CN202769315U - Lamp bulb - Google Patents

Lamp bulb Download PDF

Info

Publication number
CN202769315U
CN202769315U CN 201220252017 CN201220252017U CN202769315U CN 202769315 U CN202769315 U CN 202769315U CN 201220252017 CN201220252017 CN 201220252017 CN 201220252017 U CN201220252017 U CN 201220252017U CN 202769315 U CN202769315 U CN 202769315U
Authority
CN
China
Prior art keywords
light
light source
lampshade
section
light guide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN 201220252017
Other languages
Chinese (zh)
Inventor
柴原雄右
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Lighting and Technology Corp
Original Assignee
Toshiba Lighting and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Lighting and Technology Corp filed Critical Toshiba Lighting and Technology Corp
Application granted granted Critical
Publication of CN202769315U publication Critical patent/CN202769315U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Landscapes

  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The utility model provides a lamp bulb that can be expected to fully inhibit temperature rising of a heating semiconductor light-emitting component under luminance. The lamp bulb is characterized by comprising a main body, a light source and a lampshade, wherein the main body is made of metal and comprises a light source mounting part; and the light source comprises a light-emitting part with a heating LED (light-emitting diode) under luminance and a light source substrate mounted with the light-emitting part. The light source substrate is in contact with the light source mounting part, in order to mount the light source onto the light source mounting part. The lampshade is formed by a lampshade main body and a light guide part, which are both made of the material with light transmission property and high thermal conductivity. The light guide part is thermally combined with the center part of the lampshade main body and protruded toward the lampshade main body. The lampshade main body covers the light source and the light source mounting part. The light-emitting part is held at the protruding front end part of the light guide part, and the protruding front end part is thermally bonded with the light source substrate.

