JP2008130823A - Lighting device, and electronic equipment with it - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lighting device which is excellent in heat dissipation and can effectively dissipate heat generated in a light emitting element even when a heat generation amount of the light emitting element increases. <P>SOLUTION: The LED light (lighting device) has a housing part 1 formed of aluminum and a plurality of surface mount type LEDs 10. The surface mount type LED 10 has a substrate 11, an LED element 12 fixed on an upper surface of the substrate 11 and a reflection frame body 13 which reflects light from the LED element 12. The reflection frame body 13 of the surface mount type LED 10 is constituted of aluminum. The surface mount type LED 10 is disposed in an inside of the housing part 1 so that the reflection frame body 13 and an upper side housing part 1a directly come into thermal contact with each other in an upper surface side of the substrate 11. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a lighting device and an electronic device including the same, and more particularly to a lighting device provided with a light emitting device as a light source and an electronic device including the lighting device.

  Conventionally, a light-emitting device with excellent heat dissipation has been known (see, for example, Patent Document 1), and is generally used as a light source of a lighting device.

Patent Document 1 discloses a surface in which an LED (Light Emitting Diode) element (light emitting element) and a reflection frame body that is made of resin and has an inner peripheral surface as a reflection surface are fixed on a metal substrate. A mounting LED (light emitting device) is described. Such a surface-mounted LED is generally mounted on a circuit board made of glass epoxy or the like, and the circuit board is fixed to a casing unit of the lighting apparatus, so that the casing of the lighting apparatus is obtained. It is arranged in the part.
JP 2003-218398 A

  By the way, in the light emitting device such as the surface mount type LED described in the above-mentioned Patent Document 1, generally, after fixing the substrate and the reflection frame body, by cutting with a dicing saw, etc. Divided. For this reason, the size of the substrate of the light emitting device is formed to be approximately the same as the size of the light emitting device. Therefore, the surface-mounted LED described in Patent Document 1 has a disadvantage that the size (heat dissipation area) of the metal substrate that dissipates heat generated by the light emission of the LED element is very small. In this case, while the amount of heat generated by the LED element is small, the heat generated by the light emission of the LED element can be efficiently radiated from the metal substrate of the surface-mounted LED, while the amount of heat generated by the LED element is increased. In this case, it is difficult to sufficiently dissipate the heat generated in the LED element from the metal substrate. As a result, there is a problem that it is difficult to obtain a lighting device having good heat dissipation characteristics even if the surface-mounted LED described in Patent Document 1 is used as the light source of the lighting device.

  The present invention has been made in order to solve the above-described problems, and one object of the present invention is to provide a light-emitting element having good heat dissipation characteristics even when the heat generation amount of the light-emitting element is increased. An illumination device capable of efficiently dissipating generated heat and an electronic apparatus including the illumination device are provided.

  In order to achieve the above object, a lighting device according to a first aspect of the present invention includes a light emitting device in which a light emitting element and a reflection frame that reflects light from the light emitting element are fixed on the upper surface of the substrate, and the substrate And a first heat dissipating member that is in thermal contact with the reflecting frame of the light emitting device. In addition, the thermal contact of this invention is a thermal contact which does not interpose air.

  In the illumination device according to the first aspect, as described above, by providing the first heat dissipation member in thermal contact with the reflection frame of the light emitting device on the upper surface side of the substrate, the heat generated by the light emission of the light emitting element is obtained. Since heat can be radiated from the first heat radiating member via the reflecting frame, the reflecting frame is made of a material having high thermal conductivity and the size of the first heat radiating member is set to a predetermined size. Good heat dissipation characteristics can be obtained, and even when the heat generation amount of the light emitting element is increased, the generated heat can be efficiently radiated from the first heat radiating member. Even when the amount of heat generated by the light emitting element is increased by dissipating heat generated by the light emission of the light emitting element from the first heat radiating member, thereby driving the light emitting element with a large light output, the temperature of the light emitting element is increased. Since the increase can be suppressed, it is possible to suppress the disadvantage that the light emission characteristics of the light emitting element are deteriorated due to the temperature of the light emitting element being increased. As a result, the light output can be increased without degrading the light emission characteristics.

  In the illumination device according to the first aspect, preferably, the reflection frame is in direct contact with the first heat dissipation member. With this configuration, the thermal resistance between the reflective frame and the first heat radiating member can be reduced, so that the heat generated by the light emission of the light emitting element can be easily transmitted through the reflective frame. 1 It is possible to dissipate heat from the heat dissipating member. Thus, by configuring the first heat radiating member to a predetermined size, it easily has good heat radiating characteristics, and even when the heat generation amount of the light emitting element increases, the heat generated in the light emitting element can be reduced. An illumination device that can efficiently dissipate heat can be obtained.

  In the illuminating device according to the first aspect, preferably, the reflection frame body is indirectly in contact with the first heat radiating member via the heat conducting member. If comprised in this way, since the heat conductive member provided between a reflective frame and a 1st heat radiating member can fill the clearance gap between a reflective frame and a 1st heat radiating member, a reflective frame and It can suppress that the problem that the efficiency of the heat transfer between a reflective frame body and a 1st heat radiating member falls resulting from a clearance gap producing | generating between a 1st heat radiating member and a 1st heat radiating member arises. For this reason, since the heat generated by the light emission of the light emitting element can be efficiently transferred to the first heat radiating member via the reflection frame, the heat generated by the light emission of the light emitting element can be easily Heat can be radiated from the first heat radiating member. Thus, by configuring the first heat radiating member to a predetermined size, it easily has good heat radiating characteristics, and even when the heat generation amount of the light emitting element increases, the heat generated in the light emitting element can be reduced. An illumination device that can efficiently dissipate heat can be obtained.

  In the illumination device according to the first aspect, preferably, the reflection frame of the light emitting device is made of a metal material. If comprised in this way, since a metal material has high heat conductivity, compared with the case where the reflective frame of a light-emitting device is comprised from a resin material, the heat which generate | occur | produced by light emission of the light emitting element is made to reflect a reflective frame. Thus, heat can be easily transferred to the first heat radiating member. Accordingly, the heat generated by the light emission of the light emitting element can be easily transferred to the first heat radiating member by bringing the reflective frame body and the first heat radiating member into thermal contact with each other. The heat generated by the light emission can be efficiently radiated from the first heat radiating member. In this case, since the heat dissipation from the reflecting frame can be improved as compared with the case where the reflecting frame of the light emitting device is made of a resin material, the heat generated by the light emission of the light emitting element can be more efficiently generated. Heat can be dissipated.

