CN102682671B - LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen - Google Patents
LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen Download PDFInfo
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- CN102682671B CN102682671B CN201210148984.9A CN201210148984A CN102682671B CN 102682671 B CN102682671 B CN 102682671B CN 201210148984 A CN201210148984 A CN 201210148984A CN 102682671 B CN102682671 B CN 102682671B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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Abstract
The invention discloses an LED (light-emitting diode) dot matrix display screen and a combined dot matrix display screen. The dot matrix display screen comprises a heat-dissipating substrate, a PCB (printed circuit board), an uniformly-arrayed LED light-emitting unit, an imaging controller, a layout circuit conducting layer, a pervious-to-light packaging colloid for packaging LED chips, and a plastic plate forming the pervious-to-light packaging colloid for packaging the LED chips, wherein the LED light-emitting unit comprises more than one LED chips, guide lines and the pervious-to-light packaging colloid; the guide lines electrically connect the LED chips with the layout circuit conducting layer, and the pervious-to-light packaging colloid is used for packaging the LED chips; a hermetically-sealed outer cavity side wall which is hermetically connected with the plastic plate and the heat-dissipating substrate is arranged between the plastic plate and the heat-dissipating substrate; the heat-dissipating substrate, the hermetically sealed outer cavity side wall and the plastic plate defines a hermetically-sealed cavity, and the PCB is accommodated in the hermetically-sealed cavity; and the heat-dissipating substrate, the plastic plate and the pervious-to-light packaging colloid are directly contacted with the outside air. The dot matrix display screen disclosed by the invention has the advantages that of being simple in structure and low in cost and having good waterproof and heat-dissipating effects since the PCB is accommodated in the hermetically-sealed cavity formed by the heat-dissipating substrate, the hermetically sealed outer cavity side wall and the plastic plate.
Description
Technical field
The present invention relates to a kind of display screen, particularly relate to a kind of LED dot matrix display screen and combined type dot matrix display screen.
Background technology
LED light emitting diode has not leaded, mercury than conventional light source, without stroboscopic, plurality of advantages such as energy-conserving and environment-protective, long service life, fast response time, vibration resistance, easy care, brightness is high, energy consumption is low, few UV radiation and environmental pollution, safety in utilization height and being widely used in display screen imaging.
The light decay of LED light source is directly relevant with its junction temperature with its life-span.LED lamp, particularly high-power LED light source, when luminous, heat is concentrated, if the heat that LED chip produces distributes not in time, junction temperature is just very high, the life-span is just short.According to Jordi Arresse rule, 10 ℃ of the every reductions of temperature, the life-span will extend twice.Show according to the study, if junction temperature can be controlled at 65 ℃, the life-span of LED light source light decay to 70% just can be up to 100,000 hours.Because LED belongs to electroluminescence device, its heat can not distribute by radiation mode.In its photoelectric conversion process, only have 15 one 25% electric energy to convert luminous energy to, nearly all energy transform into heat energy of remaining electric energy, raises the temperature of LED light fixture.And for LED wafer integrated packaging light source, because wafer is more concentrated, luminous source region heat is high, be so just easy to cause the device temperatures such as LED chip too high.If can not distributing in time, a large amount of heats can cause series of problems: for example, can accelerate the device agings such as LED chip, reduction of service life, even can cause LED chip to burn; Make the wavelength generation red shift of blue-ray LED, and colourity to white light LEDs, colour temperature produces material impact, if wavelength shift is too much, departed from the absorption peak of fluorescent powder, will cause fluorescent powder quantum efficiency to reduce, affect light extraction efficiency; Temperature also has a significant impact the radiation characteristic of fluorescent powder, along with temperature rise, fluorescent powder quantum efficiency reduces, and radiation wavelength also can change, the change of fluorescent powder radiation wavelength also can cause the variation of white light LED color temperature, colourity, and higher temperature also can be accelerated the aging of fluorescent powder.Conventionally, the power of LED wafer integrated packaging light source is larger, and imaging effect is better; But meanwhile, heat dissipation problem is more difficult to resolve certainly.Heat dissipation problem has finally restricted the raising of LED wafer integrated packaging light source power.
Application number in my application is 201020262611.0, name is called in a kind of utility model patent of LED integrated morphology, discloses a kind of LED dot matrix display screen, comprises top cover, transparent panel and LED integrated morphology.LED integrated morphology, comprise heat-radiating substrate, LED chip, lens, the plastic parts of positioning lens or molded lens, the wire of electrical connection LED chip electrode and the Butut circuit conductive layer of electrical connecting wire, imaging controller, on the plastic parts of positioning lens or molded lens, be provided with one or more the first through hole, on the end face of the plastic parts of positioning lens or molded lens, extend and be provided with fixed leg, on heat-radiating substrate, be provided with the second through hole coordinating with fixed leg, fixed leg, through the second through hole of heat-radiating substrate, is provided with blocking part in the end of fixed leg; The plastic parts of positioning lens or molded lens is fixed by fixed leg and blocking part and heat-radiating substrate; LED chip is directly fixed on heat-radiating substrate by die bond technique, and is placed in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and LED chip of the first through hole, and wire is placed in the first through hole, and wire one end is electrically connected with the electrode of LED chip, and the other end of wire is electrically connected with the Butut circuit conductive layer between the first through hole and LED chip; The side that heat-radiating substrate deviates from LED chip directly contacts with heat radiation gas or radiator liquid.The Butut circuit conductive layer of each chip is electrically connected separately with imaging controller.Although this utility model heat-radiating substrate directly contacts with extraneous, the closed chamber of accommodating pcb board is installed together and is formed by top cover, transparent panel, heat-radiating substrate, complex structure, and cost is high.
