WO2012169407A1

WO2012169407A1 - Light-emitting device

Info

Publication number: WO2012169407A1
Application number: PCT/JP2012/063938
Authority: WO
Inventors: 俊二柄川; 村松　正博; 菜津子北島
Original assignee: シチズンホールディングス株式会社
Priority date: 2011-06-08
Filing date: 2012-05-30
Publication date: 2012-12-13

Abstract

This light-emitting device has: a substrate (220) on which light-emitting elements (210) are mounted; a heat-conducting member that is provided on the top surface of the substrate (220); and a protective member (130) that is provided over the heat-conducting member so as to cover the light-emitting elements (210) and the heat-conducting member. The light-emitting elements (210) form a light-emitting face on the protective member (130). The heat-conducting member guides the heat generated by the light-emitting elements (210) to the protective member (130) so as to create a temperature distribution comprising a high-temperature region and a low-temperature region on the light-emitting face.

Description

Light emitting device

The present invention relates to a light emitting device, and more particularly to a light emitting device used outdoors.

In recent years, as a light emitting device, a light emitting diode using a light emitting diode as a light source is in widespread use, taking advantage of its features of low power consumption and ease of maintenance and management.

However, when a light emitting device using a light emitting diode, for example, a signal lamp, is used in heavy snow areas, snowfall can not be melted due to its low power consumption compared to a device using a light bulb, and visibility is low There is a problem of causing deterioration.

Moreover, when the light-emitting device using a light emitting diode is used for a street lamp, there existed a problem that illumination efficiency fell by snowfall.

That is, in light emitting devices such as signal lamps and road signs used in snowy areas, in order to prevent deterioration of visibility due to snowfall, it is required to prevent snowfall on the light emitting surface as much as possible. A light emitting device using a light emitting diode as a light source has a problem that the function to prevent snow deposition is inferior to a device using a light bulb due to its low power consumption.

As a prior art which coped with such a problem, there is a light emitting device of Patent Document 1.

In the traffic light as a light emitting device described in Patent Document 1, a heat generating body that generates heat by energization is provided on a transparent cover that covers a light emitting body in which a plurality of LEDs are arranged, and the temperature of the transparent cover is raised to adhere to the transparent cover. Are trying to melt

However, in the prior art described in Patent Document 1, there is a problem that power consumption is increased because a power supply for snow melting is separately required. In addition, it is necessary to produce a special cover with a built-in heating element, and there is a problem that the cost increase can not be avoided. In addition, as described later, although it is effective against wet snowfall containing moisture when the temperature is relatively high, dry snowfall containing little water when the temperature is relatively low. In the case, there is a problem that the snowfall prevention effect is not always sufficient. Dry-type snowfall and wet-type snowfall are different in the snowfall mechanism.

A light emitting device of Patent Document 2 is known as a prior art in which a separate snow melting means is eliminated from the light emitting device of Patent Document 1.

In the lamp of Patent Document 2, the heat generated by the light emitting unit constituted by a plurality of LEDs is covered with the light emitting unit via the heat transfer supporting unit disposed on the back surface of the light emitting unit, and is formed of a thermally conductive material. Transmission to the hood prevents snow on the outer surface of the hood.

However, the light-emitting device of Patent Document 2 relates to a light-emitting device with a hood, and is intended to prevent snow on the hood. Therefore, there is no effect at all to prevent snow on the light emitting device front surface, that is, the light emitting surface surrounded by the hood.

Moreover, there is a light emitting device of patent document 3 as another prior art which coped with such a problem.

In the signal lamp as a light emitting device described in Patent Document 3, the LED unit is inclined forward, a snow prevention plate formed of polycarbonate which is a water repellent (hydrophobic) member is provided on the front surface, and I try to keep the snow from sticking. This is because the contact angle between the snow particles and the surface of the member is maintained large when snowing on the surface of the hydrophobic member, and therefore, the property that snowing is difficult is made.

However, the prior art described in Patent Document 3 is effective against dry type snow which hardly contains water when the temperature is low, but moisture containing water when the temperature is relatively high In the case of model snowfall, there is a problem that the snowfall prevention effect is not always sufficient. As described above, this is caused by the difference between the dry type snow and the wet type snow.

Here, the relationship between the temperature and the quality of snow and the nature of the surface of the structure will be described.

When the temperature is low, for example, snow falling under an environment where the temperature is below -3 ° C. to 0 ° C. is dry snow that contains almost no water. The phenomenon of dry snow falling is generally referred to as dry snow. On the other hand, snowfall when the temperature is relatively high, such as -3 ° C. to 0 ° C. or higher, is wet snow that contains melting water, so the phenomenon of such snow falling is generally referred to as wet snowfall. The mechanism of dry type snowfall is mainly attributed to the intermolecular force between snow molecules and the surface of the structure. In addition, the mechanism of wet type snowfall is considered to be due to the surface tension that melted water of snowfall exerts on the surface of the structure. From the above, even if any of the light emitting devices of Patent Document 1 to Patent Document 3 is adopted, there is a risk that the entire light emitting surface of the light emitting device may be covered with snow depending on temperature conditions or snowfall conditions.

Furthermore, in these light emitting diode type traffic signals, a large number of light emitting diodes are planarly disposed on the light emitting surface of the traffic light, and when the light emission luminance per light emitting diode is improved, the total number of light emitting diodes can be reduced. Although this can be done, it is expected that when the number of light emitting diodes decreases, the graininess when viewing the light emitting surface will increase.

On the other hand, it is considered that planar light emission without discomfort can be obtained even with a small number of light emitting diodes by diffusing light rays from the light emitting diodes in a planar manner using the light guide plate.

As such, Patent Document 4 is a traffic sign with a traffic sign displayed, and a white light emitting LED is disposed on the light entrance end face of the light guide plate and attached to the light exit surface of the light guide plate. It describes what makes the display surface light.

However, in the traffic sign described in Patent Document 4, no measure is taken against snow on the light emitting surface. As described above, in the light emitting diode type traffic light, since the power consumption is low compared to the traffic light using a conventional light bulb, the amount of heat generation is small. In addition, in the type using the light guide plate, the light emitting diode as the heat source is disposed outside the light emitting surface, so the temperature rise of the light emitting surface remains extremely low.

If such a signal device is installed in a cold area, snow and ice adhering to the light emitting surface in winter will remain without melting and the light emitting surface can not be viewed. In addition, providing a heat source such as a heater for melting ice and snow not only causes an increase in the cost of the traffic light, but also impairs the advantage of low power consumption, which is the trigger for adopting a light emitting diode in the first place.

Unexamined-Japanese-Patent No. 2009-145952 JP, 2009-123364, A JP, 2007-048260, A Patent No. 3103972

The present invention has been made in view of the background art as described above, and the problem to be solved is low cost and low power consumption without using a separate snow melting means such as a heater. It is to ensure visibility of the light emitting surface in winter by preventing snow deposition on the light emitting surface of the light source device and securing the light emitting surface without snow deposition at least partially.

In addition, an additional object of the present invention is to provide a light emitting device which can effectively exhibit the snowfall preventing effect in a wide temperature range and under various snow quality environments.

In order to solve the above problems, the invention disclosed in the present application has various aspects, and the outline of typical ones of the aspects are as follows.

(1) A substrate having a light emitting element mounted thereon, a heat transfer member provided on the surface of the substrate, and a protective member provided on the heat transfer member so as to cover the light emitting element and the heat transfer member The light emitting element forms a light emitting surface on the protective member, the heat transfer member guides the heat generated by the light emitting element to the protective member, and a high temperature region and a low temperature region on the light emitting surface A light emitting device characterized by producing a temperature distribution comprising:

(2) In (1), the heat transfer member and the protection member are in contact with each other along the periphery of the protection member, and a high temperature region is formed in the peripheral portion of the light emitting surface and a low temperature region is formed in the central portion. Characteristic light emitting device.

(3) In (1), the heat transfer member and the protection member are in contact at the central portion of the protective member, and a high temperature region is formed at the central portion of the light emitting surface, and a low temperature region is formed at the peripheral portion surrounding the central portion. A light emitting device characterized in that.

(4) In (1), the heat transfer member and the protective member are in contact in a plurality of island regions in plan view, and a low temperature region surrounding the high temperature region of island shape and the high temperature region of island shape on the light emitting surface A light emitting device characterized in that

(5) In (1), the heat transfer member and the protection member are in contact with each other at approximately one half of the surface of the protection member, a high temperature area is formed at approximately one half surface of the light emitting surface, and a low temperature area is formed at approximately the other half surface. A light emitting device characterized by

(6) In any one of (1) to (5), the surface of the protective member has a hydrophilic region and a hydrophobic region, and the hydrophilic region has a temperature relative to the hydrophobic region. And a high temperature region maintained at a high level.

(7) The light-emitting device according to (6), wherein the hydrophilic region and the hydrophobic region are in contact with each other through a heat insulating member.

(8) In any one of (1) to (7), the light transmitting element further includes a light transmitting member covering the light emitting element, and the heat transfer member is positioned immediately above the light emitting element. A light emitting device formed in contact with the protective member.

(9) In any one of (1) to (7), the substrate has a first surface on which a plurality of the light emitting elements are mounted and a second surface located on the back surface side of the first surface, The light-emitting device, wherein the heat transfer member is provided between the plurality of light-emitting elements on the first surface of the substrate and is formed of a metal material.

(10) In any one of (1) to (7), the substrate is a first surface and a second surface located on the back surface side of the first surface, and the second surface from the first surface The light emitting element is formed of a thermally conductive material having a plurality of through holes penetrating through the surface, and the light emitting element emits light from the second surface to the first surface through the through holes. A light emitting device mounted on the upper surface of the light emitting element, wherein the heat generated in the plurality of light emitting elements is conducted to the protective member through the substrate.

(11) The light emitting device according to any one of (1) to (9), wherein a heat insulating member is disposed in contact with the surface of the substrate opposite to the light emitting element mounting surface.

(12) In any one of (1) to (5), the housing and a light guide plate for changing the direction of light incident from the end face and emitting light from the front face, the light emitting element faces the end face of the light guide plate A plurality of heat transfer members are disposed, and the heat transfer member is disposed on the front side of the light guide plate, is thermally connected to the light emitting element, and generates heat from the light emitting element as a heating area which is a partial area of the light emitting surface A light emitting device that is a heat transfer structure that transmits to the

(13) In (12), the heat transfer portion having a plurality of openings through which the heat transfer structure transmits a light beam emitted from the light guide plate, the light emitting element mounted thereon, and the heat transfer portion thermally A light emitting device having a mounting portion connected thereto.

(14) In (12) or (13), a light emitting device having a light suppression structure which suppresses an amount of light emitted from the light emitting surface in a non-heating region which is a region other than the heating region of the light emitting surface.

(15) In (14), the light emitting element is provided to face the end face of the light guide plate at a part of the periphery of the light guide plate, and the total amount of heat generation of the light emitting element at the position facing the heating region is A light emitting device having a larger amount of heat generation of the light emitting element at a position facing the non-heated region.

(16) The light emitting device according to any one of (12) to (15), further comprising: a heat insulating member that prevents heat transfer at least between the heat transfer structure and the light guide plate and between the heat transfer structure and the housing.

(17) The light emitting device according to any one of (12) to (16), including a lower heat transfer structure for transferring the heat of the heat transfer structure to the housing.

(18) In any one of (12) to (17), the conversion circuit board having a conversion circuit for converting alternating current to direct current is provided, and the conversion circuit board is in thermal contact with the lower portion of the heat transfer structure. Light emitting devices that are arranged to

(19) The light emitting device according to any one of (12) to (18) and the case having the opening on the front surface for housing the light emitting device and exposing the light emitting surface, the protective member has the heat transfer structure The light emitting surface of the protective member is convex forwardly, and the light emitting surface and the case are provided on the outer peripheral edge of the light emitting surface. A traffic signal that does not form a step between it and the front of it.

(20) In (19), the traffic light may be a curved surface which is straight in the vertical direction and curved in the horizontal direction in front of the light emitting surface.

According to the above aspect (1), the snowfall on the light emitting surface of the light source device can be effectively prevented at low cost and low power consumption without using a separate snow melting means such as a heater. The visibility of the light emitting surface in winter can be secured by securing the light emitting surface that is partially snow-free.

According to the side surfaces of the above (2) to (5), the heat generated when the light emitting element is turned on is efficiently conducted to the protective member, that is, the light emitting surface of the front of the light emitting device, and concentrated on a specific part of the protective member. . Therefore, the temperature of the specific location is higher than when the conducted heat is distributed over the entire surface of the protective member, and it is possible to melt the snow that has fallen on the specific location.

According to the side surface of the above (6), the surface of the protective member as the light emitting surface is formed of a hydrophilic member and is formed of a high temperature region maintained at a relatively high temperature, and a hydrophobic member. Since the low temperature region is maintained at a low temperature, it is possible to share the temperature or snow environment that can effectively prevent snow deposition on the light emitting surface. Therefore, to provide a light emitting device capable of effectively exerting the snowfall preventing effect in a wide temperature range and under various snow quality snow environments and securing a light emitting surface having no snowfall at least partially. Can.

Further, in the side surface of the above (6), even when the substantially half surface of the surface of the protective member is a hydrophilic region and the remaining substantially half surface is a hydrophobic region, even under the environmental conditions under which icicles are generated, The icicles can be formed outside the light emitting surface at the lower portion of the light emitting surface, and the effect of the icicles can be minimized.

Further, according to the side surface of the above (7), since the hydrophilic region and the hydrophobic region are in contact with each other through the heat insulating member, the temperature of the high temperature region can be raised more efficiently, so snow deposition is further prevented. The effect is achieved that the effect can be enhanced.

Moreover, according to the side surface of said (8), since a heat-transfer member is formed with a translucent member, temperature distribution can be changed variously by changing the shape of transparent member, and arrangement variously. While being able to do, it is not necessary to provide a heat-transfer member separately, manufacture can be simplified and it can be effective in cost reduction becoming more advantageous.

According to the side surface of (9), the heat generated when the light emitting element is lit can be efficiently conducted to the protective member, that is, the light emitting surface of the front surface of the light emitting device. Therefore, even if the present light emitting device is installed outdoors in a heavy snow zone and snow adheres to the light emitting surface of the light emitting device, the effect of snow melting can be achieved quickly, and snow deposition can be effectively prevented.

Further, according to the side surface of the above (10), the heat generated from the light emitting element is directly conducted to the protective member through the mounting substrate of the light emitting element, so the heat transfer efficiency is further enhanced and the snow melting effect is more effective. It has the effect of being able to

Further, according to the side surface of the above (11), since the heat insulating member is disposed on the back surface side of the substrate, the heat transmitted from the light emitting element to the mounting substrate is the back surface side of the mounting substrate, that is, the opposite side to the light emitting surface. Prevent heat transfer by heat conduction, convection and heat radiation. Therefore, since heat can be thermally conducted to the protective member, that is, the light emitting surface of the light emitting device efficiently, it is possible to exhibit an effect that snow melting can be performed more effectively.

According to the side surface of said (12), the visibility of the light emission surface of winter can be ensured in the signal apparatus which used the light emitting diode and the light-guide plate.

Moreover, according to the side surface of said (13), while transferring the heat | fever from a light emitting diode to a heat transfer part, a light ray can be permeate | transmitted to a front side in a heat transfer part.

Moreover, according to the side surface of said (14), the difference of the light dose in a heating area | region and a non-heating area | region can be compensated.

Moreover, according to the side surface of said (15), uniform light emission is efficiently obtained by fewer light emitting diodes.

Further, according to the side surface of (16), the heat of the heat transfer structure does not escape to at least either the light guide plate side or the housing side.

Moreover, according to the side of said (17), generation | occurrence | production of an ice pillar can be suppressed.

Moreover, according to the side surface of said (18), generation | occurrence | production of an ice pillar can be suppressed further.

Moreover, according to the side surface of said (19), drop-off | omission of the ice snow adhering to the light emission surface is not prevented in the signal apparatus.

Moreover, according to the side surface of said (20), in a signal apparatus, the reflected light by strong external light, such as a west sun, can be suppressed, without preventing drop-off | omission of ice snow.

