides a kind of radiating structure of computer, to improve the heat dissipation of computer
Efficiency guarantees heat dissipation effect.
Summary of the invention
The object of the present invention is to provide a kind of structure novels, effectively improve a kind of computer heat dissipation of computer heat dissipation effect
Structure.
To achieve the above object, the present invention adopts the following technical scheme: a kind of radiating structure of computer comprising radiate out
Pneumatic module, heat conducting pipe and heat absorption component, wherein the heat source device-side of computer is arranged in the heat absorption component, described to radiate out
Pneumatic module is arranged at the heat release hole of computer, and described radiate is connected between pneumatic module out and the heat absorption component using heat conducting pipe
It connects, which is characterized in that the pneumatic module out that radiates includes heat radiation rack one, heat radiation rack two and heat radiation rack three, and the heat radiation rack one dissipates
Hot frame two and heat radiation rack three are U-shaped structure, and the heat radiation rack one is symmetricly set on the U-shaped of the heat radiation rack three with heat radiation rack two
Open side, and the heat radiation rack one is oppositely arranged with the open end of heat radiation rack two and the open side of the heat radiation rack three, it is described to dissipate
The medial axis of the bottom surface of the U-shaped structure of heat radiation rack one described in the side elevation face of the U-shaped structure of hot frame three or heat radiation rack two
Position, the side elevation of side and the leaning on for the U-shaped structure of heat radiation rack one of the close heat radiation rack three of the U-shaped structure of the heat radiation rack two
The short side elevation with the respective other side of the side elevation of the side of nearly heat radiation rack three, the heat radiation rack one, heat radiation rack two and dissipates
The region surrounded between hot frame three is provided centrally with cooling fan.
Further, preferably, the blade of the cooling fan be intensively be arranged it is multiple, and between two neighboring blade
Gap be less than the width of blade, the blade is made of Cu alloy material.
Further, preferably, the U-shaped structure of the heat radiation rack one, heat radiation rack two or heat radiation rack three with U-shaped opening phase
Pair bottom surface on the outside of be provided with multiple auxiliary heat dissipation columns, the end face of the auxiliary heat dissipation column is provided with auxiliary heat dissipation ball, described
The diameter of auxiliary heat dissipation ball is greater than the auxiliary heat dissipation column diameter, and the auxiliary heat dissipation ball and auxiliary heat dissipation column are all made of copper material
Material is made.
Further, preferably, being provided on the outside of the side elevation of the U-shaped structure of the heat radiation rack one and heat radiation rack two
The end face of multiple auxiliary heat dissipation columns, the auxiliary heat dissipation column is provided with auxiliary heat dissipation ball.
Further, preferably, being also equipped on the outside of the side elevation of the U-shaped structure of the heat radiation rack three multiple
The end face of auxiliary heat dissipation column, the auxiliary heat dissipation column is provided with auxiliary heat dissipation ball.
Further, preferably, the heat absorption component includes heat absorption conductive plate, thermally conductive connecting column and heat absorption conductive seat,
In, the side of the heat source device of computer is arranged in the heat absorption guide plate, and the both ends of the heat absorption guide plate, which are separately connected, to be provided with
The thermally conductive connecting column, the end of the thermally conductive connecting column are connected with heat absorption conductive seat, and the heat absorption conductive seat is along meter
The length direction of calculation machine heat source device is extended, and the outer surface of the heat absorption conductive seat is provided with arcuate relief structure.
Further, preferably, the outer surface of the heat absorption conductive seat is circular arcuate relief structure.
Further, preferably, the cross section of the heat absorption conductive seat is plum-shaped structure.
Further, preferably, the heat absorption conductive seat is hollow structure.
The beneficial effects of the present invention are:
A kind of radiating structure of computer provided by the invention changes current simple copper pipe circulating type radiator structure
Into, it can effectively improve heat dissipation effect, the heat radiation rack of three special construction shapes be set around fan, these three heat dissipations
The heat exchange of frame can the heat transfer by computer heat source device rapidly and efficiently gather at radiator fan, radiator fan can be with
Computer is discharged in air-flow using high speed rotation, and special heat absorption component is set at computer heat source device, it can be quick
The heat absorption of heat source device is taken away, heat is discharged using fan, the cooling fan being adapted to therewith has also been devised in the present invention,
Radiator shutter can assist quickly absorbing and take away heat, it is ensured that heat dissipation effect.
