JP2012256676A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent accumulation of snow on a light-emitting surface of a light source device even when a relatively small heat is generated in a light-emitting device which exerts a snow melting effect using heat generated in a light-emitting element without using separate snow melting means such as a heater.SOLUTION: A light-emitting device includes: a substrate on which a plurality of light-emitting elements are mounted; a heat transfer member provided on a light-emitting element mounting surface side of the substrate; and a protective member provided on the heat transfer member so as to cover the plurality of light-emitting elements and the heat transfer member. The plurality of light-emitting elements emit light in a direction approximately vertical to the substrate to form a light-emitting surface on the protective member. The heat transfer member induces the heat generated by the plurality of light-emitting elements to the protective member to cause a temperature distribution composed of a high temperature region and a low temperature region on the light-emitting surface.

Description

  The present invention relates to a light emitting device, and more particularly to a light emitting device used outdoors.

  In recent years, light-emitting devices that use light-emitting diodes as a light source have become widespread by taking advantage of their low power consumption and ease of maintenance and management.

  However, when a light-emitting device using a light-emitting diode, for example, a signal lamp, is used in a heavy snowfall area, the snow that has landed cannot be melted due to its low power consumption compared to a device using a light bulb, and visibility is improved. There was a problem of causing deterioration.

  In addition, when a light-emitting device using a light-emitting diode is used for a street lamp, there is a problem that illumination efficiency is reduced due to snowfall.

  As a conventional technique that addresses such a problem, there is a light-emitting device disclosed in Patent Document 1.

  In the traffic light as the light emitting device described in Patent Document 1, a heat generating element that generates heat by energization is provided on a transparent cover that covers a light emitting element in which a plurality of LEDs are arranged, and the temperature of the transparent cover is increased, so that the snow attached to the transparent cover To melt.

  However, in the prior art described in Patent Document 1, there is a problem that power consumption increases because power supply for melting snow is required separately. In addition, it is necessary to produce a special cover with a built-in heating element, and there is a problem that the cost increase is inevitable.

  The present inventors have considered a light emitting device 1100 illustrated in FIG. 19 as having a configuration in which a separate snow melting means is excluded from the light emitting device of Patent Document 1.

  In FIG. 19, 1110 is a light emitting element, 1120 is a mounting substrate, 1130 is a heat transfer member, 1140 is a protective member, 1150 is a bowl-shaped case, and 1160 is an opening.

  In the light emitting device 1100, as shown in the heat conduction path of FIG. 19, the heat generated in the light emitting element 1110 is protected through the mounting substrate 1120 and the heat transfer member 1130, and the protective member 1140 constituting the light emitting surface of the light emitting device 1100. Heat conduction.

  According to the light emitting device 1100, by actively using the heat generated by the light emitting diodes, it is possible to quickly perform a snow melting action without using a separate snow melting means such as a heater, and to effectively prevent snow accumulation. Become.

  However, when considering the use of an LED as a light emitting element, due to its low power consumption, if the heat is distributed over the entire light emitting surface, the temperature of the light emitting surface may not be increased to a temperature sufficient to melt snow. Concerned. This problem is expected to become prominent especially in cold regions.

JP 2009-145952 A

  In view of the background art as described above, the present invention is a light-emitting device that exhibits the snow-melting effect by using heat generated in a light-emitting element without using a separate snow-melting means such as a heater. The object is to prevent snow from reaching the light emitting surface of the light source device even when the heat is relatively small.

  In order to solve the above-described problems and achieve the object, a light-emitting device of the present invention includes a substrate on which a light-emitting element is mounted, a heat transfer member provided on the light-emitting element mounting surface side of the substrate, the light-emitting element, and the light-emitting element. And a protective member provided on the heat transfer member so as to cover the heat transfer member, the light emitting element forms a light emitting surface on the protective member, and the heat transfer member is generated by the light emitting element. The generated heat is guided to the protective member, and a temperature distribution including a high temperature region and a low temperature region is generated on the light emitting surface.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is such that the heat transfer member and the protective member are in contact with each other along the periphery of the protective member, and the peripheral portion of the light-emitting surface has a high temperature. A low temperature region is formed in the region and the central portion.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is such that the heat transfer member and the protective member are in contact with each other at a central portion of the protective member, and a high-temperature region is formed at the central portion of the light-emitting surface. A low temperature region is formed in a peripheral portion surrounding the central portion.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is such that the heat transfer member and the protection member are in contact with each other in a plurality of island-like regions in plan view, and the island-like high temperature is formed on the light-emitting surface. A low temperature region surrounding the region and the island-shaped high temperature region is formed.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is characterized in that the heat transfer member is a metal.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is such that the substrate is a metal, and the heat generated from the light-emitting element passes through the substrate and the heat transfer member to form the protective member. It is characterized by being transmitted to.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention further includes a light-transmitting member that covers the light-emitting element, and the heat transfer member is located immediately above the light-emitting element. A translucent member is formed in contact with the protective member.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is characterized in that a non-thermally conductive member is disposed in a portion of the translucent member other than directly above the light-emitting element. .

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is characterized in that a heat insulating member is provided in contact with the surface of the substrate opposite to the light-emitting element mounting surface.

  In order to solve the above-described problems and achieve the object, the light emitting device of the present invention is characterized by including a GX53 base as a base.

  In order to solve the above-described problems and achieve the object, the light-emitting device of the present invention is characterized in that there is one light-emitting surface.

  According to the above light-emitting device, heat generated when the light-emitting element is turned on is efficiently conducted to the protective member, that is, the light-emitting surface on the front surface of the light-emitting device, and concentrated on a specific portion of the protective member. Therefore, the temperature of the specific location is higher than when the conducted heat is distributed over the entire surface of the protective member, and the snow that has landed on the specific location can be melted. The moisture generated by the snow melting action melts snow other than the specific location, and as a result, it is possible to prevent the entire light emitting surface from snowing.