In the utility model patent that is 201020620120.9 at application number, a kind of image system LED lamp source module is disclosed, comprise housing, corner connector, outlet piece, LED lamp base plate, optical scattering plate and the LED lamp of aluminium alloy, housing, outlet piece fit together by corner connector, LED lamp is installed on LED lamp base plate, LED lamp base plate is installed in housing, and optical scattering plate is installed on the position of corresponding LED lamp on shell.Outlet piece is provided with wire hole.LED lamp base plate is provided with radiating fin.Housing is provided with three mounting grooves.Mounting groove is respectively fixed installation groove, display board mounting groove and guidance panel mounting groove.Due to the Butut circuit conductive layer of display and the circuit of imaging controller very complicated, this utility model is installed on LED lamp on LED lamp base plate, is not provided with pcb board, and therefore circuit, difficult forming are set on base plate.Although this utility model LED lamp base plate directly contacts with extraneous, the closed chamber of sealing Butut circuit is installed together and is formed by housing, LED lamp base plate, due to needs housing, and complex structure, cost is high.
Application number is in 200720312314.0 utility model patent, a kind of combined type LED display screen is disclosed, comprise main body framework, LED light emitting module and the display driver circuit of plastic cement, the side of main body framework has the lattice-like plug-in opening matching with LED light emitting module, in each plug-in opening, be provided with positive electrode and the negative electrode of mutually insulated, positive electrode is connected with display driver circuit with negative electrode; LED light emitting module is made up of LED luminotron and plug-in mounting body, on plug-in mounting body, has contact electrode, and LED light emitting module is plugged in plug-in opening and contacts and be connected with negative electrode with positive electrode.Because main body framework adopts plastic parts, dispel the heat bad.The circuit of the open how sealing LED light emitting module of this utility model, can be used for LED light emitting module outdoor.
Application number is, in 200620074254.9 utility model patent, to disclose a kind of high density Full-function LED display screen module.This module is using the printed circuit board (PCB) of 2 one 6 layers as carrier, and the upper surface layer of printed circuit board (PCB) is provided with two-dimentional lattice point, and each lattice point is provided with pad, mounts or be welded with LED chips monochromatic or double-colored or three primary colours in lattice point; LED chip outside surface scribbles silica gel or the epoxide-resin glue with diffusant or UV glue, and it is surface protective glue, is also the luminous lens of LED; Printed circuit board (PCB) is provided with the very thin through hole in aperture, is filled with metallic copper or other Heat Conduction Material in through hole; The bottom surface layer of printed circuit board (PCB) is provided with to control and drives components and parts and web member.This display panel module directly mounts or is welded with LED chips monochromatic or double-colored or three primary colours in the lattice point of printed circuit board (PCB), in the very thin through hole in the aperture being provided with by printed circuit board (PCB), be filled with metallic copper or other Heat Conduction Material heat conduction, heat-conducting effect is poor, complex process.This utility model is the not open printed circuit board (PCB) that how to seal also.
Summary of the invention
First technical matters that the present invention will solve is, the LED dot matrix display screen of a kind of plastic plate that directly utilizes moulding packaging LED chips printing opacity packing colloid and the airtight pcb board of heat-radiating substrate, simple in structure, good heat dissipation effect, good water-proof effect is provided.
Second technical matters that the present invention will solve be, the combined type dot matrix display screen of a kind of plastic plate that directly utilizes moulding packaging LED chips printing opacity packing colloid and the airtight pcb board of heat-radiating substrate, simple in structure, good heat dissipation effect, good water-proof effect is provided.
