CN2490631Y - Cooling model set in electronic product - Google Patents
Cooling model set in electronic product Download PDFInfo
- Publication number
- CN2490631Y CN2490631Y CN 01225046 CN01225046U CN2490631Y CN 2490631 Y CN2490631 Y CN 2490631Y CN 01225046 CN01225046 CN 01225046 CN 01225046 U CN01225046 U CN 01225046U CN 2490631 Y CN2490631 Y CN 2490631Y
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- Prior art keywords
- air channel
- heat
- cpu
- electronic product
- processing unit
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Abstract
The utility model relates to a cooling model set in electronic product. The utility model comprises a base, an air passage pipe, a heat conduction pipe, a CPU and a cooling fan, wherein the base is extended outwards along one side and connected with one side of the air passage pipe, the connected side of the air passage pipe is extended to the base along air passage pipe, and then is provided with the heat conduction pipe, the heat generated from the surface of the CPU is transmitted to the air passage pipe and then is blown off by the cooling fan which is arranged at the one side of the air passage pipe; meanwhile the cooling fan blows another flow of cold air to the CPU and the neighboring and the surrounding electronic elements through the outlet of the other air passage, thereby the heat generated by the other electronic elements of the electronic product can convect adequately, the electronic elements can not be smouldered in the electronic product, other hot elements can be cooling and the temperature of the whole housing is reduced.
Description
The utility model is the heat radiation module in a kind of electronic product, refers to a kind of temperature that makes shell body no longer produce overheated phenomenon and reduce the monolithic case body especially, with the heat radiation module in the electronic product that reaches the integral heat sink effect really.
General CPU (central processing unit) (CPU) and the electronic component on every side thereof in the electronic product (as: laptop) now, under running or duty, all can send high heat, the CPU (central processing unit) institute evolution of heat in the past is also few, so the natural convection by heat radiator is dispelled the heat, be enough to cool off CPU (central processing unit), make its surface temperature be lower than maximum operation temperature.
Yet along with the processing speed of CPU (central processing unit) speeds, its distribute heat also improves thereupon, therefore, installs a heat radiation module additional and dispel the heat on CPU (central processing unit), just is applied in the CPU (central processing unit) of high heat.
The above-mentioned heat radiation module of commonly using is carrying out having in the thermolysis its problem to exist with CPU (central processing unit), what promptly this heat radiation module only can be produced CPU (central processing unit) itself is high hot, conduct heat on the heat exchanger (Heat Exchanger) of far-end via the heat pipe (Heat Pipe) on the heat radiation module, and then, the hot blow on this heat exchanger is gone out outside the host shell by the radiator fan of an end; Therefore, above-mentioned heat radiation shortcoming, be to be that single radiator fan can only handle the heat on this heat exchanger, and can't the heat that electronic component produced around other contiguous these CPU (central processing unit) in this host shell be handled, it is overheated directly to influence this host housing body generation, so, to cause the radiating effect variation of this heat radiation module integral body, and then cause the total system instability, even the situation of machine will take place to work as.
Therefore, how outside possessing the advantage of former heat exchanger, can provide another strand cold wind to blow to system again, make in the system and can have sufficient gaseous exchange, unlikely causing in the system smouldered, and the effect of other hot parts of cooling, and makes shell body no longer produce overheated phenomenon, and then the temperature of reduction monolithic case body, be the suitable major issue that present CPU (central processing unit) was faced in the high speed epoch.
The purpose of this utility model is to provide the heat radiation module in a kind of electronic product, makes the heat that other electronic components produced of this electronic product inside all to have sufficient gaseous exchange; So, smouldering in the unlikely product inside of causing, and can cool off other hot parts, and make shell body no longer produce overheated phenomenon, and then reduce the temperature of monolithic case body, to reach the purpose of integral heat sink effect really.
The technical scheme that the utility model adopted is: the heat radiation module in this electronic product, comprise a pedestal, which is provided with a heat-conducting block, be sticked mutually in order to surface with a CPU (central processing unit), one epitaxial lateral overgrowth of this pedestal is stretched with the one side of an air channel body and is connected, this face extends to pedestal and heat-conducting block contact position and then is provided with one in order to the heat conduction of the CPU (central processing unit) heat pipe to this air channel body, it is characterized in that: the inside of this air channel body is provided with an air channel and another air channel, one radiator fan is located at the end that this air channel body has air channel and another air channel, heat on this air channel body can blow out from the outlet in this air channel, and radiator fan provides another strand wind, blows to this CPU (central processing unit) and contiguous its electronic component place on every side from the outlet in another air channel.