  In addition, in the present invention, since the heat generation of the light emitting diode is actively utilized, no additional snow melting means such as a heater is used, so that no additional power is required during snow melting and standby. Therefore, the power consumption of the light emitting device as a whole is not increased, and an excellent effect that it is advantageous for cost reduction can be achieved.

  Further, according to the above light emitting device, when the heat generated when the light emitting element is turned on is conducted to the light emitting surface, that is, the protective member and concentrated on a specific portion of the protective member, the material, shape, and arrangement of the heat transfer portion are The temperature distribution can be changed in various ways.

  Therefore, when the snow melting effect is exhibited in the light emitting device, there is an effect that an optimum temperature distribution can be selected in consideration of visibility and the like.

  Moreover, according to said light-emitting device, since the heat-transfer member is formed with the translucent member, temperature distribution can be changed variously by changing the shape and arrangement | positioning of a translucent member variously.

  Therefore, there is no need to provide a separate heat transfer member, and it is possible to produce effects that the manufacturing is simplified and the cost reduction is more advantageous.

  Moreover, according to said light-emitting device, since the non-thermally conductive member was distribute | arranged to parts other than a heat-transfer part, there exists an effect that the heat collection effect can be heightened more.

  Further, according to the above light emitting device, since the heat insulating member is arranged on the back surface side of the substrate, the heat transferred from the light emitting element to the mounting substrate is heated on the back surface side of the mounting substrate, that is, on the side opposite to the light emitting surface. Prevent heat transfer by conduction, convection and heat radiation. Therefore, since heat can be efficiently conducted to the protective member, that is, the light emitting surface of the light emitting device, the effect of making snow melting more effective can be achieved.

  Further, according to the above light emitting device, since the GX53 base is provided as the base, the light emitting device can be thinned.

  In addition, according to the light emitting device described above, there may be one light emitting surface, which causes the light emitting surface to always generate heat, and there is no period during which the light is extinguished. Can do.

It is a top view of the light-emitting device concerning Example 1 of this invention. It is sectional drawing of the light-emitting device concerning Example 1 of this invention. It is a perspective view of the heat-transfer member concerning Example 1 of this invention. It is explanatory drawing which shows the heat conduction path | route of the light-emitting device concerning Example 1 of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning Example 1 of this invention. It is a top view of the light-emitting device concerning Example 2 of this invention. It is sectional drawing of the light-emitting device concerning Example 2 of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning Example 2 of this invention. It is a top view of the light-emitting device concerning Example 3 of this invention. It is sectional drawing of the light-emitting device concerning Example 3 of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning Example 3 of this invention.

It is a top view of the light-emitting device concerning Example 4 of this invention. It is sectional drawing of the light-emitting device concerning Example 4 of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning Example 4 of this invention. It is sectional drawing of the light-emitting device concerning Example 5 of this invention. It is sectional drawing of the light-emitting device concerning Example 6 of this invention. It is a perspective view of the light-emitting device concerning Example 7 of this invention. It is a back surface perspective view of the light-emitting device concerning Example 7 of this invention. It is sectional drawing of an example of the light-emitting device concerning background art.

  The present invention efficiently transfers heat generated from a light-emitting element to a protective member of the light-emitting device, that is, the light-emitting surface, and concentrates the heat on the light-emitting surface of the light-emitting device so as to concentrate on a specific portion of the protective member. Each embodiment that realizes the gist of the present invention will be described below in detail with reference to the drawings.

  In the following description, the same parts and components are denoted by the same reference numerals. Therefore, since their names and functions are also the same, detailed description thereof will not be repeated.

  Moreover, in the following drawings, the dimensional ratio of each component is exaggerated as appropriate according to the description, and does not necessarily indicate the actual dimensional ratio.

  FIG. 1 is a plan view of a light emitting device 100 according to the present embodiment, FIG. 2 is a cross-sectional view of the light emitting device 100 according to the present embodiment, taken along line AA in FIG. 1, and FIG. 3 is a perspective view of a heat transfer member according to the present embodiment. FIG.

  1 and 2, reference numeral 110 denotes an opening in which the light emitting element 210 is disposed, 120 b denotes a heat conductive sheet, 130 denotes a protective member, 140 denotes a case, 150 denotes a region without a heat transfer member, and 230 denotes a heat transfer member. A thermal member 260 indicates a donut-shaped region. Although the protective member 130 is on the entire front surface of the light emitting device 100, FIG. 1 shows a partially cutaway state so that the internal configuration can be understood.

  As will be apparent from the following description, the doughnut-shaped region 260 in which the heat conductive sheet 120b or the heat transfer member 230 is arranged in FIG. 1 becomes the high temperature region of the protective member 130, that is, the light emitting surface. The non-existent region 150 is a low temperature region that is a natural temperature state of the light emitting surface.

Referring to FIG. 2, 120a and 120b are heat conductive sheets, 210 is a light emitting element, 212 is solder, 214a and b are wiring layers of an aluminum base substrate, 220 is an aluminum base substrate, 222 is a screw, and 230 is a heat transfer member. , 240 is a heat insulating member, and 250 is a light emitting device driving circuit. Moreover, the white upward arrow indicates the emission direction of the light emitted from the light emitting element.

  A plurality of light emitting elements 210 are mounted on the aluminum base substrate 220, and each light emitting element 210 emits light upward in the drawing as indicated by an outline arrow. In this embodiment, the aluminum base substrate constitutes the mounting substrate.

  The aluminum base substrate is a substrate in which an aluminum metal base and a copper foil wiring layer are integrated via an insulating layer, and is a substrate having excellent thermal conductivity. The thickness of the aluminum base substrate is, for example, about 1 to 2 mm.