Description

Bulb
Technical field
Embodiment of the present utility model relates to a kind of bulb that comprises lampshade.
Background technology
The bulb that possesses following formation is technology and known as a setting, described constituting: light emitting diode (light emitting diode will be installed, LED) light source substrate is installed in the surface of the light resource installing section that has as the enclosing cover of metal-made peripheral member (cover), and will comprise the light transmission lampshade that is configured as roughly spherical clear glass etc. and covers light source substrate and be installed in light resource installing section, the light conductor that covers LED is configured on the light source substrate, and the central portion inner face that makes the front end face of this light conductor and lampshade in opposite directions.
The major part of the heat that the LED of luminance sends is passed to peripheral member via light source substrate, and emits to atmosphere from the perimembranous of this peripheral member.Thus, the temperature that suppresses LED rises, thereby has realized keeping of the luminous efficiency of LED and illuminant colour etc.
In recent years, the high output of LED constantly advances, thereby the caloric value of LED increases.Therefore, consider to be difficult to fully to suppress the situation that the temperature of LED rises.And then, bulb-shaped be in the small-sized situation, the surface area of the peripheral member that possesses because of bulb, namely area of dissipation is little, rises so more be difficult to fully to suppress the temperature of LED.
[background technology document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2009-289697 communique
The utility model content
The bulb that provides a kind of temperature of expecting fully to suppress the semiconductor light-emitting elements that generates heat under the luminance to rise in the embodiment.
In order to solve described problem, the bulb of embodiment is characterised in that and comprises body, light source, and lampshade.Body is metal-made and comprises light resource installing section.Light source comprises: comprise the illuminating part of the semiconductor light-emitting elements that generates heat under the luminance and the light source substrate of this illuminating part is installed.Light source substrate is contacted with light resource installing section and light source is installed in light resource installing section.Lampshade is formed by the lampshade body and the light guide section that all comprise light transmission and high conductivity material.The central portion thermal of light guide section and lampshade body and in the lampshade body outstanding the setting.Make the lampshade body cover light source and light resource installing section and set.Illuminating part is contained in the outstanding leading section of light guide section, and makes this outstanding leading section and light source substrate thermal.
[effect of utility model]
According to the bulb of embodiment, can expect fully to suppress the effect that the temperature of the semiconductor light-emitting elements that generates heat under the luminance rises.
Description of drawings
Fig. 1 is the profile of the LED bulb of expression example 1.
Fig. 2 is the profile of the LED bulb of expression example 2.
The explanation of symbol:
1: bulb
2: body
3: perisporium
4: light resource installing section
4a: the surface of light resource installing section
5: recess
7: light source
8: light source substrate
8a: perimembranous
9: illuminating part
9a:LED (semiconductor light-emitting elements)
9b: framework
9c: containment member
11: lampshade
12: the lampshade body
13: light guide section
13a: base end part
13b: outstanding leading section
13c: narrow section
15: recess
21: insulating component
25: lamp circuit
26: circuit substrate
27: circuit component
31: lamp holder
32: the lamp holder body
33: coupling member
The specific embodiment
The bulb of embodiment 1 is characterised in that and comprises: metal body comprises light resource installing section; Light source comprises the illuminating part with the semiconductor light-emitting elements that generates heat under the luminance and the light source substrate that this illuminating part is installed, and this light source substrate is contacted with described light resource installing section and is installed in this light resource installing section; And lampshade, comprising: the lampshade body, it comprises the material of light transmission and high-termal conductivity and covers described light source and described light resource installing section and setting; And light guide section, its comprise the material of light transmission and high-termal conductivity and with the central portion thermal of described lampshade body to the inside of described lampshade body outstanding the setting, and outstanding leading section accommodate described illuminating part and with described light source substrate thermal.
In the embodiment 1, the metal that forms body can preferably use aluminium and alloy thereof etc., but also can use other metals.Meanwhile, even if body is the formation that forms as one with its light resource installing section, even if perhaps for light resource installing section and body principal part are shaped separately the formation of this light resource installing section and the binding of body principal part, all harmless.
In the embodiment 1, can use LED (light emitting diode) or semiconductor laser etc. in the semiconductor light-emitting elements.In the embodiment 1, light source substrate can preferably use the metallic substrates substrate of the metal substrate plate with the back side that forms this substrate, but also can replace, and uses an insulation board or through the insulation board of lamination etc.
In the embodiment 1, with regard to the material that forms lampshade body and light guide section, as long as the material for having light transmission and high-termal conductivity can use pottery, synthetic resin or glass etc.In the example 1, the lampshade body is for roughly hemispherical or roughly spherical, guaranteeing aspect the high surface area preferably, but is not limited to this.
In the embodiment 1, the central portion thermal of so-called light guide section and lampshade body, but refer to described both connect into the state of heat conduction, for example can enumerate the form that light guide section and lampshade body are configured as one, and light guide section and the lampshade body form of connecting airtight.In the situation that is a rear form, be difficult for residual air in order to make between light guide section and the lampshade body, but also between inserts bonding agent or heat transfer layer.As employed bonding agent, the preferably bonding agent with good thermal conductivity as the silicone-based bonding agent in this formation.And, as the material that forms heat transfer layer, can enumerate silicone resin or grease (grease) etc.