FIG. 1 is a plan view of a light emitting device according to a first embodiment of the present invention. FIG. 1 is a cross-sectional view of a light emitting device according to a first embodiment of the present invention. It is a perspective view of the heat transfer member concerning a 1st embodiment of the present invention. It is explanatory drawing which shows the heat conduction path of the light-emitting device concerning the 1st Embodiment of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning the 1st Embodiment of this invention. It is a top view of the light-emitting device concerning the 2nd Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 2nd Embodiment of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning the 2nd Embodiment of this invention. It is a top view of the light-emitting device concerning the 3rd Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 3rd Embodiment of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning the 3rd Embodiment of this invention. It is a top view of the light-emitting device concerning the 4th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 4th Embodiment of this invention. It is a conceptual diagram which shows temperature distribution of the light emission surface of the light-emitting device concerning the 4th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 5th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 6th Embodiment of this invention. It is a perspective view of the light-emitting device concerning the 7th Embodiment of this invention. It is a rear perspective view of the light-emitting device concerning the 7th Embodiment of this invention. It is a top view of the light-emitting device concerning the 9th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 9th Embodiment of this invention. It is a disassembled perspective view of the light-emitting device concerning the 9th Embodiment of this invention. It is explanatory drawing which shows the heat conduction path of the light-emitting device concerning the 9th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 10th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning 11th Embodiment of this invention. It is a socket of a light emitting device according to a twelfth embodiment of the present invention. It is a rear perspective view of the light-emitting device concerning the 12th embodiment of the present invention. It is a circuit diagram of a light emitting device concerning a 13th embodiment of the present invention. It is a perspective view of the light-emitting device concerning 14th Embodiment of this invention. It is a rear perspective view of the light-emitting device concerning the 14th embodiment of this invention. It is a top view for demonstrating the principle of the light-emitting device concerning 15th and 16th embodiment of this invention. It is a top view of the light-emitting device concerning 15th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning 15th Embodiment of this invention. It is a perspective view of the heat-transfer member concerning 15th Embodiment of this invention. It is explanatory drawing which shows the heat conduction path of the light-emitting device concerning 15th Embodiment of this invention. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the light-emitting device concerning the 15th Embodiment of this invention. It is a perspective view of the 1st form of the protection member in 15th Embodiment of this invention. It is sectional drawing of the 1st form of the protection member in 15th Embodiment of this invention. It is a perspective view of a 2nd form of the protection member in 15th Embodiment of this invention. It is sectional drawing of the 2nd form of the protection member in 15th Embodiment of this invention. It is a perspective view of the 3rd form of the protection member in the 15th Embodiment of this invention. It is sectional drawing of the 3rd form of the protection member in 15th Embodiment of this invention. It is a top view of the light-emitting device concerning the 16th Embodiment of this invention. It is sectional drawing of the light-emitting device concerning the 16th embodiment of this invention. It is a conceptual diagram which shows temperature distribution of the light emission surface of the light-emitting device concerning the 16th Embodiment of this invention. It is a front perspective view of the signal equipment concerning a 17th embodiment of the present invention. It is a rear surface exploded perspective view of a traffic signal. It is a front perspective view of a lamp. It is an exploded perspective view of a lamp. FIG. 45 is a partial cross-sectional view of the traffic signal by the line HH in FIG. 44. It is a rear perspective view of a heat-transfer member. It is a rear perspective view which shows the modification of a heat-transfer member. It is a rear perspective view which shows the modification of a heat-transfer member. It is a front perspective view which shows the modification of the signal apparatus which suppressed the reflected light by strong external light, such as a west day. It is a figure which shows the various shapes of a heat-transfer part. It is a figure which shows the various shapes of a heat-transfer part. It is a figure which shows the various shapes of a heat-transfer part.

Hereinafter, various embodiments of the present invention will be described in detail with reference to the drawings. In the following description, the same or similar parts and components are denoted by the same reference numerals in different embodiments. And since they have the same name and function, duplicate detailed description thereof will be omitted as appropriate.

Moreover, in the following drawings, the dimensional ratio of each part configuration is appropriately drawn in an exaggerated manner according to the description, and does not necessarily indicate the actual dimensional ratio.

First Embodiment
FIG. 1 is a plan view of the light emitting device 100 according to the first embodiment, FIG. 2 is a sectional view taken along the line AA in FIG. 1 of the light emitting device 100 according to the present embodiment, and FIG. 3 is a heat transfer member according to the present embodiment FIG.

1 and 2, reference numeral 110 denotes an opening in which the light emitting element 210 is disposed, 120b a heat conduction sheet, 130 a protection member, 140 a case, 150 an area without a heat transfer member, 230 a heat transfer member The heat member, 260, indicates a toroidal area. Although the protective member 130 is on the entire front surface of the light emitting device 100, FIG. 1 shows a state in which a part thereof is cut away so that the internal configuration can be understood.

Although it becomes clear in the following description, the heat conduction sheet 120b or the doughnut-shaped area 260 where the heat transfer member 230 is disposed in FIG. 1 becomes the high temperature area of the protective member 130, ie, the light emitting surface. The non-region 150 is a low temperature region which is a natural temperature state of the light emitting surface.

2, 120a and 120b are heat conduction sheets, 210 are light emitting elements, 212 is solder, 214a and b are wiring layers of the aluminum base substrate, 220 is an aluminum base substrate, 222 is a screw, 230 is a heat transfer member 240 denotes a heat insulating member, and 250 denotes a light emitting device drive circuit. In addition, the white upward arrow indicates the emission direction of the light emitted from the light emitting element.

A plurality of light emitting elements 210 are mounted on the aluminum base substrate 220, and each light emitting element 210 emits light upward in the figure indicated by a white arrow in the drawing. In the present embodiment, the aluminum base substrate constitutes a mounting substrate.

The aluminum base substrate is a substrate in which an aluminum metal base and a copper foil wiring layer are integrated via an insulating layer, and is a substrate excellent in thermal conductivity. The thickness of the aluminum base substrate is, eg, about 1 to 2 mm.

As the light emitting element 210, for example, an SMD (Surface Mount Device) enclosed in a package, that is, a surface mounting type light emitting diode (LED) can be suitably used.

The LED package is fixed directly to the aluminum base portion of the aluminum base substrate 220 by a method such as soldering or adhesion using a thermally conductive adhesive. As a heat conductive adhesive, an epoxy type, a silicone type adhesive agent, AuSn paste etc. can be mentioned.

In the case of this mounting mode, a package that emphasizes heat dissipation is used, but a normal resin package may be used. The use of a package excellent in heat dissipation is to prevent the junction temperature of the LED element from rising.

The terminal (not shown) of the light emitting element 210 is connected by soldering to the wiring layer 214 a by the solder 212.

Referring again to FIG. 2, heat transfer member 230 is provided on aluminum base substrate 220. As illustrated in FIG. 3, the heat transfer member 230 is a doughnut-shaped plate having an opening 110 surrounding the light emitting element 210, and in the present embodiment, the heat transfer member 230 is formed to have substantially the same diameter as the outer diameter of the protection member 130. It is disposed at the periphery of the protective member 130. Therefore, a predetermined range from the center of the light emitting device 100 is the area 150 without the heat transfer member.

As a material of the heat transfer member 230, a metal excellent in thermal conductivity, such as an aluminum plate, is used.

The heat transfer member 230 is a member for guiding the heat generated by the light emitting element 210 and conducted through the aluminum base substrate 220 to the protective member 130 as described later.

The thickness of the heat transfer member 230 is, for example, about 2 to 4 mm in consideration of the light distribution angle of the LED and the like.

The heat transfer member 230 has been described as a structure in which the heat conduction sheet 120a is sandwiched on the aluminum metal base of the aluminum base substrate 220, but the structure is not limited to this. For example, the heat conductive sheet 120 a may be sandwiched on the aluminum metal base of the aluminum base substrate 220, the insulating layer, and the copper foil wiring layer.

The aluminum base substrate 220 and the heat transfer member 230 are integrally fixed by screws 222 disposed at appropriate positions.

The fixing of the aluminum base substrate 220 and the heat transfer member 230 is not limited to a screw, and may be fixed to each other by soldering, adhesion with a heat conductive adhesive, or the like as appropriate.

Referring to FIG. 2, a heat conductive sheet 120a may be provided between the aluminum base substrate 220 and the heat transfer member 230, or a heat conductive grease may be applied. The heat conductive sheet lowers the thermal resistance by increasing the contact area between the aluminum base substrate 220 and the heat transfer member 230, and the heat generated by the light emitting element 210 is efficiently transferred to the heat transfer member 230 through the aluminum base substrate 220. It is a sheet to guide well.

As the heat conductive sheet, a silicone rubber sheet, a sheet obtained by filling silicone with a ceramic filler, or the like can be suitably used.

The heat conduction sheet 120 a is provided with a hole corresponding to the light emitting element 210 so that the light emitted from the light emitting element 210 is not impeded.

The heat conductive sheet can be replaced by a heat conductive grease or the like according to the heat conductive design, and these sheets or grease may be omitted.

A protective member 130 is provided on the heat transfer member 230. As the protective member 130, it is preferable to select a material with good thermal conductivity, and glass with high thermal conductivity is suitable. In addition, since light transmission is required, a translucent resin such as polycarbonate or acrylic can be used.

The protection member 130 is provided to cover the opening 110 formed by surrounding the light emitting element 210 and the region 150 without the heat transfer member by the aluminum base substrate 220 and the heat transfer member 230, thereby protecting the light emitting element 210 from the outside air. Play a role in

The protective member 130 may be integrally fixed to the heat transfer member 230 by a packing that prevents the entry of water or the like, or may be bonded to the heat transfer member (or to the heat conductive sheet 120b) with a thermally conductive adhesive. It may be fixed.

The protective member 130 is in direct contact with the outside air as a light emitting surface of the light emitting device 100.

A heat conduction sheet 120 b is provided between the heat transfer member 230 and the protection member 130. The heat transfer sheet 120b improves the heat transfer between the heat transfer member 230 and the protection member 130 to lower the heat resistance. It is a sheet for efficiently conducting heat generated by the light emitting element 210 to the protective member 130 through the aluminum base substrate 220 and the heat transfer member 230.

As the heat conduction sheet 120b, the same material as the above-mentioned heat conduction sheet 120a can be used suitably.

Further, it is also similar to the heat conductive sheet 120 a that holes are provided in the heat conductive sheet 120 b corresponding to the light emitting elements 210 so as not to impede the progress of light emitted from the light emitting elements 210.

The heat conduction sheet 120b can be replaced by a heat conduction grease or the like according to the heat conduction design, and these sheets or grease may be omitted.

A light emitting device drive circuit 250 is mounted on the back surface of the aluminum base substrate 220, that is, the surface opposite to the light emitting element 210 mounting surface. Each component constituting the light emitting device drive circuit 250 is disposed on the wiring layer 214 b, and for example, a through hole (not shown) is provided in the aluminum base substrate 220, and connected to the wiring layer 214 a. Supply drive power.

In the light emitting device of the present embodiment, the light emitting device drive circuit is not essential, and may not be incorporated depending on the application.

A heat insulating member 240 is provided on the surface of the aluminum base substrate 220 opposite to the light emitting element 210 mounting surface.

The heat generated from the light emitting element 210 is diffused in the lateral direction by the aluminum base substrate 220 and guided to the heat transfer member 230 as described later, but the heat conducted to the aluminum base substrate 220 is the main heat insulating member 240 It is a member for preventing heat transfer by heat conduction, convection, and heat radiation on the side opposite to the light emitting surface in the case 140 and enhancing heat conduction to the light emitting surface side of the light emitting device 100.

As a material of the heat insulating member 240, a foamed plastic type heat insulating material, so-called expanded polystyrene, CR (chloroprene rubber) sponge, EPDM (ethylene-propylene rubber) sponge, silicone rubber sponge or the like can be suitably used.

The heat insulating member 240 is an additional one and may be omitted.

Referring to FIG. 2, a bowl-shaped case 140 is provided to surround the main body of the light emitting device 100.

The case 140 is formed of, for example, a plastic having a low thermal conductivity so as not to transfer the heat generated from the light emitting element 210 to the outside through the case 140.

The opening 110 and the region 150 without the heat transfer member may be not particularly filled, and the inside may remain as an air layer, or may be sealed with a sealing resin having a high light transmittance. As the light transmitting sealing resin, an epoxy-based thermosetting resin, an ultraviolet-curable resin, a thermosetting silicone resin, or the like can be used.

Next, with reference to FIG. 4, the heat conduction path generated in the light emitting element, which is the main point of the present invention, will be described. FIG. 4 is an explanatory view showing a heat conduction path of the light emitting device according to the present embodiment, and FIG. 5 is a conceptual view showing a temperature distribution of a light emitting surface of the light emitting device according to the present embodiment.

Since the heat generated from the light emitting element 210 is designed to reduce the thermal resistance between the light emitting element 210 and the aluminum base substrate 220 as described above, the heat is first conducted downward as shown in FIG. . This is because heat is transferred upward by convection and heat radiation, but the heat resistance is large and the heat flow upward is extremely small.

The heat conducted downward is diffused laterally by the uniformly high thermal conductivity aluminum base substrate 220. Then, the heat diffused in the lateral direction is guided to the heat transfer member 230 because the heat resistance between the aluminum base substrate 220 and the heat transfer member 230 is small, and is conducted from the lower surface to the upper surface of the heat transfer member 230 .

Since the heat transfer member 230 is disposed along the periphery of the light emitting surface of the light emitting device 100 as illustrated in FIG. 4, the heat generated by the light emitting element 210 is guided to the peripheral portion of the light emitting surface.

The heat induced upward by the heat transfer member 230 conducts heat to the periphery of the protection member 130 to raise the temperature of the periphery of the protection member 130.

Since a material having high thermal conductivity is selected for the protective member 130, there is also a movement of heat toward the center of the protective member 130, as illustrated by the outlined arrows in FIG. Produce a temperature distribution.

FIG. 5 conceptually shows the temperature distribution on the light emitting surface of the light emitting device of the present embodiment, that is, the surface of the protective member 130. As shown in the figure, on the surface of the light emitting surface, ie, the protective member 130, a doughnut-shaped relatively high temperature region 310 and a circular relatively low temperature region 320 are formed inside thereof.

Here, in order to finely control the temperature distribution on the protection member 130, the material of the protection member 130 is formed in a portion corresponding to the doughnut-shaped area 260 corresponding to the heat transfer member 230 and the area 150 without the heat transfer member. It may be different. That is, a material having a relatively high thermal conductivity is used for the doughnut-shaped region 260 corresponding to the heat transfer member 230, and a material having a relatively low thermal conductivity is used for the portion corresponding to the region 150 having no heat transfer member These may be integrally formed to constitute a protective member.

By using such a protective member, it is possible to finely control the temperature distribution on the protective member, for example, by relatively raising the temperature of the peripheral portion of the light emitting surface.

Furthermore, the doughnut-shaped heat transfer member can be disposed not only at the periphery of the light emitting surface but also at an arbitrary position, and a circular heat transfer member may be disposed at the center. Furthermore, a plurality of heat transfer members may be provided.

As described above, by arranging the heat transfer members at appropriate positions in an appropriate number, it becomes possible to form various temperature distributions on the light emitting surface. About the specific example of arrangement | positioning of these heat-transfer members, it demonstrates below 2nd Embodiment.

As apparent from the above description, the light emitting device according to the present embodiment efficiently conducts the heat generated when the light emitting element is turned on to the protective member, that is, the light emitting surface of the front surface of the light emitting device. I have to. Therefore, the temperature of the specific location is higher than when the conducted heat is distributed over the entire surface of the protective member, and it is possible to melt the snow that has fallen on the specific location. It is possible to prevent snow deposition on the entire light emitting surface as a result of water generated by the snow melting action melting snow on areas other than the specific part and also sliding off.

Moreover, since the light emitting device according to the present embodiment actively utilizes the heat generation of the light emitting diode, no additional snow melting means such as a heater is used, and therefore no additional power is required at the time of snow melting. Therefore, the power consumption of the light emitting device as a whole is not increased, and the excellent effect of cost reduction can be achieved.

Furthermore, when the heat insulating member is disposed on the back surface of the mounting substrate, the heat transferred from the light emitting element to the mounting substrate is conducted on the back surface of the mounting substrate, that is, heat conduction, convection, and heat radiation on the opposite side to the light emitting surface. To prevent being Therefore, the heat generated from the light emitting element can be transferred to other than the protective member to reduce the transmission loss, and the heat can be conducted to the light emitting surface of the protective member, that is, the light emitting device more efficiently. The effect that the removing action can be performed effectively can be achieved.

Second Embodiment
6 is a plan view of the light emitting device 400 according to the present embodiment, FIG. 7 is a cross sectional view of the light emitting device 400 according to the present embodiment taken along line BB in FIG. 6, and FIG. 8 is light emission according to the present embodiment. FIG. 10 is a conceptual diagram showing the temperature distribution of the light emitting surface of the device 400.

6 and 7, reference numeral 410 denotes a mounting substrate, 412 denotes a heat transfer portion, 430 denotes a printed substrate, and 460 denotes a high temperature region.

In the present embodiment, a path for guiding the heat generated by the light emitting element 210 to the protective member 130 is integrally formed with the mounting substrate 410 as the heat transfer portion 412. The material of the mounting substrate 410 and the heat transfer portion 412 can be a metal with good thermal conductivity, such as aluminum, and the method of integrally forming can be cutting or extrusion.

Referring to FIG. 6, the heat transfer portion 412 of the present embodiment forms an island-like region so as to surround the light emitting element 210 as one set of four L-shaped convex portions in plan view, and protrudes to the mounting substrate 410. It is formed.

Further, in the present embodiment, as a method of forming a temperature distribution on the surface of the protective member 130, the heat transfer portion 412 is formed alternately for every 5 × 5 = 25 light emitting elements 210.