  As the light emitting element 210, for example, an SMD (Surface Mount Device) sealed in a package, that is, a surface mount type light emitting diode (LED) can be suitably used.

  The LED package is directly fixed to the aluminum base portion of the aluminum base substrate 220 by soldering or bonding using a heat conductive adhesive. Examples of the heat conductive adhesive include epoxy-based, silicone-based adhesive, AuSn paste, and the like.

  In the case of this mounting form, a package that emphasizes heat dissipation is used, but a normal resin package may be used. The reason why the package having excellent heat dissipation is used is that the junction temperature of the LED element is not increased.

  A terminal (not shown) of the light emitting element 210 is soldered and connected to the wiring layer 214a with solder 212.

  Again referring to FIG. 2, a heat transfer member 230 is provided on the aluminum base substrate 220. As shown in FIG. 3, the heat transfer member 230 is formed of a donut-shaped plate having an opening 110 surrounding the light emitting element 210, and in this embodiment, is formed to have substantially the same diameter as the outer diameter of the protection member 130, It is arranged at the periphery of the protection member 130. Therefore, a predetermined range from the center of the light emitting device 100 is a region 150 having no heat transfer member.

  As a material of the heat transfer member 230, a metal having excellent thermal conductivity, such as an aluminum plate, is used.

  As will be described later, the heat transfer member 230 is a member for guiding the heat generated in the light emitting element 210 and conducted through the aluminum base substrate 220 to the protection member 130.

  The thickness of the heat transfer member 230 is, for example, about 2 to 4 mm in consideration of the light distribution angle of the LED and the like.

  The heat transfer member 230 has been described as a structure in which the heat conductive sheet 120a is sandwiched between the aluminum metal base of the aluminum base substrate 220, but is not limited thereto. For example, a heat conductive sheet 120a may be sandwiched between an aluminum metal base, an insulating layer, and a copper foil wiring layer of the aluminum base substrate 220.

  The aluminum base substrate 220 and the heat transfer member 230 are integrally fixed by screws 222 disposed at appropriate positions.

  The fixing of the aluminum base substrate 220 and the heat transfer member 230 is not limited to screws, and may be fixed to each other by appropriate soldering, adhesion with a heat conductive adhesive, or the like.

  Referring to FIG. 2, a heat conductive sheet 120a may be provided between the aluminum base substrate 220 and the heat transfer member 230, or heat conductive grease may be applied. The heat conductive sheet reduces the thermal resistance by increasing the contact area between the aluminum base substrate 220 and the heat transfer member 230, and the heat generated in the light emitting element 210 is efficiently transferred to the heat transfer member 230 via the aluminum base substrate 220. It is a sheet to guide well.

  As the heat conductive sheet, a silicone rubber sheet, a sheet filled with a ceramic filler in silicone, and the like can be suitably used.

  The heat conductive sheet 120a is provided with a hole corresponding to the light emitting element 210 so that the light emitted from the light emitting element 210 is not obstructed.

  The thermal conductive sheet can be replaced with thermal conductive grease or the like according to the thermal conductive design, and these sheets or grease may be omitted.

  A protective member 130 is provided on the heat transfer member 230. As the protective member 130, it is preferable to select a material having good thermal conductivity, and glass having high thermal conductivity is suitable. In addition, since light transmission is required, a light-transmitting resin such as polycarbonate or acrylic can be used.

  The protective member 130 is provided by the aluminum base substrate 220 and the heat transfer member 230 so as to cover the opening 110 formed surrounding the light emitting element 210 and the region 150 without the heat transfer member, and protect the light emitting element 210 from the outside air. It plays a role to do.

  The protection member 130 may be fixed integrally with the heat transfer member 230 with a packing that prevents intrusion of water or the like, and is bonded to the heat transfer member (or to the heat conductive sheet 120b) with a heat conductive adhesive. It may be fixed.

  This protective member 130 is in direct contact with the outside air as the light emitting surface of the light emitting device 100.

  A heat conductive sheet 120 b is provided between the heat transfer member 230 and the protection member 130. The heat conductive sheet 120b improves the heat conduction between the heat transfer member 230 and the protection member 130, and lowers the thermal resistance. This is a sheet for efficiently conducting heat generated in the light emitting element 210 to the protective member 130 via the aluminum base substrate 220 and the heat transfer member 230.

  As the heat conductive sheet 120b, the same material as that of the above-described heat conductive sheet 120a can be suitably used.

  Similarly to the heat conductive sheet 120a, a hole is provided in the heat conductive sheet 120b corresponding to the light emitting element 210 so as not to prevent the light emitted from the light emitting element 210 from proceeding.

  The thermal conductive sheet 120b can be replaced with thermal conductive grease or the like according to the thermal conductive design, and these sheets or grease may be omitted.

  A light emitting device driving circuit 250 is mounted on the back surface of the aluminum base substrate 220, that is, the surface opposite to the light emitting element 210 mounting surface. Each component constituting the light emitting device driving circuit 250 is arranged on the wiring layer 214b. For example, a through hole (not shown) is provided in the aluminum base substrate 220, and is connected to the wiring layer 214a. Supply drive power.

  In the light emitting device of the present invention, the light emitting device driving circuit is not essential and may not be incorporated depending on the application.

  A heat insulating member 240 is provided on the surface of the aluminum base substrate 220 opposite to the light emitting element 210 mounting surface.

  As will be described later, the heat generated from the light emitting element 210 is laterally diffused by the aluminum base substrate 220 and guided to the heat transfer member 230. However, the heat insulating member 240 has the heat conducted to the aluminum base substrate 220. It is a member for preventing heat transfer to the opposite side of the light emitting surface in the case 140 by heat conduction, convection, and heat radiation, and enhancing heat conduction to the light emitting surface side of the light emitting device 100.