A kind of LED dot matrix display screen, comprises LED luminescence unit, imaging controller, Butut circuit conductive layer, the packaging LED chips printing opacity packing colloid of cooling base, pcb board, uniform array, the plastic plate of moulding packaging LED chips printing opacity packing colloid; Butut circuit conductive layer is set directly on pcb board; LED luminescence unit comprises more than one LED chip, is electrically connected the wire of LED chip and Butut circuit conductive layer, is used for the printing opacity packing colloid of packaging LED chips; Each LED chip is electrically connected separately by Butut circuit conductive layer and imaging controller; On cooling base, uniform array has LED chip fixing lug boss, is all fixed with the LED chip of a LED luminescence unit in each LED chip fixing lug boss by die bond technique; Extend and be provided with fixed leg on the face of pcb board at plastic plate; On plastic plate, be provided with and LED chip fixing lug boss number and position the first through hole of corresponding, moulding printing opacity packing colloid one by one; On cooling base, be provided with the second through hole coordinating with fixed leg; On pcb board, be provided with the third through-hole coordinating with fixed leg and the fourth hole coordinating with LED chip fixing lug boss; Fixed leg, through third through-hole, the second through hole, is provided with blocking part in the end of fixed leg, and plastic plate, pcb board, cooling base are fixed together successively, and blocking part seals the second through hole; The LED chip fixing lug boss of cooling base stretches in the first through hole through fourth hole, and the end face of LED chip fixing lug boss deviates from the face of pcb board lower than plastic plate; Butut circuit conductive layer stretches between the first through hole and fixing lug boss, wire is placed in the first through hole, the electrode of wire one end and LED chip is electrically connected, and the Butut circuit conductive layer between the other end of wire and the first through hole and LED chip fixing lug boss is electrically connected; Between plastic plate and cooling base, be provided with the closed chamber lateral wall with plastic plate and cooling base sealing; Cooling base, closed chamber lateral wall, plastic plate form closed chamber, and pcb board is contained in closed chamber; Cooling base, plastic plate, printing opacity packing colloid directly directly contact with outside air; The power interface that also comprises fairing, data-interface, is electrically connected with external power source; On cooling base, be provided with the first accommodating cavity, be also provided with the cover plate of sealing the first accommodating cavity opening; Fairing, data-interface, the power interface being electrically connected with external power source are arranged in the first accommodating cavity; Fairing and Butut circuit conductive layer, imaging controller, external power source interface are electrically connected.
The first as scheme one is improved; plastic plate also comprises the first protective seam that is arranged on plastic plate outside surface; plastic plate directly contacts with extraneous by the first protective seam; printing opacity packing colloid also comprises the second protective seam that is arranged on printing opacity packing colloid outside surface, and printing opacity packing colloid directly contacts with extraneous by the second protective seam.
The second as scheme one improves, and convexes with the fixed mechanism that LED display is fixed on to desired location at the back side of LED display.
Improve as the third of scheme one, each LED luminescence unit comprises the LED chip of single primary colours or two dual base colors or three three primary colours or four three primary colours.
The first as scheme one to four is improved jointly, be equipped with a first heat radiation clear opening that runs through successively cooling base in the center of every four adjacent LED chip fixing lug boss, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with corresponding first clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat that dispels the heat; Plastic plate on the face of pcb board along the 3rd heat radiation clear opening periphery and/or on the face of pcb board, be provided with closed chamber madial wall along the periphery of the first heat radiation clear opening at cooling base, closed chamber madial wall is through the second heat radiation clear opening, cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form closed chamber, and pcb board is contained in closed chamber; A side that deviates from pcb board at cooling base is provided with radiating fin, and the first heat radiation clear opening runs through radiating fin, and adjacent radiating fin does not all connect; One end that the first heat radiation clear opening deviates from pcb board is all directly communicated with outside air by one end that the gap of radiating fin is communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board, and the gap of radiating fin, the first heat radiation clear opening being serially connected, the second heat radiation clear opening, the 3rd heat radiation clear opening form the gas heat dissipation channel of convection current.
The second as scheme one to four improves jointly, and a side that deviates from pcb board at cooling base is provided with radiating fin, and adjacent radiating fin does not all connect, form the side direction heat dissipation channel of convection current between radiating fin.
Jointly improve as the third of scheme one to four, also comprise and be arranged on the runner housing that cooling base deviates from pcb board one side, between runner housing and cooling base, be provided with flow path wall, runner housing, flow path wall, cooling base form coolant flow channel; The back side of LED chip fixing lug boss be cooled completely runner cover.
As the 4th kind of common improvement of scheme one to four, also comprise and be arranged on the runner housing that cooling base deviates from LED luminescence unit one side, heat radiation clear opening runs through runner housing; Be equipped with in the center of every four adjacent LED chip fixing lug boss one run through from bottom to top successively the of runner housing scatter hot clear opening, run through cooling base the first heat radiation clear opening, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with corresponding first clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat that dispels the heat; Plastic plate on the face of pcb board along the 3rd heat radiation clear opening periphery and/or on the face of pcb board, be provided with closed chamber madial wall along the periphery of the first heat radiation clear opening at cooling base, closed chamber madial wall is through the second heat radiation clear opening, cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form closed chamber, and pcb board is contained in closed chamber; Between runner housing and cooling base, be provided with the runner lateral wall with runner housing and cooling base liquid sealing, between runner housing and cooling base, along scatter the periphery of hot clear opening and/or along the periphery of the first heat radiation clear opening, be provided with runner madial wall, runner housing and heat-radiating substrate are fixed together, and cooling base, runner lateral wall, runner madial wall, runner housing have formed hermetic coolant flow channel; The scatters, and one end that one end is directly communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board that hot clear opening deviates from pcb board is all directly communicated with outside air, the dispel the heat gas heat dissipation channel of clear opening formation convection current of hot clear opening, the first heat radiation clear opening, the second heat radiation clear opening, the 3rd that scatters being serially connected.
