WO2008011756A1

WO2008011756A1 - High power light emitting diode illuminating equipment with efficiently heat-dissipating module

Info

Publication number: WO2008011756A1
Application number: PCT/CN2006/001761
Authority: WO
Inventors: Jen-Shyan Chen
Original assignee: Jen-Shyan Chen
Priority date: 2006-07-19
Filing date: 2006-07-19
Publication date: 2008-01-31
Also published as: KR100999844B1; KR20080114733A

Abstract

A light-emitting diode illuminating equipment (3) comprises a heat-dissipating plate device (31), a plurality of heat-dissipating fins (32), a plurality of diode light-emitting apparatuses (33, 34), and a plurality of bar-shaped heat-conducting devices (35) with high heat-conducting coefficient. The heat-dissipating fins extend from the surface of the heat-dissipating plate device, the heat-conducting devices are closely attached to the surface of the heat-dissipating plate device and are disposed between the heat-dissipating fins. Thus, the heat generated by each diode light-emitting apparatus during working is uniformly distributed over the heat-dissipating plate device and the heat-dissipating fins via high efficiently heat-conducting effect of the heat-conducting devices, so that the diode light-emitting apparatuses have consistent junction temperature in order to ensure the consistency of light-emitting performance and life of the diode light-emitting apparatuses.

Description

High-power LED lighting equipment with efficient cooling module

Technical field

The present invention relates to a light-emitting diode illuminating equipment, and in particular, to a light-emitting diode lighting apparatus having a high power, high heat dissipation efficiency, and uniform heat distribution structure. Background technique

Light emitting diodes (LEDs) have many advantages such as power saving, shock resistance, fast response, and mass production. Therefore, lighting equipment using light-emitting diodes as a light source has been continuously researched and developed. The existing high-power LEDs have a problem of excessive temperature after a period of continuous illumination, so that the luminous efficiency of the LED itself is lowered, and the brightness cannot be improved. Therefore, various products that use high-power LEDs require good thermal and thermal dissipation mechanisms. In addition, traditional lighting devices that use multiple light-emitting diodes have uneven heat distribution during operation, so that the long-term heat impact of the light-emitting diodes in the lighting device may be due to the junction temperature (Junction temperature). Too high and first decay (Decay), which in turn causes a decrease in luminous efficiency. In addition, if the lighting device is not uniformly dissipated, the life of each of the LEDs in the lighting device will be uneven, which indirectly affects the overall illumination brightness of the lighting device.

In response to this heat dissipation problem, there is currently a method of dissipating heat using fins. Please refer to FIG. 1A. FIG. 1A is a schematic diagram of the apparatus 1 of the method. The device 1 includes a heat-dissipating plate device 11, a plurality of heat-dissipating fins 12, and a plurality of diode light-emitting devices 13. The heat sink assembly 11 has a first surface 112 and a second surface 114 that is the reverse side of the first surface 112. A diode lighting device 13 is disposed on the first surface 112 of the heat dissipation plate assembly 11. The heat dissipating fins 12 are formed on the second surface 114. Therefore, the heat generated by each of the diode lighting devices 13 during operation is dissipated by the heat dissipation plate assembly 11 and the heat dissipation fins 12. In order to achieve uniform heat dissipation, the distance from the end of the heat dissipating fin 12 to the second surface 114 is not the same. As shown in Fig. 1A, the heat dissipating fins 12 of the intermediate portion are longer, and they can dissipate more heat than the heat dissipating fins 12 of the side portions. The purpose is to avoid the generation of hot spots, resulting in the photoelectric performance of the thermally illuminating diode illuminator 13. The first decline, which in turn causes the luminous efficiency to drop. However, only such heat dissipating fins 12 can not dissipate heat evenly, the temperature difference may be more than ten percent, and the heat dissipating efficiency is also poor, so that there are still hot spots, and the foregoing problems have not been solved.

Another solution uses a vapor chamber (Vapor chamber) to dissipate heat. Please refer to FIG. 1B, which is a schematic diagram showing the apparatus 2 of the method. The device 2 includes a heat sink assembly 21, a plurality of heat dissipating fins 22, a plurality of diode illuminators 23, and a vapor chamber heat sink 24. The heat sink assembly 21 has a first surface 212 and a second surface 214 that is the reverse side of the first surface 212. The vapor chamber heat sink 24 is disposed on the first surface 212. In the heat sink assembly 21, the diode lighting device 23 is disposed on the vapor chamber heat sink 24. The heat dissipating fins 22 are formed on the second surface 214. Compared with the former device 1, although the device 2 solves the problem of uneven temperature distribution of the diode lighting device 23, the vapor chamber heat sink 24 is too expensive and difficult to manufacture, making the device 2 unfavorable for application.

