CN204179103U - Light-emitting diode flat bracket, carrier unit and LED device - Google Patents
Light-emitting diode flat bracket, carrier unit and LED device Download PDFInfo
- Publication number
- CN204179103U CN204179103U CN201420437909.9U CN201420437909U CN204179103U CN 204179103 U CN204179103 U CN 204179103U CN 201420437909 U CN201420437909 U CN 201420437909U CN 204179103 U CN204179103 U CN 204179103U
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- China
- Prior art keywords
- metal substrate
- hole
- emitting diode
- light
- carrier unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 52
- 239000002184 metal Substances 0.000 claims abstract description 52
- 239000000758 substrate Substances 0.000 claims abstract description 51
- 239000012212 insulator Substances 0.000 claims abstract description 17
- 238000012360 testing method Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000084 colloidal system Substances 0.000 claims description 5
- 238000012856 packing Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229920006336 epoxy molding compound Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of light-emitting diode flat bracket, carrier unit and LED device, wherein light-emitting diode flat bracket comprises metal substrate and partly encapsulates the insulator of described metal substrate, it is characterized in that: described insulator comprises the housing being covered in metal substrate upper surface and the connector be filled between metal substrate, described housing comprises the large through-hole of M × N number of array arrangement and the small through hole of the individual array arrangement of (M+1) × (N+1), wherein M, N >=1, described large through-hole is surrounded by described small through hole, the connector being metal substrate bottom described large through-hole and being filled between metal substrate, constitute chip mount portion and electrical junction, metal substrate bottom described small through hole, constitute stent electrode.
Description
Technical field
The utility model relates to LED technology field, particularly relates to a kind of light-emitting diode flat bracket, carrier unit and LED device.
Background technology
Light-emitting diode (LED) light source have high efficiency, the long-life, not containing the advantage of the harmful substances such as Hg.Along with the fast development of LED technology, the performance such as brightness, life-span of LED is obtained for great lifting, makes the application of LED more and more extensive, from outdoor lightings such as street lamps to room lightings such as decorative lamps, uses all one after another or be replaced with LED as light source.
The EMC(Epoxy Molding Compound of current employing etch-forming) support, all the mode adopting bottom test after the encapsulation of encapsulation factory, this test mode encapsulation factory needs to drop into expensive testing equipment, and efficiency is low, so the present each producer of EMC support for etch-forming is all in the suitable feasible side method of testing of searching, to save manufacturing cost and first equipment investment.
Utility model content
The purpose of this utility model is to overcome shortcoming of the prior art with not enough, provides a kind of and can carry out side test and the light-emitting diode flat bracket of use existing equipment, carrier unit and LED device.
The utility model is achieved through the following technical solutions:
A kind of light-emitting diode flat bracket, comprise metal substrate and partly encapsulate the insulator of described metal substrate, it is characterized in that: described insulator comprises the housing being covered in metal substrate upper surface and the connector be filled between metal substrate, described housing comprises the large through-hole of M × N number of array arrangement and the small through hole of the individual array arrangement of (M+1) × (N+1), wherein M, N >=1, described large through-hole is surrounded by described small through hole, the connector being metal substrate bottom described large through-hole and being filled between metal substrate, constitute chip mount portion and electrical junction, metal substrate bottom described small through hole, constitute stent electrode.
Preferably, described metal substrate is electrical lead frame.
Preferably, described housing is the insulator of EMC material.
Preferably, the centre distance of adjacent two described small through hole is greater than the diameter of large through-hole.
Preferably, the diameter of described small through hole is between 0.2mm to 0.8mm.
A kind of carrier unit, comprises metal substrate and partly encapsulates the insulator of described metal substrate, it is characterized in that: described metal substrate is electrical lead frame; Described insulator comprises the housing being covered in metal substrate upper surface and the connector be filled between electrical lead frame; Described housing comprises large through-hole and small gap; Described large through-hole is surrounded by four small gaps, the connector being electrical lead frame bottom described large through-hole and being filled between electrical lead frame, constitute chip mount portion and electrical junction, metal substrate bottom described small gap, directly communicate with the external world in the side away from large through-hole, constitute stent electrode; Described small gap and small through hole have overlapping region.
Preferably, the shape of described small gap is arc or polygon.
Preferably, the degree of depth of described small gap is between 0.3mm to 0.5mm, and the bottom of described small gap is metal substrate, forms test department.
