CN2842730Y - Lower-blowing type radiation apparatus - Google Patents
Lower-blowing type radiation apparatus Download PDFInfo
- Publication number
- CN2842730Y CN2842730Y CN 200520109971 CN200520109971U CN2842730Y CN 2842730 Y CN2842730 Y CN 2842730Y CN 200520109971 CN200520109971 CN 200520109971 CN 200520109971 U CN200520109971 U CN 200520109971U CN 2842730 Y CN2842730 Y CN 2842730Y
- Authority
- CN
- China
- Prior art keywords
- heat
- heat radiation
- pipe
- fan
- fins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000007664 blowing Methods 0.000 title claims abstract description 16
- 230000005855 radiation Effects 0.000 title abstract description 34
- 238000010438 heat treatment Methods 0.000 claims abstract description 19
- 238000009833 condensation Methods 0.000 claims description 10
- 230000005494 condensation Effects 0.000 claims description 9
- 230000017525 heat dissipation Effects 0.000 claims description 7
- 230000000994 depressogenic effect Effects 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011469 building brick Substances 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 241000883990 Flabellum Species 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a lower blowing type heat radiation device arranged on a processor of a main board of a computer. The utility model comprises a heat pipe radiator and a heat radiation fan, wherein the heat pipe radiator comprises a heat radiation fin group, a heat pipe and a fan cover. The heat pipe is provided with a heating end and a condensing end. The condensing end is connected in series on the heat radiation fin group. A heat radiation channel is formed between the heat radiation fin group and the heating end of the heat pipe. The fan cover surrounds outside the heat radiation fin group and the condensing end of the heat pipe, and the fan cover is fixedly arranged outside the heat radiation fin group and the condensing end of the heat pipe. The heat radiation fan is fixedly arranged at the upper part of the heat pipe radiator. Air current blown by the heat radiation fan passes through the inner parts of the heat radiation fin group and the fan cover to flow out of the heat radiation channel. Therefore, the speed of the air current which is blown by the heat radiation fan downwards is enhanced, the utility model can radiate heat of a circumferential heating assembly of the processor and the utility model makes the assembly continuously work in the working temperature which is permitted.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular on a kind of processor that is arranged on computer main frame panel, and the air-flow that radiator fan is blowed downwards quickens, and the bottom blowing type heat abstractor that can dispel the heat to the heat generating component around the processor.
Background technology
Progress along with Information technology and computer industry, the caloric value of electronic building brick such as central processing unit chip, internal memory is more and more high, and size is more and more little, for the heat that this is intensive effectively is dispersed into environment outside the system, to keep of the following operation of heating electronic building brick in permissive temperature, usually be attached on the electronic building brick surface of heating with fin, or increase its overall radiating efficiency by the rotating speed that increases radiator fan with big base area; Thus, will derive relevant issues such as noise, weight, cost and system complexity, make that above-mentioned respectively this scheme is not the heat radiation good plan that solves electronic building brick.
At present aspect the heat radiation of electronic heating component, utilize that heat pipe has high capacity of heat transmission, heat transfer rate is fast, heat conduction efficiency is high, characteristic such as in light weight, simple in structure and multipurpose, can transmit a large amount of heats and not consume electric power, therefore be fit to very much the radiating requirements of electronic product; Therefore with heat pipe in conjunction with formed heat-pipe radiator of assemblies such as groups of fins or device, become the important topic that solves heat radiation.
Known bottom blowing type heat abstractor includes the first heat radiation group, the second heat radiation group, fan and heat pipe.Wherein, be formed with the space between this first heat radiation group and the second heat radiation group, this fan is fixedly installed in this space.The two ends of this heat pipe are serially connected in the inside of the first heat radiation group and the second heat radiation group respectively; Thus, make heat, again the part heat is guided to the second heat radiation group by heat pipe, thereby realize dual heat radiation earlier by the heat radiation of the first heat radiation group.