  The lighting device according to the first aspect preferably further includes a housing portion in which the light emitting device is disposed, and the first heat radiating member includes at least a part of the housing portion. With this configuration, the heat generated by the light emission of the light emitting element can be radiated from the housing through the reflective frame, so that good heat radiation characteristics can be obtained without providing a heat radiating member separately. Obtainable. As a result, even when the amount of heat generated by the light emitting element increases, the heat generated in the light emitting element can be efficiently radiated from the casing, and the increase in the number of parts can be suppressed, and the casing can be suppressed. Space in the body can be used effectively. In this case, the casing is preferably made of a metal material having a high thermal conductivity.

  In this case, preferably, the housing part is constituted by an outer shape member and a first heat radiating member. According to this configuration, even when the outer shape member of the casing is made of resin or the like, the heat generated by the light emission of the light emitting element can be dissipated from the first heat radiating member. Good heat dissipation characteristics can be obtained without depending on the above. In addition, when the outer shape member of the housing part is made of a material having high thermal conductivity such as a metal material, the heat generated by the light emission of the light emitting element can be efficiently radiated from the outer shape member. Good heat dissipation characteristics can be obtained.

  The lighting device according to the first aspect preferably further includes a second heat radiating member that is disposed on the lower surface side of the substrate and radiates heat from the light emitting element. If such a configuration is applied to the lighting device according to the first aspect, the first heat radiating member that is in thermal contact with the reflection frame body on the upper surface side of the substrate, and the second heat radiating member disposed on the lower surface side of the substrate, Since heat generated by light emission of the light emitting element can be dissipated, good heat dissipation characteristics can be obtained more easily. Thereby, even when the calorific value of the light emitting element increases, the heat generated in the light emitting element can be radiated efficiently.

  In the illumination device according to the first aspect, preferably, the first heat radiating member is formed with a reflection surface that reflects light from the light emitting element. If comprised in this way, since the light from a light emitting element can be reflected in the reflective surface formed in the 1st heat radiating member, the 1st heat radiating member radiates the heat | fever which generate | occur | produced by light emission of the light emitting element, and is 1st. 1 The directivity of light from the light emitting element can be adjusted (condensed or dispersed) by the reflecting surface of the heat radiating member.

  In the lighting device according to the first aspect, preferably, the first heat radiating member has a lens portion for adjusting the directivity of light from the light emitting element. With this configuration, the directivity of light from the light emitting element is adjusted (condensed or dispersed) by the lens portion of the first heat radiating member while the heat generated by the light emission of the light emitting element is radiated by the first heat radiating member. )can do.

  An electronic apparatus according to a second aspect of the present invention is an electronic apparatus provided with the illumination device according to the first aspect. With this configuration, it is possible to easily obtain an electronic device that has good heat dissipation characteristics and can efficiently dissipate heat generated in the light emitting element even when the heat generation amount of the light emitting element increases. it can.

  As described above, according to the present invention, it is possible to obtain a lighting device that has good heat dissipation characteristics and can efficiently dissipate heat generated in a light emitting element even when the heat generation amount of the light emitting element increases. Can do.

  In addition, according to the present invention, it is possible to obtain an electronic device that has good heat dissipation characteristics and can efficiently dissipate heat generated in the light emitting element even when the heat generation amount of the light emitting element increases.

  DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the first to sixth embodiments, a case where the present invention is applied to an LED light which is an example of a lighting device will be described. In the seventh embodiment, a case where the present invention is applied to a side-edge type backlight device that is an example of a lighting device will be described.

(First embodiment)
FIG. 1 is an overall perspective view of the LED light according to the first embodiment of the present invention, and FIG. 2 is a plan view of the LED light according to the first embodiment of the present invention shown in FIG. FIG. 3 is a cross-sectional view taken along the line 100-100 in the region surrounded by the broken line in FIG. 4 to 7 are views for explaining the structure of the LED light according to the first embodiment of the present invention shown in FIG. The structure of the LED light according to the first embodiment of the present invention will be described with reference to FIGS.

  The LED light by 1st Embodiment is provided with the housing | casing part 1 and the some surface mount type LED10 arrange | positioned inside this housing | casing part 1, as shown in FIGS. Further, the plurality of surface mount LEDs 10 are disposed inside the housing unit 1 in a state of being mounted on the upper surface of the circuit board 2. The housing portion 1 is formed in a rectangular shape extending in the direction of arrow A, and includes an upper housing portion 1a and a lower housing portion 1b. Further, the upper housing portion 1a and the lower housing portion 1b are configured so as to be split vertically, and are each formed of aluminum. In addition, a plurality of openings 1c for extracting light from the surface-mounted LED 10 are formed on the upper surface of the upper housing 1a at predetermined intervals so as to extend in the arrow A direction. The upper housing 1a is an example of the “first heat radiating member” and the “housing” in the present invention.

  As shown in FIGS. 4 and 5, the surface-mounted LED 10 includes a substrate 11 made of glass epoxy or the like, and a plurality (three) of light emitting diode elements (LED elements) fixed on the upper surface of the substrate 11. 12, a reflective frame 13 that is fixed on the upper surface of the substrate 11 and reflects light emitted from the LED element 12, and a translucent member 14 that is filled inside the reflective frame 13. Yes. The surface-mounted LED 10 is an example of the “light emitting device” in the present invention, and the LED element 12 is an example of the “light emitting element” in the present invention.

  Further, the substrate 11 of the surface mount LED 10 is formed in a square shape in plan view, and a plurality of (three) polar electrode layers 15 having a positive polarity are formed on the upper surface of the substrate 11. Further, a plurality of (three) polar electrode layers 16 having negative polarity, and nonpolarity (neutral) having no polarity electrically separated through the polar electrode layers 15 and 16 and the insulating groove 17 An electrode layer 18 is formed. On the lower surface of the substrate 11, although not shown, a plurality of electrode layers electrically connected to the polar electrode layers 15 and 16 through a through-hole connection portion (not shown), respectively. Is formed. The electrode layer (not shown) electrically connected to the polar electrode layers 15 and 16 is mainly used as a wiring terminal. The polar electrode layers 15 and 16, the nonpolar electrode layer 18, and the electrode layer (not shown) are made of a conductive material having excellent thermal conductivity such as copper.

  In addition, the LED element 12 of the surface-mounted LED 10 is on the upper surface of the nonpolar electrode layer 18 and has an adhesive (not shown) or the like in a region located inside the opening 13a of the reflection frame 13 described later. It is fixed by. The LED element 12 is arranged and fixed at a predetermined interval between the positive polar electrode layer 3 and the negative polar electrode layer 4. Each LED element 12 has a function of emitting red, green, and blue light. When these LED elements 12 emit light at the same time, their colors are mixed and emitted. . In this case, only the LED element 12 that emits blue light is mounted, and the phosphor is dispersed in the translucent member 14 so that the light emitted from the surface-mounted LED 10 becomes white light. Alternatively, the surface mount type LED 10 may be configured.