Referring to FIG. 7, printed circuit board 430 is provided on mounting substrate 410 with an opening corresponding to heat transfer portion 412. The integration of the printed circuit board 430 and the heat transfer portion 412 is adhesively fixed using a thermally conductive adhesive such as an epoxy adhesive or a silicone adhesive.

As the printed circuit board 430, in addition to a general substrate such as a glass epoxy substrate FR4 and a flexible substrate, an aluminum base substrate excellent in thermal conductivity and the like can be suitably used.

The heat conducted downward from the light emitting element 210 mounted on the printed circuit board 430 is laterally diffused in the mounting board 410 and is guided to the heat transfer portion 412. The heat reaching the heat transfer portion 412 is conducted upward and is guided to the protective member 130.

With such a configuration, in the portion where the heat transfer portion 412 is disposed, the light emitting element 210 existing in the portion surrounded by the heat transfer portion 412 and the light emission not surrounded by the heat transfer portion 412 arranged around the light emitting element The heat of the element 210 is concentrated. In the protective member 130, although there is heat conducted to the outside from the region surrounded by the heat transfer portion 412, since the heat transfer portion is locally disposed, a temperature distribution is generated on the surface of the protective member 130. The portion immediately above the region surrounded by the heat transfer portion 412, which is indicated by reference numeral 460 in FIG. 7, becomes a relatively high temperature high temperature region.

FIG. 8 conceptually shows the temperature distribution on the light emitting surface of the light emitting device 400 of the present embodiment, that is, the surface of the protective member 130. In FIG. 8, reference numeral 460 denotes a high temperature region, and 470 denotes a low temperature region.

In the present embodiment, since every heat transfer portion is disposed, high temperature regions 460 and low temperature regions 470 are alternately disposed in a checkered pattern as shown in the figure.

In the above description, the example in which the light emitting element is mounted on the printed circuit board is shown, but it is also possible to directly mount the light emitting element on the mounting board in the present embodiment as in the first embodiment.

Further, as in the first embodiment, the material of the protective member 130 may be changed corresponding to the high temperature region and the low temperature region.

As is apparent from the above description, in the light emitting device according to the present embodiment, the shape of the heat transfer portion in the case where the heat generated during lighting of the light emitting element is conducted to the light emitting surface, ie, the protective member, By varying the arrangement, the temperature distribution can be varied.

Therefore, in the case of causing the light emitting device to exhibit a snow melting effect, there is an effect that it is possible to select an optimum temperature distribution in consideration of visibility and the like.

Further, in the present embodiment, since the mounting substrate and the heat transfer portion are integrally formed, the number of parts can be reduced, the manufacturing can be simplified, and the cost can be further advantageously reduced.

Third Embodiment
FIG. 9 is a plan view of a light emitting device 800 according to the present embodiment, FIG. 10 is a cross sectional view taken along line CC in FIG. 9 of the light emitting device 800 according to the present embodiment, and FIG. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the apparatus 800. FIG.

The basic structure of this embodiment is the same as that of the second embodiment, but in this embodiment, the arrangement of the heat transfer portion relatively raises the temperature near the center of the light emitting surface, ie, the protective member. There is a feature.

9 and 10, reference numeral 810 denotes a mounting substrate, 812 denotes a heat transfer portion, 830 denotes a printed substrate, and 860 denotes a high temperature region.

The method of forming the heat transfer unit 812 on the mounting substrate 810, the method of mounting the printed circuit board 830 on the mounting substrate 810, and the like are the same as in the second embodiment.

In the present embodiment, since the heat transfer portion 812 is formed in a convex shape in the vicinity of the center of the mounting substrate 810, the temperature of the portion of the protective member 130 in contact with the convex portion becomes relatively high. Form

FIG. 11 conceptually shows the state of the temperature distribution of the protective member 130. As shown in the figure, in the present embodiment, a high temperature region 860 having a relatively high temperature is formed near the center of the protective member 130, and a low temperature region 870 having a relatively low temperature is formed to surround the high temperature region 860. Be done.

As described above, in the light emitting device according to the present embodiment, the shape and arrangement of the heat transfer portion are conducted when conducting heat generated during lighting of the light emitting element to the light emitting surface, that is, the protective member By changing variously, the temperature distribution can be changed variously.

Fourth Embodiment
FIG. 12 is a plan view of a light emitting device 500 according to the present embodiment, FIG. 13 is a cross sectional view taken along the line DD in FIG. 12 of the light emitting device 500 according to the present embodiment, and FIG. It is a conceptual diagram which shows the temperature distribution of the light emission surface of an apparatus.

12 and 13, reference numeral 510 denotes a light transmitting member, 512 denotes a convex portion, 514 denotes a cavity, 520 denotes a mounting substrate, 530 denotes a printed circuit board, 560 denotes a high temperature area, and 570 denotes a low temperature area.

The present embodiment is characterized in that the heat transfer portion is formed of a translucent member that seals the light emitting element.

Referring to FIGS. 12 and 13, in the present embodiment, a light transmitting member 510 is provided on the printed circuit board 530 so as to cover the light emitting element 210 mounted. A transparent silicone resin, a transparent urethane resin, a transparent acrylic resin, a transparent epoxy resin, etc. can be used as a material of the translucent member 510. The light-transmissive member 510 is preferably selected to have good thermal conductivity.

In the present embodiment, the light transmitting member 510 is processed so as to project in a cylindrical shape directly above the light emitting element 210 to form a convex portion 512. The convex portion 512 is disposed in close contact with the protective member 130. As a method of forming the light transmitting member 510 as in the present embodiment, a method of bonding the light transmitting member which has been processed to a printed circuit board with an adhesive, a mold is disposed in the case 140, and the light transmitting member And the like.

FIG. 13 shows the heat conduction path of the light emitting device 500 configured as described above.

In FIG. 13, since the hollow 514 having a low thermal conductivity, for example, air, is present in a portion other than the convex portion 512 of the light transmitting member 510, the conduction of heat is inhibited. Therefore, the heat generated by the light emitting element 210 is concentrated on the portion immediately above the light emitting element 210 and is directly induced to the protective member constituting the light emitting surface.

Since the protrusions 512 are dispersedly disposed as shown in FIG. 12, a temperature distribution will occur on the surface of the protective member 130.

In the portion corresponding to the cavity 514, a non-heat conductive member such as heat insulating resin may be disposed. In this way, the heat collecting effect can be further enhanced.

A state of temperature distribution on the light emitting surface, that is, the surface of the protective member 130 is illustrated in FIG.

In FIG. 14, reference numeral 560 denotes a high temperature region, and 570 denotes a low temperature region.

In the present embodiment, since the convex portions 512 constituting the heat transfer portion are discretely arranged, the high temperature regions 560 are distributed in an island shape on the surface of the protective member.

In the present embodiment, since it is not necessary to diffuse heat between the printed board 530 and the mounting board 520, it is not necessary to take into consideration the thermal conductivity of them, and the mounting board 520 should be composed of a thermally insulating member. Is preferred.

As apparent from the above description, the light emitting device according to the present embodiment transmits the heat generated during lighting of the light emitting element to the light emitting surface, that is, the protective member, and concentrates the light emitting element in a specific portion of the protective member. The temperature distribution can be changed in various ways by changing the shape and arrangement of the resin.

Therefore, it is not necessary to separately provide a heat transfer member, the manufacturing can be simplified, and the cost can be further advantageously reduced.

Fifth Embodiment
A cross-sectional view of a light emitting device 600 according to the present embodiment is illustrated in FIG. In the figure, reference numeral 610 denotes a light transmitting member, 612 denotes a heat transfer portion, 614 denotes a cavity, 620 denotes a mounting substrate, 630 denotes a printed circuit board, 660 denotes a high temperature area, and 670 denotes a low temperature area.

In the present embodiment, the cavity 514 (see FIG. 13) in the fourth embodiment is provided as a cavity 614 inside the translucent member 610. The other configuration is the same as that of the fifth embodiment. It is also the same as the fourth embodiment that a non-heat conductive member such as a heat insulating resin may be disposed in a portion corresponding to the cavity 614.

In this embodiment, since the cavity 614 which is a non-heat transfer area can be disposed near the light emitting element 210, the heat collection effect can be further enhanced.

Sixth Embodiment
A cross-sectional view of a light emitting device 700 according to the present embodiment is illustrated in FIG. In the figure, reference numeral 710 denotes a resin molded type light emitting element, 712 denotes an LED chip, 730 denotes a printed board, 732 denotes a solder, 760 denotes a high temperature area, and 770 denotes a low temperature area.

The present embodiment is characterized in that a resin molded type light emitting element itself is used as the heat transfer portion.

Referring to FIG. 16, a resin molded light emitting element 710 is mounted on a printed circuit board 730. The resin molded type light emitting element 710 is a lead type having a built-in LED chip 712, and a hole for a lead is provided on a printed circuit board, and the lead is fixed by a solder 732 on the back surface.

Of course, the resin-molded light emitting element 710 is not limited to the lead type, and may be an SMD type. Moreover, it is also possible to mix and mount the light emitting element 210 of the SMD type.

The resin molded type light emitting element 710 is configured such that the top is wider than the bottom so that the heat transfer portion can be effectively formed. The outer shape of the resin-molded light emitting element 710 may be cylindrical or prismatic, but the wide portion is tapered as shown in FIG. 16 in order to effectively conduct heat. It is preferable to form it.

The top of the resin-molded light emitting element 710 is disposed in close contact with the protective member 130. The upper surface of the resin molded type light emitting element 710 and the protective member 130 are preferably in contact with each other via a heat conductive grease or the like, from the viewpoint of heat conduction.

In the light emitting device 700 configured as described above, the heat generated from the resin molded type light emitting element 710 causes the temperature of the protective member 130 to locally rise. As a result, a high temperature area 760 and a low temperature area 770 are formed on the protective member 130 to produce a temperature distribution.

According to the present embodiment, since the light emitting element itself constitutes the heat transfer part, no additional structure is particularly required as the heat transfer part. Therefore, the manufacturing can be further simplified, and cost reduction can be further advantageous.

Seventh Embodiment
In the present embodiment, an example in which the present invention is applied to a traffic signal lamp will be described as an example of a light emitting device exhibiting a snow melting effect according to the present invention.

FIG. 17 is a perspective view of a traffic signal lamp 900 according to an embodiment of the present invention.

In FIG. 17, 910 B, 910 Y, and 910 R indicate light emitting portions, 920 indicates a ridge, 930 indicates a lid, 940 indicates a screw, and 950 indicates a housing.

Referring to FIG. 17,

light emitting units

910 B, 910 Y, and 910 R can incorporate any of the light emitting devices according to the above-described embodiments, but here, the periphery of the first embodiment can be used. The case where a GX 53 base is adopted for the part high temperature type is illustrated and explained.

Furthermore, although a horizontal traffic signal lamp is illustrated here, it is needless to say that the present invention is applicable to a vertical type that is common in heavy snow areas.

Referring again to FIG. 17, the

light emitting portions

910B, 910Y, and 910R emit blue green, orange, and red, respectively, and can be configured by adopting known LEDs corresponding to the respective colors.

The housing 950 is formed by aluminum die casting or the like, and integrally fixes three light emitting units.

The weir 920 prevents it from becoming difficult to identify the color of the

light emitting parts

910B, 910Y and 910R when the sunlight is directly applied to the

light emitting parts

910B, 910Y and 910R from above, and also prevents rain and snow It is intended to serve as a shelter.

The lid 930 fixes the

light emitting parts

910B, 910Y, 910R, and the screw 940 is a screw for opening the lid. That is, by loosening and removing the screw 940, the lid 930 is opened in the direction indicated by the black arrow in FIG. 17 around the hinge 1020 (FIG. 18) disposed above the lid.

The state in which the lid 930 is opened is shown in FIG. FIG. 18 is a rear perspective view of the traffic signal lamp 900 according to the present embodiment.

Referring to FIG. 18, the back surface of the light emitting unit 910B fixed to the lid 930 is illustrated, and reference numeral 1030 denotes a socket for fitting the GX53 cap, and 1040 denotes a socket for fitting to the GX53 cap.

GX53 is a standard for lighting devices specified as 7004-142-1 in IEC (International Electrotechnical Commission) for the purpose of thinning, and in Japan it is specified as JIS (Japanese Industrial Standard) C 7709-1. ing.

The GX 53 mouth ring 1030 is provided with a convex portion 1034. The convex portion has a circular upper surface and a lower surface, and its thickness is relatively thin at about 20 mm, and the drive circuit of the light emitting device is disposed therein. It is a structure.

Therefore, it is not necessary to provide a power supply circuit on the side of the lighting device body as in the prior art (that is, in the present standard, only a commercial power source is directly connected to the lighting device body side, and the LED drive circuit emits light) It is easy to realize thinning because it is entirely built-in) and the whole is flat.

The power supply terminal 1032 is a power supply terminal for supplying power to the traffic signal lamp 900, and is connected to the light emitting device main body by an appropriate wiring system.

A socket 1040 fitted to the GX 53 cap 1030 has a power supply terminal insertion hole 1044 and a fitting recess 1042, and a power supply line 1010 for supplying commercial power is connected.

The protrusion 1034 of the GX 53 cap 1030 is fitted into the fitting recess 1042, the power supply terminal 1032 is inserted into the power supply terminal insertion hole 1044, the socket is rotated, and the light emitting portion 910B is detachably engaged with the socket 1040. .

A contact fitting (not shown) connected to a commercial power supply is disposed inside the socket 1040, and when the contact fitting comes in contact with the power supply terminal, power is supplied to the light emitting unit 910B.

In the traffic signal lamp 900, when replacing any of the

light emitting parts

910B, 910Y, and 910R, the socket 1040 may be removed, and the light emitting part fixed to the lid may be removed and replaced, so maintenance is easy.

In addition, since the GX53 cap is adopted in the present embodiment, it is possible to make the entire traffic signal lamp 900 thin as about 60 mm.

Hereinafter, the snow melting effect of the present embodiment will be described.

According to the present invention, as described above, the thermal energy generated from the light emitting element is efficiently guided to the protective member (the protective member 130 in FIG. 2) which constitutes the light emitting surface, and the thermal energy is protected It concentrates on the specific place of, and makes the specific place become a relatively high temperature area.

In the present embodiment, as illustrated in FIG. 17, the high temperature region 960 exists in the peripheral portion of the light emitting surface of the

light emitting portions

910B, 910Y, and 910R.

On the other hand, since the size of the display surface of the light emitting unit of the traffic signal lamp is determined by the standard of, for example, about 300 mmφ, an appropriate number of LEDs are arranged on the light emitting unit in consideration of the size However, for example, about 200 LED packages can be used with 0.05 W. The type of LED is not particularly limited.

According to the knowledge of the inventors, when the light emitting unit is configured under the above conditions, the power supplied to the LED including the drive circuit is about 10 to 20 W per color, as in the ninth embodiment described later. (See FIG. 20) If the heat generated on the entire surface of the protective member is transmitted, the temperature of the protective member is expected to rise to about + 10 ° C. to 15 ° C. with respect to the air temperature. For example, if the temperature is -10.degree. C., the temperature of the protective member is about 0.degree. C. to + 5.degree.

In the present embodiment, since the heat energy is concentrated on the peripheral portion of the light emitting surface of the

light emitting portions

910B, 910Y, and 910R, the temperature of the peripheral portion of the protective member further rises.

Therefore, since the ability to melt locally deposited snow can be improved as compared to the case where the temperature of the protective member constituting the light emitting surface is uniformly raised, the water produced by this snow melting action is specified By melting snow on areas other than the area, it is possible to improve the ability to prevent snow on the entire light emitting surface as a result.

Eighth Embodiment
In the present embodiment, an example in which the present invention is applied to a single-lamp type traffic signal lamp will be described as an example of a light emitting device exhibiting a snow melting effect according to the present invention.

There is known a single-lamp type traffic light device in which blue, yellow, and red three-color LEDs are used as a set of light emitting units, and a plurality of light emitting units are arranged in a light emitting display unit (for example, JP 2009-301519 A) ). In this single-lamp type traffic signal lamp, the light emission time of the required color of the three color LEDs is controlled so that blue, yellow and red traffic signals can be displayed with one lamp.

The present invention is also applicable to the above-described single-lamp type traffic signal lamp.

Specifically, for example, in FIG. 1 of the first embodiment, instead of a single light emitting element 210 disposed in the opening 110, blue, yellow, and red three-color LEDs may be disposed as light emitting units. Good. Alternatively, any one of blue, yellow and red LEDs may be disposed in the opening 110, and the three openings 110 may constitute a light emitting unit.

About the above-mentioned light emitting device, a single-lamp type traffic signal lamp can be configured by cyclically lighting each group of blue, yellow and red LEDs for a necessary time. The control of the lighting time can be performed by, for example, the light emitting device driving circuit 250 illustrated in FIG.