Yet, above-mentioned known bottom blowing type heat abstractor, because pyrotoxin is positioned at the bottom of heat abstractor, and this bottom is the closed plane, when fan blows spiral air flow downwards, is difficult for being blown into the root of the first heat radiation group, makes heat dissipation not good; Secondly, when heat that this thermal source produced upwards conducted, the air-flow that is blowed downwards by fan drove downwards again, and heat is hoarded in the bottom of the first heat radiation group, overheated burn or when the phenomenon of machine of causing thermal source; In addition, this second heat radiation group be arranged on fan directly over, upwards derive when arriving the second heat radiation group through heat pipe when the heat of bottom, this high heat is sucked in the first heat radiation group by fan again immediately, under using for a long time, significantly shortened the useful life of thermal source.
So, the design people is in view of the defective that exists in the above-mentioned prior art, rely on the sector experience for many years of being engaged in, at carrying out improved defective, through concentrating on studies and cooperating actual utilization, in line with excelsior spirit, propose a kind of reasonable in design and effectively improve the utility model of above-mentioned defective finally.
The utility model content
Main purpose of the present utility model is to provide a kind of bottom blowing type heat abstractor, is arranged on the processor of computer main frame panel, and it comprises: heat-pipe radiator and radiator fan.Wherein, this heat-pipe radiator includes groups of fins, heat pipe and fan housing; This heat pipe has heating end and condensation end, and this condensation end is arranged on the groups of fins, and is formed with heat dissipation channel between the heating end of this groups of fins and heat pipe; This fan housing is around the condensation end outside that is fixedly installed on groups of fins and heat pipe, and this radiator fan is fixedly installed on the top of heat-pipe radiator.The air-flow that this radiator fan blowed will be inner and flow out from heat dissipation channel through groups of fins and fan housing.
The utility model utilizes the setting of fan housing and heat dissipation channel, the air-flow that radiator fan blows is downwards quickened, and can dispel the heat to the heat generating component around the processor, make this assembly can be under the working temperature of allowing continuous service.
Description of drawings
Fig. 1 is the three-dimensional exploded view of heat-pipe radiator of the present utility model;
Fig. 2 is the three-dimensional exploded view of heat-pipe radiator of the present utility model and radiator fan;
Fig. 3 is the combination schematic diagram of heat-pipe radiator of the present utility model and radiator fan;
Fig. 4 is the assembled sectional view of heat-pipe radiator of the present utility model and radiator fan;
Fig. 5 is applied to the three-dimensional exploded view of central processing unit for heat-pipe radiator of the present utility model;
Fig. 6 is applied to the user mode figure of central processing unit for heat-pipe radiator of the present utility model.
In the accompanying drawing, the list of parts of each label representative is as follows:
The 1-heat-pipe radiator
11-groups of fins 111-fin
112-recess 113-concave part
114-flanging 115-barricade
116-heat radiation runner 12-heat pipe
121-heating end 122-condensation end
13-fan housing 131-header board
Plate 133-left plate behind the 132-
134-right plate 135-Fixed Division
136-depressed part 14-heat dissipation channel
The 15-heat-conducting plate
The 2-radiator fan
21-body 22-flabellum
The affixed assembly of 23-hole 24-
The 5-computer main frame panel
51-central processing unit 52-heat generating component
Embodiment
Relevant feature of the present utility model and technology contents see also following detailed description and accompanying drawing, and accompanying drawing only provides reference and explanation, is not to be used for the utility model is limited.
Fig. 1 to Fig. 4 is respectively the combination schematic diagram and the assembled sectional view of three-dimensional exploded view, heat-pipe radiator and radiator fan of three-dimensional exploded view, heat-pipe radiator and the radiator fan of heat-pipe radiator of the present utility model.The utility model provides a kind of bottom blowing type heat abstractor, includes heat-pipe radiator 1 and radiator fan 2, wherein:
Heat-pipe radiator 1 includes groups of fins 11, at least one heat pipe 12 and fan housing 13.Groups of fins 11 is combined by a plurality of fin 111, and fin 111 is made with aluminium, copper or other thermal conductivity good metal material.The place is formed with " V " shape recess 112 in the middle of above groups of fins 11, and is formed with concave part 113 respectively at its left and right two ends.Side at each fin 111 is outward extended with flanging 114 and barricade 115 respectively, utilizes the setting of flanging 114 and barricade 115, makes 111 of adjacent fin paste butts mutually and touches, and be formed with the heat radiation runner 116 (as shown in Figure 4) of equi-spaced apart.Heat pipe 12 has heating end 121 and condensation end 122.Condensation end 122 is serially connected in the perforation of groups of fins 11, and is formed with heat dissipation channel 14 between the heating end 121 of groups of fins 11 and heat pipe 12.Fan housing 13 is around condensation end 121 outsides that are fixedly installed on groups of fins 11 and heat pipe 12, and it comprises header board 131, back plate 132, left plate 133 and right plate 134.Above left plate 133 and right plate 134, be formed with Fixed Division 135 respectively, and locate therebetween to form and be formed with depressed part 136 respectively, the concave part 113 corresponding cooperations of depressed part 136 and groups of fins 11.