  Further, the LED element 12 of the surface mount LED 10 is electrically connected to the positive polar electrode layer 15 and the negative polar electrode layer 16 via bonding wires 19 and 20, respectively. Thereby, by applying a voltage between the positive polar electrode layer 15 and the negative polar electrode layer 16, a current flows through the LED elements 12, and each LED element 12 emits light at a specific wavelength. The bonding wires 19 and 20 are made of fine metal wires made of Au, Ag, Al, or the like.

  Moreover, the reflective frame 13 of the surface-mounted LED 10 is made of aluminum. The reflection frame 13 is formed in a planar shape having substantially the same size as the substrate 11. Specifically, the reflection frame 13 is formed in a square shape when seen in a plan view. In addition, an opening 13a is formed in the central portion of the reflection frame 13, and an inner side surface 13b of the opening 13a is configured to function as a reflection surface that reflects light emitted from the LED element 12. Has been. In addition, the opening 13a of the reflection frame 13 has an inner side surface 13b formed in a circular shape so as to uniformly collect the light emitted from the LED elements 12, and is tapered toward the upper side of the opening 13a. It is configured to spread in a shape. In addition, the surface of the inner side surface 13b of the opening 13a is subjected to a silver plating process or an alumite process for improving the light reflectance. As described above, the inner side surface 13b of the opening 13a is configured to efficiently reflect the light emitted from the LED element 12 upward.

  The reflective frame 13 of the surface-mounted LED 10 is fixed on the substrate 11 with an adhesive or the like so as to surround the LED element 12 with the inner side surface 13b of the opening 13a. At this time, the reflecting frame 13 is fixed on the substrate 11 so that the lower surface of the reflecting frame 13 and the nonpolar electrode layer 18 of the substrate 11 are in direct or indirect thermal contact. Thereby, in the surface-mounted LED 10 of the LED light according to the first embodiment, the heat generated when the LED element 12 emits light is transferred to the reflective frame body 13 via the nonpolar electrode layer 18, and the reflective frame body 13 is configured to dissipate heat.

  The translucent member 14 of the surface mount LED 10 is made of a resin material such as an epoxy resin or a silicon resin, and the reflective frame 13 is sealed so as to seal the LED element 12 and the bonding wires 19 and 20. It is provided in the opening 13a. The translucent member 14 has a role of suppressing the LED element 12 and the bonding wires 19 and 20 from coming into contact with air or moisture.

  Further, as shown in FIGS. 6 and 7, the circuit board 2 is made of glass epoxy or the like, and is formed in a rectangular shape extending in the arrow A direction. On the upper surface of the circuit board 2, a plurality of surface-mounted LEDs 10 are mounted in a straight line so as to extend in the longitudinal direction (arrow A direction) of the circuit board 2 at a predetermined interval. A plurality of through holes 2a for inserting screws 3 (see FIG. 3) are formed in a predetermined region of the circuit board 2.

  Moreover, the circuit board 2 is being fixed to the back surface side of the upper side housing | casing part 1a with the screw 3 inserted in the through-hole 2a, as shown in FIG. That is, the circuit board 2 is fixed on the upper surface side of the circuit board 2 so that the upper housing part 1a is located. Further, the circuit board 2 is fixed to the upper housing 1a so that the opening 13a of the reflection frame 13 of the mounted surface mount LED 10 and the opening 1c of the upper housing 1a coincide with each other. Has been. In this case, the opening 1c of the upper housing 1a may be made larger than the opening 13a of the reflection frame 13 in consideration of the mounting position accuracy of the surface mount LED 10. Note that light emitted from the surface-mounted LED 10 is extracted to the outside of the housing unit 1 through an opening 1c formed in the upper housing unit 1a. Further, a spacer member 4 is provided between the upper housing part 1 a and the circuit board 2.

  Here, in 1st Embodiment, when the circuit board 2 is fixed to the upper side housing | casing part 1a, the upper surface of the reflective frame 13 of the surface mount type LED10 contacts with the back surface of the upper side housing | casing part 1a. It is configured. That is, the surface-mounted LED 10 is disposed inside the housing 1 so that the reflective frame 13 and the upper housing 1a are in direct thermal contact with each other on the upper surface side of the substrate 11 of the surface-mounted LED 10. Has been. Thereby, the heat from the LED element 12 transferred to the reflective frame 13 is transferred to the upper casing 1a, and the heat generated by the light emission of the LED element 12 is also radiated from the upper casing 1a. It becomes possible.

  Since the screw 3 and the spacer member 4 for fixing the circuit board 2 are in contact with the upper housing part 1a, the reflection frame 13 is formed by configuring them with a material having high thermal conductivity such as a metal material. It is possible to efficiently dissipate the heat transferred to the upper housing portion 1a through the screw 3 and the spacer member 4 as well.

  As described above, in the LED light according to the first embodiment, the LED element 12 is directly brought into thermal contact with the reflective frame 13 and the upper housing portion 1a on the upper surface side of the substrate 11 of the surface-mounted LED 10. Since the heat generated by the light emission is configured to be dissipated from the upper housing portion 1a, it is not necessary to take measures for heat dissipation on the circuit board 2 or the like located on the lower surface side of the substrate 11 of the surface-mounted LED 10. For this reason, it is possible to avoid various inconveniences due to heat radiation countermeasures applied to other portions (members) located on the lower surface side of the substrate 11 such as the circuit board 2.

  Here, as a heat dissipation measure on the circuit board 2 side, a method of forming an electrode pattern for heat dissipation on the circuit board 2 and dissipating heat from other parts through this electrode pattern is conceivable. Since it is necessary to form an electrode pattern for heat dissipation on the circuit board 2, there is a disadvantage that restrictions are imposed on the conductor design of the circuit board 2 and the mounting method of the surface-mounted LED 10. . While a method using a metal core substrate for the circuit board 2 is also conceivable, in this case, there is a disadvantage that restrictions are imposed on the selection of the material and type of the circuit board 2. Further, since the metal core substrate is more expensive than a glass epoxy substrate or the like, when the metal core substrate is used for the circuit board 2, there is a disadvantage that the manufacturing cost of the LED light increases. Furthermore, a method of providing a heat sink or the like on the lower surface side of the circuit board 2 (the side opposite to the side on which the surface-mounted LED 10 is mounted) is also conceivable. In this case, the heat sink and the surface-mounted LED 10 are heated. Since it is necessary to form a through hole or the like in the circuit board 2 in order to make contact, there is a disadvantage that the configuration of the circuit board 2 becomes complicated due to the formation of the through hole or the like. When the heat sink is merely brought into contact with the lower surface of the circuit board 2 without forming a through hole or the like in the circuit board 2, the circuit board 2 disposed between the surface mount LED 10 and the heat sink. It is difficult to obtain sufficient heat dissipation due to the thermal resistance.