In a normal three-lamp type traffic signal lamp, there is a time when it is turned off when viewed with one light emitting device, but in the present embodiment, one light emitting device is almost always lit because of its configuration Because I am, I have a constant fever. That is, the protective member 130 always receives the supply of heat generated from the light emitting element, and as a result, the temperature of the protective member 130 is higher than that of the three-lamp type traffic light.

Therefore, in the present embodiment, the snow melting effect can be more effectively performed by raising the temperature of the protective member 130.

The ninth embodiment
FIG. 19 is a plan view of a light emitting device 2100 according to the present embodiment, FIG. 20 is a cross-sectional view of the light emitting device 2100 according to the present embodiment taken along line EE in FIG. FIG.

In FIG. 19, reference numeral 110 denotes an opening in which a light emitting element is disposed, reference numeral 120 b denotes a heat conduction sheet, reference numeral 130 denotes a protection member, and reference numeral 140 denotes a case. Although the protective member 130 is on the entire front surface of the light emitting device 100, FIG. 19 shows a state in which a part of the protective member 130 is cut away so that the internal configuration can be understood.

In FIGS. 20 and 21, 120a and 120b are heat conduction sheets, 210 is a light emitting element, 212 is a solder, 214a and b are wiring layers of an aluminum base substrate, 220 is an aluminum base substrate, 222 is a screw, 230 is a heat transfer member 240 denotes a heat insulating member, 250 denotes a light emitting device drive circuit, 311 denotes a packing, and 330 denotes a lid. In addition, the white upward arrow indicates the emission direction of the light emitted from the light emitting element.

Referring to FIG. 20, a plurality of light emitting elements 210 are mounted on an aluminum base substrate 220, and each light emitting element 210 emits light to the upper side of the drawing sheet indicated by a white arrow in the figure. In the present embodiment, the aluminum base substrate constitutes a mounting substrate.

Referring to FIGS. 20 and 21, heat transfer member 230 is provided on aluminum base substrate 220. The heat transfer member 230 is a member for guiding the heat generated by the light emitting element 210 and conducted through the aluminum base substrate 220 to the protective member 130 as described later.

The heat transfer member 230 is formed by providing a plurality of substantially circular openings 110 corresponding to the light emitting elements 210 in a substantially circular plate as illustrated in FIG.

Here, the number of the openings 110 is generally the same as the number of the light emitting elements 210, and one opening 110 is disposed in correspondence with one light emitting element 210. However, the number of the openings 110 is not limited to this. For example, the number of the openings 110 may be larger than the number of the light emitting elements 210, and components such as chip resistors and chip capacitors may be mounted on the opened openings.

In addition, by arranging the plurality of light emitting elements 210 in correspondence with a part of the openings 110, the number of the openings 110 can be smaller than the number of the light emitting elements 210.

In the above, although the heat-transfer member 230 was demonstrated as one plate-shaped member which has an opening, it is not restricted to this, Arbitrary shape and structure are employable.

For example, a plurality of plate-like louvers may be disposed in parallel and in one direction on the aluminum base substrate 220 so as to protrude perpendicularly to the mounting surface of the aluminum base substrate 220, and the light emitting element 210 may be disposed therebetween. The light emitting elements may be arranged in the area surrounded by the louvers in a mesh shape. Further, the heat transfer member 230 need not be provided over the entire surface of the aluminum base substrate 220, and may be provided in part.

A heat conduction sheet 120 a is provided between the aluminum base substrate 220 and the heat transfer member 230. In addition, it changes to the heat conductive sheet 120a, and you may apply | coat a heat conductive grease.

The heat conduction sheet 120 a is provided with a hole corresponding to the opening 110 provided in the heat transfer member 230 so as not to hinder the progress of the light emitted from the light emitting element 210.

In addition, a protective member 130 is provided on the heat transfer member 230.

A heat conduction sheet 120 b is provided between the heat transfer member 230 and the protection member 130.

Further, holes may be provided in the heat conduction sheet 120b corresponding to the openings 110 provided in the heat transfer member 230 so that the progress of the light emitted from the light emitting element 210 is not impeded, similarly to the heat conduction sheet 120a. is there.

Referring to FIG. 20, a light emitting device drive circuit 250 is mounted on the back surface of the aluminum base substrate 220, that is, the surface opposite to the light emitting element 210 mounting surface. The light emitting device drive circuit 250 is, for example, an LED drive circuit so-called AC drive circuit by supply of AC power described later. Each component constituting the light emitting device drive circuit 250 is disposed on the wiring layer 214 b, and for example, a through hole (not shown) is provided in the aluminum base substrate 220, and connected to the wiring layer 214 a. Supply drive power.

In the light emitting device according to the present embodiment, the light emitting device drive circuit 250 is not essential, and may not be incorporated depending on the application.

Referring to FIGS. 20 and 21, a heat insulating member 240 is provided on the surface of the aluminum base substrate 220 opposite to the surface on which the light emitting element 210 is mounted.

Furthermore, a bowl-shaped case 140 is provided to cover the main body of the light emitting device 2100.

The opening 110 may be filled with nothing, and the inside may remain as an air layer, or may be sealed with a sealing resin having a high light transmittance. As the light transmitting sealing resin, an epoxy-based thermosetting resin, an ultraviolet-curable resin, a thermosetting silicone resin, or the like can be used.

Next, with reference to FIG. 22, the heat conduction path generated in the light emitting element 210, which is the main point of the present invention, will be described. FIG. 22 is an explanatory view showing a heat conduction path of the light emitting device 2100. As shown in FIG.

The heat conducted upward by the heat transfer member 230 conducts heat to the protection member 130, and as described above, since the protection member 130 is made of a material having high thermal conductivity, heat transfer to the protection member 130 is made. The heat generated is diffused to locally heat the entire protective member 130, although a high temperature region where the temperature of the protective member is high and a low temperature region where the temperature is low are formed.

As apparent from the above description, according to the light emitting device, heat generated when the light emitting element is turned on can be efficiently conducted to the front surface of the light emitting device, that is, the light emitting surface. Therefore, even if the light emitting device is installed outdoors in a heavy snow area and snow adheres to the light emitting surface of the light emitting device, the effect of snow melting can be achieved quickly, and snow deposition can be effectively prevented. .

Moreover, in the present light emitting device, since the heat generation of the light emitting diode is actively used, no additional snow melting means such as a heater is used, so that no additional power is required at the time of snow melting. Therefore, the power consumption of the light emitting device as a whole can not be increased, and the excellent effect of cost reduction can be achieved.

Tenth Embodiment
FIG. 23 is a cross-sectional view of a light emitting device 2400 according to the present embodiment.

In FIG. 23, 411 indicates an iron plate, and 420a and 420b indicate printed circuit boards.

In the ninth embodiment, an aluminum base substrate is used as a mounting substrate, while in the present embodiment, an iron plate 411 and printed

boards

420a and 420b are used in combination.

A printed circuit board 420 a for power supply wiring of the light emitting element 210 is provided on the iron plate 411. Further, the light emitting device drive circuit 250 is also mounted on the printed circuit board 420b.

A glass epoxy substrate FR4, a flexible substrate or the like can be used as the printed

circuit boards

420a and 420b.

The thickness of the iron plate 411 may be, for example, t2 mm, and the thickness of the printed circuit board may be, for example, t0.3 mm for a glass epoxy substrate and t0.05 mm for a flexible substrate.

According to the same technical concept as the ninth embodiment, the LED as the light emitting element 210 is mounted on the printed circuit board 420a. The heat transfer member 230 preferably has an opening in the printed circuit board 420 and is disposed so as to be in direct contact with the iron plate 411. Of course, it is also possible to dispose the heat transfer member 230 on the wiring of the printed circuit board without providing the opening in the printed circuit board.

As in the ninth embodiment, the iron plate 411 and the printed circuit board 420 a are integrally screwed and fixed to the heat transfer member 230 by the screws 222. Alternatively, the iron plate 411, the printed circuit board 420a, and the heat transfer member 230 may be fixed to each other by soldering, adhesion using a heat conductive adhesive, or the like.

In the present embodiment, as compared with the ninth embodiment, since a combination of an inexpensive iron plate and a printed circuit board is adopted as a mounting substrate, there is an effect that the manufacturing cost can be reduced.

Eleventh Embodiment
FIG. 24 is a cross-sectional view of a light emitting device 2600 according to the present embodiment.

In FIG. 25, reference numeral 611 denotes a mounting board, 621 denotes a printed board, and 631 denotes a thermally conductive sheet.

In the ninth embodiment or the tenth embodiment, the mounting substrate of the light emitting element and the heat transfer member are separately provided, but the present embodiment is characterized in that they are integrally formed.

A metal having good thermal conductivity, such as an aluminum plate, is used for the mounting substrate 611, and an opening 110 is provided corresponding to the mounting position of the light emitting element 210 as in the heat transfer member 230 of FIG.

On the lower surface of the mounting substrate 611, a printed substrate 621 provided with an opening 110 in the same shape and arrangement as the mounting substrate 611 is disposed.

In the present embodiment, as the light emitting element 210, an LED enclosed in a package, which is an SMD type LED in which the light emitting surface and the soldering mounting surface are formed on the same surface, can be suitably used. That is, light is arranged to be emitted toward the front surface, that is, toward the protective member 130 through the openings of the printed circuit board and the mounting substrate.

By configuring as in the present embodiment, the heat generated from the light emitting element 210 is thermally conducted to the mounting substrate 611, thermally conducted directly to the protective member 130, and diffused in the plane of the protective member 130.

As in the ninth embodiment, the combination of the mounting substrate 611 and the printed substrate 621 can be replaced by an aluminum base substrate, and the heat conduction sheet 631 may be omitted.

The effect of the heat insulating member 240 is also the same as that of the ninth embodiment, and may be omitted.

In the ninth embodiment or the tenth embodiment, since the mounting substrate of the light emitting element and the heat transfer member are separately formed, a minute thermal resistance exists at their connection portion, and hence the light emitting element The induction of heat from 210 to the protective member 130 was slightly inhibited.

In the present embodiment, heat can be more efficiently guided to the protective member 130 by removing these factors, so that the snow melting effect can be further enhanced.

Furthermore, according to the present embodiment, since the path from the light emitting element to the protective member is formed of a single material, the manufacturing can be simplified and the cost can be further advantageously reduced. .

Twelfth Embodiment
The present embodiment is directed to adopting a GX 53 cap for the light emitting device.

FIG. 25A is a socket 750 fitted to the light emitting device 2700 according to the present embodiment, and FIG. 26B is a rear perspective view of the light emitting device 2700 according to the present embodiment.

In FIG. 25A, reference numeral 761 is a socket main body, 771 is a power supply terminal insertion hole, 780 is a fitting recess, in FIG. 7B, reference numeral 711 is a GX53 base, 720 is a convex portion, 731 is a power supply terminal, 733 is an engagement holding receiving portion , 740 indicate a case.

Inside the case 740, the light emitting device main body described in the ninth to eleventh embodiments is accommodated.

Referring to FIG. 25B, a GX 53 cap 711 having a convex portion 720 is provided on the back surface of the light emitting device. The convex portion 720 has a circular upper surface and a lower surface, and the thickness thereof is relatively thin at about 20 mm, and a drive circuit of the light emitting device (the light emitting device drive circuit 250 in FIG. 21 corresponds to this) is disposed therein. Is configured to Therefore, it is not necessary to provide a power supply circuit on the side of the lighting device body as in the prior art (that is, in the present standard, only a commercial power source is directly connected to the lighting device body side, and the LED drive circuit emits light) It is easy to realize thinning because it is entirely built-in) and the whole is flat.

The power supply terminal 731 is a power supply terminal for supplying power to the light emitting device 2700, and is connected to the light emitting device main body by an appropriate wiring system.

The engagement holding receiving portion 733 is formed so as to be recessed in an L shape around the convex portion 720.

On the other hand, the socket 750 illustrated in FIG. 25A is usually inserted into and fixed to an opening or a ceiling or a wall. The socket 750 is provided with a power supply terminal insertion hole 771 and a fitting recess 780, and the power supply terminal 731 and the convex part 720 of the light emitting device main body are fitted respectively.

The power supply terminal insertion hole 771 is a so-called slack hole, and after the insertion, the light emitting device side is rotated to support the power supply terminal 731 so as not to come off. A contact fitting connected to a commercial power supply (not shown) is provided in the socket 750, and the commercial power supply is supplied to the light emitting device 2700 when the power supply terminal 731 contacts the contact fitting.

Further, the socket 750 is provided with an engagement holding portion (not shown), and can be engaged with and disengaged from the engagement holding receiving portion 732 of the light emitting device 2700 by fitting the convex portion 720 into the fitting concave portion 780. The light emitting device 2700 is held by the socket 750.

As described above, according to the light emitting device according to the present embodiment, since the GX53 base, which is a standard of lighting equipment, is adopted, the device can be miniaturized and thinned, and other general lighting devices Thus, it is possible to achieve the effect that the versatility in application is also increased.

Thirteenth Embodiment
The present embodiment relates to a light emitting device incorporating an LED drive circuit by supply of AC commercial power, a so-called AC drive circuit.

FIG. 26 is a circuit diagram of a light emitting device 2800 according to the present embodiment. Reference numeral 811 is a light emitting element group, and 820 is a light emitting element, for example, a light emitting diode. Reference numeral 831 denotes an AC drive circuit, which includes a diode bridge 850, a smoothing capacitor 861, and a limiting resistor 871. 840 represents an AC power source.

As shown in the figure, the AC drive circuit 831 incorporates a diode bridge 850. After full-wave rectification of the AC voltage of the AC power supply 840 by this diode bridge, the current controlled by the rectification voltage limiting resistor 871 is used as a light emitting element group. 811 is supplied.

Although FIG. 26 exemplifies a light emitting element group 811 in which one light emitting element 820 is connected in series, the configuration of the light emitting element group is not limited to this, and an arbitrary number of light emitting elements 820 connected in series. An appropriate configuration is possible such as connecting in parallel any number of them.

If the number of light emitting elements connected in series is appropriately set so as not to exceed the rectified voltage supplied by the sum of the forward voltage (Vf) of the light emitting element group 811, a driving circuit with reduced power loss due to limiting resistance is realized. it can.

According to the light emitting device, the light emitting device can be directly connected to an AC power source, and there is no need to mount an additional circuit such as an AC / DC converter. It is possible to achieve the effect of being able to

Fourteenth Embodiment
In this embodiment, an example in which the present invention is applied to a traffic signal lamp will be described as an example in which the snow melting effect according to the present invention is exhibited.

FIG. 27 is a perspective view of a traffic signal lamp 2900 according to the present embodiment.

In FIG. 27, 910B, 910Y, 910R are light emitting parts, 920 is a weir, 930 is a lid, 940 is a screw, and 950 is a housing.

Referring to FIG. 27,

light emitting units

910B, 910Y, and 910R can incorporate any of the light emitting devices according to the above-described embodiments, but here, GX53 of the twelfth embodiment. The case where a base type is adopted is illustrated and explained.

Referring again to FIG. 27, the

light emitting portions

910B, 910Y, and 910R emit blue-green, orange, and red light, respectively, and can be configured by adopting known LEDs corresponding to the respective colors.

The weir 920 prevents it from becoming difficult to identify the color of the

light emitting parts

910B, 910Y and 910R when the sunlight is directly applied to the

light emitting parts

910B, 910Y and 910R from above, and also prevents rain and snow It is intended to be used for protection.

The lid 930 fixes the

light emitting parts

910B, 910Y, 910R, and the screw 940 is a screw for opening the lid. That is, by loosening and removing the screw 940, the lid 930 is opened in the direction indicated by the black arrow in FIG. 27, centering on the hinge 1020 (FIG. 28) disposed above the lid.

The state in which the lid 930 is opened is shown in FIG. FIG. 28 is a rear perspective view of a traffic signal lamp 2900 according to the present embodiment.

Referring to FIG. 28, a back surface of light emitting unit 910B fixed to lid 930 is illustrated, and reference numeral 1030 indicates a GX 53 cap.

Further, reference numeral 1040 is a socket which is fitted to the GX 53 cap, and a power supply line 1010 for supplying commercial power is connected to the socket. In the traffic signal lamp 2900, when replacing any of the

light emitting parts

910B, 910Y, and 910R, the socket 1040 may be removed and the light emitting part fixed to the lid may be removed and replaced, so maintenance is easy.

In the present embodiment, since the GX53 cap is adopted, it is possible to make the thickness of the entire traffic signal lamp 2900 as thin as about 60 mm.

Since the size of the display surface of the light emitting unit is determined by the standard of, for example, about 300 mmφ, an appropriate number of LEDs are disposed in the light emitting unit in consideration of the size and the light emission luminance of the light emitting unit. For example, about 200 LED packages can be used with 0.05W. The type of LED is not particularly limited.

When the light emitting portion is configured as described above, the power supplied to the LED including the drive circuit is about 10 to 20 W per color. According to the present invention, this thermal energy can be efficiently conducted to the protective member (the protective member 130 in FIG. 20) which constitutes the light emitting surface.

