CN2527069Y - Efficient radiator - Google Patents

Efficient radiator Download PDF

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Publication number
CN2527069Y
CN2527069Y CN 02221454 CN02221454U CN2527069Y CN 2527069 Y CN2527069 Y CN 2527069Y CN 02221454 CN02221454 CN 02221454 CN 02221454 U CN02221454 U CN 02221454U CN 2527069 Y CN2527069 Y CN 2527069Y
Authority
CN
China
Prior art keywords
heat radiation
main leaf
radiation main
substrate
base plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN 02221454
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Chinese (zh)
Inventor
刘永言
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chengdu Hope Electronic Institute Co., Ltd.
Original Assignee
XIWANG ELECTRONIC INST CHENGDU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by XIWANG ELECTRONIC INST CHENGDU filed Critical XIWANG ELECTRONIC INST CHENGDU
Priority to CN 02221454 priority Critical patent/CN2527069Y/en
Application granted granted Critical
Publication of CN2527069Y publication Critical patent/CN2527069Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model discloses a radiator which consists of a base plate, a heat radiation main leaf and alar radiating ribs. The base plate has an echelon connecting boss, the middle of the end of the echelon connecting boss is provided with a notch; a joint of the radiating ribs and the base plate is provided with a connecting joint, the end of which is provided with an echelon notch. The bottom of the echelon notch is provided with a splay inclined narrow notch along the side of the notch respectively. When in assembly, the end of the echelon connecting boss of the base plate transforms into self-riveting which can fixedly connect the base plate and the heat radiation main leaf together. The alar radiating ribs are arranged on the both sides of the heat radiation main leaf. The arrangement distance of the alar radiating rib is that distance of root part near the heat radiation main leaf is relatively larger than the distance of top part. The structure has the advantages of simple technique and high heat dissipation efficiency.