  In the LED light according to the first embodiment, the heat generated by the light emission of the LED element 12 is dissipated from the upper housing portion 1a, so that the other portion (member) such as the circuit board 2 on which the surface-mounted LED 10 is mounted. Since it is not necessary to take measures against heat dissipation, it is possible to avoid the occurrence of the above inconvenience. For this reason, unlike the case where other parts (members) located on the lower surface side of the substrate 11 such as the circuit board 2 are provided with heat dissipation measures, the material and type of the circuit board 2, the conductor design of the circuit board 2, the surface mounting type It becomes possible to increase the degree of freedom in designing the LED 10 mounting method and the like. In addition, since it is not necessary to form a through hole or the like in the circuit board 2, it is possible to prevent the configuration of the circuit board 2 from being complicated by the formation of the through hole or the like, and this also allows freedom of design. It becomes possible to increase the degree. Furthermore, by using an inexpensive glass epoxy substrate or the like for the circuit board 2, it is possible to suppress an increase in the manufacturing cost of the LED light.

  The LED light according to the first embodiment described above can be used as a light source for various electronic devices such as a display device.

  In the first embodiment, as described above, the upper housing 1a and the reflective frame 13 of the surface-mounted LED 10 are configured to be in direct thermal contact with each other on the upper surface side of the substrate 11 of the surface-mounted LED 10. Thus, the heat generated by the light emission of the LED element 12 can be dissipated from the upper housing part 1a through the reflecting frame 13 made of aluminum, so that good heat dissipation characteristics can be obtained, and the LED element Even when the calorific value of 12 increases, the generated heat can be efficiently radiated from the upper casing 1a. In addition, even when the calorific value of the LED element 12 increases by driving the LED element 12 with a large light output by dissipating the heat generated by the light emission of the LED element 12 from the upper casing 1a, Since the temperature rise of the LED element 12 can be suppressed, it is possible to suppress the inconvenience that the light emission characteristics of the LED element 12 are deteriorated due to the temperature rise of the LED element 12. As a result, the light output can be increased without degrading the light emission characteristics.

  In the first embodiment, since the reflective frame 13 of the surface-mounted LED 10 is made of aluminum, aluminum has a high thermal conductivity. Therefore, the reflective frame 13 of the surface-mounted LED 10 is made of a resin material. Compared to the case, the heat generated by the light emission of the LED element 12 can be easily transferred to the upper casing 1a via the reflection frame 13. Thereby, the heat generated by the light emission of the LED element 12 can be easily transferred to the upper housing portion 1a by bringing the reflective frame 13 and the upper housing portion 1a into thermal contact with each other. The heat generated by the light emission of the element 12 can be efficiently radiated from the upper housing part 1a. In this case, since heat dissipation from the reflection frame 13 can be improved as compared with the case where the reflection frame 13 of the surface-mounted LED 10 is made of a resin material, heat generated by light emission of the LED element 12 can be improved. Can be radiated more efficiently.

  Further, in the first embodiment, the heat generated by the light emission of the LED element 12 can be radiated from the upper housing part 1a (housing part 1) made of aluminum via the reflective frame 13, so that heat is radiated. Good heat radiation characteristics can be obtained without separately providing a member or the like. Thereby, even when the heat generation amount of the LED element 12 increases, the heat generated by the light emission of the LED element 12 can be efficiently dissipated from the upper housing portion 1a, and an increase in the number of components is suppressed. In addition, the space inside the casing 1 can be effectively utilized.

(Second Embodiment)
FIG. 8 is a cross-sectional view illustrating the structure of an LED light according to the second embodiment of the present invention. Next, the structure of the LED light according to the second embodiment will be described with reference to FIG.

  In the LED light according to the second embodiment, as shown in FIG. 8, in the configuration of the first embodiment (see FIG. 3), between the upper housing portion 1 a and the reflection frame 13 of the surface-mounted LED 10. Further, a heat conductive member 5 such as a heat conductive sheet or heat conductive grease is provided. That is, in the second embodiment, unlike the first embodiment, the reflective frame 13 of the surface-mounted LED 10 is configured to indirectly make thermal contact with the upper housing portion 1a via the heat conducting member 5. Has been.

  Moreover, the LED light by 2nd Embodiment mentioned above can be used as a light source of various electronic devices, such as a display apparatus similarly to the said 1st Embodiment.

  In addition, the other structure of 2nd Embodiment is the same as that of the structure of 1st Embodiment mentioned above.

  In the second embodiment, as described above, the reflective frame body 13 of the surface-mounted LED 10 is configured to be in thermal contact indirectly with the upper housing portion 1a via the heat conducting member 5, The gap between the reflective frame 13 and the upper casing 1a can be filled by the heat conducting member 5 provided between the reflective frame 13 and the upper casing 1a. It is possible to suppress the inconvenience that the efficiency of heat transfer between the reflection frame 13 and the upper housing portion 1a is reduced due to the gap between the housing portion 1a and the housing portion 1a. For this reason, since the heat generated by the light emission of the LED element 12 can be efficiently transferred to the upper housing 1a via the reflection frame 13, it is easily generated by the light emission of the LED element 12. Heat can be dissipated from the upper casing 1a. Thereby, even if it has a favorable heat dissipation characteristic and the emitted-heat amount of the LED element 12 increases, the heat | fever which generate | occur | produced in the LED element 12 can be thermally radiated efficiently.

  The remaining effects of the second embodiment are similar to those of the aforementioned first embodiment.

(Third embodiment)
9 is an overall perspective view of the LED light according to the third embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along the line 200-200 in the region surrounded by the broken line in FIG. Next, the structure of the LED light according to the third embodiment will be described with reference to FIGS.

  In the LED light according to the third embodiment, as shown in FIGS. 9 and 10, in the configuration of the first embodiment (see FIG. 3), the casing 51 includes an upper casing 52 and a lower casing. The upper casing 52 is further composed of an outer member 52a and a heat radiating plate 52b provided on the back side of the outer member 52a. When the circuit board 2 is fixed to the upper casing 52 with screws 54, the heat sink 52b and the upper surface of the reflection frame 13 of the surface-mounted LED 10 are formed on the upper surface side of the substrate 11 of the surface-mounted LED 10. It is configured to be in direct thermal contact. Thereby, the heat from the LED element 12 transferred to the reflecting frame 13 can be transferred to the heat radiating plate 52b, and the heat generated by the light emission of the LED element 12 is also radiated from the heat radiating plate 52b. It becomes possible to make it. The outer shape member 52a and the heat radiating plate 52b constituting the upper housing part 52 are each made of aluminum, as in the first and second embodiments. The upper casing 52 is formed with a plurality of openings 52 c for taking out the light emitted from the surface-mounted LED 10 to the outside of the casing 51.