As the improvement of such scheme, set runner madial wall between be provided with connecting wall, or set runner madial wall between, set runner lateral wall and runner madial wall between be provided with connecting wall, coolant flow channel is circulatory flow; On runner housing or cooling base, be also provided with the inlet and the liquid outlet that are communicated with coolant flow channel.
A kind of combined type dot matrix display screen, combined type dot matrix display screen is combined by two above dot matrix display screens.
The invention has the beneficial effects as follows:
1) end face of LED chip fixing lug boss deviates from the face of pcb board lower than the first through hole, and LED chip does not need lens after encapsulating by printing opacity packing colloid, simple in structure.Between plastic plate and cooling base, be provided with the lateral wall with plastic plate and cooling base sealing, blocking part seals the second through hole, pcb board is contained in the closed chamber of cooling base, lateral wall, plastic plate formation, avoid on the one hand that the unclean air such as the wetly and harmful chemical of external belt cause LED luminescence unit, wire and Butut circuit conductive layer to be subject to polluting, thermal resistance improves, cause fluorescent powder, silica gel Material degradation, improves the life-span of LED luminescence unit; On the other hand can be by outdoor LED display use, anti-sealings etc. enter in closed chamber, good water-proof effect; Simple in structure in addition, cost is low, and heat-radiating substrate directly contacts with extraneous, good heat dissipation effect.
2) owing to being provided with plastic plate, Butut circuit conductive layer can stretch in plastic plate, on the one hand wire can be directly and the electric connection of Butut circuit conductive layer, no longer need by conducting metal support, wire to be connected with Butut circuit conductive layer or pass with Butut circuit conductive layer and be connected from deviating from the cooling base of LED chip by wiring pin, the thermal resistance that simplifies the structure and cut down the number of intermediate links to greatest extent, good heat dissipation effect; No longer need on the other hand weld metal support or wiring pin and Butut circuit conductive layer to be electrically connected, do not need Reflow Soldering or wave-soldering, therefore packing colloid can be with resin or silica gel etc.; But also can guarantee that LED chip, electric connection wire and two welding end can not be exposed in air, are conducive to the long-life using.And while needing Reflow Soldering or wave-soldering, because the temperature of Reflow Soldering or wave-soldering is generally at 250 ℃ or 280 ℃, packing colloid just cannot use resin.Because the price of silica gel is far away higher than resin, light transmission is poorer than resin, and therefore the present invention can further save cost, improves the optical property of LED chip.The advantage of this COB package design is that the electrode of each LED chip passes through bonding lead directly and Butut circuit conductive layer forms Ohmic contact, the formation of LED multi-path chip array is to realize electrical interconnection by the electrical connection device of cooling base and LED chip, the connection in series-parallel of LED chip can be realized, reliability and the production qualification rate of product can be improved again.
3) on cooling base, be provided with and the integrated multiple chip fixed chip fixing lug boss of cooling base, the area of cooling base is greater than the area at chip fixing lug boss top greatly, and LED chip is directly fixed in chip fixing lug boss by die bond mode.Greatly reducing so on the one hand dissipation of heat that LED chip produces is airborne intermediate path distance and has greatly increased and the contact area of the gas that dispels the heat in heat radiation gas, greatly reduce heat built-up effect, can greatly improve radiating efficiency and make chip be held in suitable working temperature, thus the long-life of maintenance chip and effectively luminescence efficiency.Chip fixing lug boss and cooling base are one-body molded, and the heat that therefore chip produces only sees through cooling base and just directly distributes in air, therefore thermal resistance is little, radiating rate is fast, must not dispel the heat by other radiating piece, and radiating effect is just fairly good.The shade of keeping out that makes to be electrically connected light that wire sends LED chip drops to minimumly, is beneficial to optical secondary optimization owing to there being chip fixing lug boss! Save existing LED support, namely save the heat radiating metal part in LED support, and the multilayer intermediate link such as electrode metal pin, especially reduced the high thermal resistance producing between two parts of heat radiating metal part and cooling base, therefore thermal resistance is little, and the fast good heat dissipation effect of heat conduction is simple and reliable for structure, especially one-body molded design and the assembly technology that is more conducive to light source of chip fixing lug boss and cooling base, saves again cost.Therefore the present invention is simple and reliable for structure, and part is few, and thin thickness is easy to assembling, is specially adapted to the powerful occasion of light source requirements.
4) the first protective seam and the second protective seam generally complete after packaging LED chips at printing opacity packing colloid, at plastic plate and printing opacity packing colloid spraying protective layer, reach better waterproof effect and protection effect once.
