CN214848600U

CN214848600U - CPU radiator

Info

Publication number: CN214848600U
Application number: CN202121391124.9U
Authority: CN
Inventors: 唐维
Original assignee: Changsha Sirui Electronic Technology Co ltd
Current assignee: Changsha Sirui Electronic Technology Co ltd
Priority date: 2021-06-22
Filing date: 2021-06-22
Publication date: 2021-11-23
Anticipated expiration: 2031-06-22

Abstract

The utility model relates to a CPU radiator, include the base with CPU contact installation, the heat pipe in the base is worn to locate by one end, and wears to locate the fin of the heat pipe other end, and the fan that corresponds the fin setting, wherein the base correspondence is provided with two at least heat dissipation areas, and every heat dissipation area all includes two piece at least L shape heat pipes that the horizontal migration was arranged, and evenly wears to establish the fin group in L shape heat pipe outer end, the fan setting in fin group below. The utility model discloses a horizontal plane is reverse to be set up a plurality of radiating areas, has not only increased the area of fin, has overcome the easy problem that appears of concentrated heat dissipation, has improved the radiating effect, and the heat pipe side direction extends the mainboard outside and adopt horizontal mirror image to increase the radiating area moreover, does not have the volume that increases the radiator when promoting the radiating effect, and the installation is used and can not receive the restriction of host computer box inner space. Meanwhile, as a plurality of radiating areas share the heat dissipation, a high-speed fan of the existing radiator is not needed, and the noise caused by the fan is greatly reduced.

Description

CPU radiator

Technical Field

The utility model relates to a heat abstractor especially indicates a CPU radiator.

Background

The existing ultrathin CPU radiator is divided into two types, one type is used for notebook and all-in-one products, the products generally use flattened heat pipes, small-area fins and high-rotation-speed turbofan, the heat conduction efficiency is sacrificed for pursuing extreme ultrathin, and the noise of the turbofan is extremely high. The other type is a downward-pressing radiator for a desktop, the thickness of the product is thicker than that of the product, the heat conduction efficiency of the product is not influenced, the product is limited by the area of a main board and other elements, the area of fins is still very small, the fin can only be compensated by a high-speed fan, the noise is still large, discharged hot air blows to the main board, the hot air cannot be directly discharged out of a case, and the hidden danger of heat accumulation exists.

CN02233202.2 discloses a heat pipe radiator, which aims at the problems that the existing heat pipe radiator is easily limited by the geometrical size of the surrounding space, the effective heat absorption area of the heat pipe is less than 1/5 of the surface area of the evaporation section, and the heat dissipation effect is poor. By designing the radiator comprising the heat pipes, the saddles, the fins, the air collectors and the axial flow fans, the upper parts of the heat pipes can be inclined or are vertically arranged with the horizontal lower parts. The radiator forces cold air to flow through the surfaces of the fins rapidly by arranging the air collector between the fins and the axial flow fan, and the air collector can be provided with a single fan or double fans in order to enhance the heat exchange capacity; meanwhile, the upper part of the vertical or inclined heat pipe can meet the requirement of small space of a desktop computer. However, although the design of the air collector in the scheme can accelerate the air flow, reduce the thermal resistance of convection heat transfer and improve the heat dissipation effect, the heat dissipation area is concentrated at one position, when the CPU has large power consumption and excessive heat dissipation, the local temperature is easily overhigh, and meanwhile, the area of the fin is still limited by the internal space of the host machine due to the integrated design of the fin, the air collector and the axial flow fan; in addition, the scheme mainly improves the heat dissipation effect by accelerating the airflow, can not well overcome the noise caused by high-speed rotation of the fan, particularly the double fans, and can generate new noise in the heat exchange convection process because the wind collector connecting fin made of thin aluminum plates or engineering plastics is added to the axial flow fan.

Disclosure of Invention

The utility model aims at the shortcoming and the problem that exist among the background art improve and innovate, provide a CPU radiator.

The technical scheme of the utility model be that construct one kind including with the base of CPU contact installation, the heat pipe in the base is worn to locate by one end, and the fin of the heat pipe other end is worn to locate, and the radiator of the fan that corresponds the fin setting, wherein: the base correspond and be provided with two at least radiating areas, every radiating area all includes two piece at least L shape heat pipes that the horizontal migration arranged with evenly wear to establish the fin group in L shape heat pipe outer end, the fan setting from the downdraft in fin group below up blow through the fin and take away the heat.

In one embodiment, the heat dissipation area is arranged on one side or two sides of the base in a mirror image manner. Two heat dissipation areas on one side or four heat dissipation areas on two sides can be reversely arranged according to the horizontal plane of the installation space of the elements needing heat dissipation, such as a CPU (central processing unit), so that the heat dissipation effect is further improved, and the application range is wider.

In one embodiment, the size of the base is adapted to the size of the CPU, and two corresponding side surfaces of the base are provided with mounting lugs, and the mounting lugs are provided with fastener mounting screw holes for mounting the heat sink on the main board. The fasteners of various platforms such as AM4, LGA115X, LGA2011 and the like can be installed through the installation lugs and the screw holes, and the fasteners are adaptive to various mainboards, so that the applicability is high.

In one embodiment, the fan is a low-speed axial fan. The low-speed fan can satisfy the fin heat dissipation of this radiator that has many radiating areas, has overcome the noise problem that current radiator is mostly high-speed fan and has brought, and axial fan can ensure simultaneously that the heat dissipation is blown to specific direction, does not influence other part wind channels.

The utility model has the advantages and beneficial effect:

the utility model discloses set up a plurality of radiating areas, not only increased the area of fin, overcome the easy problem that appears of concentrated heat dissipation, improved the radiating effect, the heat pipe side direction extends the mainboard in addition and outside and adopt horizontal mirror image to increase the radiating area, does not have the volume that increases the radiator when promoting the radiating effect, and the restriction that can not receive host computer box inner space is used in the installation. Meanwhile, as a plurality of radiating areas share the heat dissipation, a high-speed fan of the existing radiator is not needed, and the noise caused by the fan is greatly reduced. The utility model discloses simple structure, installation convenient to use, heat conduction and radiating effect are good.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic view of the structure of the present invention.

Fig. 3 is a schematic top view of fig. 2.

Description of the figures:

1. the heat pipe cooling device comprises a base 1-1, mounting lugs 2, an L-shaped heat pipe 3, a fin group 4 and a fan.

Detailed Description

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. The invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "disposed" or "connected" to another element, it can be directly disposed or connected to the other element or intervening elements may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description presented herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

As shown in fig. 1 to 3, the heat sink includes a base 1 mounted in contact with the CPU, mirroring two heat dissipation areas provided on one side of the base 1. Each heat dissipation area comprises three L-shaped heat pipes 2 which are horizontally arranged in an offset mode, and a fin group 3 which is uniformly arranged at the outer ends of the L-shaped heat pipes 2 in a penetrating mode. One end of each L-shaped heat pipe 2 is arranged in the base 1 in a penetrating way, and the other end is arranged in the evenly distributed fin group 3 in a penetrating way. The fans 4 are arranged below the fin groups 3 of the two heat dissipation areas, the fans 4 are low-speed axial flow fans, and heat is taken away by the fin groups 3 from the lower part to the upper part through air suction.

Specifically, the size of the base 1 is adapted to the size of the CPU, two corresponding side surfaces of the base 1 are provided with mounting lugs 1-1, and the mounting lugs 1-1 are further provided with mounting screw holes for mounting a fastener (a conventional fastener, not shown) to mount the heat sink on the main board.

The utility model discloses structure and theory of operation:

base: directly touches the top cover of the CPU to absorb the heat transferred from the CPU and evenly transfers the heat to the heat pipe.

L-shaped heat pipes: the heat at the base end is efficiently transferred to the fins by utilizing the principles of evaporation heat absorption and capillary reflux.

Fin group: the heat pipe is in heat exchange with the air flow by utilizing the characteristic of high heat conductivity of the aluminum, and the heat transferred by the heat pipe is quickly dissipated into the air flow.

A fan: the air flow is driven to flow through the fins, and the heat dissipation efficiency is improved.

When the heat exchanger works, the base is in contact with the CPU top cover for heat conduction, the L-shaped heat pipe is inserted and welded into the base, the L-shaped heat pipe transversely extends to the north of the mainboard (the south bridge chip direction is south, and the CPU direction is north), the other end of the L-shaped heat pipe is inserted into the aluminum fin group, the fan is installed below the fins, and the fins are blown upwards from the lower air suction to take away heat.

The utility model discloses utilize the side to put the overall arrangement, make the fin area not restricted by the mainboard overall arrangement, cooperate horizontal quick-witted case, use the axial fan of lower rotational speed can realize quiet independent wind channel air inlet air-out, do not influence other part wind channels. Outside L shape heat pipe side direction extended the mainboard, thickness was no longer than mainboard IO baffle height, and fin and fan overall height also equal with mainboard thickness, realized more reasonable heat conduction and heat dissipation under ultra-thin prerequisite.

The embodiments of the present invention are only descriptions of the preferred embodiments of the present invention, not right the present invention is designed and limited, without departing from the design concept of the present invention, the technical personnel in the field should fall into the protection scope of the present invention for various modifications and improvements made by the technical solution of the present invention, and the technical contents of the present invention are all recorded in the claims.

Claims

1. The utility model provides a CPU radiator, includes the base with CPU contact installation, the heat pipe in the base is worn to locate by one end, and wears to locate the fin of the heat pipe other end, and the fan that corresponds the fin setting, its characterized in that:

the base correspond and be provided with two at least radiating areas, every radiating area all includes two piece at least L shape heat pipes that the horizontal migration arranged with evenly wear to establish the fin group in L shape heat pipe outer end, the fan setting from the downdraft in fin group below up blow through the fin and take away the heat.

2. The CPU heat sink of claim 1, wherein the heat dissipation area is disposed on one side or both sides of the base in a mirror image manner.

3. The CPU radiator of claim 1 or 2, wherein the base is adapted to the CPU, and mounting lugs are provided on two corresponding sides of the base, and the mounting lugs are provided with fastener mounting screw holes for mounting the radiator on the motherboard.

4. The CPU heat sink of claim 1, wherein said fan is a low speed axial fan.