  Further, the heat radiating plate 52b constituting the upper housing part 52 is configured to be in direct thermal contact with the outer shape member 52a of the upper housing part 52. Thereby, the heat from the LED element 12 that has been transferred to the heat radiating plate 52b is further transferred to the upper casing 52, so that the LED element 12 also emits light from the upper casing 52. It is possible to dissipate heat efficiently. The heat radiating plate 52b is an example of the “first heat radiating member” in the present invention, and the upper housing part 52 is an example of the “casing part” in the present invention.

  Further, the LED light according to the third embodiment described above can be used as a light source for various electronic devices such as a display device, as in the first and second embodiments.

  In addition, the other structure of 3rd Embodiment is the same as that of the structure of 1st Embodiment mentioned above.

  In the third embodiment, as described above, when the upper casing 52 is composed of the outer member 52a and the heat radiating plate 52b, the outer member 52a of the upper casing 52 is composed of resin or the like. However, since the heat generated by the light emission of the LED element 12 can be dissipated from the heat radiating plate 52b, good heat dissipation characteristics can be obtained without depending on the material of the outer member 52a of the upper housing portion 52. . For this reason, in the third embodiment, the outer shape member 52a of the upper housing portion 52 can be made of a material other than a material such as aluminum having excellent heat dissipation properties. It can suppress that it falls.

  The remaining effects of the third embodiment are similar to those of the aforementioned first embodiment.

(Fourth embodiment)
FIG. 11 is an overall perspective view of an LED light according to a fourth embodiment of the present invention, and FIG. 12 is a plan view of the LED light according to the fourth embodiment of the present invention shown in FIG. 13 is a cross-sectional view taken along the line 300-300 in the region surrounded by the broken line in FIG. Next, the structure of the LED light according to the fourth embodiment will be described with reference to FIGS.

  In the LED light according to the fourth embodiment, as shown in FIGS. 11 to 13, in the configuration of the third embodiment (see FIG. 10), the back surface side of the circuit board 2 (surface-mounted LED 10 is mounted). A heat radiating plate 64 that dissipates heat from the LED element 12 is attached to the surface opposite to the surface. That is, in the LED light according to the fourth embodiment, on the upper surface side of the substrate 11 of the surface mount LED 10, the heat radiating plate 62 b that is in direct thermal contact with the reflection frame 13 and the lower surface side of the substrate 11 of the surface mount LED 10 ( The heat generated by the light emission of the LED element 12 is radiated from both the heat radiating plate 64 attached to the back surface side of the circuit board 2). The heat radiating plate 64 is an example of the “second heat radiating member” in the present invention.

  Further, as shown in FIG. 13, the surface-mounted LED 10 is fixed to the back surface side of the upper housing portion 62 with screws 65 in a state of being sandwiched between the two heat sinks 62 b and 64 described above. The screw 65 is made of a metal material and is in direct contact with both of the two heat sinks 62b and 64. Thereby, it is possible to efficiently transfer the heat from the LED element 12 transferred to the heat radiating plate 62b to the heat radiating plate 64 attached to the back side of the circuit board 2 via the screws 65. Therefore, it is possible to efficiently dissipate heat from the heat radiating plate 64 without forming an electrode pattern for heat dissipation or a through hole on the circuit board 2. Note that a heat dissipation electrode pattern, a through hole, or the like may be formed on the circuit board 2 to further improve heat dissipation. Further, as described above, by adopting a configuration in which the surface-mounted LED 10 is sandwiched between the two heat sinks 62b and 64, the adhesion between the reflective frame 13 and the heat sink 62b is further improved. Contact with the heat sink 62b is stabilized. For this reason, the heat conduction from the reflection frame 13 to the heat sink 62b is more reliably improved.

  Similarly to the third embodiment, the housing unit 61 includes an upper housing unit 62 and a lower housing unit 63. The upper housing unit 62 includes an outer shape member 62a and an outer shape member 62a. It is comprised from the heat sink 62b provided in the back surface side. In addition, an opening 62 c for taking out light from the surface-mounted LED 10 to the outside of the housing unit 61 is formed on the upper surface of the upper housing unit 62. The heat radiating plate 62b is an example of the “first heat radiating member” in the present invention, and the upper housing part 62 is an example of the “casing part” in the present invention.

  In addition, a lens member 66 for adjusting the directivity of light emitted from the surface-mounted LED 10 is disposed above the LED element 12 of the surface-mounted LED 10. The lens member 66 is made of resin, and a convex lens portion 66a is fitted into the opening 62c of the upper housing portion 62 (outer shape member 62a).

  Moreover, the LED light by 4th Embodiment mentioned above can be used as a light source of various electronic devices, such as a display apparatus similarly to the said 1st-3rd embodiment.

  In addition, the other structure of 4th Embodiment is the same as that of the above-mentioned 3rd Embodiment.

  In the fourth embodiment, as described above, by disposing the heat radiating plate 64 that dissipates heat from the LED element 12 on the back surface side of the circuit board 2 that is the lower surface side of the substrate 11 of the surface-mounted LED 10, 11 and the heat radiating plate 64 arranged on the lower surface side of the substrate 11 together with the heat radiating plate 62b that is in direct thermal contact with the reflecting frame 13 on the upper surface side of the LED 11, the heat generated by the light emission of the LED element 12 can be radiated. Therefore, good heat dissipation characteristics can be obtained more easily. Thereby, even when the calorific value of the LED element 12 increases, the heat generated in the LED element 12 can be radiated more efficiently.

  The remaining effects of the fourth embodiment are similar to those of the aforementioned first and third embodiments.

(Fifth embodiment)
FIG. 14 is an overall perspective view of the LED light according to the fifth embodiment of the present invention, and FIG. 15 is a plan view of the LED light according to the fifth embodiment of the present invention shown in FIG. 16 and 17 are cross-sectional views for explaining the structure of the LED light according to the fifth embodiment of the present invention shown in FIG. Next, the structure of the LED light according to the fifth embodiment will be described with reference to FIGS.