5) owing to being equipped with a heat radiation clear opening in every four adjacent LED luminescence unit centers, each LED luminescence unit is all adjacent with heat radiation clear opening, reduced LED luminescence unit dense arrangement produces very high junction temperature together on the one hand, the heat that each LED luminescence unit produces on the other hand can directly distribute by the heat radiation clear opening being adjacent, make as far as possible the heat dissipation path of each LED luminescence unit the shortest, the heat dissipation path of each LED luminescence unit equates or is roughly equal, the radiating effect that guarantees each LED luminescence unit is fine, further reduce LED luminescence unit and produced very high junction temperature.Heat radiation clear opening runs through cooling base, and the two ends of heat radiation clear opening are all communicated with the gas heat dissipation channel that forms convection current with outside air, so be very beneficial for cross-ventilation.The heat that LED light source produces in the course of the work conducts on pedestal, and pedestal becomes hot conductor and carrier.The hot-air that can dispel the heat in clear opening with heat radiation clear opening with the pedestal of amount of heat is discharged, extraneous cold air can constantly supplement and enter in heat radiation clear opening, form the gas of continuous flow from the hole wall continuous absorption heat of heat radiation clear opening, make pedestal cooling, so circulation, thereby take away fast the heat in pedestal, therefore in pedestal, can not hoard amount of heat and to affect serviceable life, the radiating efficiency of LED light source high.The processing of heat radiation clear opening is very convenient, quick, saves human and material resources, financial resources, can significantly reduce heat abstractor and even have the cost of the LED dot matrix display screen of this heat abstractor.In the time that LED dot matrix display screen is fixed on the wall, a side that deviates from pcb board at runner housing convexes with the fixed mechanism that LED display is fixed on to desired location, thereby guarantees that heat-radiating substrate directly contacts with outside air.
6) be provided with radiating fin and heat radiation boss, increase area of dissipation, improve radiating effect.Between radiating fin, form the side direction heat dissipation channel of convection current, also the heat on the heat on the substrate in cooling base centre position and radiating fin can be distributed by the gap of radiating fin, improve radiating effect.Particularly, in the time that display screen is fixed on the wall, distribute along vertical cooling base direction because wall has blocked heat, therefore the side direction heat dissipation channel of convection current is essential.
7) coolant flow channel is set, can further improve radiating effect.General filling chilled water in coolant flow channel, because specific heat of water is high, can pass through again heat loss through convection, can make the heat of LED light source be dispersed into rapidly in water, be heated the water that water that temperature is higher can be lower with the temperature of the heat radiation terminal of ingress of air and form convection current, the heat radiation terminal that heat is switched to the ingress of air that temperature is lower is dispersed into rapidly in air by heat radiation terminal, and rapid heat dissipation, can effectively reduce junction temperature.Also have because the maximum temperature of water is 100 ℃, can avoid the junction temperature at LED light source place considerably beyond 100 ℃, for larger outdoor lattice LED display of Temperature Difference Ratio etc., can reduce the suddenly cold and hot of LED dot matrix display screen, improve the working temperature environment of LED dot matrix display screen.
8) by be provided with connecting wall between some runner madial wall, between some runner madial wall, do not establish connecting wall, make coolant flow channel form circulatory flow, by inlet, the cooling liquid of outside is input in coolant flow channel, by liquid outlet, the liquid output in coolant flow channel is gone, the quick convective motion of being convenient to heat eliminating medium, radiating effect is better.By being provided with connecting wall between the runner lateral wall setting between runner madial wall, set and runner madial wall, make the first circulating cooling runner Perfect Ring stream madial wall without dead angle, do not have the heat-sink unit not covered by cold coolant flow channel, radiating effect is better, more even.
Accompanying drawing explanation
Fig. 1 is the schematic perspective view of the embodiment of the present invention 1
Fig. 2 is the cross-sectional schematic along the A-A of Fig. 1.
Fig. 3 is the perspective exploded view of the embodiment of the present invention 1.
Fig. 4 is the perspective exploded view of the embodiment of the present invention 1 from another direction projection.
Fig. 5 is the perspective exploded view of the embodiment of the present invention 2.
Fig. 6 is the perspective exploded view of the embodiment of the present invention 2 from another direction projection.
Fig. 7 is that the master of the embodiment of the present invention 2 looks schematic diagram
Fig. 8 is the cross-sectional schematic along the B-B of Fig. 7.
Fig. 9 is the perspective exploded view of the embodiment of the present invention 3.
Figure 10 is the perspective exploded view of the embodiment of the present invention 4.
Figure 11 is the I portion enlarged diagram of Figure 10.
Figure 12 is the perspective exploded view of the embodiment of the present invention 5.
Figure 13 is the II portion enlarged diagram of Figure 12.
Figure 14 is the perspective exploded view of the embodiment of the present invention 6.
Figure 15 is the III portion enlarged diagram of Figure 14.
Figure 16 is the schematic perspective view of the embodiment of the present invention 7.
Figure 17 is the schematic perspective view of the embodiment of the present invention 8.
Figure 18 is the perspective exploded view of the embodiment of the present invention 8.
Embodiment
As shown in Figures 1 to 4, a kind of LED dot matrix display screen, comprises LED luminescence unit, imaging controller, the Butut circuit conductive layer (not shown) of single primary colours of plastic plate 4, the uniform array of printing opacity packing colloid 3, the moulding packaging LED chips printing opacity packing colloid 3 of cooling base 1, pcb board 2, packaging LED chips; Butut circuit conductive layer is set directly on pcb board 2, and imaging controller is set directly at the pcb board back of the body 2 on the face of Butut circuit conductive layer.