The inside of this air channel body sees through a demarcation strip to be separated into this air channel and another air channel; Adjacent thermal conductive pipe place is provided with plural equally spaced arcuated fin piece in this air channel, and the heat that is absorbed on these fins is blown out by the other end of radiator fan from this air channel body; The junction that contiguous this air channel body of the outlet in this another air channel and pedestal extend, radiator fan can provide the outlet of another strand cold wind by this another air channel, blows to this CPU (central processing unit) and contiguous its electronic component on every side; Heat-conducting block on this pedestal and heat pipe can promptly conduct heat to the heat pipe heat-conducting glue through one respectively and be sticked mutually with the surface of this CPU (central processing unit).
Principle of work of the present utility model is, utilize this pedestal to stretch and be attached thereto the one side that connects an air channel body along an epitaxial lateral overgrowth, and extend to pedestal in this face along the air channel body and be provided with a heat pipe, the heat that one CPU (central processing unit) surface is produced, can be via a heat-conducting block and the heat pipe on this pedestal, conduct heat on the air channel body of far-end, again by the set radiator fan of this air channel body one end, with the heat on this air channel body, the outlet in a set air channel blows out in this air channel body, this radiator fan simultaneously, another strand cold wind will be provided, by the outlet in another set in this air channel body air channel, blow to this CPU (central processing unit) certainly and contiguous electronic component place around it.
Be stranded this, effect of the present utility model is, outside the advantage that can possess former heat radiation module, can provide another strand cold wind to blow to electronic product again, make to form in the electronic product to have sufficient gaseous exchange, unlikely causing in the electronic product smouldered, and can cool off other hot parts, and make shell body no longer produce overheated phenomenon, and reduce the temperature of monolithic case body, to reach the structure of integral heat sink effect really; In the utility model, the heat pipe on this pedestal is bonding through a heat-conducting glue and this heat-conducting block, and heat-conducting block then sees through heat-conducting glue and is sticked mutually with the surface of this CPU (central processing unit), makes heat energy enough promptly conduct to heat pipe.
In sum, the utility model can have practicality and the progressive of promoting former article use effect really; Again, structure described in the utility model and shape facility can be improved every shortcoming of located by prior art, can promote effect in the use, close in practicality.
With embodiment the utility model is described in further detail with reference to the accompanying drawings below.
The explanation of accompanying drawing drawing:
Fig. 1 is a perspective exploded view of the present utility model;
Fig. 2 is an enforcement synoptic diagram of the present utility model;
Fig. 3 is an enforcement assembled state cut-open view of the present utility model.
See also Fig. 1, Fig. 2 and shown in Figure 3, the utility model is the heat radiation module in a kind of electronic product, be applied on the inner CPU (central processing unit) 1 (CPU) of an electronic product (as: laptop), this heat radiator module 10 is a good heat conductor made (as: aluminium etc.), include a pedestal 11 (as shown in Figure 1), which is provided with a heat-conducting block 121 (as shown in Figure 1), and extend along a side direction outside sweep of this pedestal 11 and to be connected with the one side of an air channel body 20, be provided with one in this face extends to pedestal 11 along air channel body 20 heat-conducting block 121 places in order to the heat conduction of CPU (central processing unit) 1 heat pipe 12 to this air channel body 20, the heat that one CPU (central processing unit), 1 surface is produced, can conduct heat on the air channel body 20 of far-end via this heat-conducting block 121 and heat pipe 12, again by the set radiator fan 30 (as shown in Figure 2) of these air channel body 20 1 ends, heat on this air channel body 20 is blown out from the other end, and provide another strand cold wind to blow to this CPU (central processing unit) 1 and contiguous its electronic component (not shown) on every side, make the heat that other electronic components produced of this electronic product inside, has sufficient gaseous exchange, smoulder in the unlikely product inside of causing, and can cool off other hot parts, and make this electronic product shell body no longer produce overheated phenomenon, and then reduce the temperature of monolithic case body.
In the utility model, heat pipe 12 on this pedestal 11 sees through one, and can promptly to conduct heat to heat-conducting glue (not shown) and this heat-conducting block 121 (as shown in Figure 1) of heat pipe 12 bonding, 121 of heat-conducting blocks see through heat-conducting glue and are sticked mutually with the surface of this CPU (central processing unit) 1, enough promptly conduct to heat pipe 12 to make heat energy.