  In the LED light according to the fifth embodiment, as shown in FIGS. 14 to 17, the circuit board 2 on which the surface-mounted LED 10 is mounted is attached by a screw 75 via a heat dissipation member 74 on which a reflective surface 74 a is formed. The upper casing 73 is fixed on the upper surface of the lower casing 73. When the circuit board 2 is fixed to the lower housing portion 73, the heat dissipation member 74 and the upper surface of the reflection frame 13 of the surface mount LED 10 are directly on the upper surface side of the substrate 11 of the surface mount LED 10. It is comprised so that it may be in thermal contact. Thereby, the heat from the LED element 12 transferred to the reflective frame 13 can be transferred to the heat radiating member 74, and the heat generated by the light emission of the LED element 12 is also radiated from the heat radiating member 74. It becomes possible. In addition, the reflective surface 74a formed in the heat radiating member 74 has the function to reflect and condense the light radiate | emitted from the surface mount type LED10. As described above, in the LED light according to the fifth embodiment, unlike the first to fourth embodiments described above, a function for condensing light from the surface-mounted LED 10 is added to the heat dissipation member 74. The heat dissipation member 74 is an example of the “first heat dissipation member” in the present invention. Moreover, the heat radiating member 74 is comprised from the metal material etc. which were excellent in heat dissipation, such as aluminum.

  Further, in the LED light according to the fifth embodiment, as shown in FIG. 16, the upper surface of the heat dissipation member 74 is configured to come into contact with the rear surface of the upper housing portion 72. Therefore, the upper casing 72 is made of a metal material having excellent heat dissipation such as aluminum, so that the heat from the LED element 12 transferred to the heat dissipation member 74 is also heated to the upper casing 72. It is possible to transmit the heat, and the heat generated by the light emission of the LED element 12 can also be efficiently radiated from the upper casing 72. In addition, by configuring the lower casing 73 from a metal material having excellent heat dissipation such as aluminum, it is possible to dissipate heat generated by the light emission of the LED element 12 from the lower casing 73 as well. It becomes. At this time, by using a screw 75 made of a metal material or the like as the screw 75 for fixing the circuit board 2, the heat generated by the light emission of the LED element 12 through the heat radiating member 74 and the screw 75 is reduced. It becomes possible to efficiently transfer heat to the body part 73. Accordingly, it is possible to efficiently dissipate heat from the lower housing portion 73 without forming an electrode pattern for heat dissipation or a through hole on the circuit board 2. The lower casing 73 is an example of the “second heat radiating member” in the present invention. Further, similarly to the above-described fourth embodiment, a heat dissipation electrode pattern, a through hole, or the like may be formed on the circuit board 2 to further improve heat dissipation.

  In the LED light according to the fifth embodiment, an opening 72a is formed on the upper surface of the upper casing 72, and a diffusion plate 76 is attached to the opening 72a.

  Moreover, the LED light by 5th Embodiment mentioned above can be used as a light source of various electronic devices, such as a display apparatus similarly to the said 1st-4th embodiment.

  The remaining configuration of the fifth embodiment is similar to the configuration of the first embodiment described above.

  In the fifth embodiment, as described above, the reflective surface 74 a that reflects the light from the LED element 12 on the heat radiating member 74 is formed on the heat radiating member 74 so that the light from the LED element 12 is formed on the heat radiating member 74. Therefore, the directivity of light from the LED element 12 can be adjusted (condensed or dispersed) while the heat generated by the light emission of the LED element 12 is dissipated by the heat dissipating member 74.

  The remaining effects of the fifth embodiment are similar to those of the aforementioned first embodiment.

  FIG. 18 is a cross-sectional view showing the structure of an LED light according to a modification of the fifth embodiment. Referring to FIG. 18, in the LED light according to the modification of the fifth embodiment, a convex lens portion 77 a is formed on the diffusion plate 77 in the configuration of the fifth embodiment. Thereby, the directivity of light from the surface-mounted LED 10 collected by the reflection surface 74 a of the heat radiating member 74 can be adjusted by the lens portion 77 a of the diffusion plate 77.

  In addition, the other structure of the modification of 5th Embodiment is the same as that of 5th Embodiment mentioned above.

(Sixth embodiment)
19 is an overall perspective view of the LED light according to the sixth embodiment of the present invention, and FIG. 20 is a plan view of the LED light according to the sixth embodiment of the present invention shown in FIG. 21 and 22 are cross-sectional views for explaining the structure of the LED light according to the sixth embodiment of the present invention shown in FIG. Next, the structure of the LED light according to the sixth embodiment will be described with reference to FIGS.

  In the LED light according to the sixth embodiment, as shown in FIGS. 19 to 22, in the configuration of the fifth embodiment (see FIG. 16), a resin lens portion formed in a convex shape on the heat radiating member 84. 84a is provided. Further, in the LED light according to the sixth embodiment, the circuit board 2 on which the surface mount type LED 10 is mounted constitutes the housing portion 81 with the screw 85 via the heat radiating member 84 as in the fifth embodiment. It is fixed on the upper surface of the lower housing part 83. When the circuit board 2 is fixed to the lower housing 83, the heat dissipation member 84 and the upper surface of the reflective frame 13 of the surface-mounted LED 10 are directly connected to the upper surface side of the substrate 11 of the surface-mounted LED 10. It is comprised so that it may be in thermal contact. Thereby, the heat from the LED element 12 transferred to the reflective frame 13 can be transferred to the heat radiating member 84, and the heat generated by the light emission of the LED element 12 is also radiated from the heat radiating member 84. It becomes possible. The convex lens portion 84a provided on the heat radiating member 84 has a function of adjusting the directivity of light emitted from the surface-mounted LED 10. The heat dissipation member 84 is an example of the “first heat dissipation member” in the present invention.

  Further, in the LED light according to the sixth embodiment, the upper surface of the heat dissipation member 84 is configured to come into contact with the rear surface of the upper housing portion 82 as in the fifth embodiment. In addition, an opening 82 a for taking out the light emitted from the surface-mounted LED 10 to the outside of the housing 81 is formed on the upper surface of the upper housing 82.

  In addition, the LED light according to the sixth embodiment can be used as a light source for various electronic devices such as a display device, as in the first to fifth embodiments.

  The remaining configuration of the sixth embodiment is similar to the configuration of the fifth embodiment described above.

  In the sixth embodiment, as described above, the heat radiating member 84 is provided with the lens portion 84a for adjusting the directivity of light from the LED element 12, so that the heat radiating member 84 causes light emission of the LED element 12. The directivity of light from the LED element 12 can be adjusted (condensed or dispersed) by the lens portion 84a of the heat dissipation member 84 while dissipating the generated heat.

  The remaining effects of the sixth embodiment are similar to those of the aforementioned first and fifth embodiments.

(Seventh embodiment)
FIG. 23 is an overall perspective view of the backlight device according to the seventh embodiment of the present invention, and FIG. 24 is a plan view of the backlight device according to the seventh embodiment of the present invention shown in FIG. FIG. 25 is a cross-sectional view taken along the line 600-600 in FIG. Next, referring to FIGS. 23 to 25, in the seventh embodiment, unlike the first to sixth embodiments, the present invention is applied to a side-edge type backlight device which is an example of a lighting device. Will be described.