A kind of LED device, the stent electrode comprising described carrier unit, be arranged on the LED chip on described carrier unit and arrange on the housing, and on described metal substrate the packing colloid of encapsulated moulding.
Preferably, described packaging body is epoxy resin or silica gel.
Relative to prior art, a kind of light-emitting diode flat bracket of the present utility model, carrier unit and LED device pass through housing four small gap bottom metal as test department, thus realize realizing side test to carrier unit, improve production efficiency, reduce manufacturing cost.
In order to the utility model can be understood more clearly, illustrate below with reference to accompanying drawing and set forth embodiment of the present utility model.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of a kind of light-emitting diode flat bracket of the present utility model;
Fig. 2 is the schematic diagram of a kind of carrier unit of the present utility model;
Fig. 3 is the structural representation of a kind of LED device of the present utility model.
Embodiment
For making the object of the utility model embodiment, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the utility model embodiment, technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is the utility model part embodiment, instead of whole embodiments.Based on the embodiment in the utility model, the every other embodiment that those of ordinary skill in the art obtain under the prerequisite not making creative work, all belongs to the scope of the utility model protection.
embodiment one
As shown in Figure 1, a kind of light-emitting diode flat bracket 10 that the utility model provides, comprises metal substrate 1 and partly encapsulates the insulator of described metal substrate 1.Described metal substrate 1 is electrical lead frame.Described insulator comprises the housing 2 being covered in metal substrate upper surface and the connector be filled between electrical lead frame.Described housing 2 comprises the large through-hole of M × N number of array arrangement and the small through hole of the individual array arrangement of (M+1) × (N+1), wherein M, N >=1.Each large through-hole is surrounded by four small through hole.The connector being electrical lead frame bottom described large through-hole and being filled between electrical lead frame, constitutes chip mount portion and electrical junction.Be metal substrate 1 bottom described small through hole, constitute stent electrode 3.Adjacent two described small through hole are greater than the diameter of large through-hole in the distance at center.The diameter of described small through hole is between 0.2mm to 0.8mm.A kind of light-emitting diode flat bracket that the present embodiment provides, can pass through cutting technique, form at least one M × N, wherein M, N >=1 carrier unit.
Wherein, described metal substrate 1 can be made up of metallic copper or metallic aluminium or the conductive metallic material such as copper alloy or aluminium alloy.
Wherein, described housing 2 is EMC(epoxy molding compound) insulator of material, in the present embodiment, described EMC is white, is not limited to the present embodiment.
embodiment two
The utility model also provides a kind of carrier unit 20, and it is formed by a kind of light-emitting diode flat bracket cutting of described embodiment one.As shown in Figure 2, described carrier unit 20 comprises metal substrate 1 and partly encapsulates the insulator of described metal substrate, and described metal substrate 1 is electrical lead frame.Described insulator comprises the housing 2 being covered in metal substrate 1 upper surface and the connector be filled between electrical lead frame.Described housing 2 comprises large through-hole and small gap, and described large through-hole is surrounded by four small gaps.The connector being electrical lead frame bottom described large through-hole and being filled between electrical lead frame, constitutes chip mount portion and electrical junction.Be metal substrate 1 bottom described small gap, directly communicate with the external world in the side away from large through-hole, constitute stent electrode 3.The shape of described small gap is arc or polygon, and the preferred arc of this example, is not limited to the present embodiment.Described small gap and small through hole have overlapping region.Described stent electrode is that the upper surface of metal substrate 1 is exposed to formation outside housing 2, and namely stent electrode 3 is exposed to outside housing.
Described four small gap degree of depth are between 0.3mm to 0.5 mm, are metal substrates bottom described small gap, form test department, described at least two electrodes be arranged on housing 2 four small gaps be used for be electrically connected LED chip.A kind of carrier unit structure that the present embodiment provides, by housing four small gap bottom metal as test department, thus realizes realizing side test to carrier unit, improves production efficiency, reduce manufacturing cost.
embodiment three
As shown in Figure 3, the present embodiment also provides a kind of LED device 30, it is formed by a kind of carrier unit manufacture of described embodiment two, comprise carrier unit 20, the LED chip 4 be arranged on this carrier unit 20, the stent electrode be arranged on described housing, and the packing colloid 5 of encapsulated moulding on metallic substrates, in other embodiments, LED chip is flip-chip, namely can save wire.