In the utility model, the inside of this air channel body 20 is provided with a demarcation strip 21 (as Fig. 1, shown in Figure 3) at an end place that is connected with radiator fan 30, body 20 inside in air channel can be separated into an air channel 22 and another air channel 23 by this demarcation strip 21, wherein adjacent thermal conductive pipe 12 places are provided with plural equally spaced arcuated fin piece 221 in this air channel 22, radiator fan 30 can be with the warm that is absorbed on these fins 221, and the other end of this air channel body 20 blows out certainly; Again, the junction that this air channel body 20 of 231 vicinities of the outlet in this another air channel 23 and pedestal 11 extend, radiator fan 30 can provide the outlet 231 of another strand cold wind by this another air channel 23, blow to this CPU (central processing unit) 1 and contiguous its electronic component (as shown in Figure 3) on every side, make the heat that other electronic components produced of this electronic product inside, can have sufficient gaseous exchange.
The member that mat is above-mentioned, the heat that this CPU (central processing unit) 1 surface is produced is (as Fig. 2, shown in Figure 3), can be via this heat-conducting glue, the heat conduction of heat-conducting block 121 and heat pipe 12 is to this air channel body 20, again by this radiator fan 30, the other end of heat from this air channel 23 on this air channel body 20 blown out, this radiator fan 30 simultaneously, the outlet 231 of another strand cold wind by this another air channel 23 will be provided, blow to this CPU (central processing unit) 1 and contiguous its electronic component on every side, make the heat that other electronic components produced of this electronic product inside, can have sufficient gaseous exchange.Like this, can make the heat that other electronic components produced of this electronic product inside have sufficient gaseous exchange, smouldering in the unlikely product inside of causing, and can cool off other hot parts, and make shell body no longer produce overheated phenomenon, and then reduce monolithic case body temperature degree.
Claims (5)
1. the heat radiation module in the electronic product, comprise a pedestal, which is provided with a heat-conducting block that pastes mutually with the surface of CPU (central processing unit), one epitaxial lateral overgrowth of this pedestal is stretched with the one side of an air channel body and is connected, and this face extends to pedestal and heat-conducting block contact position and then is provided with one in order to the heat conduction of the CPU (central processing unit) heat pipe to this air channel body; It is characterized in that: the inside of this air channel body is provided with an air channel and another air channel, one radiator fan is located at the end that this air channel body has air channel and another air channel, heat on this air channel body can blow out from the outlet in this air channel, and radiator fan provides another strand wind, blows to this CPU (central processing unit) and contiguous its electronic component place on every side from the outlet in another air channel.
2. the heat radiation module in the electronic product according to claim 1 is characterized in that: the inside of this air channel body sees through a demarcation strip and is separated into this air channel and another air channel.
3, the heat radiation module in the electronic product according to claim 2, it is characterized in that: adjacent thermal conductive pipe place is provided with plural equally spaced arcuated fin piece in this air channel, and the heat that is absorbed on these fins is blown out by the other end of radiator fan from this air channel body.
4. the heat radiation module in the electronic product according to claim 2, it is characterized in that: the place is established in connecing that contiguous this air channel body of the outlet in this another air channel and pedestal extend, radiator fan can provide the outlet of another strand cold wind by this another air channel, blows to this CPU (central processing unit) and contiguous its electronic component on every side.
5. the heat radiation module in the electronic product according to claim 1 is characterized in that: heat-conducting block on this pedestal and heat pipe see through a heat-conducting glue that can promptly conduct heat to heat pipe respectively and are sticked mutually with the surface of this CPU (central processing unit).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01225046 CN2490631Y (en) | 2001-05-31 | 2001-05-31 | Cooling model set in electronic product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01225046 CN2490631Y (en) | 2001-05-31 | 2001-05-31 | Cooling model set in electronic product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2490631Y true CN2490631Y (en) | 2002-05-08 |
Family
ID=33641201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01225046 Expired - Fee Related CN2490631Y (en) | 2001-05-31 | 2001-05-31 | Cooling model set in electronic product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2490631Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188914A (en) * | 2011-12-29 | 2013-07-03 | 富瑞精密组件（昆山）有限公司 | Radiating module |
| CN103576784A (en) * | 2013-10-31 | 2014-02-12 | 昆山市大久电子有限公司 | Heat-dissipation dustproof laptop case |
-
2001
- 2001-05-31 CN CN 01225046 patent/CN2490631Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103188914A (en) * | 2011-12-29 | 2013-07-03 | 富瑞精密组件（昆山）有限公司 | Radiating module |
| CN103576784A (en) * | 2013-10-31 | 2014-02-12 | 昆山市大久电子有限公司 | Heat-dissipation dustproof laptop case |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20020508 Termination date: 20100531 |