  As shown in FIGS. 23 to 25, the side-edge type backlight device according to the seventh embodiment includes a box-shaped casing 91 having an upper surface opened, and a light guide plate mounted inside the casing 91. 92 and a plurality of surface-mounted LEDs 10 attached to the outer surface of the casing 91. The light guide plate 92 has a predetermined thickness, and reflects the light from the surface-mounted LED 10 incident from the side surface of the light guide plate 92 inside the light guide plate 92, whereby the upper surface of the light guide plate 92. It has a function to irradiate from. Further, the bottom surface of the casing 91 is configured to function as a reflection surface that reflects light incident on the light guide plate 92 upward. The surface-mounted LED 10 of the seventh embodiment has the same configuration as that of the first to sixth embodiments, and is mounted linearly on the flexible printed wiring board (FPC) 93 with a predetermined interval. Has been.

  Here, in the seventh embodiment, as shown in FIG. 25, an opening 91 a for allowing light from the surface-mounted LED 10 to enter the light guide plate 92 is formed on the outer surface of the housing portion 91. Further, the surface-mounted LED 10 is fixed to the outer surface of the housing portion 91 by a heat conductive sheet 94. Specifically, the surface mount type LED 10 is mounted on the housing 91 by the heat conductive sheet 94 so that the position of the opening 91a of the housing 91 matches the position of the opening 13a of the reflective frame 13. It is fixed to the outside surface. Thereby, in the backlight device according to the seventh embodiment, on the upper surface side of the substrate 11 of the surface-mounted LED 10, the upper surface of the reflective frame 13 and the outer surface of the housing portion 91 are interposed via the heat conductive sheet 94. It is configured to be in indirect thermal contact. The heat conductive sheet 94 is provided with an opening 94 a corresponding to the opening 91 a of the housing 91. Moreover, the housing | casing part 91 is an example of the "1st heat radiating member" of this invention, and the heat conductive sheet 94 is an example of the "heat conductive member" of this invention.

  Moreover, the housing | casing part 91 is comprised from the metal material excellent in heat dissipation, such as aluminum.

  The backlight device according to the seventh embodiment can be used as a light source for various electronic devices such as a liquid crystal display device. In this case, in the backlight device according to the seventh embodiment, since the surface-mounted LED 10 is fixed to the outer surface of the housing portion 91, the external circuit of the electronic device main body is Is easy to connect.

  In the seventh embodiment, as described above, on the upper surface side of the substrate 11 of the surface mount LED 10, the outer surface of the housing portion 91 and the upper surface of the reflection frame body 13 of the surface mount LED 10 form the heat conductive sheet 94. Therefore, the heat generated by the light emission of the LED element 12 can be dissipated from the housing portion 91 via the reflective frame 13 by being configured so as to be in thermal contact indirectly, and thus good heat dissipation is achieved. Characteristics can be obtained, and even when the amount of heat generated by the LED element 12 is increased, the generated heat can be efficiently radiated from the housing portion 91.

  The other effects of the seventh embodiment are the same as the effects of the first and second embodiments described above.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description of the embodiment but by the scope of claims for patent, and includes all modifications within the meaning and scope equivalent to the scope of claims for patent.

  For example, in the first to seventh embodiments, the example in which the present invention is applied to the LED light and the side edge type backlight device has been described. However, the present invention is not limited to this, and the LED light and the side edge type backlight device are used. You may make it apply this invention to illuminating devices other than a light apparatus.

  In the first to sixth embodiments, an example in which a plurality of surface-mounted LEDs are provided in a straight line has been described. However, the present invention is not limited to this, and only one surface-mounted LED is provided. Alternatively, a plurality of surface mount LEDs may be provided in a matrix. When only one surface mount LED is provided, it can function as a flash light source for a camera by being mounted on an electronic device such as a mobile phone with a camera function or a digital still camera. In addition, when a plurality of surface-mount LEDs are provided in a matrix, a direct-type backlight device or the like can be formed and used as a light source for an electronic device such as a liquid crystal television or a liquid crystal display device. .

  Moreover, although the said 1st-7th embodiment showed the example using the surface mount type LED by which the LED element was mounted as a light source of the illuminating device (LED light, backlight apparatus) of this invention, this invention is shown. Not only this but the light-emitting device in which light emitting elements other than an LED element are mounted may be used as a light source of an illuminating device.

  Moreover, in the said 1st-7th embodiment, although the example which comprised the reflective frame body of surface mount type LED from aluminum was shown, this invention is not restricted to this, The reflective frame body of surface mount type LED is used. You may comprise from magnesium and another metal material. Moreover, you may comprise a reflective frame from materials other than a metal material. Examples of materials other than metal materials include resins and ceramics. Moreover, you may coat | cover a metal material on the surface of the reflective frame body comprised from resin, ceramics, etc. Further, the reflection frame may be made of a material in which a metal is dispersed in a resin.

  Moreover, although the example using the circuit board which consists of glass epoxy was shown in the said 1st-6th embodiment, this invention is not limited to this, Circuit boards other than glass epoxy boards, such as FPC and a metal core board | substrate, are shown. It may be used.

  Moreover, although the said 1st-6th embodiment showed the example which attached the surface mount type LED to the housing | casing part by fixing a circuit board to a housing | casing part with a screw, this invention is not limited to this. If the reflective frame body can be brought into thermal contact with a heat radiating member or the like, the surface mount type LED may be attached to the housing or the like using a method other than the method of fixing with a screw. Good. For example, the surface-mount type LED may be attached to the housing by using a method such as fitting, soldering, welding, or pressing (pressure welding), or a surface using a heat conductive double-sided tape or the like. You may make it mount mounting LED in a housing | casing part. When mounting the surface-mounted LED on the casing using a method of pressing (pressure contact), for example, a spring (spring) or a rubber rubber is disposed on the back side of the circuit board, and this spring (spring And a method of pressing the reflective frame against the heat radiating member by a pressing force of rubber rubber or the like.

  In the third to sixth embodiments, examples in which the casing is made of aluminum are shown. However, the present invention is not limited to this, and the casing is made of a metal material other than aluminum or a resin material such as plastic. You may make it comprise a body part.

  Moreover, in the said 3rd-6th embodiment, the heat sink, the heat radiating member, the upper side housing | casing part, and the reflective frame body of surface mount type LED showed the example comprised so that it might be in direct thermal contact. However, the present invention is not limited thereto, and the heat radiating plate, the heat radiating member, and the upper housing portion, and the reflective frame body of the surface-mounted LED are interposed via a heat conductive member such as a heat conductive sheet or heat conductive grease. Alternatively, it may be configured to indirectly contact with heat.