According to the findings of the inventors, the temperature of the protective member is expected to rise to about + 10 ° C. to 15 ° C. with respect to the air temperature according to the above-described configuration. For example, if the temperature is -10.degree. C., the temperature of the protective member is about 0.degree. C. to + 5.degree. If the temperature of the protective member constituting the light emitting surface rises to such an extent, the snow that has snowed can be melted, so that the snow can be effectively prevented from being deposited on the light emitting surface. .

[Principle of the fifteenth and sixteenth embodiments]
The basic technical concept of the fifteenth and sixteenth embodiments to be described is explained with reference to FIG.

FIG. 29 is a plan view for explaining the principle of the light emitting device according to the fifteenth and sixteenth embodiments, and is a view of the light emitting surface 901 of the substantially circular light emitting device as viewed from the front. As illustrated in FIG. 29, the light emitting surface 901 is divided into a region A formed of a hydrophilic member and maintained at a relatively high temperature, and a region B formed of a hydrophobic member and having a relatively low temperature. By making the light emitting surface such structure, the snow preventing effect is effectively exhibited in wide temperature range and under various snow conditions, and the light emitting surface without snow at least partially is secured. A possible light emitting device can be realized. The reason will be described below.

First, let T0 be the temperature of the boundary where it is determined whether it will be dry snow or wet snow. The boundary temperature T0 has a value of about -3 ° C. to 0 ° C., but may vary depending on actual weather conditions. Dry snow occurs at temperatures below T0, and wet snow occurs above T0.

When the air temperature is T0 or less, the temperature of the region A of the light emitting surface is maintained at 0 ° C. or more by the heat generated from the light emitting element from T0 to a certain temperature on the low temperature side (Tmin). .

First, consider the temperature range from Tmin to T0.

In the region A, since snow that has snowed can be effectively melted in this temperature range, snow contact is reduced. In addition, since the snow quality in this temperature range is dry snow, it is difficult for snow to adhere to the region B formed of the hydrophobic member. Therefore, when the temperature is in the range from Tmin to T0, it is difficult for the entire light emitting surface 901 to snow.

Next, consider the case where the temperature falls below Tmin. The snow quality in this temperature range is dry snow. If the air temperature is less than Tmin, the snow melting effect in the region A is not sufficient, and the material of the region A is hydrophilic, so the region A is relatively dry and snow adheres easily. However, since there is no change in the state of the area B, at least the area B is in a state of little snowfall, and even when the temperature is Tmin or less, the area B is secured as a light emitting area with little snowfall on the light emitting surface 901 It will be

Next, consider the case where the temperature is T0 or more. Since the quality of snow in this temperature range is wet snow, the region B formed of the hydrophobic member is in a state in which the snow easily adheres. On the other hand, since the snow melting effect of the region A is generally effective, snow is less likely to adhere to the region A formed of the hydrophilic member. Therefore, even when the air temperature is T0 or more, the region A is secured as a light emitting region with less snowfall on the light emitting surface 901.

As apparent from the above description, according to the light emitting devices according to the fifteenth and sixteenth embodiments, the snow preventing effect is effectively exhibited in a wide temperature range and under various snow conditions of snow quality. It is possible to secure a light emitting surface without snowfall at least partially. Hereinafter, the fifteenth and sixteenth embodiments will be described in detail with reference to the drawings.

Fifteenth Embodiment
FIG. 30 is a plan view of a light emitting device 3100 according to the present embodiment, FIG. 32 is a cross-sectional view of the light emitting device 3100 according to the present embodiment taken along line FF in FIG. FIG.

Referring to FIG. 30, reference numeral 110 denotes an opening in which the light emitting element 210 is disposed, 120b a heat conduction sheet, 130 a protection member, 140 a case, 150 an area without a heat transfer member, 230 a heat transfer member Show. Although the protection member 130 is on the entire front surface of the light emitting device 100, FIG. 30 shows a state in which a part of the protection member 130 is cut away so that the internal structure can be seen.

Although it becomes clear in the following description, the heat conduction sheet 120b or the doughnut-shaped area in which the heat transfer member 230 is disposed in FIG. 30 is the protective member 130, that is, the high temperature area of the light emitting surface, and there is no heat transfer member. The region 150 is a low temperature region which is a natural temperature state of the light emitting surface.

Referring to FIG. 31,

reference numerals

120a and 120b denote heat conduction sheets, 210 denotes light emitting elements, 212 denotes solders, 214a and b denote wiring layers of a mounting substrate, 221 denotes a mounting substrate, 222 denotes a screw, 230 denotes a heat transfer member, 240 Denotes a heat insulating member, 250 denotes a light emitting device drive circuit, 260 denotes a doughnut-shaped area, 270 denotes an insulating layer, and 280 denotes a thermally conductive adhesive. In addition, the white upward arrow indicates the emission direction of the light emitted from the light emitting element.

A plurality of light emitting elements 210 are mounted on the mounting substrate 221, and each light emitting element 210 emits light upward in the figure indicated by a white arrow in the drawing.

As the mounting substrate 221, a glass epoxy substrate FR4, a flexible substrate or the like mounted on an aluminum plate, an aluminum base substrate or the like can be suitably used.

The LED package is fixed on the direct mounting substrate 221 by a method such as soldering or adhesion using a heat conductive adhesive 280. In the present embodiment, the terminal (not shown) of the light emitting element 210 is connected by soldering to the wiring layer 214 a by the solder 212.

Referring again to FIG. 31, a heat transfer member 230 is provided on the mounting substrate 221. As illustrated in FIG. 32, the heat transfer member 230 is formed of a doughnut-shaped plate having an opening 110 surrounding the light emitting element 210, and in the present embodiment is formed to have substantially the same diameter as the outer diameter of the protection member 130. It is disposed at the periphery of the protective member 130. Therefore, a predetermined range from the center of the light emitting device 100 is the area 150 without the heat transfer member. As a material of the heat transfer member 230, a metal excellent in thermal conductivity, such as an aluminum plate, is used. The heat transfer member 230 is a member for guiding the heat generated by the light emitting element 210 and conducted through the mounting substrate 221 to the protective member 130 as described later.

The thickness of the heat transfer member 230 is, for example, about 2 to 4 mm in consideration of the light distribution angle of the LED and the like. The mounting substrate 221 and the heat transfer member 230 are integrally fixed by screws 222 disposed at appropriate positions. The fixing of the mounting substrate 221 and the heat transfer member 230 is not limited to a screw, and may be fixed to each other by soldering, adhesion with a heat conductive adhesive, or the like as appropriate.

Referring to FIG. 31, a heat conduction sheet 120a may be provided between the mounting substrate 221 and the heat transfer member 230, or a heat conduction grease may be applied. The heat conduction sheet 120 a reduces the thermal resistance by increasing the contact area between the mounting substrate 221 and the heat transfer member 230, and the heat generated by the light emitting element 210 is efficiently transferred to the heat transfer member 230 through the mounting substrate 221. It is a sheet for guiding. Although the structure which pinched | interposed the heat conductive sheet 120a on the mounting board | substrate 221 was illustrated and demonstrated as a mounting method of the heat-transfer member 230, it is not restricted to this. For example, an insulating layer and a copper foil wiring layer may be disposed on the mounting substrate 221, and the heat conduction sheet 120a may be interposed therebetween. The heat conduction sheet 120 a is provided with a hole corresponding to the light emitting element 210 so that the light emitted from the light emitting element 210 is not impeded.

The heat conductive sheet can be replaced by a heat conductive grease or the like according to the heat conductive design, and these sheets or grease may be omitted. A protective member 130 is provided on the heat transfer member 230. As the protective member 130, it is preferable to select a material with good thermal conductivity, and glass with high thermal conductivity is suitable. In addition, since light transmission is required, a translucent resin such as polycarbonate or acrylic can be used. In the present embodiment, it is intended that the portion of the surface of the protective member 130 corresponding to the region A in FIG. 29 is made hydrophilic and the portion corresponding to the region B is formed hydrophobic. A method of separating and forming the surface of the protective member 130 into hydrophilic and hydrophobic regions will be described later. The protective member 130 is provided to cover the heat transfer member 230 and the area 150 without the heat transfer member, and plays a role of protecting the light emitting element 210 from the open air. The protective member 130 may be integrally fixed to the heat transfer member 230 by a packing that prevents the entry of water or the like, or may be bonded to the heat transfer member (or to the heat conductive sheet 120b) with a thermally conductive adhesive. It may be fixed. The protective member 130 is in direct contact with the outside air as a light emitting surface of the light emitting device 100.

A heat conduction sheet 120 b is provided between the heat transfer member 230 and the protection member 130. The heat transfer sheet 120b improves the heat transfer between the heat transfer member 230 and the protection member 130 to lower the heat resistance. The heat transfer sheet 120 b is a sheet for efficiently transferring the heat generated by the light emitting element 210 to the protective member 130 via the mounting substrate 221 and the heat transfer member 230. As the heat conduction sheet 120b, the same material as the above-mentioned heat conduction sheet 120a can be used suitably. Further, it is also similar to the heat conductive sheet 120 a that holes are provided in the heat conductive sheet 120 b corresponding to the light emitting elements 210 so as not to impede the progress of light emitted from the light emitting elements 210.

A light emitting device drive circuit 250 is mounted on the back surface of the mounting substrate 221, that is, the surface opposite to the light emitting element 210 mounting surface. Each component constituting the light emitting device drive circuit 250 is disposed on the wiring layer 214b. For example, a through hole (not shown) is provided in the mounting substrate 221 to connect the wiring layer 214b and the wiring layer 214a. The driving power is supplied to the light emitting element 210.

In the light emitting device of the present embodiment, the light emitting device driving circuit 250 is not essential, and may not be incorporated depending on the application.

A heat insulating member 240 is provided on the surface of the mounting substrate 221 opposite to the surface on which the light emitting element 210 is mounted.

The heat generated from the light emitting element 210 is diffused in the lateral direction by the mounting substrate 221 and guided to the heat transfer member 230 as described later. However, the heat insulating member 240 has the case 140 where the heat conducted to the mounting substrate 221 is It is a member for preventing heat transfer by heat conduction, convection, and heat radiation on the opposite side to the light emitting surface inside and enhancing heat conduction to the light emitting surface side of the light emitting device 3100.

The heat insulating member 240 is an additional one and may be omitted.

Referring to FIG. 31, a bowl-shaped case 140 is provided to surround the main body of the light emitting device 3100. The case 140 is formed of, for example, a plastic having a low thermal conductivity so as not to transfer the heat generated from the light emitting element 210 to the outside through the case 140. The opening 110 and the region 150 without the heat transfer member may be not particularly filled, and the inside may remain as an air layer, or may be sealed with a sealing resin having a high light transmittance. As the light transmitting sealing resin, an epoxy-based thermosetting resin, an ultraviolet-curable resin, a thermosetting silicone resin, or the like can be used.

Next, with reference to FIG. 33, the heat conduction path generated in the light emitting element will be described. FIG. 33 is an explanatory view showing a heat conduction path of the light emitting device according to the present embodiment, and FIG. 34 is a conceptual view showing a temperature distribution of the light emitting surface of the light emitting device according to the present embodiment.

Since the heat generated from the light emitting element 210 is designed to reduce the thermal resistance between the light emitting element 210 and the mounting substrate 221 as described above, the heat is first conducted downward as shown in FIG. This is because heat is transferred upward by convection and heat radiation, but the heat resistance is large and the heat flow upward is extremely small.

The heat conducted downward is diffused laterally by the mounting substrate 221 having high thermal conductivity. Then, the heat diffused in the lateral direction is guided to the heat transfer member 230 because the thermal resistance between the mounting substrate 221 and the heat transfer member 230 is small, and is thermally conducted from the lower surface to the upper surface of the heat transfer member 230. Since the heat transfer member 230 is disposed along the periphery of the light emitting surface of the light emitting device 3100 as illustrated in FIG. 33, the heat generated by the light emitting element 210 is guided to the peripheral portion of the light emitting surface.

The heat induced upward by the heat transfer member 230 conducts heat to the periphery of the protection member 130 to raise the temperature of the periphery of the protection member 130. Since a material having high thermal conductivity is selected for the protective member 130, there is also a movement of heat toward the center of the protective member 130 as illustrated by the white arrow in FIG. Produce a temperature distribution. FIG. 34 conceptually shows the temperature distribution on the light emitting surface of the light emitting device of the present embodiment, that is, the surface of the protective member 130. As shown in the figure, on the surface of the light emitting surface, ie, the protective member 130, a doughnut-shaped relatively high temperature region 310 and a circular relatively low temperature region 320 are formed inside thereof.

Next, a method of forming the surface of the protective member so as to be separated into hydrophilicity and hydrophobicity will be described. As a method of separating and forming the surface of the protective member into hydrophilicity and hydrophobicity, (1) using a hydrophilic member as a base material and subjecting the member to a hydrophobic treatment or arranging a hydrophobic member, (2 ) Hydrophobic member is used as a base material on which hydrophilic treatment is applied, or a configuration in which hydrophilic member is placed, (3) hydrophilic or hydrophobic treatment is applied on suitable base material, hydrophilicity and hydrophobicity Although the structure which distributes a sex member is considered, the method of (1) and (2) is demonstrated concretely here. The method (3) can be realized by appropriately combining the members used in the descriptions of (1) and (2).

[First embodiment of protective member]
The present embodiment corresponds to the above (1), and FIG. 35 illustrates a perspective view of the first embodiment of the protective member 130 and FIG. 36 illustrates a cross-sectional view of the first embodiment of the protective member 130.

In FIG. 35 and FIG. 36, reference numeral 413 denotes a hydrophobic member, and 421 denotes a hydrophilic substrate. For example, glass can be used as the hydrophilic base 421. Furthermore, when the glass is subjected to a hydrophilic coating with a titanium oxide (TiO ₂ ) photocatalyst, the hydrophilicity is improved. As the hydrophobic member 413, for example, polycarbonate which is a transparent member can be used. Furthermore, the water repellency is improved by applying a water repellent coating. In this embodiment, the protective member 130 can be formed by attaching a substantially circular polycarbonate concentrically with an adhesive or the like on a substantially circular glass substrate.

The hydrophobic member 413 of the protective member 130 formed as described above corresponds to the region 150 without the heat transfer member shown in FIG. 31, and the hydrophilic base 421 has the donut shape shown in FIG. The protection member 130 of the light emitting device 3100 according to the present embodiment can be realized by arranging the region 260 to correspond to the region 260.

[Second form of protective member]
The present embodiment corresponds to the above (2), and FIG. 37 shows a perspective view of the second embodiment of the protective member 130 and FIG. 38 shows a cross-sectional view of the second embodiment of the protective member 130.

In FIGS. 37 and 38, reference numeral 431 denotes a hydrophobic base, and 440 denotes a hydrophilic member. As the hydrophobic substrate, for example, polycarbonate can be used, and as the hydrophilic member, for example, a balloon-type hydrophilizing agent can be used. In this embodiment, it is possible to form a protective member 130 by coating a toroidal coating with a balloon-type hydrophilizing agent added on the periphery of a substantially circular polycarbonate substrate.

The central portion of the protective member 130 formed as described above, to which the hydrophobic base material 431 is exposed, corresponds to the region 150 without the heat transfer member shown in FIG. The protection member 130 of the light emitting device 3100 according to the present embodiment can be realized by arranging the hydrophilic member 440 corresponding to the doughnut-shaped region 260 illustrated in FIG. 31.

[Third form of protective member]
In this embodiment, the hydrophilic region to be the high temperature region and the hydrophobic region to be the low temperature region are thermally separated. FIG. 39 illustrates a perspective view of the third embodiment of the protective member 130, and FIG. 40 illustrates a cross-sectional view of the third embodiment of the protective member 130.

In FIG. 39 and FIG. 40, reference numeral 450 denotes a hydrophobic member, 461 denotes a heat insulating member, 471 denotes a hydrophilic member, and 480 denotes a substrate.

In this embodiment, a circular hydrophobic member 450 having the same thickness as the base material 480 and a diameter slightly smaller than the inner diameter of the base material 480 is formed in a shape in which the central portion of the substantially circular base material 480 is cut out in a circle. Make it fit. Then, the heat insulating member 461 is filled in the gap formed by the inner periphery of the base material 480 and the hydrophobic member 450. For example, silicone rubber can be used as the heat insulating member.

The material or the treatment can be appropriately selected, but for example, the hydrophobic member 450 can be made of polycarbonate, and the substrate 480 can be made of glass and coated with titanium oxide to make the hydrophilic member 471.

The hydrophobic member 450 of the protective member 130 formed as described above corresponds to the region 150 without the heat transfer member shown in FIG. 31, and the hydrophilic member 471 has the donut shaped region shown in FIG. The protection member 130 of the light emitting device 3100 according to the present embodiment can be realized by arranging it to correspond to 260.

By configuring the protective member 130 as in this embodiment, the high temperature region (portion corresponding to symbol 471 in FIG. 39) and the low temperature region (portion corresponding to symbol 450 in FIG. 39) are thermally separated. Therefore, the conduction of heat from the high temperature region to the low temperature region is prevented, and the temperature of the high temperature region can be raised more efficiently. Therefore, the temperature range in which the snow melting effect can be exhibited can be expanded (that is, the above-described Tmin can be lowered), and the snow deposition preventing effect can be further enhanced.