  As a material of the heat insulating member 240, a foamed plastic heat insulating material, so-called expanded polystyrene, CR (chloroprene rubber) sponge, EPDM (ethylene / propylene rubber) sponge, silicon rubber sponge, or the like can be suitably used.

  In addition, this heat insulation member 240 is additional, and may be omitted.

Referring to FIG. 2, a bowl-shaped case 140 is provided surrounding the main body of the light emitting device 100.
The case 140 is formed of, for example, a plastic having low thermal conductivity so that heat generated from the light emitting element 210 is not transferred to the outside through the case 140.

  The opening 110 and the region 150 without the heat transfer member may be filled with nothing and the inside may be an air layer, or may be sealed with a sealing resin having a high light transmittance. As the light-transmitting sealing resin, an epoxy thermosetting resin, an ultraviolet curable resin, a thermosetting silicone resin, or the like can be used.

  Next, referring to FIG. 4, the heat conduction path generated in the light emitting element, which is the main point of the present invention, will be described. FIG. 4 is an explanatory view showing a heat conduction path of the light emitting device according to the present embodiment, and FIG. 5 is a conceptual diagram showing a temperature distribution of the light emitting surface of the light emitting device according to the present embodiment.

  Since the heat generated from the light emitting element 210 is designed to reduce the thermal resistance between the light emitting element 210 and the aluminum base substrate 220 as described above, it first conducts heat downward as shown in FIG. . This is because heat is transferred upward by convection and heat radiation, but its thermal resistance is large and the upward heat flow is extremely small.

  The heat conducted downward is diffused laterally by the aluminum base substrate 220 having a uniform high thermal conductivity. The heat diffused in the lateral direction is guided to the heat transfer member 230 and is conducted from the lower surface to the upper surface of the heat transfer member 230 because the thermal resistance between the aluminum base substrate 220 and the heat transfer member 230 is small. .

  Since the heat transfer member 230 is arranged along the periphery of the light emitting surface of the light emitting device 210 as illustrated in FIG. 4, the heat generated in the light emitting element 210 is guided to the peripheral portion of the light emitting surface.

  The heat induced upward by the heat transfer member 230 conducts heat to the periphery of the protection member 130 and raises the temperature of the periphery of the protection member 130.

Since the protective member 130 is selected from a material having high thermal conductivity, there is heat transfer toward the center of the protective member 130 as shown by the white arrow in FIG. This produces a temperature distribution.

  FIG. 5 conceptually shows the temperature distribution on the light emitting surface of the light emitting device of this embodiment, that is, the surface of the protective member 130. As shown in the drawing, a doughnut-shaped high temperature region 310 having a relatively high temperature and a circular low temperature region 320 having a relatively low temperature are formed inside the light emitting surface, that is, the surface of the protection member 130.

  Here, in order to finely control the temperature distribution on the protection member 130, the material of the protection member 130 is divided into a doughnut-shaped region 260 corresponding to the heat transfer member 230 and a portion corresponding to the region 150 without the heat transfer member. It may be different. That is, a material having a relatively high thermal conductivity is used for the doughnut-shaped region 260 corresponding to the heat transfer member 230, and a material having a relatively low heat conductivity is used for the portion corresponding to the region 150 without the heat transfer member, These may be integrally formed to constitute the protective member.

  By using such a protective member, it is possible to finely control the temperature distribution on the protective member, for example, by relatively increasing the temperature of the peripheral portion of the light emitting surface.

  Furthermore, the doughnut-shaped heat transfer member can be disposed not only at the periphery of the light emitting surface but also at an arbitrary position, and a circular heat transfer member may be disposed at the center. Further, a plurality of heat transfer members may be arranged.

  Thus, by arranging an appropriate number of heat transfer members at appropriate positions, it is possible to form various temperature distributions on the light emitting surface. Specific examples of the arrangement of these heat transfer members will be clarified in Embodiment 2 and below.

  As apparent from the above description, the light emitting device according to the present embodiment efficiently conducts heat generated when the light emitting element is turned on to the protective member, that is, the light emitting surface on the front surface of the light emitting device, and concentrates it on a specific portion of the protective member. I have to. Therefore, the temperature of the specific location is higher than when the conducted heat is distributed over the entire surface of the protective member, and the snow that has landed on the specific location can be melted. The moisture generated by the snow melting action melts and slides off snow other than the specific location, and as a result, it is possible to prevent the entire light emitting surface from snowing.

  In addition, since the light emitting device according to the present embodiment positively uses the heat generated by the light emitting diode, no additional snow melting means such as a heater is used, so that no additional power is required during snow melting. Therefore, the power consumption of the light emitting device as a whole is not increased, and an excellent effect that it is advantageous for cost reduction can be achieved.

  Furthermore, when a heat insulating member is disposed on the back surface of the mounting board, the heat transferred from the light emitting element to the mounting board is heat conduction, convection, heat radiation on the back side of the mounting board, that is, the side opposite to the light emitting surface. To be prevented. Therefore, it is possible to reduce transmission loss in which heat generated from the light emitting element is transferred to other than the protective member, and to more efficiently conduct heat to the light emitting surface of the protective member, that is, the light emitting device. The effect that the removal action can be performed effectively can be produced.

  FIG. 6 is a plan view of the light emitting device 400 according to the present embodiment, FIG. 7 is a cross-sectional view of the light emitting device 400 according to the present embodiment, taken along the line BB in FIG. 6, and FIG. 4 is a conceptual diagram illustrating a temperature distribution on a light emitting surface of the apparatus 400. FIG.

  6 and 7, reference numeral 410 denotes a mounting board, 412 denotes a heat transfer portion, 430 denotes a printed board, and 460 denotes a high temperature region.

  In this embodiment, a path for guiding the heat generated in the light emitting element 210 to the protection member 130 is formed integrally with the mounting substrate 410 as the heat transfer section 412. The material of the mounting substrate 410 and the heat transfer part 412 can be a metal having good thermal conductivity, such as aluminum, and the method of forming the substrate integrally can be cutting or extrusion molding.