  Further, in the first and second embodiments, the example in which the casing is made of aluminum has been shown. However, the present invention is not limited to this, and the casing is made of a metal material other than aluminum or a ceramic material. You may make it comprise.

  Moreover, although the example which comprised the heat sink from aluminum was shown in the said 3rd and 4th embodiment, this invention is not limited to this, A heat sink is comprised from metal materials other than aluminum, or a ceramic material. You may make it do.

  In the fourth embodiment, the example in which the lens member for adjusting the directivity of the light emitted from the surface-mounted LED is provided above the LED element of the surface-mounted LED is described. However, the present invention is not limited to this, and such a lens member may not be provided.

  Moreover, although the example which used FPC as a circuit board was shown in the said 7th Embodiment, this invention is not restricted to this, You may use a glass epoxy board, a metal core board, etc. as a circuit board.

  In the seventh embodiment, an example is shown in which the outer surface of the housing portion and the reflective frame of the surface-mounted LED are configured to be in thermal contact indirectly via the heat conductive sheet. The present invention is not limited to this, and the outer surface of the housing portion and the reflection frame body of the surface-mounted LED may be configured to be in direct thermal contact.

  Moreover, in the said 7th Embodiment, although the reflective frame body of surface mount type LED was fixed to the outer surface of a housing | casing part with the heat conductive sheet, this invention is not restricted to this, It is screwed, You may comprise so that surface mounting type LED may be fixed to the outer surface of a housing | casing part using methods, such as insertion, soldering, welding, or pressing (pressure welding). Moreover, you may comprise so that surface-mounted LED may be fixed to the outer surface of a housing | casing part using a heat conductive double-sided tape etc. instead of a heat conductive sheet.

  Moreover, in the said 7th Embodiment, although the structural example which does not attach a heat radiating member etc. to the back surface side of FPC which mounted surface mount type LED was shown, this invention is not limited to this but mounted surface mount type LED. You may comprise so that heat radiating members, such as a housing frame, may be attached to the back surface side of FPC.

1 is an overall perspective view of an LED light according to a first embodiment of the present invention. It is a top view of the LED light by 1st Embodiment of this invention shown in FIG. It is sectional drawing along the 100-100 line of the area | region enclosed with the broken line of FIG. FIG. 2 is an overall perspective view of a surface-mounted LED used as a light source of the LED light according to the first embodiment of the present invention shown in FIG. 1. It is a top view of surface mount type LED used as a light source of the LED light by 1st Embodiment of this invention shown in FIG. It is a top view which shows the state which mounted the surface mount type LED used as a light source of the LED light by 1st Embodiment of this invention shown in FIG. 1 on the circuit board. FIG. 2 is an enlarged perspective view showing a part of a state in which a surface-mounted LED used as a light source of the LED light according to the first embodiment of the present invention shown in FIG. 1 is mounted on a circuit board. It is sectional drawing which showed the structure of the LED light by 2nd Embodiment of this invention. It is a whole perspective view of the LED light by 3rd Embodiment of this invention. FIG. 10 is a cross-sectional view taken along line 200-200 in a region surrounded by a broken line in FIG. 9. It is a whole perspective view of the LED light by 4th Embodiment of this invention. FIG. 12 is a plan view of an LED light according to the fourth embodiment of the present invention shown in FIG. 11. It is sectional drawing along the 300-300 line of the area | region enclosed with the broken line of FIG. It is a whole perspective view of the LED light by 5th Embodiment of this invention. FIG. 15 is a plan view of an LED light according to a fifth embodiment of the present invention shown in FIG. 14. It is sectional drawing along the 400-400 line of the area | region enclosed with the broken line of FIG. It is sectional drawing along the 450-450 line | wire of FIG. It is sectional drawing which showed the structure of the LED light by the modification of 5th Embodiment. It is a whole perspective view of the LED light by 6th Embodiment of this invention. It is a top view of the LED light by 6th Embodiment of this invention shown in FIG. It is sectional drawing along the 500-500 line of the area | region enclosed with the broken line of FIG. It is sectional drawing along the 550-550 line | wire of FIG. It is a whole perspective view of the backlight apparatus by 7th Embodiment of this invention. FIG. 24 is a plan view of a backlight device according to a seventh embodiment of the present invention shown in FIG. FIG. 25 is a cross-sectional view taken along line 600-600 in FIG. 24.

Explanation of symbols

1, 51, 61, 71, 81, 91 Case 1a, 52, 62, 72, 82 Upper case (first heat radiating member, case)
1b, 53, 63, 73, 83 Lower casing (second heat radiating member)
1c, 52c, 62c, 72a, 82a, 91a Opening 2 Circuit board 2a Through hole 3, 54, 65, 75, 85 Screw 4 Spacer member 5 Thermal conduction member 10 Surface mount type LED (light emitting device)
11 Substrate 12 LED element (light emitting element)
DESCRIPTION OF SYMBOLS 13 Reflecting frame 13a Opening part 13b Inner side surface 14 Translucent member 15, 16 Polarized electrode layer 17 Insulating groove 18 Nonpolar electrode layer 19, 20 Bonding wire 52a, 62a Outer member 52b, 62b Heat sink (1st heat radiating member) )
64 Heat dissipation plate (second heat dissipation member)
74, 84 Heat dissipation member (first heat dissipation member)
74a Reflecting surface 84a Lens part 76, 77 Diffuser 94 Heat conduction sheet (heat conduction member)

Claims (10)

A light emitting device in which a light emitting element and a reflection frame that reflects light from the light emitting element are fixed on the upper surface of the substrate;
A lighting device comprising: a first heat radiating member in thermal contact with the reflection frame of the light emitting device on an upper surface side of the substrate.   The lighting device according to claim 1, wherein the reflection frame body is in direct contact with the first heat radiating member.   The lighting device according to claim 1, wherein the reflection frame body is in indirect contact with the first heat radiating member via a heat conducting member.   The lighting device according to claim 1, wherein the reflection frame body of the light emitting device is made of a metal material. It further comprises a housing part in which the light emitting device is disposed,
The lighting device according to any one of claims 1 to 4, wherein the first heat radiating member includes at least a part of the casing.   The lighting device according to claim 5, wherein the housing portion includes an outer shape member and the first heat radiating member.   The lighting device according to claim 1, further comprising a second heat dissipating member that is disposed on a lower surface side of the substrate and dissipates heat from the light emitting element.   The lighting device according to claim 1, wherein a reflection surface that reflects light from the light emitting element is formed on the first heat radiating member.   The lighting device according to claim 1, wherein the first heat radiating member has a lens portion for adjusting the directivity of light from the light emitting element.   An electronic apparatus comprising the lighting device according to claim 1.

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