Similarly, in the embodiment 1, the outstanding leading section of so-called light guide section and light source substrate thermal, but refer to described both connect into the state of heat conduction, for example can enumerate the form that outstanding leading section and light source substrate connect airtight.In this case, be difficult for residual air in order to make between outstanding leading section and the light source substrate, but also between inserts bonding agent or heat transfer layer.As employed bonding agent, the preferably bonding agent with good thermal conductivity as the silicone-based bonding agent in this formation.And, as the material that forms heat transfer layer, can enumerate silicone resin or grease etc.
In the embodiment 1, the lampshade of light transmission comprises the material of high-termal conductivity, and this lampshade comprises the light guide section with the light source substrate thermal, and this light guide section is combined with the lampshade calor innatus.Therefore, the heat that the semiconductor light-emitting elements of light source sends under the state of lighting a lamp of bulb can be passed to the lampshade body from light source substrate via light guide section, and emits to atmosphere from the surface of this lampshade body.In addition, the light resource installing section transmission that the heat that the semiconductor light-emitting elements of light source sends under the state of lighting a lamp of bulb can be from light source substrate to body, and emit to atmosphere from the surface of body.
The bulb of the embodiment 1 that can be as described dispels the heat from the both sides of body and lampshade like that, because of large to its outside area of dissipation, even if so in the situation of using the large semiconductor light-emitting elements of caloric value, even if in the small-sized situation of being shaped as of bulb, can expect that also the temperature that fully suppresses semiconductor light-emitting elements rises.
The bulb of embodiment 2 such as enforcement mode 1 is characterized in that described lampshade body and described light guide section form as one.
With regard to embodiment 2, in embodiment 1, (thermal resistance) is less for thermal resistance between lampshade body and the light guide section, and thermal capacitance is easily moved to the lampshade body from light guide section, thereby emits performance can improving from the surface of lampshade body to atmosphere.
The bulb of embodiment 3 such as enforcement mode 1 is characterized in that: described light guide section and described lampshade body are not integrated.
With regard to this embodiment 3, in embodiment 1, and then lampshade body and light guide section are formed severally, thereby can expect following advantage.For example make the position of bearing lens function or bear to the position of light guide section light diffusion function on every side and be formed on light guide section, in the situation to the additional desired function of light guide section, the formation that is integrated than light guide section and lampshade body, behind shaping lampshade body and light guide section, there is no the position that becomes undercutting (under cut), thereby formability is good.
The bulb of embodiment 4 such as the enforcement mode 1 arbitrary embodiment to the embodiment 3 is characterized in that: at the base end part of the described light guide section of being combined with described lampshade calor innatus, the lens section that the light that sees through described light guide section is controlled is being set.
With regard to this embodiment 4, at embodiment 1 to embodiment 3, by the lens section of the light that illuminating part is sent to the light guide section of lampshade body guiding, assemble or diffusion to the light that utilizes the direction outgoing of light and make from the central portion of lampshade body, thereby can form the luminous intensity distribution of regulation.
The bulb of embodiment 5 such as enforcement mode 1 is characterized in that to arbitrary embodiment of embodiment 4: described lampshade body and described light guide section are the pottery system.
With regard to this embodiment 5, to arbitrary embodiment of embodiment 4, the thermal conductivity of lampshade is higher at embodiment 1, thereby by the heat radiation from the surface of this lampshade to atmosphere, the temperature that can fully suppress semiconductor light-emitting elements rises.
[example 1]
Below, with reference to Fig. 1 the bulb of example 1 is elaborated.
Bulb 1 comprises metal body 2, light source 7, lampshade 11, insulating component 21, lamp circuit 25, reaches lamp holder 31.
Body 2 comprises the integrally formed product of aluminium for example or its alloy.This body 2 comprises perisporium 3 and light resource installing section 4.Perisporium 3 becomes cylindric, and its outer peripheral face is used as radiating surface.Perisporium 3 is along with the undergauge gradually away from light resource installing section 4.In addition, the perisporium 3 of the perimembranous of formation body 2 also can have a plurality of radiating fins of giving prominence to foreign side in order to increase its area of dissipation.Light resource installing section 4 forms as one with mode and the perisporium 3 of direction of principal axis one end of sealing perisporium 3.The surperficial 4a of this light resource installing section 4 comprises tabular surface.Body 2 comprises the recess 5 that is formed with light resource installing section 4 encirclements by perisporium 3.Recess 5 is opened to the direction of principal axis other end of perisporium 3.
Light source 7 comprises light emitting module, and this light emitting module for example is installed in the central portion of the light source substrate 8 that becomes circular or rectangle with illuminating part 9 and forms.
Light source substrate 8 comprises printed wiring board etc., though this printed wiring board is not shown, but for example at a lamination insulating barrier of metal-made substrate plate, and form Wiring pattern at this insulating barrier, and have the insulating barrier that overlayed on except the regulation position of this Wiring pattern and the thin resist layer of the insulating properties on the Wiring pattern.The substrate plate that forms the back side of light source substrate 8 comprises aluminium or its alloy, iron or copper etc.Insulating barrier comprises synthetic resin or pottery etc.And, also can replace substrate plate and insulating barrier, and use the insulation board of a pottery system.