Here, in order to further increase the temperature difference between the high temperature region and the low temperature region on the protective member 130, the material of the hydrophobic member 450 and the material of the base 480 may be made different. That is, the protective member may be configured using a material having a relatively high thermal conductivity for the substrate 480 and a material having a relatively low thermal conductivity for the hydrophobic member 450. By using the protective member formed in this manner, it is possible to further raise the high temperature region temperature of the peripheral portion of the light emitting surface.

As is apparent from the above description, in the light emitting device according to the present embodiment, the surface of the protective member as the light emitting surface is formed of a hydrophilic member and is formed of a high temperature region maintained at a relatively high temperature and a hydrophobic member Since the low temperature region is maintained at a temperature lower than the high temperature region, it is possible to share the air temperature or the snow quality environment that can effectively prevent the snow deposition on the light emitting surface. Therefore, the effect of preventing snow deposition effectively in a wide temperature range and under snow conditions of various types of snow, and achieving the effect of securing a light emitting surface without snow deposition at least partially. it can.

Furthermore, in the light emitting device according to the present embodiment, when the heat generated during lighting of the light emitting element is conducted to the light emitting surface, that is, the protective member and concentrated on a specific location of the protective member, , Temperature distribution can be changed in various ways. Therefore, the effect of being able to select an optimal shape is also available in a wide temperature range and under snow conditions of various types of snow, in view of visibility etc., in order to secure a light emitting surface area without snowfall partially. Can play.

Further, in the light emitting device according to the present embodiment, since the hydrophilic region and the hydrophobic region are in contact with each other through the heat insulating member, the temperature of the high temperature region can be raised more efficiently. The effect is that it can be enhanced.

Sixteenth Embodiment
FIG. 41 is a plan view of a light emitting device 3800 according to the present embodiment, FIG. 42 is a cross sectional view taken along the line GG in FIG. 41 of the light emitting device 3800 according to the present embodiment, and FIG. It is a conceptual diagram which shows the temperature distribution of the light emission surface of the apparatus 800. FIG. The basic structure of this embodiment is the same as that of the fifteenth embodiment, but in this embodiment the temperature of the light emitting surface, that is, the lower half surface of the protective member is relatively increased by the arrangement of the heat transfer member. There is a feature.

In FIGS. 41 to 43, reference numeral 832 denotes a heat transfer member, 860 denotes a high temperature area, and 870 denotes a low temperature area.

The method of mounting the heat transfer member 832 on the mounting substrate 221, the method of mounting the light emitting element 210 on the mounting substrate 221, and the like are the same as in the fifteenth embodiment.

In the present embodiment, as shown in FIGS. 41 and 43, a heat transfer member 832 having a rectangular shape in plan view is mounted on the substantially lower half of the light emitting surface. Similar to the fifteenth embodiment, the heat conducted downward from the light emitting element 210 mounted on the mounting substrate 221 is diffused in the lateral direction in the mounting substrate 221 and conducted to the heat transfer member 82. The heat reaching the heat transfer member 832 is conducted upward and is guided to the protection member 130.

With this configuration, in the region of the protection member 130 in contact with the heat transfer member 832, the light emitting element 210 present in the portion surrounded by the heat transfer member 832 and the heat of the light emitting element 210 disposed in the region without the heat transfer member. Concentrate. Therefore, as shown in FIG. 44, the lower half of the protective member 130 in contact with the heat transfer member 832 has a relatively high temperature to form a high temperature region 860, and the upper half of the protective member is a low temperature region. Form 870.

Therefore, the surface of the protective member 130 is adjusted so that the portion corresponding to the high temperature region 860 of the surface of the protective member 130 is hydrophilic and the portion corresponding to the low temperature region 870 is hydrophobic. The method of forming the surface of the protective member 130 separately into hydrophilic and hydrophobic is the same as the method described in the fifteenth embodiment.

By the way, in the case of a snowfall preventing mechanism which melts snow by heat generation to prevent snowfall, the melted snow may refreeze in the light emitting surface depending on the temperature conditions, and may interfere with visual recognition on the light emitting surface.

To solve this problem, in the light emitting device according to the present embodiment, the snow melting type snowfall preventing mechanism is formed on the substantially lower half of the light emitting surface, so the snow melting is dropped downward by gravity and does not refreeze in the light emitting surface. . Even under the environmental conditions under which the icicles are generated, the icicles can be formed outside the light emitting surface below the light emitting surface, and the problems caused by the icicles can be minimized.

As is apparent from the above description, also in the light emitting device according to the present embodiment, the surface of the protective member as the light emitting surface is formed of a hydrophilic member and is a high temperature region maintained at a relatively high temperature; Since it is formed and is composed of a low temperature area maintained at a temperature lower than the high temperature area, it is possible to share the air temperature or the snow quality environment which is effective in preventing the snow deposition on the light emitting surface.

Therefore, the effect of preventing snow deposition effectively in a wide temperature range and under snow conditions of various types of snow, and achieving the effect of securing a light emitting surface without snow deposition at least partially. it can.

Moreover, in the light emitting device according to the present embodiment, when the heat generated during lighting of the light emitting element is conducted to the light emitting surface, that is, the protective member and concentrated on a specific portion of the protective member, the shape and arrangement of the heat transfer members are variously changed. , Temperature distribution can be changed in various ways.

Therefore, the effect of being able to select an optimal shape is also available in a wide temperature range and under snow conditions of various types of snow, in view of visibility etc., in order to secure a light emitting surface area without snowfall partially. is there.

Furthermore, in the light emitting device according to the present embodiment, under the environment where icicles are generated, the icicles can be formed outside the light emitting surface below the light emitting surface, and the problems caused by the icicles can be minimized. Play an effect.

The light emitting devices according to the fifteenth and sixteenth embodiments are not limited to the above-described configurations, and various modifications and applications are possible. For example, the hydrophilic area (high temperature area) and the hydrophobic area (low temperature area) exemplified in each of the above embodiments may be interchanged with each other in consideration of the visibility of the light emitting surface and the like.

Seventeenth Embodiment
FIG. 44 is a front perspective view of a traffic signal 1 according to a seventeenth embodiment of the present invention. The illustrated traffic signal 1 is a general vertical traffic light emitting three colors of red, yellow and green, and three light emitting surfaces 12 can be seen from an opening 11 provided on the front surface of the case 10. In the present embodiment, the “light emitting surface” refers to the surface on which the light emission of the traffic signal 1 is viewed, and in the illustrated traffic signal 1, the light emitting surface 12 disposed on the upper side is disposed in the center in red. The light emitting surface 12 emits light yellow, and the light emitting surface 12 disposed below emits light green. Moreover, from the upper part of each light emitting surface 12 to both side parts, a weir 13 is provided.

In the present embodiment, a three-lamp type vertical traffic light is shown as the traffic light 1. However, the present invention is not limited to this, the number of light emitting surfaces 12 and the color development thereof are arbitrary, and a plurality of light emitting surfaces 12 May be a horizontal traffic signal arranged in the horizontal direction. Further, although the light emitting surface 12 shown in the drawing is circular, it is not limited to this, and may have another shape, for example, a rectangular shape.

FIG. 45 is a rear exploded perspective view of the traffic signal 1. The case 10 is composed of a front case 10F and a rear case 10R, and houses therein the number of lamps 2 corresponding to the number of light emitting surfaces 12. The number of lamps 2 is three in this embodiment. Although the material of case 10 is not specifically limited, In this embodiment, it is manufactured by metal, for example, a steel plate. The wedge 13 is attached to the front case 10F by an appropriate method such as welding or screwing. In addition, a light fixture fixing portion 14 for fixing the light fixture 2 is suitably provided in the front case 10F. In the present embodiment, since the lamp 2 is fixed to the front case 10F by screwing, the lamp fixing portion 14 is a female screw. Further, the rear case 10 </ b> R is provided with a wiring hole 15 for drawing out the electric wiring extending from the lamp 2 to the outside of the case 10.

In the present specification, the “lighting device” corresponds to the “light emitting device” in the first to sixteenth embodiments, and is provided corresponding to one light emitting surface 12 (see FIG. 44). Refers to a single unit of light-emitting Therefore, the traffic light 1 having the plurality of light emitting surfaces 12 has the number of lighting devices 2 corresponding to the light emitting surfaces 12.

FIG. 46 is a front perspective view of the lamp 2. In the present embodiment, the lamp 2 is different in that the light emission color of the light emitting diodes as light emitting elements is different, and the number and arrangement density of the light emitting diodes are changed according to the luminance of the light emitting diodes having different light emission colors. Since they all have the same structure, the green-emitting lamp 2 disposed at the lower side of FIG. 45 is shown here as a representative.

In the present embodiment, the lamp 2 has a structure in which various members are accommodated in a housing 28 having a substantially hexagonal outer shape as shown. A transparent cover 21 is visible on the front side of the lamp 2, and the cover 21 is fixed to the housing 28 by screws 2101. In addition, the light emitting surface 12 protrudes in a convex shape on the front side on the front surface of the cover 21, and a gasket 20 is provided to surround the outer periphery of the light emitting surface 12. A housing attachment portion 2805 is provided at an appropriate position on the outer periphery of the housing 28 so that the housing 28 can be attached to the front case 10F. In the present embodiment, the housing attachment portion 2805 is a protrusion having a hole for screwing.

FIG. 47 is an exploded perspective view of the lamp 2 and shows the same lamp 2 as that shown in FIG. In the lamp 2, the gasket 20, the cover 21, the heat transfer member 22, the spacer 23, the optical sheet group 24, the light guide plate 25 and the reflective sheet 26 are disposed in this order from the front and housed in the housing 28 together with the heat insulating member 27. It has a structure. In addition, in the figure, the kind of electrical wiring and an electronic component is abbreviate | omitting illustration.

The gasket 20 is disposed around the light emitting surface 12 of the cover 21 and is interposed between the cover 21 and the front case 10F (see FIG. 45), thereby sealing the gap between the front case 10F and the cover 21 in a liquid tight manner. Do. The material and arrangement method of the gasket 20 are not particularly limited, but in the present embodiment, it is a black rubber ring. As the gasket 20, an annular sealing material such as a general O-ring may be used, or a suitable sealing material such as caulking material may be applied to the periphery of the opening 11 of the cover 21 or the front case 10F shown in FIG. Alternatively, the gasket 20 may be used. In addition, although the gasket 20 of this embodiment being black is because it is excellent in a weather resistance and the leak of the light to the front surface of the cover 21 can be prevented, the color in particular is not limited.

The cover 21 corresponds to the “protecting member” in the first to sixteenth embodiments, and is a transparent plate-like member that protects the internal structure of the lamp 2 from the external environment, and is made of glass or synthetic resin It is good. As described later, in order to transfer the heat transferred to the back surface of the cover 21 to the front surface, a material with good thermal conductivity of the cover 21 is preferable, but when the thickness of the cover 21 increases, the thickness direction of the cover 21 Thermal resistance increases. Therefore, it is preferable to select an appropriate material of the cover 21 in consideration of the thermal resistance in the thickness direction when the thickness of the cover 21 can be secured. In the present embodiment, the cover 21 is made of polycarbonate which is a synthetic resin, and the thickness of the light emitting surface 12 is 2 mm. Further, on the front surface of the cover 21, the light emitting surface 12, which is a portion exposed from the opening 11 (see FIG. 45) of the front case 10F, has a shape that is convex on the front side. This is a structure for preventing a difference in level between the front surface of the front case 10F and the light emitting surface 12, as described later.

The heat transfer member 22 is a material having excellent conductivity, for example, a metal such as aluminum, and is disposed on the back side of the cover 21. The heat transfer member 22 has a polygonal outer shape, here, a hexagonal outer shape, and each side thereof is a placement portion 2200 bent to the back side. A plurality of light emitting diodes are provided on the inner surface of the placement unit 2200. Further, a region overlapping with the light emitting surface 12 of the heat transfer member 22 is a honeycomb mesh provided with a plurality of openings as illustrated, and emitted from the light guide plate 25 provided on the back side of the heat transfer member 22 It is designed to transmit light. The honeycomb mesh is in thermal contact with the back surface of the cover 21 at the time of assembly of the lamp device 2 to transmit the heat generated when the light emitting diode emits light from the mounting portion 2200 to the honeycomb mesh and further to the back surface of the cover 21. Thereby, the cover 21 is warmed by utilizing the heat generation from the light emitting diode, and the visibility of the light emitting surface 12 is secured by melting or preventing the adhesion of ice and snow adhering to the front of the light emitting surface 12 especially in winter. .

Hereinafter, in the present specification, the main region where heat generation at the time of light emission of the light emitting diode is transmitted to the heat transfer member 22 is referred to as a heating region, and the other region is referred to as a non-heating region. The heating area may be an area covering at least a part of the light emitting surface 12, and the entire surface of the light emitting surface 12 may be a heating area. In the present embodiment, as shown in the figure, the honeycomb mesh of the heat transfer member 22 is divided up and down, and the heat from the placement unit 2200 is not easily transmitted to the upper honeycomb mesh, and placed on the lower honeycomb mesh. The heat from the placing portion 2200 is easily transmitted. Although the details of this structure will be described later, therefore, in this example, the heating area is the lower half of the light emitting surface 12. A portion of the heat transfer member 22 in the heating region, in this example, the lower half of the honeycomb mesh, is a heat transfer portion 2201 that transfers heat to the cover 21. In other words, the heat transfer portion 2201 is thermally connected to the light emitting diode in the heating area which is at least a partial area of the light emitting surface 12 and provided with a plurality of openings for transmitting light emitted from the light guide plate 25 It is a part. Further, in the present embodiment, the heat transfer portion 2201 is thermally connected to the cover 21 by contacting the back surface of the cover 21. Here, the cover 21 has a thin flat plate shape, and heat conduction in the in-plane direction does not occur much as compared to the thickness direction. Thus, the cover 21 will be warmed in the heating area but not much in the non-heating area. Therefore, it can be said that the non-heated area is an area where the amount of heat transfer from the light emitting diode is smaller than the heated area. The heating area corresponds to the "high temperature area" in the first to sixteenth embodiments, and the non-heating area corresponds to the "low temperature area" in the first to sixteenth embodiments.

Here, a structure in which the heat from the light emitting diode is integrated with the placement unit 2200, and the cover 21 is heated using the heat transfer member 22 having the heat transfer unit 2201 contacting the back surface of the heating area of the cover 21. However, the structure for warming the cover 21 may not be limited to such a structure. That is, it is disposed in a state of being thermally connected to both the light emitting diode and the cover 21 and transfers heat generated from the light emitting diode to the heating area of the cover 21, ie, at least a partial area of the light emitting surface 12. Any structure may be used. For example, a heat transfer portion 2201 in which a honeycomb mesh or a metal wire is previously embedded in the cover 21 by insert molding or the like is a heat transfer portion 2201, and the mounting portion 2200 and the heat transfer portion 2201 are thermal when assembling the lamp 2. Contact may be made. Alternatively, a heat conductive material such as conductive paste is used on the back surface of the heating area of the cover 21 to form a pattern having a plurality of openings through which light passes by printing to form the heat transfer portion 2201. The heat unit 2201 and the placement unit 2200 may be in thermal contact with each other. Furthermore, the cover 21 itself may be omitted, and the heat transfer member 22 may be directly exposed to melt adhering ice and snow, but the cover 21 is provided from the viewpoint of ease of falling of the ice and snow and durability. Can be said to be preferable.

Further, in the present embodiment, the heat transfer member 22 is polygonal as shown, but if the shape of the heat transfer member 22 is a polygon, the mounting portion 2200 provided on the side is Because it is flat, mounting of the light emitting diode is easy. In addition, as a polygon, it is not limited to a hexagon like the example shown here, It is good also as another shapes, such as a heptagon and an octagon. There is no particular upper limit on the number of sides of the polygon, but in order to enjoy the advantage that the placement unit 2200 is a flat surface, the dodecagonal position is the practical upper limit. Of course, the heat transfer member 22 may be circular instead of polygonal. In that case, the placement unit 2200 is a curved surface. Further, since the entire shape of the lamp 2 is matched to the shape of the heat transfer member 22, when the shape of the heat transfer member 22 is a shape other than a hexagon, the shape of the entire lamp 2 is also You may match.

The spacer 23 is a member provided between the heat transfer member 22 and the light guide plate 25, in this embodiment in front of the optical sheet group 24, for thermally isolating the heat transfer member 22 and the light guide plate 25. It is made of a material with low thermal conductivity such as synthetic resin. In addition, the back surface of the spacer 23 may be a reflective surface that reflects light. In this case, the light emitted to the front side from the portion other than the portion corresponding to the light emitting surface 12 of the light guide plate 25 is reflected and enters the light guide plate 25 again, so that the utilization efficiency of light can be increased. The spacer 23 is not an essential member, and may be omitted as long as the heat transfer member 22 and the light guide plate 25 are thermally isolated. For example, if the optical sheet group 24 has sufficient thermal insulation, the spacer 23 is unnecessary. Of course, the heat transfer member 22 and the light guide plate 25 may be thermally separated by a method other than the spacer 23, and the spacer 23 may be provided. In this case, if the spacer 23 has a back surface as a reflection surface, an effect of improving the utilization efficiency of light can be obtained. Alternatively, a simple reflection sheet not having a function as a spacer may be provided at the position of the spacer 23.