In addition, heat-pipe radiator of the present utility model further includes heat-conducting plate 15.Heating end 121 bottom surfaces that can heating tube 12 on the heat-conducting plate 15 attach and connect, and heat-conducting plate 15 has thermal conductivity good metal material with copper etc. and makes.
Fig. 5 and Fig. 6 are respectively three-dimensional exploded view and the user mode figure that heat-pipe radiator of the present utility model is applied to central processing unit.Heat abstractor of the present utility model can be arranged on the computer main frame panel 5.On motherboard 5, be provided with central processing unit 51 (CPU) and have the electronic heating component 52 of various difference in functionalitys.Heat generating component 52 is distributed in the surrounding space place of motherboard 5 and processor 51, makes the volume of motherboard 5 significantly obtain to dwindle, to adapt to the requirement of information products " light, thin, short, little ".During combination, the bottom surface of heat-conducting plate 15 is flattened on the end face of central processing unit 51, press heating end 121 tops with the central authorities of fastener (not shown) again in heat pipe 12, and the two ends of fastener detain respectively and are solidly connected on the default holder (not shown) of motherboard 5, with heat abstractor strong fix of the present utility model on motherboard 5.
During use, start power supply earlier, to make radiator fan 2 downward blow flow, since fan housing 13 around setting be coated on groups of fins 11 around, the air-flow that radiator fan 2 is blowed is able to be concentrated and blow out downwards post, formed recess 112 can effectively be eliminated the wind-force back pressure and the sinuous flow of radiator fan 12 centers above groups of fins 11, and can significantly reduce the generation of noise; In addition, can swimmingly central processing unit 51 and heat generating component on every side 52 thereof be dispelled the heat by steering currents at the heat dissipation channel 14 of 121 formation of heating end of groups of fins 11 and heat pipe 12, make assembly 51,52 can be under the working temperature of allowing continuous service.
In sum, bottom blowing type heat abstractor of the present utility model has practicality, novelty and creativeness, and structure of the present utility model had not also seen like product and public use, met the requirement of utility application fully, filed an application according to Patent Law.
The above only is a preferred embodiment of the present utility model, be not so promptly limit claim of the present utility model, the equivalent structure transformation that every utilization the utility model specification and accompanying drawing content are done, directly or indirectly be used in other relevant technical field, all in like manner be included in the claim of the present utility model.
Claims (7)
1. a bottom blowing type heat abstractor is characterized in that, comprising:
Heat-pipe radiator, described heat-pipe radiator includes groups of fins, at least one heat pipe and fan housing, described heat pipe has heating end and condensation end, described condensation end is arranged on the described groups of fins, be formed with heat dissipation channel between the heating end of described groups of fins and heat pipe, described fan housing is around the condensation end outside that is fixedly installed on groups of fins and heat pipe; And
Radiator fan is fixedly installed on the top of described heat-pipe radiator.
2. bottom blowing type heat abstractor as claimed in claim 1 is characterized in that being formed with recess above described groups of fins.
3. bottom blowing type heat abstractor as claimed in claim 1 is characterized in that described fan housing comprises header board, back plate, left plate and right plate.
4. bottom blowing type heat abstractor as claimed in claim 3 is characterized in that being formed with the Fixed Division respectively above the left plate of described fan housing and right plate.
5. bottom blowing type heat abstractor as claimed in claim 4, it is characterized in that being formed with depressed part respectively at the left plate of described fan housing and the middle place of right plate, left and right two ends in described groups of fins are formed with concave part respectively, the corresponding cooperation with depressed part of described concave part.
