CN2283888Y - Radiating board for central processing unit - Google Patents
Radiating board for central processing unit Download PDFInfo
- Publication number
- CN2283888Y CN2283888Y CN 97200267 CN97200267U CN2283888Y CN 2283888 Y CN2283888 Y CN 2283888Y CN 97200267 CN97200267 CN 97200267 CN 97200267 U CN97200267 U CN 97200267U CN 2283888 Y CN2283888 Y CN 2283888Y
- Authority
- CN
- China
- Prior art keywords
- central processing
- processing unit
- plate body
- fan
- heat sink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a radiating board for a central processing unit, which enhances heat radiation property. The radiating board for a central processing unit comprises a board body and a fan. The radiating board for a central processing unit is characterized in that the center of the board body is provided with a circular space which is matched with the fan and integrally inlaid, the fan is arranged on the center of the board body, and the board body of the periphery of the circular space is provided with cylindrical radiating posts which are consubstantial and perpendicular to the board body. Gaps between the cylindrical radiating posts form paths used for circuitous air-exhausting. The utility model is used for central processing units.
Description
The utility model relates to heat sink, refers in particular to the heat sink of a kind of CPU (central processing unit) of structure through having improved.
Have CPU (central processing unit) heat sink A now as shown in Figure 3: it is on high-thermal conductive metal plate body B, be provided with the multi-disc parallel vertical in metal plate B and be the heat radiator C of consubstantiality,, improve radiating effect to increase area of dissipation, and on multi-disc heat radiator C, establish cooling fan D, to promote air velocity.But this structural design, because heat radiator C is arranged in parallel, the wind of cooling can only be discharged at passage E two ends between heat radiator C, the orthogonal direction is then hindered by heat radiator C therewith, can't discharge, and therefore influences radiating effect.And the CPU (central processing unit) thermal value is surprisingly big, and surface temperature often reaches more than 80 ℃, must cooling maintain below 50 ℃, and this cooling plate structure has been difficult to reach.
The purpose of this utility model provides the comparatively good CPU (central processing unit) heat sink of a kind of radiating effect.
The utility model purpose is achieved in that the CPU (central processing unit) heat sink, and it comprises plate body, fan, it is characterized in that: be provided with the circular space that cooperates the whole setting-in of fan in plate body central authorities, plate body central authorities are provided with fan; Be provided with on the plate body around the circular space perpendicular to plate body and with the cylindrical thermal column of plate body consubstantiality.Gap between cylindrical thermal column forms the passage of circuitous air draft.
Above-mentioned design utilizes many cylindrical thermal columns on the plate body that circular space Zhou Chongchong is surrounded, and in order to directly increasing the heat sink area of dissipation down with the wind, thereby has reached the effect that the heat sink radiating effect greatly improves.
Below by drawings and Examples the utility model is described further again.
Fig. 1 the utility model stereoscopic synoptic diagram;
Schematic perspective view behind Fig. 2 the utility model setting-in cooling fan;
Fig. 3 is existing CPU (central processing unit) heat sink synoptic diagram;
As Fig. 1, shown in 2: the utility model comprises plate body 2, fan 3; Heat sink 1 is formed by the high thermal conductivity alloy die casting, and its plate body 2 can be various suitable shapes, and the plate body 2 of present embodiment is square for cooperating CPU (central processing unit), and its plate body 2 central authorities are provided with the circular space 4 that cooperates fan 3 whole setting-ins, in order to setting-in cooling fan 3.On the plate body 2 around this circular space 4, be provided with a plurality ofly perpendicular to plate body 2, and be the cylindrical thermal column 5 of plate body 2 consubstantialities, with heavy surrounding around the circular space 4, in order to directly to increase the area that heat sink 1 dispels the heat down with the wind.The gap that cylindrical thermal column is 5, the passage 6 of many circuitous air drafts of formation passes through in order to the air draft of air feed fan 3, enters in heat sink 1 air all around.Air draft simultaneously also walks to obtain to reduce its temperature with the torrid zone of each cylindrical thermal column 5.So when cooling fan 3 running, the direct circular space 4 of cooling heat dissipation plate 1 not only, a plurality of cylindrical thermal column 5 of cooling heat dissipation plate 1 simultaneously, and make whole heat sink 1 reduce its temperature.
Heat sink 1 sampling device of the present utility model is tested to replace having heat sink A now in existing heat sink A position, main frame used under the identical time, the temperature-averaging value on CPU (central processing unit) surface will use existing heat sink A to reduce by 3.5 ℃-5.5 ℃, proof really can reach desired effect, has to utilize very much to be worth.
Claims (3)
1, CPU (central processing unit) heat sink, it comprises plate body, fan, it is characterized in that: be provided with the circular space that cooperates the whole setting-in of fan in plate body central authorities, plate body central authorities are provided with fan; Be provided with on the plate body around the circular space perpendicular to plate body and with the cylindrical thermal column of plate body consubstantiality.
2, CPU (central processing unit) heat sink as claimed in claim 1 is characterized in that: plate body is square.
3, CPU (central processing unit) heat sink as claimed in claim 1, it is characterized in that: the gap between cylindrical thermal column forms circuitous air exhaust passage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97200267 CN2283888Y (en) | 1997-01-06 | 1997-01-06 | Radiating board for central processing unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97200267 CN2283888Y (en) | 1997-01-06 | 1997-01-06 | Radiating board for central processing unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2283888Y true CN2283888Y (en) | 1998-06-10 |
Family
ID=33921962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97200267 Expired - Fee Related CN2283888Y (en) | 1997-01-06 | 1997-01-06 | Radiating board for central processing unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2283888Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106319184A (en) * | 2016-10-26 | 2017-01-11 | 常熟纺织机械厂有限公司 | Clamp structure for heat treatment of signal swing arm |
| CN107426942A (en) * | 2016-05-24 | 2017-12-01 | 罗伯特·博世有限公司 | For cooling down the cooling body of electronic structure element |
| CN107450692A (en) * | 2017-07-18 | 2017-12-08 | 陕西理工大学 | A kind of radiating structure of computer |
| CN108575074A (en) * | 2017-03-09 | 2018-09-25 | 德尔福国际业务卢森堡公司 | Electronic equipment for motor vehicles |
-
1997
- 1997-01-06 CN CN 97200267 patent/CN2283888Y/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107426942A (en) * | 2016-05-24 | 2017-12-01 | 罗伯特·博世有限公司 | For cooling down the cooling body of electronic structure element |
| CN107426942B (en) * | 2016-05-24 | 2020-12-04 | 罗伯特·博世有限公司 | Cooling body for cooling electronic components and method for producing the same |
| CN106319184A (en) * | 2016-10-26 | 2017-01-11 | 常熟纺织机械厂有限公司 | Clamp structure for heat treatment of signal swing arm |
| CN108575074A (en) * | 2017-03-09 | 2018-09-25 | 德尔福国际业务卢森堡公司 | Electronic equipment for motor vehicles |
| CN108575074B (en) * | 2017-03-09 | 2020-06-02 | 德尔福国际业务卢森堡公司 | Electronic assembly |
| CN107450692A (en) * | 2017-07-18 | 2017-12-08 | 陕西理工大学 | A kind of radiating structure of computer |
| CN107450692B (en) * | 2017-07-18 | 2019-07-05 | 陕西理工大学 | A kind of radiating structure of computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |