CN201142047Y - 1U chassis cooling device that is good for heat dissipation - Google Patents

Abstract

The utility model provides a radiating device of a 1U casing, which facilitate heat dissipating. The radiating device comprises a computer CPU, a CPU radiating plate, air guiding hoods and a turbo fan. The CPU radiating plate is fixedly arranged on the computer CPU, one side of the CPU radiating plate is fixedly connected with one air guiding hood which is provided with a transverse air duct, and the other end of the air guiding hood is connected with the turbo fan. The radiating air duct between fins of the CPU radiating plate and the air duct of the air guiding hood are in parallel. The radiating device of the 1U casing has reasonable design and simple structure, greatly improves the radiating efficiency, and is suitable for radiating the 1U casing, thus being of good popularization and use value.

Description

1U chassis cooling device that is good for heat dissipation

1. Technical field

The utility model relates to a heat dissipation technology for a computer system, in particular to a heat dissipation device for a 1U case which is beneficial to heat dissipation.

2. Background technology

For rack servers, the size of the server directly determines the cost of system maintenance. However, as the computer system becomes more and more integrated, the heat generated by each accessory in the case is increasing, and the heat dissipation space in the case is required to be larger and larger. At the same time, the use of large-volume heat sinks and high-power fans requires more free space. For 1U servers, maintaining the size of the chassis and improving heat dissipation efficiency have become an important contradiction.

Now, the heat dissipation of computer systems is highly valued by manufacturers and users. Fans play a very important role in the heat dissipation system of computers. Fans such as computer CPUs, chassis, graphics cards and power supplies are the defenders of the normal and stable operation of computers.

For a 1U server, the known heat dissipation technology is to fixedly install a CPU heat sink on the CPU, and a fan is fixedly installed on the upper part of the CPU heat sink. Due to the limitation of the height of the chassis by the 1U server, the size of the heat sink and the power of the fan are also limited to a certain extent, and the heat dissipation efficiency cannot be improved.

3. Contents of the invention

The purpose of the utility model is to overcome the above-mentioned shortcomings, and provide a 1U chassis cooling device with higher heat dissipation efficiency and good heat dissipation.

The technical scheme of the utility model is realized in the following manner. By changing the position structure of the heat sink and the fan of the computer system, the heat sink in the 1U chassis can have a larger volume and heat dissipation area, and at the same time increase the power of the fan. The direct blowing method dissipates heat for the CPU, which improves the heat dissipation efficiency. The 1U chassis heat dissipation device favorable for heat dissipation includes a computer CPU, a CPU heat sink, an air guide cover and a turbo fan. A CPU cooling fin is fixedly arranged on the CPU of the computer, and one side of the CPU cooling fin is fixedly connected with an air guide cover with a horizontal air passage, and the other end of the air guide cover is connected with a turbofan. The heat dissipation air duct between the fins of the CPU heat sink is parallel to the air duct of the air guide cover.

The utility model has the advantages of:

1. The direct blowing heat dissipation method effectively forms a high wind pressure and strong diffused airflow inside the heat sink, and quickly takes away the internal heat;

2. Reasonably arrange the position of accessories in the chassis, increase the volume of the CPU heat sink and the power of the turbo fan, and greatly improve the heat dissipation efficiency.

4. Description of drawings

Accompanying drawing 1 is the structural schematic diagram of the cooling device of 1U case that is good for heat dissipation.

Accompanying drawing 2 is the connection schematic diagram of the air guide cover of the 1U chassis cooling device which is beneficial to heat dissipation.

The marks in the accompanying drawings indicate respectively: main board 1, CPU 2, heat sink 3, air guide cover 4, turbofan 5, screw 6.

5. Specific implementation

Below in conjunction with the accompanying drawings, the 1U chassis cooling device of the present invention, which is beneficial to heat dissipation, will be described in detail below.

As shown in FIG. 1 , a motherboard 1 , a CPU 2 , a CPU cooling fin 3 , an air guide cover 4 and a turbo fan 5 are arranged in a 1U case. The two ends of the ventilation opening of the air guide cover 4 are respectively connected with the CPU cooling fin 3 and the air outlet of the turbo fan 5 . The upper panel of the air guide cover 4 covers the top of the heat sink 3 and is fixed on the heat sink 3 by screws 6 . The turbofan 5 is fixed on the chassis of the mainboard 1 side by screws, and the turbofan adopts a high-power fan directly blowing to the cooling fins 3 .

As shown in accompanying drawing 2, CPU2 is installed on the CPU base of main board 1, and cooling fin 3 is fixed above CPU2, and contacts with the cooling chip of CPU2. A turbofan 5 is installed on the right side of the CPU2, and the cooling fin 3 is connected with the turbofan 5 through the air guide cover 4 in the middle. The heat dissipation channels between the fins of the CPU heat sink 3 are parallel to the air ducts of the air guide cover.

The heat dissipation device of the 1U chassis of the utility model is reasonable in design, simple in structure, safe and reliable, easy to use, effectively improves the heat dissipation efficiency of the computer system, and thus has good popularization and use value.

Claims (2)

1. A 1U chassis cooling device that is beneficial to heat dissipation, including a computer CPU, a CPU heat sink and a turbo fan, is characterized in that the computer CPU is fixedly provided with a CPU heat sink, and the CPU heat sink is fixedly connected to a wind guide cover with a horizontal air passage, and the air guide The other end of windshield is connected turbofan. 2. The cooling device for 1U chassis that facilitates heat dissipation according to claim 1, characterized in that the heat dissipation air duct between the fins of the CPU heat sink is parallel to the air duct of the air guide cover.

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