The optical sheet group 24 is a member for controlling the state of a light beam from the light guide plate 25, and a diffusion sheet, a prism sheet, and the like are appropriately selected and used as needed. Of course, it may be omitted if it is unnecessary.

The light guide plate 25 is an optical member that changes the direction of light incident from the end face of the outer periphery, which is a side face, and emits light substantially uniformly from the front face, and has a plate shape made of transparent synthetic resin. In this embodiment, it is a hexagonal plate made of acrylic resin. Then, on the back surface of the light guide plate 25, a suitable light reflection structure is provided for changing the reflection direction of the light beam traveling repeatedly inside the light guide plate 25 in the direction toward the front surface. In this example, the reflective ink is printed on the back surface of the light guide plate 25 in an appropriate pattern as a light reflection structure, but instead, a three-dimensional structure such as a groove or a dimple may be provided. Further, the front surface of the light guide plate 25 may be a flat surface, or an appropriate structure for controlling the direction of the light emitted from the light guide plate 25 may be provided. In the present embodiment, the front surface of the light guide plate 25 is a flat surface.

The reflection sheet 26 is a member that reflects the light emitted to the back side of the light guide plate 25 and introduces the light into the light guide plate 25 again to enhance the utilization efficiency of the light beam. The reflective sheet 26 has a mirror surface or a white reflective surface on the front. In the present embodiment, the reflective sheet 26 is a white sheet made of polyethylene terephthalate resin. Note that the reflection sheet 26 is not essential, and so-called pseudo lights that appear as if the external light that entered the lamp 2, for example, the light of the west day, is reflected inside the lamp 2, and the lamp 2 is lit. This may be omitted if lighting is a problem. Alternatively, the reflection sheet 26 may be replaced with an absorption sheet having an absorption surface on the front surface that absorbs and does not reflect light. There are no particular limitations on the visible light reflectance of the reflecting surface and the absorbing surface, and the reflectance may be set as desired. However, in the present specification, a surface that reflects 90% or more of incident light is used as a reflecting surface for convenience. The surface that absorbs 50% or more of light is taken as the absorption surface.

The heat insulating member 27 is disposed on the inner surface along the outer periphery of the housing 28 to thermally insulate the cover 21 and the heat transfer member 22 from the housing 28 so that the heat of the heat transfer member 22 is not transmitted to the housing 28 and dissipated It is a member for making it. The material of the heat insulating member 27 is not particularly limited as long as it has a heat insulating property, but a CR rubber sponge, a foamed polystyrene resin or the like is suitably used. The lower end of the heat insulating member 27 is provided with a notch 270 that accommodates a heat transfer protrusion 2803 of the housing 28 described later.

In addition, the structure and shape of the heat insulation member 27 are not limited to what was illustrated here. For example, the heat insulating member 27 may not be integral but may be divided into a plurality of members, or an irregular heat insulating material (for example, glass wool) may be packed between the heat transfer member 22 and the housing 28. . Alternatively, the heat insulating member 27 may be omitted, and the heat transfer member 22 may be supported so as not to be in direct contact with the housing 28 so as to be separated by a space.

The housing 28 is a container that accommodates the gasket 20, the cover 21, the heat transfer member 22, the spacer 23, the optical sheet group 24, the light guide plate 25, the reflective sheet 26, and the heat insulating member 27 described above. The material of the housing 28 is not particularly limited, and is formed of a synthetic resin such as polycarbonate or ABS resin, or a metal such as a steel plate. However, in consideration of the heat insulating property of the lamp 2 to the rear of the signal light, it is more preferable to be formed of a material having low thermal conductivity such as a synthetic resin. The housing mounting portion 2805 described above is provided on the front peripheral edge where the housing 28 is open. Further, at an appropriate position on the inner surface of the housing 28, a mounting boss 2801 is provided so as to project forward, and a screw for fixing the cover 21 is received. Further, a hole 2802 provided on the back is for drawing electrical wiring from the outside of the housing 28 to the inside.

Furthermore, at the lowermost edge of the housing 28, a heat transfer projection 2803 is provided which protrudes to the inner surface side of the housing 28. The heat transfer projection 2803 is a lower heat transfer structure that contacts the heat transfer member 22 and causes the heat transfer member 22 and the housing 28 to be in thermal contact at this portion. In FIG. 47, the heat transfer projection 2803 is shown as a portion where a part of the housing 28 protrudes, but when the housing 28 is formed of a material with low thermal conductivity such as a synthetic resin, the heat transfer projection 2803 is formed. The heat conductivity of the lower heat transfer structure may be enhanced by providing a metal member in the portion where the heat transfer is performed.

FIG. 48 is a partial cross-sectional view of the signal device 1 taken along the line HH in FIG. The rear case 10R is not shown in FIG.

The housing 28 is fixed by attaching the housing attachment portion 2805 to the back of the front case 10F with a screw 2804. At this time, the lamp 20 is attached to the front case 10F in a fluid-tight manner by the gasket 20 being sandwiched and compressed between the cover 21 and the front case 10F. The light emitting surface 12 of the cover 21 is convex on the front side, and protrudes into the opening 11 of the front case 10F. As a result, the front surface of the front case 10F and the light emitting surface 12 become continuous planes, and no step is formed between them. In addition, when ice and snow attached to the light emitting surface 12 slide down the surface of the light emitting surface 12 and fall off due to gravity, this structure is not to be caught on the surface irregularities to prevent the falling off. It is a thing. Therefore, the expression "no level difference is formed" as used herein means that the level difference is not formed to the extent that the above-mentioned purpose, i.e., the falling off of ice and snow, is prevented. Specifically, the difference in position between the front surface of the front case 10F and the light emitting surface 12 in the front-rear direction is suitably 1 mm or less, and more preferably 0.5 mm or less. Furthermore, as shown in FIG. 5, if the inclinations of the light emitting surface 12 and the front surface of the front case 10F are also equal, it is preferable because the falling of the ice and snow attached to the light emitting surface 12 is not prevented. Note that this condition may be satisfied at the outer peripheral edge of the light emitting surface 12, and the inclination at a position away from the light emitting surface 12 on the front surface of the front case 12F does not matter. In addition, the expression "the inclination is equal" also means that there is no difference in inclination for preventing the falling off of ice and snow purposely, specifically, the light emitting surface 12 and the front surface of the front case 10F The difference in inclination may be 10 degrees or less, more preferably 5 degrees or less.

The back surface of the light emitting surface 12 of the cover 21 has a concave shape on the front side, as shown in FIG. This structure is not essential, but if the thickness of the cover 21 on the light emitting surface 12 is large, the heat transmitted to the back surface of the light emitting surface 12 by the heat transfer member 22 is less likely to be transmitted to the front surface. There is an effect of reducing the thickness 21 and improving the heat conduction performance in the thickness direction. In addition, such a structure brings about reduction of the use material of the cover 21 and suppression of the deformation | transformation at the time of shaping | molding.

The heat transfer member 22 is provided with a mounting portion 2200 around its periphery, and a light emitting diode substrate 2202 on which a light emitting diode 2203 is mounted is attached to the inner surface. The material of the light emitting diode substrate 2202 is not particularly limited, but a material excellent in thermal conductivity is preferable, and in the present embodiment, an aluminum substrate having an insulating coating on the surface is used. Here, a so-called light emitting diode package is mounted on the light emitting diode substrate 2202, but instead, a light emitting diode element may be formed directly on the light emitting diode substrate 2202. It is preferable to apply a heat conductive grease between the light emitting diode substrate 2202 and the mounting portion 2200 so as to reduce the thermal resistance between the two. The light emitting diode substrate 2202 may be omitted, and the light emitting diode 2203 may be disposed directly on the inner surface of the mounting portion 2200.

Further, a portion corresponding to the light emitting surface 12 of the heat transfer member 22 has a convex shape corresponding to the concave shape of the cover 21, and the heat transfer portion 2201 is in contact with the back surface of the cover 21. It is preferable that the heat transfer portion 2201 and the back surface of the cover 21 be bonded and thermally connected by an appropriate method such as use of an adhesive or heat fusion so that an air layer is not formed therebetween. It is also preferable to apply a heat conductive grease between the heat transfer portion 2201 and the back surface of the cover 21 to reduce the thermal resistance between them. Furthermore, the back surface of the heat transfer portion 2201 or the heat transfer member 22 may be a reflective surface. This is because the honeycomb mesh of the heat transfer portion 2201 blocks the light emitted forward from the light guide plate 25, so if the heat transfer portion 2201 absorbs the light beam, the light utilization efficiency decreases, but the heat transfer portion 2201 is heated. The light beam is reflected back to the light guide plate 25 side, and is reflected again by the light reflection structure on the back surface of the light guide plate 25 or the reflection sheet 26 and taken out in front of the lamp 2 to suppress a decrease in light beam utilization efficiency. It is for.

The mounting portion 2200 positioned below the heat transfer member 22 extends further rearward and is then bent to form a conversion circuit board mounting portion 2204. The conversion circuit board 2205 is attached to the conversion circuit board attachment portion 2204. The conversion circuit board 2205 is a board on which a conversion circuit for converting an alternating current sent from an external control panel to a traffic light into a direct current suitable for lighting the light emitting diode 2203 is mounted. The shape of the conversion circuit board 2205 itself may be any shape as long as the conversion circuit can be mounted, but in the present embodiment, the heat transfer member 22 is attached so as to be in thermal contact. Although this does not extend to the light emitting diode 2203, the conversion circuit is also a heat source, so the heat is transmitted to the heat transfer member 22 and used. Furthermore, the conversion circuit board 2205 is attached to the lower part of the heat transfer member 22 because the conversion circuit is closer to the heat transfer portion 2201 provided on the lower part of the light emitting surface 12 and the heat transfer projection 2803 which is a lower heat transfer structure described later. This is for disposing the substrate 2205. The conversion circuit board mounting portion 2204 and the conversion circuit board 2205 are arranged to have a gap from them so as not to be in thermal contact with the housing 28 and the light guide plate 25.

As shown in the upper part in the drawing, the heat insulating member 27 is sandwiched between the mounting portion 2200 of the heat transfer member 22 and the housing 28. On the other hand, at the portion of the lower heat transfer structure shown in the lower part of the figure, the mounting portion 2200 and the heat transfer projection 283 of the housing 28 directly contact, and the heat of the heat transfer member 22 is conducted to the lower portion of the housing 28 It is supposed to be. This is a structure for slightly warming the front case 10F on the lower side of the lamp 2 by transferring part of the heat of the light emitting diode 2203 and the conversion circuit to the front case 10F through the lower heat transfer structure. is there. As a result, the formation of an ice column due to the water that has flowed to the lower part of the front case 10F being melted by the light emitting surface 12 of the lamp 2 or the like being frozen again is suppressed. The lower heat transfer structure including the heat transfer projections 2803 is not essential, and may be omitted if the formation of the ice pillars is not a problem. Further, as shown in FIG. 45, in the traffic signal device 1 of the type in which a plurality of lamp devices 2 are vertically disposed, it is sufficient that the lamp device 2 disposed at the lowermost side has a lower heat transfer structure, The lower heat transfer structure may be omitted in the lamp 2 of the present invention. Furthermore, the specific configuration of the lower heat transfer structure may be anything as long as it transfers heat from the heat transfer member 22 to the lower portion of the housing 28. For example, instead of the heat transfer projections 2803, a plate Both may be brought into contact with each other by an elastic metal member such as a spring.

The optical sheet group 24, the light guide plate 25, and the reflective sheet 26 are disposed in this order on the back side of the heat transfer member 22 in a state of being thermally isolated by the spacer 23.

FIG. 49 is a rear perspective view of the heat transfer member 22. FIG. As shown in the figure, a portion corresponding to the heating area of the heat transfer member 22 is in a honeycomb mesh shape, and is a heat transfer portion 2201. The heat transfer portion 2201 is connected to the mounting portion 2200 on which the light emitting diode substrate 2202 mounted with the light emitting diode 2203 is mounted, and is connected to the peripheral portion 2206 located at the outer periphery of the light emitting surface 12 at many points. The heat which flows in through these many places is transmitted to the whole region of the heat transfer portion 2201. Then, since the heat transfer portion 2201 and the back surface of the cover 21 are in thermal contact, the heat from the heat transfer member 22 is directly transmitted to the light emitting surface 12 of the cover 21 in the heating area.

On the other hand, the portion corresponding to the non-heating region of the heat transfer member 22 is also a non-heat transfer portion 2208 in a honeycomb mesh shape. In the non-heat transfer area 2208, since a part of the light beam is blocked by the heat transfer section 2201 in the heating area, the light quantity in the heating area and the non-heating area is also blocked by blocking a part of the light beam in the non-heating area as well. To eliminate the difference in luminance due to the difference in That is, the non-heat transfer portion 2208 is a light suppression structure that suppresses the amount of light emitted from the light emitting surface.

However, assuming that the non-heat transfer portion 2208 has the same structure as the heat transfer portion 2201, the heat from the light emitting diode 2203 is also transferred to the back surface of the cover 21 also in the non-heat transfer portion 2208. Therefore, as shown in the figure, the heat transfer portion 2201 and the non-heat transfer portion 2208 are not connected by a structure such as a beam, and a gap is provided between them, and a small number of non-heat transfer portion 2208 and peripheral portion 2206 are provided. The cross section of the part connected to the peripheral part 2206 is small by mounting by connecting with the beam 2207 (four in the illustration, the one on the near side (left side in the figure is hidden because it is hidden)) Heat from the placement portion 2200 is less likely to be transmitted than the heat transfer portion 2201. Therefore, most of the heat from the light emitting diode 2203 is transferred to the heat transfer portion 2201 through the peripheral portion 2206 while the temperature of the non-heat transfer portion 2208 hardly increases. Therefore, in the non-heating area, the heat from the heat transfer member 22 flows only slightly from the heating area or the area outside the light emitting surface 12 of the cover 21 due to the heat conduction in the plane of the cover 21. That is, in the non-heated region, the heat from the heat transfer member 22 is not directly transmitted to the light emitting surface 12 of the cover 21.

In the present embodiment, the heating region is shaped so as not to cover the entire surface of the light emitting surface 12 but to cover a portion, in this case, the lower side. Explaining this, especially in a cold region where the conditions are severe and the temperature is significantly lower than 0 ° C., the total calorific value by the light emitting diode 2203 is insufficient, so the entire light emitting surface 12 is the melting point of water. In some cases, the temperature can not rise above 0 degrees Celsius. In this case, the ice and snow attached to the front of the light emitting surface 12 can not be melted, and the ice and snow adheres to the front of the light emitting surface 12, and the light emission can not be viewed. Therefore, by making the heating area a partial area of the light emitting surface 12, the heat from the light emitting diode 2203 is concentrated in the heating area, and a part of the cover 21 is heated to a temperature above the melting point of water. Melts and removes ice and snow. As a result, the light emitting surface 12 can be viewed at least in the heating area, and the situation in which the entire surface of the light emitting surface 12 is covered with ice and snow and can not be viewed at all is avoided. As apparent from the above description, depending on the installation environment of the traffic signal 1, the cold may not be so severe, and the total calorific value of the light emitting diode 2203 may be able to raise the entire surface of the light emitting surface 12 to the melting point of water. . In this case, the heating area may be the entire surface of the light emitting surface 12.

Further, in the present embodiment, the heating area is an area under the light emitting surface 12. The shape of the heating area is intended to easily drop off the ice and snow attached to the surface of the light emitting surface 12. That is, since the portion in contact with the light emitting surface 12 melts in the heating area, the ice snow adhering to the front surface of the light emitting surface 12 slides down the surface of the light emitting surface 12 by gravity and drops out. At this time, if there is a non-heating area further below the heating area, and ice and snow are firmly attached to the front of the light emitting surface 12 in that area, the adhering snow and ice in the heating area is supported by the lower ice and slips off It is thought that it is impossible to drop off the ice and snow attached to the surface of the light emitting surface 12 after all. Therefore, there should be no unheated area further below the heated area. That is, that the heating area is the lower part of the light emitting surface 12 means that the non-heating area exists vertically above the heating area and the non-heating area does not vertically below the heating area. Means

In the example shown in FIG. 49, the heating area has a semicircular shape, but the shape is not particularly limited as long as the heating area is a portion under the light emitting surface 12. The position of the boundary between the heating area and the non-heating area may be appropriately selected in accordance with the installation environment of the traffic light 1 or the like, and the direction of the boundary may not necessarily be horizontal. Further, the shape of the heating area is not limited to that shown here, and may be another shape. For example, the light emitting surface 12 may have an annular rim shape or may have a strip shape extending in the vertical direction.