Wherein, described LED chip 4 is the one in UV chip, blue chip, green glow chip or red light chips, is preferably gallium nitride base blue light chip.
Wherein, packing colloid 5 is epoxy resin or silica gel, is preferably epoxy resin, but is not limited to the utility model embodiment in the present embodiment.
The utility model is not limited to above-mentioned execution mode, if do not depart from spirit and scope of the present utility model to various change of the present utility model or distortion, if these are changed and distortion belongs within claim of the present utility model and equivalent technologies scope, then the utility model is also intended to comprise these changes and distortion.
Claims (10)
1. a light-emitting diode flat bracket, comprise metal substrate and partly encapsulate the insulator of described metal substrate, it is characterized in that: described insulator comprises the housing being covered in metal substrate upper surface and the connector be filled between metal substrate, described housing comprises the large through-hole of M × N number of array arrangement and the small through hole of the individual array arrangement of (M+1) × (N+1), wherein M, N >=1, described large through-hole is surrounded by described small through hole, the connector being metal substrate bottom described large through-hole and being filled between metal substrate, constitute chip mount portion and electrical junction, metal substrate bottom described small through hole, constitute stent electrode.
2. a kind of light-emitting diode flat bracket according to claim 1, is characterized in that: described metal substrate is electrical lead frame.
3. a kind of light-emitting diode flat bracket according to claim 1, is characterized in that: described housing is the insulator of EMC material.
4. a kind of light-emitting diode flat bracket according to claim 1, is characterized in that: the centre distance of adjacent two described small through hole is greater than the diameter of large through-hole.
5. a kind of light-emitting diode flat bracket according to claim 1, is characterized in that: the diameter of described small through hole is between 0.2mm to 0.8mm.
6. a carrier unit, it is formed by a kind of light-emitting diode flat bracket according to claim 1 cutting, comprises metal substrate and partly encapsulates the insulator of described metal substrate, it is characterized in that: described metal substrate is electrical lead frame; Described insulator comprises the housing being covered in metal substrate upper surface and the connector be filled between electrical lead frame; Described housing comprises large through-hole and small gap; Described large through-hole is surrounded by four small gaps, the connector being electrical lead frame bottom described large through-hole and being filled between electrical lead frame, constitute chip mount portion and electrical junction, metal substrate bottom described small gap, directly communicate with the external world in the side away from large through-hole, constitute stent electrode; Described small gap and small through hole have overlapping region.
7. a kind of carrier unit according to claim 6, is characterized in that: the shape of described small gap is arc or polygon.
8. a kind of carrier unit according to claim 6, is characterized in that: the degree of depth of described small gap is between 0.3mm to 0.5mm, and the bottom of described small gap is metal substrate, forms test department.
9. a LED device, it is formed by the arbitrary described a kind of carrier unit manufacture of claim 6 to 8, the stent electrode comprising described carrier unit, be arranged on LED chip on described carrier unit and arrange on the housing, and on described metal substrate the packing colloid of encapsulated moulding.
10. a kind of LED device according to claim 9, is characterized in that: described packing colloid is epoxy resin or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420437909.9U CN204179103U (en) | 2014-08-06 | 2014-08-06 | Light-emitting diode flat bracket, carrier unit and LED device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420437909.9U CN204179103U (en) | 2014-08-06 | 2014-08-06 | Light-emitting diode flat bracket, carrier unit and LED device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204179103U true CN204179103U (en) | 2015-02-25 |
Family
ID=52567888
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420437909.9U Expired - Lifetime CN204179103U (en) | 2014-08-06 | 2014-08-06 | Light-emitting diode flat bracket, carrier unit and LED device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204179103U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI629431B (en) * | 2017-02-17 | 2018-07-11 | 隆達電子股份有限公司 | Fram, light-emitting device applying the same, and method for manufacturing light-emitting device applying the same |
-
2014
- 2014-08-06 CN CN201420437909.9U patent/CN204179103U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI629431B (en) * | 2017-02-17 | 2018-07-11 | 隆達電子股份有限公司 | Fram, light-emitting device applying the same, and method for manufacturing light-emitting device applying the same |
| US10475975B2 (en) | 2017-02-17 | 2019-11-12 | Lextar Electronics Corporation | Frame, light-emitting device using the same, and method for manufacturing the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150225 |