Therefore, it is necessary to provide a light-emitting diode lighting device with high power, high heat dissipation efficiency, and uniform heat dissipation. Summary of the invention

The present invention provides a light-emitting diode lighting apparatus having high power, high heat dissipation efficiency, and uniform heat dissipation.

In accordance with a preferred embodiment of the present invention, an LED lighting apparatus of the present invention includes a heat sink assembly, a plurality of heat dissipating fins, N first diode lighting devices, M second diode lighting devices, and a plurality of high thermal conductivity The coefficient of the heat-conducting device ₀ N is an integer greater than or equal to 3. M is a natural number. The heat sink assembly has a first surface and a second surface that is a reverse side of the first surface. The heat dissipating fins extend from a second surface of the heat sink assembly. The N first diode lighting devices are disposed on the first surface of the heat sink assembly and enclose an area. Each of the first diode lighting devices converts electrical energy into a first light (Light). The M second diode lighting devices are disposed on the first surface of the heat dissipation plate assembly and arranged in the region. Each of the second diode lighting devices converts electrical energy into a second light. The high thermal conductivity strip heat conducting component is closely attached to the second surface of the heat sink assembly and disposed between the heat dissipating fins such that each of the first diode lighting devices and each of the first The heat generated by the two diode illuminating devices during operation is evenly distributed on the heat sink assembly and the heat dissipating fins, and And then the heat sink assembly and the heat dissipating fins dissipate heat, so that the diode lighting devices on the first surface have consistent junction temperatures to ensure the luminescence performance and the lifetime of the LED chips.

Therefore, the LED lighting device of the present invention has high power, high heat dissipation efficiency characteristics, and can distribute heat evenly to maintain the luminous performance and lifetime of the diode lighting device.

The advantages and spirit of the present invention will be further understood from the following detailed description of the invention and the accompanying drawings. DRAWINGS

1A is a schematic view of a device using a heat dissipating fin heat dissipation method;

Figure IB is a schematic view of a device utilizing a vapor chamber heat sink method;

Figure 2 is a view showing a light-emitting diode lighting apparatus according to a first preferred embodiment of the present invention; Figure 3 is a cross-sectional view taken along line X-X of Figure 2;

4 is a schematic view showing a configuration of a diode light-emitting device of the preferred embodiment; FIG. 5 is a cross-sectional view showing a light-emitting diode lighting device according to a second preferred embodiment of the present invention.

1 : LED lighting 2: LED lighting

3: LED lighting equipment 11 heat sink assembly

12 heat sink fins 13 diode light fixture

21 Heat sink assembly 22 Heat sink fins

23 Diode illuminator 24 Vapor chamber radiator

31 Heat sink assembly 32 Heat sink fins

33 first diode illuminating device 34 second diode illuminating device

35 high thermal conductivity strip heat conduction component

36 Cover assembly 37 . Thermal insulation ring

38 sealed space 112: first surface

114: second surface 212: first surface

214: second surface 312: first surface

314: second surface S: area detailed description

Referring to Figures 2 and 3, Figure 2 is a perspective view of a light-emitting diode lighting apparatus according to a preferred embodiment of the present invention. Figure 3 is a cross-sectional view taken along line X-X of Figure 2. According to the first preferred embodiment, the LED lighting device 3 of the present invention comprises a heat sink assembly 31, a plurality of heat dissipating fins 32, N first diode lighting devices 33, and M second diode lighting devices 34. The plurality of high thermal conductivity strip heat conduction members 35, the Shield device 36, and the heat-isolating ring 37o N are integers greater than or equal to 3. M is a natural number.

The heat sink assembly 31 has a first surface 312 and a second surface 314 that is the reverse side of the first surface 312. The plurality of heat dissipating fins 32 extend from the second surface 314 of the heat sink assembly 31. The heat sink assembly 31 has N first recesses formed on the first surface 312

(Cavity) 3122 and M second recesses 3124 formed on the first surface 312. Each of the first diode lighting devices 33 corresponds to a first recess 3122 of the N first recesses 3122, is disposed in the corresponding first recess 3122, and encloses a region S (in FIG. 2 Not shown). Each of the second diode illuminators 34 corresponds to a second recess 3124 of the N second recesses 3124, is disposed within the corresponding second recess 3124, and is disposed within the region S. The high thermal conductivity strip heat conducting assembly 35 is closely attached to the second surface 314 of the heat sink assembly 31 and disposed between the heat dissipating fins 32.