  With reference to FIG. 6, the heat transfer section 412 of this embodiment forms an island-like region so as to surround the light emitting element 210 as a set of four L-shaped projections in plan view, and protrudes from the mounting substrate 410. It is formed.

  In this embodiment, as a method for forming a temperature distribution on the surface of the protective member 130, the heat transfer portions 412 are formed every other 5 × 5 = 25 light emitting elements 210.

  Referring to FIG. 7, printed circuit board 430 is provided on mounting substrate 410 with an opening provided corresponding to heat transfer portion 412. The printed circuit board 430 and the heat transfer part 412 are integrated by using a heat conductive adhesive such as an epoxy adhesive or a silicone adhesive.

  As the printed board 430, an aluminum base board having excellent thermal conductivity can be suitably used in addition to a general board such as a glass epoxy board FR4 and a flexible board.

  The heat conducted downward from the light emitting element 210 mounted on the printed circuit board 430 is diffused laterally in the mounting board 410 and is guided to the heat transfer section 412. The heat reaching the heat transfer unit 412 is conducted upward and is guided to the heat transfer member 130.

  With this configuration, the portion where the heat transfer unit 412 is disposed has the light emitting element 210 present in the portion surrounded by the heat transfer unit 412 and the light emission not surrounded by the heat transfer unit 412 disposed around the light emitting element 210. The heat of the element 210 is concentrated. In the protective member 130, there is heat conducted outside from the region surrounded by the heat transfer part 412, but since the heat transfer part is locally arranged, a temperature distribution is generated on the surface of the protective member 130. Thus, the portion immediately above the region surrounded by the heat transfer section 412 indicated by reference numeral 460 in FIG. 7 becomes a relatively high temperature high temperature region.

  FIG. 8 conceptually shows the temperature distribution on the light emitting surface of the light emitting device 400 of this embodiment, that is, the surface of the protective member 130. In FIG. 8, reference numeral 460 indicates a high temperature region and 470 indicates a low temperature region.

  In this embodiment, since every other heat transfer section is arranged, as shown in the figure, the high temperature regions 460 and the low temperature regions 470 are alternately arranged in a checkered pattern.

  In the above description, the example in which the light emitting element is mounted on the printed board is shown, but in the present embodiment as well as the first embodiment, the light emitting element can be directly mounted on the mounting board.

  Similarly to the first embodiment, the material of the protective member 130 may be changed in correspondence with the high temperature region and the low temperature region.

As is apparent from the above description, the light emitting device according to the present embodiment conducts heat generated when the light emitting element is turned on to the light emitting surface, that is, the protective member, and concentrates it on a specific portion of the protective member. By varying the arrangement, the temperature distribution can be varied.

  Therefore, when the snow melting effect is exhibited in the light emitting device, there is an effect that an optimum temperature distribution can be selected in consideration of visibility and the like.

  Further, in this embodiment, since the mounting substrate and the heat transfer portion are integrally formed, the number of parts is small, the manufacturing is simplified, and the cost reduction is more advantageous.

9 is a plan view of the light emitting device 800 according to the present embodiment, FIG. 10 is a cross-sectional view taken along the line CC of FIG. 9 of the light emitting device 800 according to the present embodiment, and FIG. 11 illustrates the light emission according to the present embodiment. 4 is a conceptual diagram illustrating a temperature distribution on a light emitting surface of the apparatus 800. FIG.

  The basic structure of the present embodiment is the same as that of the second embodiment, but the present embodiment is characterized in that the temperature near the center of the light emitting surface, that is, the protective member is relatively increased by the arrangement of the heat transfer section. is there.

  9 and 10, reference numeral 810 denotes a mounting board, 812 denotes a heat transfer section, 830 denotes a printed board, and 860 denotes a high temperature region.

  The method for forming the heat transfer part 812 on the mounting substrate 810, the method for mounting the printed circuit board 830 on the mounting substrate 810, and the like are the same as in the second embodiment.

  In this embodiment, since the heat transfer portion 812 is formed in a convex shape near the center of the mounting substrate 210, the temperature of the portion of the protective member 130 that is in contact with the convex portion is relatively high, and the high temperature region 860. Form.

  FIG. 11 conceptually shows the temperature distribution of the protection member 130. As shown in the figure, in this embodiment, a high temperature region 860 having a relatively high temperature is formed near the center of the protective member 130, and a low temperature region 870 having a relatively low temperature is formed so as to surround the high temperature region 860. Is done.

  As described above, in the light emitting device according to the present embodiment, when the heat generated when the light emitting element is turned on is conducted to the light emitting surface, that is, the protective member, and concentrated on a specific portion of the protective member, the shape and arrangement of the heat transfer portion are Various effects can be achieved by changing the temperature distribution in various ways.

  12 is a plan view of the light emitting device 500 according to the present embodiment, FIG. 13 is a cross-sectional view taken along the line DD in FIG. 12 of the light emitting device 500 according to the present embodiment, and FIG. 14 illustrates the light emission according to the present embodiment. It is a conceptual diagram which shows the temperature distribution of the light emission surface of an apparatus.

  12 and 13, reference numeral 510 denotes a translucent member, 512 denotes a convex portion, 514 denotes a cavity, 520 denotes a mounting board, 530 denotes a printed board, 560 denotes a high temperature region, and 570 denotes a low temperature region.

  The present embodiment is characterized in that the heat transfer portion is constituted by a light transmissive member that seals the light emitting element.

With reference to FIG. 12 and FIG. 13, in this embodiment, a translucent member 510 is provided on the printed board 530 so as to cover the light emitting element 210 mounted thereon. As a material of the translucent member 510, a transparent silicone resin, a transparent urethane resin, a transparent acrylic resin, a transparent epoxy resin, or the like can be used. As the translucent member 510, it is preferable to select a member having good thermal conductivity.