Detailed description of the invention
Fig. 1 is a kind of mounting arrangements structural schematic diagram of radiating structure of computer of the invention；
Fig. 2 is the structural schematic diagram of the pneumatic module out of radiating of the embodiment of the present invention one；
Fig. 3 is the structural schematic diagram of the pneumatic module out of radiating of the embodiment of the present invention two；
Fig. 4 is the structural schematic diagram of the pneumatic module out of radiating of the embodiment of the present invention three；
Fig. 5 is the structural schematic diagram of the pneumatic module out of radiating of the embodiment of the present invention four；
Fig. 6 is schematic diagram of main cross-sectional structure of the heat absorption component at heat source device of the invention；
Wherein, 1, radiate pneumatic module out, 2, heat conducting pipe, 3, heat absorption component, 4, heat radiation rack one, 5, heat radiation rack two, 6, heat dissipation
Frame three, 7, cooling fan, 8, auxiliary heat dissipation column, 9, auxiliary heat dissipation ball, 10, heat absorption conductive plate, 11, thermally conductive connecting column, 12, heat absorption
Heat-conducting seat, 13, heat source device.
Specific embodiment
Come to carry out detailed description to the present invention below in conjunction with attached drawing.It should be appreciated, however, that attached drawing has been provided only more
Understand the present invention well, they should not be interpreted as limitation of the present invention.
As shown in figures 1 to 6, the present invention provides a kind of radiating structure of computer comprising radiate pneumatic module 1, heat conducting pipe 2 out
With heat absorption component 3, wherein 13 side of heat source device of computer is arranged in the heat absorption component 1, and the pneumatic module 1 out that radiates is set
It sets at the heat release hole of computer, described radiate is connected between pneumatic module 1 out and the heat absorption component 3 using heat conducting pipe 2, special
Sign is, as shown in Fig. 2, the pneumatic module 1 out that radiates includes heat radiation rack 1, heat radiation rack 25 and heat radiation rack 36, the heat dissipation
Frame 1, heat radiation rack 25 and heat radiation rack 36 are U-shaped structure, and the heat radiation rack 1 is symmetricly set on described with heat radiation rack 25
The U-shaped opening side of heat radiation rack 36, and the opening of the open end and the heat radiation rack 36 of the heat radiation rack 1 and heat radiation rack 25
Side is oppositely arranged, the U-shaped knot of heat radiation rack one described in the side elevation face of the U-shaped structure of the heat radiation rack 36 or heat radiation rack 25
The medial axis position of the bottom surface of structure, the side elevation of the side of the close heat radiation rack 36 of the U-shaped structure of the heat radiation rack 25 with
The short side elevation with the respective other side of the side elevation of the side of the close heat radiation rack 36 of the U-shaped structure of heat radiation rack 1, institute
That states the region surrounded between heat radiation rack 1, heat radiation rack 25 and heat radiation rack 36 is provided centrally with cooling fan 7.
Wherein, in the present embodiment one, in order to improve the heat dissipation effect of cooling fan, the blade of the cooling fan is close
Collection is arranged multiple, and the gap between two neighboring blade is less than the width of blade, and the blade uses Cu alloy material system
At quickly heat being distributed in this way, the heat conduction and heat radiation effect of radiator shutter can be enhanced.
Such as Fig. 3, as more preferably embodiment two, the heat radiation rack 1, heat radiation rack 25 or heat radiation rack 36 it is U-shaped
Multiple auxiliary heat dissipation columns 8 are provided on the outside of the bottom surface opposite with U-shaped opening of structure, the end face of the auxiliary heat dissipation column 8 is set
It is equipped with auxiliary heat dissipation ball 9, the diameter of the auxiliary heat dissipation ball 9 is greater than 8 diameter of auxiliary heat dissipation column, the auxiliary heat dissipation ball 9
It is all made of copper material with auxiliary heat dissipation column 8 to be made, the heat dissipation heat-conducting effect of auxiliary can be enhanced with heat dissipation ball for thermal column, increase
The area of heat dissipation region.
As another more preferably embodiment three, in order to further enhance heat dissipation region, as shown in figure 4, the heat radiation rack
1 and heat radiation rack 25 U-shaped structure side elevation on the outside of be provided with multiple auxiliary heat dissipation columns 8, the auxiliary heat dissipation column 8
End face be provided with auxiliary heat dissipation ball 9.
As another more preferably example IV, in order to further enhance heat dissipation region, as shown in figure 5, described is described
Multiple auxiliary heat dissipation columns 8, the end face of the auxiliary heat dissipation column 8 are also equipped on the outside of the side elevation of the U-shaped structure of heat radiation rack 36
It is provided with auxiliary heat dissipation ball 9.