LED luminescence unit comprises the LED chip 5 of single primary colours, is electrically connected the gold thread 6 of LED chip 5 and Butut circuit conductive layer, is used for the printing opacity packing colloid 3 of packaging LED chips 5; Each LED chip 5 is electrically connected separately by Butut circuit conductive layer and imaging controller.
On cooling base 1, uniform array has LED chip fixing lug boss 7, in each LED chip fixing lug boss 7, is all fixed with a LED chip 5 by die bond technique.Extend and be provided with fixed leg 8 on the face of pcb board 2 at plastic plate 4.On plastic plate 4, be provided with LED chip fixing lug boss 7 numbers and position one by one the first through hole 9, the first through holes 9 corresponding, moulding printing opacity packing colloid 3 be up big and down small bellmouth.On cooling base 1, be provided with the second through hole 10 coordinating with fixed leg 8.On pcb board 2, be provided with the third through-hole 11 coordinating with fixed leg 8 and the fourth hole 12 coordinating with LED chip fixing lug boss 7.Extend and be provided with closed chamber lateral wall 13 on the face of heat-radiating substrate 1 at plastic plate 4, cooling base 1, closed chamber lateral wall 13, plastic plate 4 form closed chamber 24, and pcb board 2 is contained in closed chamber 24.Fixed leg 8, through third through-hole 11, the second through hole 10 and in formation blocking part, the end of fixed leg 8 14, is fixed together plastic plate 4, pcb board 2, cooling base 1 successively, and blocking part 14 seals the second through hole 10.The LED chip fixing lug boss 7 of cooling base 1 stretches in the first through hole 9 through fourth hole 12, and the end face of LED chip fixing lug boss 7 deviates from the face of pcb board 2 lower than plastic plate 4.Butut circuit conductive layer (not shown) stretches between the first through hole 9 and chip fixing lug boss, gold thread 6 is placed in the first through hole 9, the electrode of gold thread 6 one end and LED chip 5 is electrically connected, and the Butut circuit conductive layer (not shown) between the other end of gold thread 6 and the first through hole 9 and LED chip fixing lug boss 7 is electrically connected.Deviate from cooling base 1 on the face of pcb board 2 and extend and be provided with flow path wall, also comprise and be arranged on the flow passage cover plate 15 that cooling base 1 deviates from pcb board 2 one sides, deviate from cooling base 1 on the face of pcb board 2 and extend and be provided with runner lateral wall 16, erection column 18, deviate from plastic plate 4 on the face of pcb board 2 and extend and be provided with accommodating cavity sidewall 17, flow passage cover plate 15, runner lateral wall 16, cooling base 1 form coolant flow channel 19, and flow passage cover plate 15, accommodating cavity sidewall 17 and cooling base 1 form relative airtight accommodating cavity 20.In accommodating cavity 20, be provided with electric control gear 21 and data-interface 22.The back side of LED chip fixing lug boss 7 runner 17 that is cooled completely covers.On erection column 18, being provided with installation ladder hole 23. cooling bases 1, plastic plate 4, printing opacity packing colloid 3, the flow passage cover plate 15 that run through on cooling base directly contacts with outside air.
As shown in Fig. 5 to Fig. 8, a kind of LED dot matrix display screen, as different from Example 1, be equipped with a 3rd heat radiation clear opening 52 that runs through plastic plate 51 in every four adjacent chip fixing lug boss 50 centers, run through pcb board 53 the second heat radiation clear opening 54, run through cooling base 55 the first heat radiation clear opening 56, run through the of the flow passage cover plate 57 hot clear opening 58 that scatters, each chip fixing lug boss 50 and first clear opening 56 that dispels the heat is adjacent.Imaging controller is set directly on the face that pcb board 2 deviates from Butut circuit conductive layer.The LED luminescence unit of uniform array is dual base color.
Extend and be provided with closed chamber lateral wall 59 on the face of pcb board 53 at cooling base 55, extend and be provided with closed chamber lateral wall 60 on the face of pcb board 53 at plastic plate 51.Closed chamber lateral wall 59 stretches in closed chamber lateral wall 60, the medial surface laminating of the lateral surface of closed chamber lateral wall 59 and closed chamber lateral wall 60.On the face of pcb board 53, be provided with closed chamber madial wall 61 along the periphery of the 3rd heat radiation clear opening 52 at plastic plate 51, on the face of pcb board 53, be provided with closed chamber madial wall 62 along the periphery of the first heat radiation clear opening 56 at cooling base 55, closed chamber madial wall 62 is through the second heat radiation clear opening 54.Closed chamber madial wall 61 stretches in closed chamber madial wall 62, the medial surface laminating of the lateral surface of closed chamber madial wall 61 and closed chamber madial wall 62.Cooling base 55, closed chamber lateral wall 59, closed chamber lateral wall 60, closed chamber madial wall 61, closed chamber madial wall 62, plastic plate 51 form closed chamber 63, and pcb board 53 is contained in closed chamber 63.