Each of the first diode lighting devices 33 of the first diode lighting device 33 converts electrical energy into a first light (Light). Each of the second diode lighting devices 34 of the second diode lighting device 34 converts electrical energy into a second light. Moreover, one of the N first diode lighting devices 33 includes at least one light-emitting diode chip or at least one laser diode chip. One of the M second diode lighting devices 34 includes at least one light emitting diode chip or at least one laser diode chip.

The cover assembly 36 is coupled to the periphery of the heat sink assembly 31 via a heat insulating ring 37 to form a sealed space for housing the first diode lighting device 33 and the second diode lighting device 34. 38. The cover assembly 36 has a transparent shield that allows light from each of the first diode illumination devices 33 and each of the second diode illumination devices 34 to penetrate.

Because the strip thermal conductivity assembly 35 having a high thermal conductivity closely fits over the second surface 314 of the heat sink assembly 31 and is disposed between the heat dissipating fins 32, each of the first two poles The heat generated by the tube light-emitting device 33 and each of the second diode light-emitting devices 34 during operation can be uniformly distributed on the heat-dissipating plate assembly 31, and then the heat-dissipating plate assembly 31 and the heat-dissipating fins 32 are subsequently distributed. Cooling. Each of the high thermal conductivity strip heat conducting assemblies 35 can be a heat pipe or a vapor chamber heat sink.

It should be noted that the region S surrounded by the first diode lighting device 33 exhibits a convex shape, and the first diode lighting device 33 is at the boundary of the region S, and the second two The pole tube illumination device 34 then falls into this region S, forming a clustered configuration, as shown in FIG. In this case, although the entire illumination brightness can be increased, the second diode light-emitting device 34 in the region S is easily formed by other heat sources around the surface, that is, other diode light-emitting devices 33, 34. The hot spot causes the chip junction temperature of the second diode lighting device 34 to be too high to shorten the life, affecting the luminous efficiency, and the grounding affects the illumination brightness of the LED lighting device 3. However, according to the first preferred embodiment, the LED lighting device 3 of the present invention directly places the diode lighting devices 33, 34 on the first surface 312 of the heat sink assembly 31, increasing heat transfer efficiency. In addition, the LED lighting device 3 closely adheres the strip thermal conductive component 35 of high thermal conductivity to the second surface 314 of the heat dissipating plate assembly 31 and is disposed between the heat dissipating fins 32 so that heat is evenly distributed. And the heat can be quickly dissipated from the heat sink assembly 31 and the heat dissipating fins 32.

According to a first preferred embodiment, the LED lighting device 3 further comprises a circuit board. The circuit board is fixed on the first surface 312 and has a plurality of bond pads and a plurality of holes, wherein the first diode lighting device 33 and the second diode emit light Each of the diode lighting devices 33, 34 of the device 34 corresponds to one of the holes and is disposed through the hole on the first surface 312 of the heat sink assembly 31, and the pads are provided The electrode connection of each of the first diode lighting device 33 and the second diode lighting device 34 is used.

The LED lighting device 3 further includes a control circuit. The control circuit is electrically connected to the first diode lighting device 33 and the second diode lighting device 34, respectively, and is configured to control the first diode lighting device 33 and the second second The pole tube illuminating device 34 emits light. The control circuit may be disposed in the sealed space 38 or disposed outside the sealed space 38.

Referring to FIG. 5, FIG. 5 is a cross-sectional view showing a light emitting diode illumination device in accordance with a second preferred embodiment of the present invention. According to the second preferred embodiment, the LED lighting device 4 of the present invention A heat sink assembly 41, a plurality of heat dissipating fins 42, N diode illuminators 43, a plurality of heat conducting components 44, a shroud assembly 45, and a heat insulating ring 46 are included. N is an integer greater than or equal to 3.

The heat sink assembly 41 has a first surface 412 and a second surface 414 that is the reverse side of the first surface 412. The heat dissipating fins 42 extend from the second surface 414 of the heat sink assembly 41. The heat sink assembly 41 has N first recesses 4122 formed in the first surface 412. Each of the diode lighting devices 43 is correspondingly disposed within a recess 4122. The thermally conductive component 44 fits snugly over the second surface 414 of the heat spreader assembly 41 and is disposed between the heat dissipating fins 42. Also, one of the N diode illuminators 43 includes a light emitting diode chip or at least one laser diode.

