High-efficiency radiator
The utility model belongs to field of power electronics, and it is a kind of radiator.
Herringbone sheet radiator commonly used mainly is made up of radiator base plate and parallel shape fin or finned heatsink, and the spread length of finned heatsink equates; And the heat dissipation capacity of radiator to prolong that the short transverse of heat radiation main leaf distributes be unequal, position near substrate, because the heat transfer temperature difference of fin and air is big, heat dissipation capacity is big, and the top of heat radiation main leaf is little owing to the heat transfer temperature difference of fin and air, and heat dissipation capacity is little, and because the pitch of fins of finned heatsink is equal, the root of main leaf of in addition dispelling the heat is big than top thickness, so cause the closer to the root of heat radiation main leaf, its ventilation area is more little, air flow resistance is bigger, rate of air circulation is less, and the top of close heat radiation main leaf, ventilation area is big, air flow resistance is little, air mass flow is big, causes the air mass flow of main radiating area few, and the air mass flow of less important radiating area is big, the heat dissipation capacity of entire radiator is reduced, the root temperature of heat radiation main leaf raises, and substrate temperature raises, and has reduced the radiator heat-dissipation effect.
Traditional radiator of forming by substrate and fin, the technology that is connected of its substrate and fin often adopts crimping, bonding or welding, and these all respectively have shortcoming.Though common crimping efficient height is subjected to the restriction of mould processing technology, the dummy slider groove is more shallow, causes the contact-making surface of substrate and fin few, is generally line contact or some contact, and radiating efficiency is low; Bonding owing to the restriction that is subjected to adhesives, the one, manufacturability is poor, and the 2nd, complex process, the 3rd, curing time is long, and the 4th, bonding agent solidifies inside, back and has the air air gap, and thermal resistance is big, and heat transfer efficiency is low, and the 5th, cost is higher; If adopt welding manner, complex process, cost is higher.
The radiator of forming by substrate and fin that the purpose of this utility model provides that a kind of processing technology is simple, radiating efficiency is high.
To achieve these goals, the utility model is made up of substrate and heat radiation main leaf and finned heatsink, and there is the trapezoidal boss that is connected the junction with the heat radiation main leaf on the substrate, and the end is narrow, and the bottom is wide, and is fluted in the middle of the end of trapezoidal connection boss.With the junction of substrate connector is arranged on the heat radiation main leaf, there is trapezoidal groove the end of connector, slot opening, bottom land is narrow, an oblique narrow groove is respectively established on the crossheading limit, bottom of this trapezoidal groove, two oblique narrow grooves become splayed to be symmetrically distributed, between form trapezoid boss.Main is, the pitch of fins of the finned heatsink of heat radiation main leaf both sides is unequal, root direction pitch of fins along the heat radiation main leaf is big, a top-direction pitch of fins is little, make the ventilation area of the ventilation area of fin root greater than the top, make the rate of air circulation at main heat radiation position of root big, and the rate of air circulation at less important heat radiation position, top is few.Make the air resource of cooling usefulness obtain more reasonable configuration, the maximum radiating effect of performance radiator.
During assembling, the connection boss on the substrate is pressed in the groove of the connector on the heat radiation main leaf.
Because the connector on connection boss on the substrate and the heat radiation main leaf has adopted long length of fit and tapering, has added interference fit, be aided with the back locking function after the crimping, formation is from riveting, fin and substrate are closely cooperated, increased contact area, effectively improved heat-transfer effect, the cooperation intensity of fin also improves greatly.This structure only depended on pressure reaches firm assembling, so technology is simple, the efficient height.
The utility model is described in further detail below in conjunction with accompanying drawing.
Fig. 1 is radiator assembling schematic diagram.
Fig. 2 is the radiator base plate schematic diagram.
Fig. 3 is the radiator fin schematic diagram.
Shown in Figure 1, radiator is by substrate 1 and heat radiation main leaf 4 and be located at the both sides of heat radiation main leaf 4, the finned heatsink 10 that also is connected as a single entity is with it formed, and the trapezoidal connection boss 2 on the substrate 1 is pressed in the trapezoidal groove of the connector 5 on the heat radiation main leaf 4.There is the trapezoidal boss 2 that is connected junction with the heat radiation main leaf on the substrate 1 shown in Figure 2, and the end is narrow, and the bottom is wide, its end middle fluted 3.Shown in Figure 3, heat radiation main leaf 4 has connector 5 with the junction of substrate 1, and there is trapezoidal groove 7 end of connector 5, slot opening, bottom land is narrow, and the crossheading limit, bottom of trapezoidal groove 7 respectively has between oblique narrow groove 6 that 18 font is symmetrically distributed and 9, two skewed slots 6 and 9 and forms trapezoid boss 8.The arrangement of the aliform radiator 10 of heat radiation main leaf 4 both sides is not equidistant, finned heatsink 10 is near the root of heat radiation main leaf 4, and a pitch of fins is bigger, and less near the top sheet distance of heat radiation main leaf, the variation of its pitch of fins can be gradual change, also can be that subregion changes step by step.
When substrate 1 and 4 assemblings of heat radiation main leaf, only need on heat radiation main leaf 4, to exert pressure, boss 2 is pressed in the trapezoidal groove 7 of connector 5.At this moment, groove 3 two sides on the boss 2 are deformed in the two oblique narrow grooves 6 and 9 that are pressed in the connector 5, form from the riveting function, and boss 2 and connector 5 closely are fixed together, and have reached purpose fixing and that conduct heat.
Boss 2 and groove 7 also can all be made the rectangle of not being with gradient, adopt during assembling to be slidingly matched.
Mandatory declaration be, reach by the distortion of certain part on fin in the radiator or the substrate and make the purpose of locking that fin do not get loose, all belong to the protection range of this patent.