  In this embodiment, the translucent member 510 is processed so as to protrude in a cylindrical shape immediately above the light emitting element 210 to form a convex portion 512. And this convex part 512 is arrange | positioned so that it may contact | adhere to the protection member 130 closely. As a method of forming the translucent member 510 as in the present embodiment, a method of adhering a mold-processed translucent member on a printed board with an adhesive, a mold frame in the case 140, and the translucent member And the like.

  FIG. 13 shows a heat conduction path of the light emitting device 500 configured as described above.

  In FIG. 13, heat conduction is hindered because a cavity 514 having a low thermal conductivity, for example, air, is present in a portion other than the convex portion 512 of the translucent member 510. Therefore, the heat generated in the light emitting element 210 is concentrated on the portion directly above the light emitting element 210 and is directly guided to the protective member constituting the light emitting surface.

  Since the convex portions 512 are dispersedly arranged as shown in FIG. 12, a temperature distribution is generated on the surface of the protection member 130.

  Note that a portion corresponding to the cavity 514 may be provided with a non-thermally conductive member such as a heat insulating resin. In this way, the heat collection effect can be further enhanced.

  The state of the temperature distribution on the light emitting surface, that is, the surface of the protective member 130 is shown in FIG.

  In FIG. 14, reference numeral 560 indicates a high temperature region and 570 indicates a low temperature region.

  In the present embodiment, since the convex portions 512 constituting the heat transfer portion are discretely arranged, the high temperature regions 560 are distributed in an island shape on the surface of the protection member.

  In the present embodiment, since there is no need to diffuse heat in the printed circuit board 530 and the mounting board 520, it is not necessary to consider the thermal conductivity of them, and the mounting board 520 is made of a heat insulating member rather. Is preferred.

  As is clear from the above description, the light emitting device according to the present embodiment transmits the heat generated when the light emitting element is turned on to the light emitting surface, that is, the protective member, and concentrates the light emitting element on a specific portion of the protective member. The temperature distribution can be changed in various ways by changing the shape and arrangement of the resin.

  Therefore, there is no need to provide a separate heat transfer member, and it is possible to produce effects that the manufacturing is simplified and the cost reduction is more advantageous.

  A cross-sectional view of a light emitting device 600 according to this example is shown in FIG. In the figure, reference numeral 610 denotes a translucent member, 612 denotes a heat transfer portion, 614 denotes a cavity, 620 denotes a mounting board, 630 denotes a printed board, 660 denotes a high temperature region, and 670 denotes a low temperature region.

  In this example, the cavity 514 (see FIG. 13) in Example 4 is provided as a cavity 614 inside the translucent member 610. Other configurations are the same as those of the fifth embodiment. Similarly to the fourth embodiment, a non-thermal conductive member such as a heat insulating resin may be disposed in a portion corresponding to the cavity 614.

  In this embodiment, since the cavity 614 that is a non-heat transfer region can be disposed near the light emitting element 210, the heat collection effect can be further enhanced.

  A sectional view of the light emitting device 700 according to this example is shown in FIG. In the figure, reference numeral 710 is a resin-molded light emitting element, 712 is an LED chip, 730 is a printed circuit board, 732 is solder, 760 is a high temperature region, and 770 is a low temperature region.

  This embodiment is characterized in that a resin molding type light emitting element itself is used as the heat transfer section.

  Referring to FIG. 16, a resin molded type light emitting element 710 is mounted on a printed board 730. The resin-molded light-emitting element 710 is a lead type that incorporates an LED chip 712. A lead hole is provided on a printed circuit board, and the lead is fixed by solder 732 on the back surface.

  Of course, the resin molding type light emitting element 710 is not limited to the lead type, but may be an SMD type. Further, it can be mounted in a mixed manner with the SMD type light emitting element 210.

  The resin molded type light emitting element 710 has a top portion that is wider than the bottom surface so that the heat transfer portion can be effectively formed. The outer shape of the resin-molded light-emitting element 710 may be cylindrical or prismatic, but the wide portion is tapered as shown in FIG. 16 in order to effectively induce heat. It is preferable to form.

  And the top part of the resin molding type light emitting element 710 is arrange | positioned so that the protection member 130 may contact | adhere. It is preferable from the viewpoint of heat conduction that the upper surface of the resin-molded light-emitting element 710 and the protection member 130 are in contact with each other via heat conductive grease or the like.

  In the light emitting device 700 configured as described above, the heat generated from the resin molding type light emitting element 710 locally raises the temperature of the protection member 130. As a result, a high temperature region 760 and a low temperature region 770 are formed on the protective member 130 to generate a temperature distribution.

  According to the present embodiment, since the heat transfer section is configured by the light emitting element itself, no additional configuration is particularly required as the heat transfer section. Therefore, it is possible to produce an effect that the manufacturing is further simplified and the cost reduction is more advantageous.

  In this embodiment, an example in which the present invention is applied to a traffic signal lamp will be described as an example of a light emitting device that exhibits the snow melting effect of the present invention.

  FIG. 17 is a perspective view of a traffic signal lamp 900 according to an embodiment of the present invention.

  In FIG. 17, reference numerals 910B, 910Y, and 910R denote light emitting portions, 920 denotes a collar, 930 denotes a lid, 940 denotes a screw, and 950 denotes a housing.

  Referring to FIG. 17, the light emitting units 910B, 910Y, and 910R can incorporate any form of the light emitting device of each of the above-described embodiments. A case where a GX53 base is adopted for the mold will be described as an example.

  In addition, here, a horizontal traffic signal lamp is illustrated, but it goes without saying that it can be similarly applied to a vertical type that is common in heavy snowfall areas.