In the present embodiment, the light emitting diodes 2203 are provided on the entire periphery of the heat transfer member 22, that is, on all sides of the polygonal heat transfer member 22, but the present invention is not necessarily limited thereto. For example, when the heat transfer member 22 is an even square, the light emitting diodes 2203 may be provided on one side of the opposing sides of the heat transfer member 22 and the light emitting diodes 2203 may not be provided for the other side. FIG. 50 shows an example where the heat transfer member 22 is a regular hexagon, and the light emitting diodes 2203 are provided on the lower three sides in the drawing. At this time, by setting the inner peripheral surface of the mounting portion 2200 on the side where the light emitting diode is not provided as the reflection surface 2209, the light emitting diode 2203 on one side is incident on the light guide plate 25 and is opposed to the other side. A light beam directed toward and emitted is reflected by the reflection surface 2209 and enters the light guide plate 25 again, so that fewer uniform light emitting diodes 2203 can be obtained efficiently. Although the reflecting surface 2209 is provided on the inner peripheral surface of the mounting portion 2200 in this example, it may be provided directly on the end face of the light guide plate 25. The reflecting surface 2209 may be formed by performing appropriate surface treatment on the placement unit 2200, or may be formed by using an appropriate reflecting sheet.

Furthermore, in this case, as shown in FIG. 50, the side on which the light emitting diode 2203 is provided is preferably in the vicinity of the heating area, that is, the heat transfer portion 2201. Thereby, the heat from the light emitting diode 2203 can be efficiently transferred to the heat transfer portion 2201. This means that quantitatively, the light emitting diode 2203 is provided to face the end face in a part of the periphery of the light guide plate 25, and the total amount of heat generation of the light emitting diode 2203 at the position facing the heating area is the non-heating area. It can be reworded as being larger than the total amount of heat generation of the light emitting diode 2203 at the position facing the. Whether the optional light emitting diode 2203 faces the heating area or the non-heating area is determined by looking at the center of the heat transfer member 22 from the light emitting diode 2203 or the heat transfer portion 2201 or the non-heat transfer portion 2208 It may be judged by which one of them is visible. Furthermore, it can be said that the reflecting surface 2209 is preferably provided at a position facing a part of the periphery where the light emitting diode 2203 is provided.

Moreover, in this embodiment, although the light suppression structure mentioned above was made into the non-heat-transfer part 2208 provided in the heat-transfer member 22, the light suppression structure is not limited to this. For example, as shown in FIG. 51, the heat transfer member 22 may have a shape having a simple opening in the non-heating area. In this case, as a light suppression structure, referring to FIG. 47, a heat transfer portion 2201 and a portion corresponding to a non-heating area of the cover 21 which is a member disposed on the front surface of the light guide plate 25 or on the front side of the light guide plate 25. A similar light shielding pattern may be printed, or a single light coating may be used so as to have a light transmittance similar to the light transmittance of the heat transfer portion 2201. Alternatively, an appropriate sheet, that is, a sheet having a color or pattern that suppresses the light transmittance in the non-heated region may be disposed at the front side of the light guide plate 25. For example, they may be added as part of the optical sheet group 24. Alternatively, the pattern of the light reflecting structure on the back surface of the light guide plate 25 is different between the heating area and the non-heating area, and the amount of light emitted from the front surface of the light guide plate 25 in the non-heating area is smaller than the amount of light in the heating area Accordingly, a light suppression structure may be used. Furthermore, the light suppression structure itself may be omitted if the difference in light dose between the heated area and the unheated area causes no practical problem.

Subsequently, a modification of the traffic signal 1 will be shown. In the traffic signal 1 shown in FIG. 44, the light emitting surface 12 is flat. In this case, depending on the installation environment, when strong ambient light, for example, the west sun hits the light emitting surface 12, depending on the direction in which the traffic light 1 is observed, a situation may occur where the light emitting color of the light emitting surface 12 can not be seen there is a possibility. FIG. 52 is a front perspective view showing a modified example of the traffic signal device 1 in which the reflected light due to strong external light such as west day is suppressed. As illustrated, in the present modification, the front surface of the case 10 of the traffic light 1 and the light emitting surfaces 12 are curved. More specifically, the front surface of the case 10 and the light emitting surfaces 12 are curved surfaces that are straight in the vertical direction and curved in the horizontal direction. Here, since the front surface of the case 10 and each light emitting surface 12 are curved surfaces that are convex toward the front side with respect to the horizontal direction, the traffic light 1 has a semicylindrical shape that is entirely convex as a whole. In FIG. 52, although a cruciform line is put on each light emitting surface 12 to clearly show how it bends, this is for ease of understanding and there is no such cruciform line in practice.

As described above, when the light emitting surface 12 is a curved surface, even when strong external light strikes the light emitting surface 12, the external light is not reflected in a specific direction. The light is suppressed and the light emission color of the light emitting surface 12 can be visually recognized. On the other hand, considering the ice and snow adhering to the light emitting surface 12 in winter, since the ice and snow adhering to the light emitting surface 12 falls in the vertical direction when falling off, the ice and snow when the light emitting surface 12 is bent in the vertical direction It will prevent the dropout of Therefore, in the present modification, the light emitting surface 12 is a curved surface that is linear in the vertical direction and curved in the horizontal direction, does not prevent the falling off of ice and snow, and suppresses reflected light by strong external light such as west sun It is to do.

In the embodiment described above, for example, as shown in FIG. 49, the shape of the heat transfer portion 2201 is a honeycomb mesh in which a large number of regular hexagonal holes are densely arranged, but the shape is necessarily limited to this It is not a thing. That is, any structure may be used as long as it conducts heat to the entire surface of the heat transfer portion 2201 and transmits light rays through the plurality of openings. However, in such a structure, it is preferable to increase the ratio of the area occupied by the opening as much as possible from the viewpoint of light utilization efficiency, while the cross-sectional area of each portion constituting the heat transfer portion 2201 is as large as possible and from the heat source It is preferable from the viewpoint of thermal conductivity that the distance of is as small as possible. From this point of view, the honeycomb mesh shape in which the material used is the smallest with respect to the area occupied by the openings is the optimum solution, but as long as there is no problem in practical use, for example, a large number of round holes as shown in FIG. The shape may be a densely arranged punching mesh shape, a lattice shape as shown in FIG. 53B, or a shape having a large number of slits as shown in FIG. 53C.

The specific configuration shown in the seventeenth embodiment described above is an example, and a person skilled in the art may make various modifications. For example, the shape and dimensional ratio of each member, the arrangement density and the number of light emitting diodes, etc. may be changed appropriately according to the performance, application and installation environment required for the traffic signal.

In one aspect of the first to eighth embodiments of the present invention described above, the heat transfer member is a metal. Thus, the heat generated when the light emitting element is turned on can be efficiently conducted to the protective member, that is, the light emitting surface of the front surface of the light emitting device.

In another aspect of the first to eighth embodiments of the present invention, the substrate is a metal, and heat generated from the light emitting element is transmitted to the protective member via the substrate and the heat transfer member. Thus, the heat generated when the light emitting element is turned on can be efficiently conducted to the protective member, that is, the light emitting surface of the front surface of the light emitting device.

In addition, in another aspect of the first to eighth embodiments of the present invention, the non-heat conductive member is disposed in a portion of the light-transmissive member other than the portion immediately above the light-emitting element. This can further enhance the heat collection effect.

In another aspect of the first to eighth embodiments of the present invention, the light emitting surface is one. As a result, the light emitting surface constantly generates heat and there is no period for turning off the light, so the temperature of the protective member can be further raised.

In one aspect of the ninth to fourteenth embodiments of the present invention, the heat transfer member is a plate having substantially the same shape as the mounting substrate, and a plurality of the heat transfer members surround the light emitting elements corresponding to each of the plurality of light emitting elements. And a through hole, and is disposed overlapping the mounting substrate. As a result, since the heat transfer member is formed into a single plate, the manufacture of the assembly process is simplified, and cost reduction is further advantageous.

In another aspect of the ninth to fourteenth embodiments of the present invention, a heat insulating member is disposed in contact with the second surface of the mounting substrate. As a result, the heat transferred from the light emitting element to the mounting substrate is prevented from being transferred to the back surface side of the mounting substrate, that is, to the side opposite to the light emitting surface by heat conduction, convection, and heat radiation. Therefore, since the heat can be efficiently conducted to the protective member, that is, the light emitting surface of the light emitting device, the snow melting function can be more effectively performed.

Further, in one aspect of the first to fourteenth embodiments of the present invention, a GX 53 base is provided as a base. Thus, the light emitting device can be thinned.

In addition, in another aspect of the first to fourteenth embodiments of the present invention, an AC drive circuit is provided. As a result, the present light emitting device can be directly connected to an AC power source, and there is no need to mount an additional circuit such as an AC / DC converter in particular. it can.

In one aspect of the seventeenth embodiment of the present invention, the heating area is a partial area of the light emitting surface. In this way, it is possible to melt ice and snow at least in the heating area even in a cold region under severe conditions, and to ensure the visibility of the light emitting surface.

In another aspect of the seventeenth embodiment of the present invention, the heat transfer structure is a polygonal heat transfer member, and the placement portion is a flat plate-like portion extending rearward from the side of the heat transfer member. . Thus, the heat transfer structure can be configured by an integral member.

In addition, in another aspect of the seventeenth embodiment of the present invention, the light suppression structure is provided in the heat transfer structure, provided with a plurality of openings for transmitting light emitted from the light guide plate, and Of the light guide plate or a non-heat transfer portion where heat from the placement portion is not easily transmitted, or printing or painting applied to the surface of the light guide plate or a member disposed in front of the light guide plate It may be a sheet disposed on the front side, or a light reflecting structure formed on the back side of the light guide plate. This makes it possible to compensate for differences in light dose in the heated and non-heated areas.

In another aspect of the seventeenth embodiment of the present invention, the back surface of the heat transfer structure is a reflective surface. This increases the light utilization efficiency.

In another aspect of the seventeenth embodiment of the present invention, the back surface of the light emitting surface of the cover is concave. Thus, the thickness of the cover on the light emitting surface is reduced.

In another aspect of the seventeenth embodiment of the present invention, the inclinations of the light emitting surface and the front surface of the case are equal at the outer peripheral edge of the light emitting surface. This does not prevent the falling off of the ice and snow adhering to the light emitting surface.

The light emitting device according to the present invention is not limited to the above configuration, and various modifications and applications are possible.

For example, in each of the above embodiments, a circular shape and a rectangular shape have been illustrated as the main body shape of the light emitting device, but it is possible to adopt other arbitrary shapes such as an ellipse.

Moreover, although GX53 was illustrated and demonstrated as a nozzle | cap | die, the conventional nozzle | capacitances, such as E26, can also be applied.

In the description of each of the above embodiments, a rectifier circuit using a diode bridge has been exemplified as a drive circuit, but a general circuit type such as a switching type AC / DC converter can be applied.

In each of the above embodiments, a light emitting diode (LED) is illustrated as a light emitting element, but application of other semiconductor light emitting elements such as a semiconductor laser and an organic LED is also possible.

In each of the above embodiments, the mounting by means of the package-encapsulated LED is described as an example of mounting of the light emitting element, but so-called COB (Chip on Board) mounting in which bare chip light emitting diode elements are directly mounted on a substrate Application is also possible.

Furthermore, in the present embodiment, the traffic signal lamp has been exemplified and described as an example of the light emitting device that exhibits the snow melting effect, but in addition, road lighting, street light, indicator light, road sign, electric bulletin board, road information board, The present invention is applicable to all types of light emitting devices used outdoors, such as entrance lights, outdoor security lights, and headlights.

Further, in each of the above embodiments, the one in which the mounting substrate and the heat transfer member are separately configured is described as an example, which is integrally formed by cutting, extrusion molding, or the like to form one component. Is also possible. In this case, for example, the heat transfer members are formed radially from the center of the light emitting device, and the printed circuit board on which the LED is mounted is disposed between the heat transfer members. Wiring to the back surface is performed by providing an opening in the mounting substrate, and for example, it is connected to a drive circuit disposed on the back surface.

Claims

A substrate mounted with a light emitting element,
A heat transfer member provided on the surface of the substrate;
A protective member provided on the heat transfer member so as to cover the light emitting element and the heat transfer member;
The light emitting element forms a light emitting surface on the protective member,
The light-emitting device, wherein the heat transfer member guides the heat generated by the light-emitting element to the protective member, and causes a temperature distribution consisting of a high temperature region and a low temperature region on the light emitting surface.
The heat transfer member and the protective member are in contact with each other along the periphery of the protective member, and a high temperature region is formed in the peripheral portion of the light emitting surface, and a low temperature region is formed in the central portion. Light emitting device.
The heat transfer member and the protection member are in contact at a central portion of the protective member, and a high temperature region is formed at the central portion of the light emitting surface, and a low temperature region is formed at a peripheral portion surrounding the central portion. The light-emitting device according to 1.
The heat transfer member and the protective member are in contact in a plurality of island regions in plan view, and a high temperature region of island shape and a low temperature region surrounding the high temperature region of island shape are formed on the light emitting surface. The light emitting device according to claim 1.
The heat transfer member and the protection member are in contact with each other at substantially one half of the surface of the protection member, and a high temperature region is formed at approximately one half surface of the light emitting surface, and a low temperature region is formed at approximately the other half surface. The light emitting device according to claim 1.
The surface of the protective member has a hydrophilic region and a hydrophobic region,
The light emitting device according to any one of claims 1 to 5, wherein the hydrophilic region is a high temperature region in which the temperature is maintained relatively higher than the hydrophobic region.
The light emitting device according to claim 6, wherein the hydrophilic region and the hydrophobic region are in contact via a heat insulating member.
It further has a translucent member covering the light emitting element,
The light emitting device according to any one of claims 1 to 7, wherein the heat transfer member is formed by bringing the light transmitting member located immediately above the light emitting element into contact with the protective member.
The substrate has a first surface on which a plurality of the light emitting elements are mounted, and a second surface located on the back surface side of the first surface,
8. The light emission according to any one of claims 1 to 7, wherein the heat transfer member is provided between the plurality of light emitting elements on the first surface of the substrate and is formed of a metal material. apparatus.
The substrate is a thermally conductive material having a first surface, a second surface located on the back side of the first surface, and a plurality of through holes penetrating from the first surface to the second surface. Formed
The light emitting element is mounted on a second surface so as to emit light through the through hole from the second surface to the first surface.
The light emitting device according to any one of claims 1 to 7, wherein heat generated in a plurality of the light emitting elements is conducted to the protective member through the substrate.
The light emitting device according to any one of claims 1 to 9, wherein a heat insulating member is disposed in contact with the surface of the substrate opposite to the light emitting element mounting surface.
With the housing,
It has a light guide plate that changes the direction of light incident from the end face and emits light from the front face,
A plurality of the light emitting elements are disposed facing the end face of the light guide plate,
The heat transfer member is disposed on the front side of the light guide plate and thermally connected to the light emitting element to transfer heat generated from the light emitting element to a heating area which is a partial area of the light emitting surface. The light emitting device according to any one of claims 1 to 5, wherein
The heat transfer structure includes a heat transfer portion having a plurality of openings transmitting light emitted from the light guide plate, and a mounting portion on which the light emitting element is mounted and thermally connected to the heat transfer portion. A light emitting device according to claim 12.
The light emitting device according to claim 12 or 13, further comprising a light suppression structure for suppressing an amount of light emitted from the light emitting surface in a non-heating region which is a region other than the heating region of the light emitting surface.
The light emitting element is provided to face the end face of the light guide plate at a part of the periphery of the light guide plate, and the total heat generation amount of the light emitting element at a position facing the heating area faces the non-heating area The light emitting device according to claim 14, which is larger than the total amount of heat generation of the light emitting element at a position.
The light emitting device according to any one of claims 12 to 15, further comprising: a heat insulating member that prevents heat transfer at least between the heat transfer structure and the light guide plate and between the heat transfer structure and the housing.
The light emitting device according to any one of claims 12 to 16, further comprising a lower heat transfer structure for transferring the heat of the heat transfer structure to the housing at a lower portion of the light emitting device.
A converter circuit board having a converter circuit for converting alternating current into direct current;
The light emitting device according to any one of claims 12 to 17, wherein the conversion circuit board is disposed in thermal contact with a lower portion of the heat transfer structure.
A light emitting device according to any one of claims 12 to 18,
It has a case that accommodates the light emitting device and has an opening on the front surface that exposes the light emitting surface;
The protective member is disposed on the front side of the heat transfer structure and is thermally connected to the heat transfer structure in the heating area.
The light emitting surface of the protective member is convex forwardly,
The traffic signal in which a level | step difference is not formed between the said light emission surface and the front surface of the said case in the outer periphery of the said light emission surface.
20. The traffic light according to claim 19, wherein the front surface of the light emitting surface is a curved surface which is straight in the vertical direction and curved in the horizontal direction.