The cover assembly 45 engages the periphery of the heat sink assembly 41 through a heat insulating ring 46 to form a sealed space 47 for housing the N diode lighting devices 43. The housing assembly 45 has a transparent cover that allows light from the N diode illuminators 43 shown to penetrate.

Because the heat conducting component 44 is closely attached to the second surface 414 of the heat sink assembly 41 and disposed between the heat dissipating fins 42, the heat generated by each of the diode lighting devices 43 during operation can be uniformly distributed. On the heat sink assembly 41, and then the heat sink assembly 41 and the heat sink fins 42 dissipate heat. One of the thermally conductive components 44 can be a heat pipe or a vapor cavity heat sink. Moreover, when the first diode lighting device 43 and the second diode lighting device 43 of the N diode lighting devices 43 are driven by current, the first diode lighting device 43 and the second diode may be The temperature difference of the tube light-emitting device 43 is controlled within a certain range. This range is determined by how the thermally conductive component 44 is disposed on the second surface 414 of the heat sink assembly 41. Under normal circumstances, it can be controlled within about 10 °C; if it is calculated by heat dissipation, it can be controlled within a temperature range of 5 °C or less.

It is to be noted that, according to the second preferred embodiment, the temperature control of the LED chip affects its luminosity and lifetime, and the temperature control check depends on the temperature measurement, but the actual junction temperature of the chip is not easy to use the current technology. Measurement, for the feasibility of temperature control implementation, the surface temperature of the N-diode light-emitting device of the present invention may be the surface temperature after packaging or the interface temperature of the diode light-emitting device and the heat sink assembly 41. Secondly, the surface temperature after encapsulation of the N-diode illuminating device can also use thermocouples, infrared rays or other devices that can directly or indirectly measure the surface temperature. In addition, the temperature of the substitute junction temperature is not limited to the surface temperature of the diode illuminating device, and other temperatures directly or indirectly related to the junction temperature may also be used; if allowed, it may be feasible to add a temperature measuring circuit during the manufacturing process of the LED. of. According to this second preferred embodiment, the LED lighting device 4 further comprises a circuit board. The circuit board is fixed on the first surface 412 and has a plurality of pads and N holes, wherein each of the diode lighting devices 43 corresponds to a hole, and the pads are used to provide the N diode lighting devices 43 to conduct electricity. Use.

The LED lighting device 4 further includes a control circuit. The control circuit is electrically connected to the N diode illuminators 43, and is used to control the N diode illuminators 43 to emit light. The control circuit can be disposed in the sealed space 47 or outside the sealed space 47.

Therefore, according to the above preferred embodiment, the LED lighting device of the present invention not only has high power illumination, but also has high efficiency of soaking and heat dissipation, and the diode lighting device has a uniform junction temperature, and the temperature difference can be controlled Within a certain range, to ensure the luminescence performance of the LED chip and the consistency of life.

Furthermore, the arrangement of the strip-shaped thermally conductive members 35, 44 of the high thermal conductivity according to the present invention on the second surfaces 314, 414 of the heat dissipating plate assemblies 31, 41 is not limited to that shown. Its configuration should be designed according to the actual product. Therefore, it is possible that the strip-shaped heat-conducting members 35, 44 of high thermal conductivity exhibit a radial shape or a specific shape obtained experimentally.

The above description of the preferred embodiments of the present invention is intended to provide a On the contrary, the intention is that various changes and equivalent structures are included in the scope of the invention.

Claims

Rights request

1. An LED lighting device comprising:

a heat sink assembly having a first surface and a second surface that is a reverse side of the first surface;

a plurality of heat dissipating fins extending from the second surface of the heat dissipating plate assembly;

N first diode light-emitting devices, N is an integer greater than or equal to 3, the N first diode lighting devices are disposed on the first surface of the heat dissipation plate assembly and enclose An area, each of the first diode lighting devices converts electrical energy into a first light (Light);

M second diode lighting devices, M is a natural number, the M second diode lighting devices are disposed on the first surface of the heat dissipation plate assembly and arranged by the N first diode lighting devices Within the enclosed area, each of the second diode lighting devices converts the electrical energy into a second light;

a bar-shaped heat-conducting device with a high heat-conducting coefficient, the strip-shaped heat-conducting component having a high thermal conductivity closely adhering to the second surface of the heat sink assembly and disposed Between the heat dissipating fins, the heat generated by each of the first diode illuminating means and each of the second diode illuminating means during operation is highly efficient by means of the high thermal conductivity strip heat conducting component Heat conduction is uniformly distributed on the heat sink assembly and the heat dissipating fins, and then heat is dissipated by the heat sink assembly and the heat dissipating fins, resulting in uniformity of the diode lighting devices on the first surface The junction temperature is used to ensure the optical performance and consistency of the components.