6. bottom blowing type heat abstractor as claimed in claim 1 is characterized in that described heat-pipe radiator further includes heat-conducting plate, and described heat-conducting plate is located at the heating end bottom surface of described heat pipe.
7. bottom blowing type heat abstractor as claimed in claim 6 is characterized in that described heat-conducting plate is the heat-conducting plate with copper metal material of thermal conductive resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520109971 CN2842730Y (en) | 2005-06-20 | 2005-06-20 | Lower-blowing type radiation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200520109971 CN2842730Y (en) | 2005-06-20 | 2005-06-20 | Lower-blowing type radiation apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2842730Y true CN2842730Y (en) | 2006-11-29 |
Family
ID=37446604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200520109971 Expired - Fee Related CN2842730Y (en) | 2005-06-20 | 2005-06-20 | Lower-blowing type radiation apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2842730Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101472445B (en) * | 2007-12-28 | 2012-05-30 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN103961210A (en) * | 2013-06-09 | 2014-08-06 | 深圳市天时威电子有限公司 | Head-mounted bag-type miniature semiconductor cooling ice belt |
| CN108491050A (en) * | 2018-01-22 | 2018-09-04 | 安徽数驰机电设备制造有限公司 | A kind of smart mobile phone radiator |
-
2005
- 2005-06-20 CN CN 200520109971 patent/CN2842730Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101472445B (en) * | 2007-12-28 | 2012-05-30 | 鸿富锦精密工业（深圳）有限公司 | Radiating device |
| CN103961210A (en) * | 2013-06-09 | 2014-08-06 | 深圳市天时威电子有限公司 | Head-mounted bag-type miniature semiconductor cooling ice belt |
| CN108491050A (en) * | 2018-01-22 | 2018-09-04 | 安徽数驰机电设备制造有限公司 | A kind of smart mobile phone radiator |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2842730Y (en) | Lower-blowing type radiation apparatus | |
| CN2636421Y (en) | Heat radiation device having double layered fin | |
| CN2713632Y (en) | Heat sink | |
| CN2802422Y (en) | Heat pipe radiator | |
| CN2713641Y (en) | Heat sink | |
| CN2519321Y (en) | Radiator device | |
| CN2699363Y (en) | Radiator | |
| CN2672874Y (en) | Stair type radiator | |
| CN100559573C (en) | The CPU module that dispels the heat | |
| CN2845166Y (en) | Heat-pipe radiator and fin thereof | |
| CN2847818Y (en) | Heat radiator structure | |
| CN2660849Y (en) | Improved radiator | |
| CN2548395Y (en) | Radiating fin structure improvement | |
| CN2909801Y (en) | Improved structure of fin | |
| CN2473667Y (en) | Non-balance radiation fin | |
| CN2678133Y (en) | Radiating device with circulating runner | |
| CN2762345Y (en) | Heat sink | |
| CN200953244Y (en) | Harddisk holding box with radiator | |
| CN2508394Y (en) | Heat-sink for computer | |
| CN2504683Y (en) | Radiator | |
| CN2667663Y (en) | Runner type radiator | |
| CN2710320Y (en) | Power supply device without fan | |
| CN2826921Y (en) | Perforation arrangement structure of heat pipe and heat sink | |
| CN2435779Y (en) | Heat sink for integrated circuit | |
| CN2490631Y (en) | Cooling model set in electronic product |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: HUAHONG PRECISE CORP. Free format text: FORMER OWNER: CHEN GUOXING; PATENTEE Effective date: 20070608 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070608 Address after: Taiwan, China Patentee after: Huahong Precise Corp. Address before: Taiwan, China Co-patentee before: Lin Xuanzhi Patentee before: Chen Guoxing Co-patentee before: Chen Qinghong |
|
| ASS | Succession or assignment of patent right |
Owner name: WATSON PRECISION CO. Free format text: FORMER OWNER: HUAHONG PRECISE CORP. Effective date: 20080919 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080919 Address after: Chinese Taiwan Taipei City Beitou District Central Road 2 No. 37 3 floor, zip code: 000000 Patentee after: Huaxin Precision Co., Ltd. Address before: Taiwan, China, zip code: 000000 Patentee before: Huahong Precise Corp. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061129 |