In the present embodiment, in order to guarantee that the transmitting of the absorption to computer heat source device portions heat is radiated, the heat absorption
Component includes heat absorption conductive plate 10, thermally conductive connecting column 11 and heat absorption conductive seat 12, wherein the setting of heat absorption guide plate 10 is calculating
The side of the heat source device 13 of machine, the both ends of the heat absorption guide plate 10, which are separately connected, is provided with the thermally conductive connecting column 11, described
The end of thermally conductive connecting column 11 is connected with heat absorption conductive seat 12, and the heat absorption conductive seat 12 is along computer heat source device 13
Length direction be extended, the outer surface of the heat absorption conductive seat is provided with arcuate relief structure.
In order to guarantee that the absorption to heat generated at heat source device distributes, the outer surface of the heat absorption conductive seat is circle
Arcuate relief structure, to improve endotherm area, further embodiment can be by the cross section of the heat absorption conductive seat
For plum-shaped structure, naturally it is also possible to be other shapes.In addition, the weight of radiator structure is reduced in order to guarantee surface area, it is described
Heat absorption conductive seat is hollow structure.
A kind of radiating structure of computer provided by the invention changes current simple copper pipe circulating type radiator structure
Into, it can effectively improve heat dissipation effect, the heat radiation rack of three special construction shapes be set around fan, these three heat dissipations
The heat exchange of frame can the heat transfer by computer heat source device rapidly and efficiently gather at radiator fan, radiator fan can be with
Computer is discharged in air-flow using high speed rotation, and special heat absorption component is set at computer heat source device, it can be quick
The heat absorption of heat source device is taken away, heat is discharged using fan, the cooling fan being adapted to therewith has also been devised in the present invention,
Radiator shutter can assist quickly absorbing and take away heat, it is ensured that heat dissipation effect.
The above embodiments are only used to illustrate the present invention, and not limitation of the present invention, in relation to the common of technical field
Technical staff can also make a variety of changes and modification without departing from the spirit and scope of the present invention, therefore all
Equivalent technical solution also belongs to scope of the invention, and scope of patent protection of the invention should be defined by the claims.
Claims (7)
1. a kind of radiating structure of computer comprising radiate pneumatic module, heat conducting pipe and heat absorption component out, wherein the heat absorption group
The heat source device-side of computer is arranged in part, and the pneumatic module out that radiates is arranged at the heat release hole of computer, described to radiate out
It is connected between pneumatic module and the heat absorption component using heat conducting pipe, which is characterized in that the pneumatic module out that radiates includes heat radiation rack
One, heat radiation rack two and heat radiation rack three, the heat radiation rack one, heat radiation rack two and heat radiation rack three are U-shaped structure, the heat radiation rack one
The U-shaped opening side of the heat radiation rack three, and the open end of the heat radiation rack one and heat radiation rack two are symmetricly set on heat radiation rack two
It is oppositely arranged with the open side of the heat radiation rack three, heat radiation rack one described in the side elevation face of the U-shaped structure of the heat radiation rack three
Or the medial axis position of the bottom surface of the U-shaped structure of heat radiation rack two, the close heat radiation rack three of the U-shaped structure of the heat radiation rack two
Side side elevation and the side of the close heat radiation rack three of the U-shaped structure of heat radiation rack one side elevation it is short with it is respective another
The side elevation of side, the region surrounded between the heat radiation rack one, heat radiation rack two and heat radiation rack three are provided centrally with cooling fan；
The blade of the cooling fan be intensively be arranged it is multiple, and the gap between two neighboring blade be less than blade width, institute
Blade is stated to be made of Cu alloy material；The U-shaped structure of the heat radiation rack one, heat radiation rack two or heat radiation rack three and U-shaped opening
Multiple auxiliary heat dissipation columns are provided on the outside of opposite bottom surface, the end face of the auxiliary heat dissipation column is provided with auxiliary heat dissipation ball, institute
The diameter for stating auxiliary heat dissipation ball is greater than the auxiliary heat dissipation column diameter, and the auxiliary heat dissipation ball and auxiliary heat dissipation column are all made of copper
Material is made.
2. a kind of radiating structure of computer according to claim 1, which is characterized in that the heat radiation rack one and heat radiation rack two
U-shaped structure side elevation on the outside of be provided with multiple auxiliary heat dissipation columns, the end face of the auxiliary heat dissipation column is provided with auxiliary
Radiate ball.
3. a kind of radiating structure of computer according to claim 2, which is characterized in that the U of the heat radiation rack three
Multiple auxiliary heat dissipation columns are also equipped on the outside of the side elevation of type structure, the end face of the auxiliary heat dissipation column is provided with auxiliary heat dissipation
Ball.