Deviate from cooling base 55 on the face of pcb board 53 and extend the runner lateral wall 64 that surrounds the first heat radiation clear opening 56, deviate from the face of pcb board 53 at cooling base 55, extend and be provided with runner madial wall 65 along the periphery of the first heat radiation clear opening 56.Cooling base 55, runner lateral wall 64, runner madial wall 65, flow passage cover plate 57 form coolant flow channel 67.
One end that the 3rd heat radiation clear opening 52 deviates from pcb board 53 is directly communicated with outside air, and the sideshake of the scatters one end that hot clear opening 58 deviates from pcb board 53 passes through fixed leg 68 is directly communicated with outside air.The the scatter hot clear opening 58, the first heat radiation clear opening 56, the second heat radiation clear opening 54, the 3rd heat radiation clear opening 52 being serially connected forms the gas heat dissipation channel of convection current.
As shown in Figure 9, as different from Example 2, a side that deviates from pcb board 81 at cooling base 80 is provided with horizontal radiating fin 82 and vertical radiating fin 83.82 of radiating fins are parallel to each other, and 83 of radiating fins are parallel to each other.The gap of radiating fin 82, radiating fin 83, the first heat radiation clear opening 84, the second heat radiation clear opening 86, the 3rd heat radiation clear opening 85 being serially connected form the gas heat dissipation channel of convection current.The first heat radiation clear opening 84 runs through radiating fin 82, radiating fin 83, and adjacent radiating fin does not all connect.One end that the first heat radiation clear opening 84 deviates from pcb board 81 is all directly communicated with outside air by one end that the gap of radiating fin 82, radiating fin 83 is communicated with outside air, the 3rd heat radiation clear opening 85 deviates from pcb board 81.The present embodiment does not arrange coolant flow channel, mainly dispels the heat by radiating fin.The LED luminescence unit of uniform array is three primary colours.
As shown in Figure 10, Figure 11, as different from Example 2, each LED luminescence unit comprises LED chip 100, the LED chip 101 of two two primary colours, in each chip fixing lug boss 102, is fixed with LED chip 100, the LED chip 101 of two different colours.
As shown in Figure 12 and Figure 13, as different from Example 2, each LED luminescence unit comprises LED chip 110, LED chip 111, the LED chip 112 of three three primary colours, in each chip fixing lug boss 113, is fixed with the LED chip of three different colours.
Embodiment 6
As shown in Figure 14, Figure 15, as different from Example 2, each LED luminescence unit comprises LED chip 120, LED chip 121, LED chip 122, the LED chip 123 of four three primary colours, wherein the color of LED chip 120, LED chip 121 is identical, in each chip fixing lug boss 124, is fixed with LED chip 120, LED chip 121, LED chip 122, the LED chip 123 of four, three kinds different colours.
As shown in figure 16, a kind of combined type dot matrix display screen, is fixed together and is combined by four dot matrix display screens 140, dot matrix display screen 141, dot matrix display screen 142, dot matrix display screen 143.Dot matrix display screen 140, dot matrix display screen 141, dot matrix display screen 142, dot matrix display screen 143 are as different from Example 3, only be provided with fixed leg 144 at an angle position of dot matrix display screen, on the face fitting at dot matrix display screen, be provided with the fixed part (not shown) that two adjacent dot matrix display screens are fixed together.
As shown in Figure 17,18, as different from Example 3,150 of the horizontal runner madial walls of arranging at a side outermost one are connected with horizontal connecting wall 151, and at interval, 152 of vertically disposed runner madial walls are provided with the first vertical connecting wall 153; Between the runner madial wall 154 separating at the vertically disposed runner madial wall 152 that is connected the first vertical connecting wall 153, be not connected with horizontal connecting wall 151, be provided with the second vertical connecting wall 156 between runner madial wall 154 and runner lateral wall 155; Runner madial wall 152, the first vertical connecting wall 153, runner madial wall 150, horizontal connecting wall 151, runner madial wall 154, runner lateral wall 155, the second vertical connecting wall 156 form circulation passage 157, and the coolant flow channel that is provided with circulation passage is that Perfect Ring streams the circulatory flow of madial wall without dead angle; On cooling base 158, be also provided with inlet 159 and liquid outlet 160, inlet 159 is connected with water receiver 162 by water pipe 161 with liquid outlet 160.