And then Wiring pattern for example comprises Copper Foil.This Wiring pattern comprises heat radiation (heat spreader) section integratedly, and this radiating part spreads all over the roughly whole zone of light source substrate 8 for the heat that makes LED9a described later and spreads.Radiating part arrives near the circumference of light source substrate 8, and is covered by resist layer.
Illuminating part 9 for example comprises the light emitting module of COB (chip on board, chip on board encapsulation) type.Namely, illuminating part 9 comprises a plurality of LED9a, framework 9b, containment member 9c and forms.
Each LED9a comprises bare chip, is electrically connected and is installed on the light source substrate 8 with Wiring pattern.For example use the LED9a that sends blue light among each LED9a.Framework 9b gluing is in light source substrate 8, and encirclement LED9a group.Containment member 9c has electrical insulating property and light transmission, landfill LED9a etc. and being filled in the framework 9b.
Sneak into fluorophor (not shown) among the containment member 9c.Use the yellow fluorophor that is radiated sodium yellow by optical excitation that LED9a sent in the fluorophor.Therefore, illuminating part 9 sends the white light that the blue light that sends from sodium yellow and the LED9a of fluorophor radiation mixes.In addition, can use the light emitting module of surface mount device (Surface Mounted Devices, SMD) type etc. in the illuminating part 9.
Light source 7 included illuminating parts 9 have LED9a, thereby this light source 7 is led light source, and comprise that the bulb 1 of this light source 7 is the LED bulb.LED9a's is luminous by the forward current semi-conductive p-n junction of flowing through is realized, so LED directly converts electrical energy into light.Utilize the semiconductor light-emitting elements of the luminous LED of this kind principle of luminosity etc., utilize energising and make that filament is scorching hot to be high temperature, thus the incandescent lamp bulb that radiates visible light with utilizing this heat emission compare, have the effect of saving energy.
The central portion zone that illuminating part 9 connects airtight the back side of its light source substrate 8 to be installed in light resource installing section 4 in the surperficial 4a of light resource installing section 4.
Lampshade 11 comprises lampshade body 12 and light guide section 13.
Lampshade body 12 is hollow and roughly hemispherical, is preferably the semi-spherical shape that the spheroid that is equivalent to hollow is made as 1/2 shape, and the diameter of the diameter of the end face that this is circular and light resource installing section 4 about equally.This lampshade body 12 is formed by the material with light transmission and high-termal conductivity, is for example formed by light transparent ceramic.Even if lampshade 11 is transparent also harmless, but be preferably the diffusion light transmission herein.And then lampshade 11 is for high-termal conductivity refers to, having the constituent material that is compared to common synthetic resin lampshade processed is the high thermal conductivity of thermal conductivity of acrylic resin or polycarbonate resin.
Light guide section 13 is by similarly having the material of light transmission and high-termal conductivity with lampshade body 12 and forming, for example by the light transparent ceramic identical with lampshade body 12 and form.Light guide section 13 arranges to the inside of lampshade body 12 is outstanding from the central portion of lampshade body 12.Light guide section 13 and lampshade body 12 be by the bonding agent that inserts the not shown good thermal conductivity between them for example silicone-based bonding agent and gluing, and utilize this gluing section with light guide section 13 and lampshade body 12 thermal.
Light guide section 13 is column solid and that periphery is circular, and the base end part 13a being connected with the central portion inner face of lampshade body 12 is forming the lens section 14 that the luminous intensity distribution of the light of outgoing by the central authorities of lampshade 11 is controlled.Lens section 14 is arranged on the central axis of light guide section 13 and with respect to base end part 13a depression, but its opening is in the central portion sealing of lampshade body 12.Therefore, comprise on the lens section 14 of recess and can not adhere to dust.
With base end part 13a be the end of the light guide section 13 of opposition side, namely, on outstanding leading section 13b, forming and be subjected to light recess 15.Be subjected to the size of light recess 15 for can accommodate illuminating part 9, this is subjected to the bottom surface of light recess 15 to become light entrance face.
And then light guide section 13 has narrow 13c at its direction of principal axis central portion.Utilize this narrow 13c, make in the outgoing around the light guide section 13 of the part of the light of light guide section 13 interior guidings.In addition, in the transparency of light guide section 13 situation lower than clear glass, even if there be not narrow 13c in the light guide section 13, also can utilize light guide section 13 the light diffusing energy and around it emergent light.
Such lampshade 11 is not limited at its light guide section 13 and has narrow 13c as described, because lampshade body 12 and light guide section 13 are shaped severally, so than the integrally formed formation of the light guide section 13 with narrow 13c and lampshade body 12, when using mould that lampshade body 12 is shaped with light guide section 13, narrow 13c can not become undercutting.Therefore, can easily be shaped lampshade body 12 and light guide section 13.
Lampshade 11 covers light resource installing section 4 and light source 7 and sets.Therefore, the perimembranous gluing of the opening edge of lampshade body 12 and light resource installing section 4 and being supported on the body 2.In addition, the outstanding leading section 13b of light guide section 13 accommodates illuminating part 9 in it is subjected to light recess 15, and, around illuminating part 9, with light source substrate 8 gluings, be supported on the body 2 via this light source substrate 8.These bear the preferred bonding agent that uses good thermal conductivity in the not shown bonding agent of gluing, for example use the silicone-based bonding agent.Utilize light source substrate 8 to make light guide section 13 and light source substrate 8 thermal with the gluing section of outstanding leading section 13b.In addition, larger in order to ensure the area of this thermal, comparatively ideal be outstanding leading section 13b overlap with the roughly integral body of the perimembranous 8a of light source substrate 8 and gluing in this perimembranous 8a.
Need not as described above just can lampshade 11 be supported on the body 2 with simple formation be used to making lampshade 11 be supported on the part of body 2.And then, except with the opening edge gluing of lampshade body 12 in body 2 and being supported, also with light guide section 13 gluings in light source substrate 8, so the support performance of lampshade 11 improves.For this reason, even if just in case in the gluing of the opening edge of lampshade body 12 and body 2, produce bad position, the support that does not also have a lampshade 11 that is caused by this bad position unsettled worry that becomes.
Insulating component 21 is configured as the cup shape, in order to make electric insulation between body 2 and the lamp circuit described later 25, and sets along the inner face of recess 5.
The lamp circuit 25 that each LED9a that light source 7 is had is luminous is installed in various circuit component 27 on the circuit substrate 26 and in addition blocking.This lamp circuit 25 is housed in the recess 5 of body 2 and the inboard of insulating component 21.Circuit substrate 26 is electrically connected with light source substrate 8 via the not shown insulation-coated electric wire that connects insulating component 21 and light resource installing section 4.
Lamp holder 31 to lamp circuit 25 supply powers comprises lamp holder body 32 and coupling member 33.Lamp holder body 32 releasably screws in the not shown electric lamp holder that supplies.Coupling member 33 is formed by the insulating material of synthetic resin etc., and is fixed on the lamp holder body 32.This coupling member 33 links with the open end of the recess 5 of body 2.At the inner face of lamp holder body 32, connecting the not shown insulation-coated electric wire that is electrically connected with lamp circuit 25.
The bulb 1 of described formation lamp circuit 25 is switched on, thereby each LED9a that the illuminating part 9 of light source 7 has is luminous under its lamp holder 31 and the not shown state that is connected for electric lamp holder.Thus, see through lampshade 11 and in illumination from the white light of illuminating part 9 outgoing.In this situation,, except the central portion of the avigation light cover body 12 by light guide section 13, also emitting around the light guide section 13 and arrive the inner face of lampshade body 12 from the light of illuminating part 9 outgoing, so lampshade body 12 integral body become bright.
Each LED9a sends heat under the state of lighting a lamp of described bulb 1, this heat is passed to light source substrate 8, and transmit to body 2 and the lampshade body 12 that comprises the translucent material system with high-termal conductivity lampshade 11 with light guide section 13 from this light source substrate 8 and respectively, and emit to atmosphere from the surface of these bodies 2 and the surface of lampshade 11.
Namely, the heat that each LED9a sends is 4 transmission from light source substrate 8 to light resource installing section, and emit to atmosphere from the perimembranous of body 2.
Thereupon, the light guide section 13 that has of lampshade 11 is by thermal is clipped between described light guide section 13 and the light resource installing section 4 this light source substrate 8 with light source substrate 8 gluings.Therefore, the heat that each LED9a sends is passed to light guide section 13 from light source substrate 8, and conducts to the central portion of lampshade body 12 via this light guide section 13.Thereupon, described heat is conducted to the whole zone of lampshade body 12, and emits to atmosphere from the surface of this lampshade body 12.
In described heat conduction, at the perimembranous 8a of light source substrate 8, the not shown radiating part of a part that comprises as described Wiring pattern is being set, connecting the outstanding leading section 13b of the light guide section 13 that surrounds illuminating part 9 at this perimembranous 8a.Therefore, can make pining for that each LED9a sends be passed to efficiently light guide section 13 to the heat of radiating part diffusion.
In addition, the also further thermal with light resource installing section 4 gluings of the opening edge of lampshade body 12.Therefore, 4 emit and the part of the heat wanting to transmit to the perimembranous of body 2 from light source 7 to light resource installing section, via lampshade body 12 with the gluing section of light resource installing section 4 to 12 conduction of lampshade body, and emit to atmosphere from the surface of lampshade body 12.
Can as above from the bulb 1 of body 2 with both sides' heat radiation of lampshade 11, can guarantee that the area of dissipation in the atmosphere is large according to the surface area of lampshade body 12.And lampshade body 12 guarantees that for roughly hemispherical its surface area is larger, thereupon, and the thermal diffusivity can further improve from the surface of lampshade body 12 to atmosphere.
Therefore, even if in the large situation of the caloric value of the LED9a that light source 7 has, even if in the small-sized situation of being shaped as of bulb 1, even if perhaps satisfying in described both sides' the situation, can expect that all the temperature that can fully suppress each LED9a rises.
[example 2]
Fig. 2 represents example 2.The formation of the following explanation of example 2 and example 1 are different, and formation in addition is identical with example 1, and therefore, for the formation that realizes the function identical or same with example 1, also the description thereof will be omitted to enclose the symbol identical with example 1.
The bulb 1 of this example 2 makes to the interior side-prominent light guide section 13 of lampshade body 12 integrally formed with the central portion of lampshade body 12, and make the lens section 14 of the base end part 13a that is formed on light guide section 13 open on the central portion surface of lampshade 11, different with example 1 with regard to this point, and other formations of the bulb 1 of example 2 are identical with example 1.
Therefore, in this example 2, solve described problem by the reason of explanation in the example 1, the bulb 1 that can provide a kind of temperature of expecting fully to suppress the LED9a that generates heat under the luminance to rise.
In addition, in the example 2, by light guide section 13 is cut apart at the position that utilizes this narrow 13c to become minimum footpath, and can and utilize bonding agent and these two members of the outstanding end side light conducting member of this base end part side light conducting member gluing by the base end part side light conducting member that is integrated with lampshade body 12, form light guide section 13.Like this, narrow 13c can not become undercut portions when shaping lampshade 11, thereby can improve the formability of lampshade.