  Referring again to FIG. 17, the light emitting sections 910B, 910Y, and 910R emit blue-green, orange, and red, respectively, and can be configured by using known LEDs corresponding to the respective colors.

  The housing 950 is formed by aluminum die casting or the like, and three light emitting portions are fixed integrally.

  庇 920 prevents the light emitting units 910B, 910Y, and 910R from being difficult to identify when the light emitting units 910B, 910Y, and 910R are directly irradiated with sunlight from above, and prevents rain or snow. It is also used for protection.

  The lid 930 fixes the light emitting units 910B, 910Y, and 910R, and the screw 940 is a screw for opening the lid. That is, by loosening and removing the screw 940, the lid 930 is opened in the direction indicated by the black arrow in FIG. 17 around the hinge 1020 (FIG. 18) disposed above the lid.

  FIG. 18 shows a state where the lid 930 is opened. FIG. 18 is a rear perspective view of the traffic signal lamp 900 according to the present embodiment.

  Referring to FIG. 18, the back surface of the light emitting unit 910 </ b> B fixed to the lid 930 is illustrated. Reference numeral 1030 denotes a GX53 base, and 1040 denotes a socket that fits into the GX53 base.

  GX53 is a lighting device standard defined as 7004-1142-1 in the IEC (International Electrotechnical Commission) for the purpose of thinning, and in Japan, it is defined as JIS (Japanese Industrial Standard) C7709-1. ing.

  The GX 53 base 1030 is provided with a convex portion 1034 having a circular upper surface and lower surface, the thickness of which is comparatively thin, about 20 mm, and a driving circuit for the light emitting device is disposed therein. It has a configuration.

  For this reason, it is not necessary to provide a power supply circuit on the illuminating device main body side as in the past (that is, in this standard, only the commercial power supply is directly connected to the illuminating device main body side, and the LED drive circuit emits light. It is easy to realize thinning because the whole is flat.

  The power supply terminal 1032 is a power supply terminal for supplying power to the traffic signal lamp 900, and is connected to the light emitting device main body by an appropriate wiring system.

  The socket 1040 fitted to the GX53 base 1030 has a power terminal insertion hole 1044 and a fitting recess 1042, and a power line 1010 for supplying commercial power is connected thereto.

  The convex portion 1034 of the GX53 base 1030 is fitted into the fitting concave portion 1042, the power terminal 1032 is inserted into the power terminal insertion hole 1044, the socket is rotated, and the light emitting portion 910B is detachably engaged with the socket 1040. .

A contact fitting (not shown) connected to a commercial power source is arranged inside the socket 1040, and when the contact fitting comes into contact with the power supply terminal, power is supplied to the light emitting unit 910B.

  In the traffic signal lamp 900, when any one of the light emitting units 910B, 910Y, and 910R is replaced, the socket 1040 is removed, and the light emitting unit fixed to the lid is removed and replaced. Therefore, maintenance is easy.

  In addition, since the GX53 base is employed in the present embodiment, the traffic signal lamp 900 as a whole can be formed as thin as about 60 mm.

  Hereinafter, the snow melting effect of the present embodiment will be described.

  According to the present invention, as described above, the thermal energy generated from the light emitting element is efficiently guided to the protective member (the protective member 130 in FIG. 2) constituting the light emitting surface, and the thermal energy is protected. The specific part is concentrated in a relatively high temperature region.

  In this embodiment, as shown in FIG. 17, the high temperature region 960 exists in the periphery of the light emitting surfaces of the light emitting portions 910 </ b> B, 910 </ b> Y, and 910 </ b> R.

  On the other hand, since the size of the display surface of the light emitting unit of the traffic signal lamp is determined by the standard, for example, about 300 mmφ, an appropriate number of LEDs are arranged in the light emitting unit in consideration of the size and the light emission luminance of the light emitting unit. However, for example, about 200 LED packages of 0.05 W can be provided. The type of LED is not particularly limited.

  According to the knowledge of the inventors, when the light emitting unit of the background art as illustrated in FIG. 19 is configured under the above conditions, the power supplied to the LED including the drive circuit is about 10 to 20 W per color, The temperature of the protective member is expected to rise to about 10 ° C to 15 ° C with respect to the air temperature. For example, if the temperature is −10 ° C., the temperature of the protective member is about 0 ° C. to + 5 ° C.

  In this embodiment, since the thermal energy is concentrated on the peripheral portions of the light emitting surfaces of the light emitting portions 910B, 910Y, and 910R, the temperature of the peripheral portion of the protective member further increases.

  Therefore, it is possible to improve the ability to melt snow that has snowed locally, compared to the case where the temperature of the protective member constituting the light emitting surface is raised uniformly, so that the moisture generated by this snow melting action can be specified. By melting snow other than the location, it is possible to increase the ability to prevent the entire light emitting surface from snowing.

  In the present embodiment, an example in which the present invention is applied to a one-lamp type traffic signal lamp will be described as an example of a light emitting device that exhibits the snow melting effect according to the present invention.

  A one-lamp type traffic signal lamp is known in which LEDs of three colors of blue, yellow, and red are used as a set of light emitting units, and a plurality of the light emitting units are arranged on a light emitting display unit (for example, JP 2009-301519 A). ). In this one-lamp type traffic signal lamp, the light emission time of a necessary color among the three color LEDs is controlled so that blue, yellow, and red traffic signals can be displayed with one lamp.

  The present invention can also be applied to the single-light traffic signal lamp as described above.

Specifically, for example, in FIG. 1 of the first embodiment, instead of the single light emitting element 210 disposed in the opening 110, LEDs of three colors of blue, yellow, and red may be disposed as light emitting units. Alternatively, any one of blue, yellow, and red LEDs may be arranged in the opening 110, and the light emitting unit may be configured by using the three openings 110 as a set.