Description

High-efficiency radiator
The utility model belongs to field of power electronics, and it is a kind of radiator.
Herringbone sheet radiator commonly used mainly is made up of radiator base plate and parallel shape fin or finned heatsink, and the spread length of finned heatsink equates; And the heat dissipation capacity of radiator to prolong that the short transverse of heat radiation main leaf distributes be unequal, position near substrate, because the heat transfer temperature difference of fin and air is big, heat dissipation capacity is big, and the top of heat radiation main leaf is little owing to the heat transfer temperature difference of fin and air, and heat dissipation capacity is little, and because the pitch of fins of finned heatsink is equal, the root of main leaf of in addition dispelling the heat is big than top thickness, so cause the closer to the root of heat radiation main leaf, its ventilation area is more little, air flow resistance is bigger, rate of air circulation is less, and the top of close heat radiation main leaf, ventilation area is big, air flow resistance is little, air mass flow is big, causes the air mass flow of main radiating area few, and the air mass flow of less important radiating area is big, the heat dissipation capacity of entire radiator is reduced, the root temperature of heat radiation main leaf raises, and substrate temperature raises, and has reduced the radiator heat-dissipation effect.
Traditional radiator of forming by substrate and fin, the technology that is connected of its substrate and fin often adopts crimping, bonding or welding, and these all respectively have shortcoming.Though common crimping efficient height is subjected to the restriction of mould processing technology, the dummy slider groove is more shallow, causes the contact-making surface of substrate and fin few, is generally line contact or some contact, and radiating efficiency is low; Bonding owing to the restriction that is subjected to adhesives, the one, manufacturability is poor, and the 2nd, complex process, the 3rd, curing time is long, and the 4th, bonding agent solidifies inside, back and has the air air gap, and thermal resistance is big, and heat transfer efficiency is low, and the 5th, cost is higher; If adopt welding manner, complex process, cost is higher.
The radiator of forming by substrate and fin that the purpose of this utility model provides that a kind of processing technology is simple, radiating efficiency is high.
To achieve these goals, the utility model is made up of substrate and heat radiation main leaf and finned heatsink, and there is the trapezoidal boss that is connected the junction with the heat radiation main leaf on the substrate, and the end is narrow, and the bottom is wide, and is fluted in the middle of the end of trapezoidal connection boss.With the junction of substrate connector is arranged on the heat radiation main leaf, there is trapezoidal groove the end of connector, slot opening, bottom land is narrow, an oblique narrow groove is respectively established on the crossheading limit, bottom of this trapezoidal groove, two oblique narrow grooves become splayed to be symmetrically distributed, between form trapezoid boss.Main is, the pitch of fins of the finned heatsink of heat radiation main leaf both sides is unequal, root direction pitch of fins along the heat radiation main leaf is big, a top-direction pitch of fins is little, make the ventilation area of the ventilation area of fin root greater than the top, make the rate of air circulation at main heat radiation position of root big, and the rate of air circulation at less important heat radiation position, top is few.Make the air resource of cooling usefulness obtain more reasonable configuration, the maximum radiating effect of performance radiator.
During assembling, the connection boss on the substrate is pressed in the groove of the connector on the heat radiation main leaf.
Because the connector on connection boss on the substrate and the heat radiation main leaf has adopted long length of fit and tapering, has added interference fit, be aided with the back locking function after the crimping, formation is from riveting, fin and substrate are closely cooperated, increased contact area, effectively improved heat-transfer effect, the cooperation intensity of fin also improves greatly.This structure only depended on pressure reaches firm assembling, so technology is simple, the efficient height.
The utility model is described in further detail below in conjunction with accompanying drawing.
Fig. 1 is radiator assembling schematic diagram.
Fig. 2 is the radiator base plate schematic diagram.
Fig. 3 is the radiator fin schematic diagram.
Shown in Figure 1, radiator is by substrate 1 and heat radiation main leaf 4 and be located at the both sides of heat radiation main leaf 4, the finned heatsink 10 that also is connected as a single entity is with it formed, and the trapezoidal connection boss 2 on the substrate 1 is pressed in the trapezoidal groove of the connector 5 on the heat radiation main leaf 4.There is the trapezoidal boss 2 that is connected junction with the heat radiation main leaf on the substrate 1 shown in Figure 2, and the end is narrow, and the bottom is wide, its end middle fluted 3.Shown in Figure 3, heat radiation main leaf 4 has connector 5 with the junction of substrate 1, and there is trapezoidal groove 7 end of connector 5, slot opening, bottom land is narrow, and the crossheading limit, bottom of trapezoidal groove 7 respectively has between oblique narrow groove 6 that 18 font is symmetrically distributed and 9, two skewed slots 6 and 9 and forms trapezoid boss 8.The arrangement of the aliform radiator 10 of heat radiation main leaf 4 both sides is not equidistant, finned heatsink 10 is near the root of heat radiation main leaf 4, and a pitch of fins is bigger, and less near the top sheet distance of heat radiation main leaf, the variation of its pitch of fins can be gradual change, also can be that subregion changes step by step.
When substrate 1 and 4 assemblings of heat radiation main leaf, only need on heat radiation main leaf 4, to exert pressure, boss 2 is pressed in the trapezoidal groove 7 of connector 5.At this moment, groove 3 two sides on the boss 2 are deformed in the two oblique narrow grooves 6 and 9 that are pressed in the connector 5, form from the riveting function, and boss 2 and connector 5 closely are fixed together, and have reached purpose fixing and that conduct heat.
Boss 2 and groove 7 also can all be made the rectangle of not being with gradient, adopt during assembling to be slidingly matched.
Mandatory declaration be, reach by the distortion of certain part on fin in the radiator or the substrate and make the purpose of locking that fin do not get loose, all belong to the protection range of this patent.