Claims (5)

1. bulb is characterized in that comprising:
Metal body comprises light resource installing section;
Light source comprises the illuminating part with the semiconductor light-emitting elements that generates heat under the luminance and the light source substrate that described illuminating part is installed, and described light source substrate is contacted with described light resource installing section and is installed in described light resource installing section; And
Lampshade comprises: the lampshade body, and it comprises the material of light transmission and high-termal conductivity and covers described light source and described light resource installing section and setting; And light guide section, comprise the material of light transmission and high-termal conductivity and with the central portion thermal of described lampshade body to the inside of described lampshade body outstanding the setting, and outstanding leading section accommodate described illuminating part and with described light source substrate thermal.
2. bulb as claimed in claim 1 is characterized in that:
Described lampshade body and described light guide section form as one.
3. bulb as claimed in claim 1 is characterized in that:
Described light guide section and described lampshade body are not integrated.
4. bulb as claimed in claim 1 is characterized in that:
At the base end part of the described light guide section of being combined with described lampshade calor innatus, the lens section that the light that sees through described light guide section is controlled is being set.
5. bulb as claimed in claim 1 is characterized in that:
Described lampshade body and described light guide section are the pottery system.
CN 201220252017 2011-07-11 2012-05-30 Lamp bulb Expired - Fee Related CN202769315U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-153194 2011-07-11
JP2011153194A JP2013020813A (en) 2011-07-11 2011-07-11 Electric bulb