4. a kind of radiating structure of computer according to claim 1, which is characterized in that the heat absorption component includes that heat absorption is led
Hot plate, thermally conductive connecting column and heat absorption conductive seat, wherein the side of the heat source device of computer, institute is arranged in the heat absorption guide plate
The both ends for stating heat absorption guide plate, which are separately connected, is provided with the thermally conductive connecting column, and the end of the thermally conductive connecting column is connected with suction
Hot heat-conducting seat, the heat absorption conductive seat are extended along the length direction of computer heat source device, the heat absorption conductive seat
Outer surface is provided with arcuate relief structure.
5. a kind of radiating structure of computer according to claim 4, which is characterized in that the outer surface of the heat absorption conductive seat
For circular arcuate relief structure.
6. a kind of radiating structure of computer according to claim 5, which is characterized in that the cross section of the heat absorption conductive seat
For plum-shaped structure.
7. a kind of radiating structure of computer according to claim 6, which is characterized in that the heat absorption conductive seat is hollow knot
Structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710583472.8A CN107450692B (en) | 2017-07-18 | 2017-07-18 | A kind of radiating structure of computer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710583472.8A CN107450692B (en) | 2017-07-18 | 2017-07-18 | A kind of radiating structure of computer |
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| Publication Number | Publication Date |
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| CN107450692A CN107450692A (en) | 2017-12-08 |
| CN107450692B true CN107450692B (en) | 2019-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201710583472.8A Active CN107450692B (en) | 2017-07-18 | 2017-07-18 | A kind of radiating structure of computer |
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| CN2439103Y (en) * | 2000-09-06 | 2001-07-11 | 奇鋐股份有限公司 | Improvement of radiating fin structure |
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| CN2583600Y (en) * | 2002-12-05 | 2003-10-29 | 廖炎福 | Radiator |
| CN102376867A (en) * | 2011-08-26 | 2012-03-14 | 珠海市远康企业有限公司 | LED heat-conducting and radiating integrated forming device |
| CN203151920U (en) * | 2012-11-30 | 2013-08-21 | 北京航天测控技术有限公司 | Portable platform heat dissipation device |
| CN105005368A (en) * | 2015-07-17 | 2015-10-28 | 广东威创视讯科技股份有限公司 | Air cooling device |
| CN205401181U (en) * | 2016-02-23 | 2016-07-27 | 天津市福厚盈科技有限公司 | Computer radiator fan device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7184265B2 (en) * | 2003-05-29 | 2007-02-27 | Lg Electronics Inc. | Cooling system for a portable computer |
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2017
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2283888Y (en) * | 1997-01-06 | 1998-06-10 | 黄文良 | Radiating board for central processing unit |
| CN2374901Y (en) * | 1999-04-02 | 2000-04-19 | 富准精密工业(深圳)有限公司 | Computer radiating system |
| CN2439103Y (en) * | 2000-09-06 | 2001-07-11 | 奇鋐股份有限公司 | Improvement of radiating fin structure |
| CN2470871Y (en) * | 2001-02-19 | 2002-01-09 | 新渠热传导技术应用开发(大连)有限公司 | Directing heat-conductive radiating device of central processor |
| CN2583600Y (en) * | 2002-12-05 | 2003-10-29 | 廖炎福 | Radiator |
| CN102376867A (en) * | 2011-08-26 | 2012-03-14 | 珠海市远康企业有限公司 | LED heat-conducting and radiating integrated forming device |
| CN203151920U (en) * | 2012-11-30 | 2013-08-21 | 北京航天测控技术有限公司 | Portable platform heat dissipation device |
| CN105005368A (en) * | 2015-07-17 | 2015-10-28 | 广东威创视讯科技股份有限公司 | Air cooling device |
| CN205401181U (en) * | 2016-02-23 | 2016-07-27 | 天津市福厚盈科技有限公司 | Computer radiator fan device |
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| Publication number | Publication date |
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| CN107450692A (en) | 2017-12-08 |
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Effective date of registration: 20230727 Address after: 601, No. 239, Gaotang Road, Tianhe District, Guangzhou, Guangdong 510000 (office only) Patentee after: Guangzhou Hezhi Information Technology Co.,Ltd. Address before: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee before: Dragon totem Technology (Hefei) Co.,Ltd. Effective date of registration: 20230727 Address after: 230000 floor 1, building 2, phase I, e-commerce Park, Jinggang Road, Shushan Economic Development Zone, Hefei City, Anhui Province Patentee after: Dragon totem Technology (Hefei) Co.,Ltd. Address before: 723001 School of Mathematics and Computer Science, Shaanxi University of Technology, Hanzhong, Shaanxi Province (South Campus) Patentee before: Shaanxi University of Technology |
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