Claims (1)

1. radiator of being made up of substrate and fin is characterized in that: there is the trapezoidal boss that is connected the junction with the heat radiation main leaf on the substrate, and the end is narrow, and the bottom is wide, and is fluted in the middle of the end of trapezoidal connection boss; There is connector junction with substrate on the heat radiation main leaf, there is trapezoidal groove the end of connector, slot opening, bottom land is narrow, respectively there is an oblique narrow groove on the crossheading both sides, bottom of this trapezoidal groove, and two oblique narrow grooves become splayed to be symmetrically distributed, between form trapezoid boss, during assembling, the connection boss on the substrate is packed in the groove of the connector on the fin; Heat radiation main leaf both sides are provided with finned heatsink, and the spread length of finned heatsink is bigger near the root spacing of heat radiation main leaf, and top spacing is less, and the variation of its spacing can be gradual change, also can be that subregion changes step by step.
CN 02221454 2002-01-30 2002-01-30 Efficient radiator Expired - Lifetime CN2527069Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 02221454 CN2527069Y (en) 2002-01-30 2002-01-30 Efficient radiator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 02221454 CN2527069Y (en) 2002-01-30 2002-01-30 Efficient radiator

Publications (1)

Publication Number Publication Date
CN2527069Y true CN2527069Y (en) 2002-12-18

Family

ID=33699552

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 02221454 Expired - Lifetime CN2527069Y (en) 2002-01-30 2002-01-30 Efficient radiator

Country Status (1)

Country Link
CN (1) CN2527069Y (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100458344C (en) * 2005-12-13 2009-02-04 金龙精密铜管集团股份有限公司 Copper condensing heat-exchanging pipe for flooded electric refrigerator set
CN100584173C (en) * 2006-07-26 2010-01-20 富准精密工业(深圳)有限公司 Heat radiating device
CN101137281B (en) * 2007-02-16 2010-07-07 中兴通讯股份有限公司 Double-tooth radiation fin, outdoor cabinet therewith as heat radiator and heat radiating method
WO2015081842A1 (en) * 2013-12-06 2015-06-11 迈凯实金属技术(苏州)有限公司 Heat dissipation housing structure connected to heat dissipation fin
CN104900977A (en) * 2015-07-01 2015-09-09 成都众易通科技有限公司 Interactive antenna heat-radiation block
CN104934677A (en) * 2015-07-01 2015-09-23 成都众易通科技有限公司 Interactive antenna cooling block with triangular cooling fins

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100458344C (en) * 2005-12-13 2009-02-04 金龙精密铜管集团股份有限公司 Copper condensing heat-exchanging pipe for flooded electric refrigerator set
US7762318B2 (en) 2005-12-13 2010-07-27 Golden Dragon Precise Copper Tube Group, Inc. Condensing heat-exchange copper tube for an flooded type electrical refrigeration unit
CN100584173C (en) * 2006-07-26 2010-01-20 富准精密工业(深圳)有限公司 Heat radiating device
CN101137281B (en) * 2007-02-16 2010-07-07 中兴通讯股份有限公司 Double-tooth radiation fin, outdoor cabinet therewith as heat radiator and heat radiating method
WO2015081842A1 (en) * 2013-12-06 2015-06-11 迈凯实金属技术(苏州)有限公司 Heat dissipation housing structure connected to heat dissipation fin
CN104900977A (en) * 2015-07-01 2015-09-09 成都众易通科技有限公司 Interactive antenna heat-radiation block
CN104934677A (en) * 2015-07-01 2015-09-23 成都众易通科技有限公司 Interactive antenna cooling block with triangular cooling fins
CN104900977B (en) * 2015-07-01 2018-11-13 成都众易通科技有限公司 interactive antenna radiating block

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee

Owner name: CHENGDU INSTITUTE OF ELECTRONICS CO.

Free format text: FORMER NAME OR ADDRESS: CHENGDU HOPE ELECTRONIC RESEARCH INSTITUTE

CP01 Change in the name or title of a patent holder

Address after: No. 181, Airport Road, Sichuan, Chengdu: 610225

Patentee after: Chengdu Hope Electronic Institute Co., Ltd.

Address before: No. 181, Airport Road, Sichuan, Chengdu: 610225

Patentee before: Xiwang Electronic Research Inst. Chengdu City

C17 Cessation of patent right
CX01 Expiry of patent term

Expiration termination date: 20120130

Granted publication date: 20021218