2. The LED lighting device of claim 1, wherein each of the high thermal conductivity strip heat conducting components is a heat pipe or a vapor chamber.

3. The LED lighting device of claim 1, wherein the heat sink assembly has N first cavities formed on the first surface and M formed on the first surface a second recess, each of the first diode lighting devices corresponding to one of the N first recesses and disposed in the corresponding first recess, each of the second diodes emitting The device corresponds to one of the M second pockets and is disposed within the corresponding second pocket.

4. The LED lighting device of claim 1, wherein one of the N first diode lighting devices comprises at least one light-emitting diode chip Or at least one laser diode chip, and one of the M second diode lighting devices comprises at least one light emitting diode chip or at least one laser diode chip.

5. The LED lighting device of claim 4, further comprising a circuit board fixed to the first surface, the circuit board having a plurality of bond pads and a plurality of holes Wherein each of the first diode lighting device and the second diode lighting device corresponds to one of the holes and is disposed through the hole in the heat dissipation plate assembly And a pad for providing electrode connection of each of the first diode lighting device and the second diode lighting device.

6. The LED lighting device of claim 1, further comprising a Shield device coupled to the periphery of the heat sink assembly to form the first diode lighting device And a sealed space of the second diode lighting device, the cover assembly having a transparent shield such that each of the first diode lighting device and the second diode lighting device The emitted light penetrates.

7. The LED lighting device of claim 6, wherein the cover assembly engages the periphery of the heat sink assembly via a heat-isolating ring.

8. The LED lighting device of claim 6, further comprising a control circuit electrically connecting the first diode lighting device and the second diode lighting device, respectively And used to control the first diode lighting device and the second diode lighting device to emit light.

9. The LED lighting device of claim 8, wherein the control circuit is disposed within the sealed space.

10. The LED lighting device of claim 8, wherein the control circuit is disposed outside the sealed space.

11. An LED lighting device comprising:

a heat-dissipating plate device having a first surface and a second surface that is a reverse side of the first surface;

a plurality of heat dissipating fins, the heat dissipating fins extending from the second surface of the heat dissipating plate assembly; N Diode light-emitting apparatus, N is an integer greater than or equal to 3, and the N diode lighting devices are disposed on the first surface of the heat dissipation plate assembly in a two-dimensional distribution;

a plurality of thermally conductive components, the plurality of thermally conductive components being attached to the second surface of the heat sink assembly and disposed between the heat dissipating fins, wherein the first diodes in the N diode lighting devices When the light emitting device and the second diode light emitting device emit light, a temperature difference between the first diode light emitting device and the second diode light emitting device is less than 10 °C.

12. The LED lighting device of claim 1, wherein one of the thermally conductive components is a heat pipe or a vapor cavity heat sink.

13. The LED lighting device of claim 1, wherein the heat sink assembly includes N pockets on the first surface, wherein each of the diode lighting devices is correspondingly disposed within a recess.

The LED lighting device of claim 1 , wherein the third diode lighting device of the N diode lighting devices comprises a light-emitting diode chip or a laser diode chip (Laser diode) Chip).

15. The LED lighting device of claim 4, further comprising a circuit board fixed to the first surface, the circuit board having a plurality of bond pads and N holes Each of the diode lighting devices corresponds to a hole, and the pad is configured to provide conduction of the N diode lighting devices.

16. The LED lighting device of claim 1, further comprising a Shield device engaged with a periphery of the heat sink assembly to form a sealed space for accommodating the N diode illuminators (Sealed space), the cover assembly has a transparent shield to allow light rays emitted by the one of the diode light-emitting devices to penetrate.

17. The LED lighting device of claim 6, wherein the cover assembly engages the periphery of the heat sink assembly via a heat-isolating ring.

18. The LED lighting device of claim 6, further comprising a control circuit electrically connected to the N diode lighting devices to control the N diode lighting devices to emit light.

19. The LED lighting device of claim 8, wherein the control circuit is disposed within the sealed space.

20. The LED lighting device of claim 8, wherein the control circuit is provided Placed outside the sealed space ₍