Publications (1)

Publication Number Publication Date
CN202769315U true CN202769315U (en) 2013-03-06

Family

ID=47692065

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201220252017 Expired - Fee Related CN202769315U (en) 2011-07-11 2012-05-30 Lamp bulb

Country Status (2)

Country Link
JP (1) JP2013020813A (en)
CN (1) CN202769315U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106062463A (en) * 2014-03-28 2016-10-26 株式会社东芝 Lighting apparatus

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6235283B2 (en) * 2013-09-24 2017-11-22 株式会社東芝 Lighting device
JP6290436B2 (en) * 2014-10-06 2018-03-07 株式会社東芝 Lighting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106062463A (en) * 2014-03-28 2016-10-26 株式会社东芝 Lighting apparatus
US10274185B2 (en) 2014-03-28 2019-04-30 Kabushiki Kaisha Toshiba Lighting device

Also Published As

Publication number Publication date
JP2013020813A (en) 2013-01-31

Similar Documents

Publication Publication Date Title
EP2228587B1 (en) Led bulb and lighting apparatus
EP2951485B1 (en) Illumination device and method of manufacturing an illumination device
US8604679B2 (en) LED light source lamp having drive circuit arranged in outer periphery of led light source
US8803409B1 (en) Lamp device, light-emitting device and luminaire
CN102829346A (en) LED lamp and method of making the same
KR20130111516A (en) Led light bulbs
WO2009012245A9 (en) Solid state light unit and heat sink
TW200806922A (en) High power LED lamp with heat dissipation enhancement
EP2671022A2 (en) Omni-directional channeling of liquids for passive convection in led bulbs
JP2008311237A (en) Lighting fixture
JP5802497B2 (en) Light bulb type lighting device
JP5690961B2 (en) Illumination light source and illumination device
JP2015076281A (en) Lighting device
CN202769315U (en) Lamp bulb
JP6320941B2 (en) LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE MANUFACTURING METHOD
JP3158243U (en) Light emitting diode heat dissipation module
CN105588025B (en) LED lighting device
JP2011181252A (en) Lighting fixture
CN208871359U (en) Illumination light source and lighting device
EP2856023B1 (en) Lighting device having a light source heat sink arranged separate from a driver
CN105849462B (en) Radiator and lighting apparatus
CN103765096A (en) Lighting lamp
JP2016129172A (en) Semiconductor light emitting element bulb and lighting system including the same
EP2759759B1 (en) Illumination light source and lighting apparatus
CN201209841Y (en) Lamp composite structure with heat radiation function

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130306

Termination date: 20150530

EXPY Termination of patent right or utility model