  About said light-emitting device, a one-light type traffic signal lamp can be comprised by turning on each group of blue, yellow, and red LED cyclically for a required time. The lighting time can be controlled by, for example, the light emitting device driving circuit 250 shown in FIG.

  In a normal three-lamp traffic signal lamp, there is a time when the light is turned off when viewed with one light-emitting device, but in this embodiment, one light-emitting device is almost always lit due to its configuration. Because it is, it always generates heat. That is, the protection member 130 is constantly supplied with heat generated from the light emitting element, and as a result, the temperature of the protection member 130 is further increased as compared with the three-lamp type traffic signal lamp.

  Therefore, in the present embodiment, the snow melting effect can be more effectively performed by further increasing the temperature of the protection member 130.

  The light emitting device of the present invention is not limited to the above configuration, and various modifications and application examples are possible.

  For example, in each of the above-described embodiments, the circular shape and the rectangular shape are exemplified as the main body shape of the light emitting device, but any other shape such as an ellipse can be adopted.

  Moreover, although GX53 was illustrated and demonstrated as a nozzle | cap | die, conventionally, a nozzle | cap | die conventionally common, such as E26, can also be applied.

  In the description of each of the above embodiments, the format of the drive circuit has not been described, but general circuit formats such as a rectifier circuit using a diode bridge and a switching AC / DC converter can be applied.

  In each of the above embodiments, a light emitting diode (LED) has been described as an example of a light emitting element. However, other semiconductor light emitting elements such as a semiconductor laser and an organic LED can be applied.

  Further, in each of the above-described embodiments, the mounting by the package-enclosed type LED has been illustrated and described as the mounting of the light emitting element. Application is also possible.

  Furthermore, in the present embodiment, a traffic signal lamp is illustrated and described as an example of a light emitting device that exerts a snow melting effect, but in addition, road lighting, street lights, indicator lights, road signs, electric bulletin boards, road information boards, The present invention can be applied to all types of light emitting devices used outdoors such as exterior entrance lights, outdoor security lights, and headlights.

DESCRIPTION OF SYMBOLS 100 Light-emitting device 110 Opening 120a, 120b Thermal conductive sheet 130 Protection member 140 Case 150 Area | region without a heat-transfer member 210 Light-emitting element 212 Solder 214a, b Wiring layer 220 Aluminum base board 222 Screw 230 Heat-transfer member 240 Heat-insulating member 250 Light-emitting device drive Circuit 260 Donut-shaped region 310 High temperature region 320 Low temperature region 400 Light emitting device 410 Mounting substrate 412 Heat transfer portion 430 Printed substrate 460 High temperature region 470 Low temperature region 500 Light emitting device 510 Translucent member 512 Protruding portion 514 Cavity 520 Mounting substrate 530 Printed substrate 560 High temperature region 570 Low temperature region 600 Light emitting device 610 Translucent member 612 Heat transfer portion 614 Cavity 620 Mounting substrate 630 Printed circuit board 660 High temperature region 670 Low temperature region 700 Light emitting device 710 Resin Type type light emitting element 712 LED chip 730 PCB 732 Solder 760 high temperature region 770 the low temperature region
800 Light Emitting Device 810 Mounting Board 812 Heat Transfer Section 830 Printed Circuit Board 860 High Temperature Area 870 Low Temperature Area 900 Traffic Signal Lamp 910B, 910Y, 910R Light Emitting Section 920 庇 930 Lid 940 Screw 950 Housing 960 High Temperature Area 1010 Power Line 1030 Hinges X 1032 Power terminal 1034 Convex portion 1040 Socket 1042 Insertion recessed portion 1044 Power terminal insertion hole 1100 Light emitting device 1110 Light emitting element 1120 Mounting substrate 1130 Heat transfer member 1140 Protection member 1150 Case 1160 Opening

Claims (11)

A substrate mounted with a light emitting element;
A heat transfer member provided on the light emitting element mounting surface side of the substrate;
A protective member provided on the heat transfer member so as to cover the light emitting element and the heat transfer member,
The light emitting element forms a light emitting surface on the protective member,
The light-emitting device, wherein the heat transfer member induces heat generated by the light-emitting element to the protective member to generate a temperature distribution including a high-temperature region and a low-temperature region on the light-emitting surface.   The heat transfer member and the protection member are in contact with each other along a periphery of the protection member, and a high temperature region is formed in a peripheral portion of the light emitting surface, and a low temperature region is formed in a central portion. Light-emitting device.   The heat transfer member and the protective member are in contact with each other at a central portion of the protective member, and a high temperature region is formed at a central portion of the light emitting surface, and a low temperature region is formed at a peripheral portion surrounding the central portion. 2. The light emitting device according to 1.   The heat transfer member and the protection member are in contact with each other in a plurality of island-shaped regions in plan view, and an island-shaped high-temperature region and a low-temperature region surrounding the island-shaped high-temperature region are formed on the light emitting surface. The light emitting device according to claim 1.   The light-emitting device according to claim 1, wherein the heat transfer member is a metal.   The light emitting device according to claim 5, wherein the substrate is made of metal, and heat generated from the light emitting element is transmitted to the protection member via the substrate and the heat transfer member. A light-transmitting member that covers the light-emitting element;
6. The light emitting device according to claim 1, wherein the heat transfer member is formed by bringing the translucent member positioned immediately above the light emitting element into contact with the protective member. apparatus.   The light-emitting device according to claim 7, wherein a non-thermally conductive member is disposed in a portion of the translucent member other than the portion directly above the light-emitting element.   The light-emitting device according to claim 1, wherein a heat insulating member is disposed in contact with a surface of the substrate opposite to the light-emitting element mounting surface.   The light emitting device according to any one of claims 1 to 9, wherein a GX53 base is provided as the base. The light emitting device according to claim 1, wherein the number of the light emitting surfaces is one.