Claims (10)
1. a LED dot matrix display screen, comprises LED luminescence unit, imaging controller, Butut circuit conductive layer, the packaging LED chips printing opacity packing colloid of cooling base, pcb board, uniform array, the plastic plate of moulding packaging LED chips printing opacity packing colloid; Butut circuit conductive layer is set directly on pcb board; Described LED luminescence unit comprises more than one LED chip, is electrically connected the wire of LED chip and Butut circuit conductive layer, is used for the printing opacity packing colloid of packaging LED chips; Each LED chip is electrically connected separately by Butut circuit conductive layer and imaging controller; On cooling base, uniform array has LED chip fixing lug boss, is all fixed with the LED chip of the LED luminescence unit described in each LED chip fixing lug boss by die bond technique; Extend and be provided with fixed leg on the face of pcb board at plastic plate; On plastic plate, be provided with and LED chip fixing lug boss number and position the first through hole of corresponding, moulding printing opacity packing colloid one by one; On cooling base, be provided with the second through hole coordinating with fixed leg; On pcb board, be provided with the third through-hole coordinating with fixed leg and the fourth hole coordinating with LED chip fixing lug boss; Fixed leg, through third through-hole, the second through hole, is provided with blocking part in the end of fixed leg, and plastic plate, pcb board, cooling base are fixed together successively, and blocking part seals the second through hole; The LED chip fixing lug boss of cooling base stretches in the first through hole through fourth hole, and the end face of LED chip fixing lug boss deviates from the face of pcb board lower than plastic plate; Butut circuit conductive layer stretches between the first through hole and fixing lug boss, wire is placed in the first through hole, the electrode of wire one end and LED chip is electrically connected, and the Butut circuit conductive layer between the other end of wire and the first through hole and LED chip fixing lug boss is electrically connected; It is characterized in that: between plastic plate and cooling base, be provided with the closed chamber lateral wall with plastic plate and cooling base sealing; Cooling base, closed chamber lateral wall, plastic plate form closed chamber, and pcb board is contained in closed chamber; Cooling base, plastic plate, printing opacity packing colloid directly directly contact with outside air; The power interface that also comprises fairing, data-interface, is electrically connected with external power source; On cooling base, be provided with the first accommodating cavity, be also provided with the cover plate of sealing the first accommodating cavity opening; Fairing, data-interface, the power interface being electrically connected with external power source are arranged in the first accommodating cavity; Fairing and Butut circuit conductive layer, imaging controller, external power source interface are electrically connected.
2. a kind of LED dot matrix display screen as claimed in claim 1; it is characterized in that: plastic plate also comprises the first protective seam that is arranged on plastic plate outside surface; plastic plate directly contacts with extraneous by the first protective seam; printing opacity packing colloid also comprises the second protective seam that is arranged on printing opacity packing colloid outside surface, and printing opacity packing colloid directly contacts with extraneous by the second protective seam.
3. a kind of LED dot matrix display screen as claimed in claim 1, is characterized in that: convex with the fixed mechanism that described LED display is fixed on to desired location at the back side of described LED display.
4. a kind of LED dot matrix display screen as claimed in claim 1, is characterized in that: each LED luminescence unit comprises the LED chip of single primary colours or two dual base colors or three three primary colours or four three primary colours.
5. a kind of LED dot matrix display screen as described in claim 1 to 4 any one, it is characterized in that: be equipped with a first heat radiation clear opening that runs through successively cooling base in the center of every four adjacent LED chip fixing lug boss, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with described corresponding the first heat radiation clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat; Plastic plate on the face of pcb board along the 3rd heat radiation clear opening periphery and/or on the face of pcb board, be provided with closed chamber madial wall along the periphery of the first heat radiation clear opening at cooling base, closed chamber madial wall is through the second heat radiation clear opening, cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form described closed chamber, and pcb board is contained in described closed chamber; A side that deviates from pcb board at cooling base is provided with radiating fin, and the first heat radiation clear opening runs through radiating fin, and adjacent radiating fin does not all connect; One end that the first heat radiation clear opening deviates from pcb board is all directly communicated with outside air by one end that the gap of radiating fin is communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board, and the gap of radiating fin, the first heat radiation clear opening being serially connected, the second heat radiation clear opening, the 3rd heat radiation clear opening form the gas heat dissipation channel of convection current.
6. a kind of LED dot matrix display screen as described in claim 1 to 4 any one, is characterized in that: a side that deviates from pcb board at cooling base is provided with radiating fin, and adjacent radiating fin does not all connect, form the side direction heat dissipation channel of convection current between radiating fin.
7. a kind of LED dot matrix display screen as described in claim 1 to 4 any one, it is characterized in that: also comprise and be arranged on the runner housing that cooling base deviates from pcb board one side, between runner housing and cooling base, be provided with flow path wall, runner housing, flow path wall, cooling base form coolant flow channel; The back side of LED chip fixing lug boss be cooled completely runner cover.
8. a kind of LED dot matrix display screen as described in claim 1 to 4 any one, is characterized in that: also comprise and be arranged on the runner housing that cooling base deviates from LED luminescence unit one side, heat radiation clear opening runs through runner housing; Be equipped with in the center of every four adjacent LED chip fixing lug boss one run through from bottom to top successively the of runner housing scatter hot clear opening, run through cooling base the first heat radiation clear opening, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with described corresponding the first heat radiation clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat; Plastic plate on the face of pcb board along the 3rd heat radiation clear opening periphery and/or on the face of pcb board, be provided with closed chamber madial wall along the periphery of the first heat radiation clear opening at cooling base, closed chamber madial wall is through the second heat radiation clear opening, cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form described closed chamber, and pcb board is contained in described closed chamber; Between runner housing and cooling base, be provided with the runner lateral wall with runner housing and cooling base liquid sealing, between runner housing and cooling base, along scatter the periphery of hot clear opening and/or along the periphery of the first heat radiation clear opening, be provided with runner madial wall, runner housing and heat-radiating substrate are fixed together, and cooling base, runner lateral wall, runner madial wall, runner housing have formed hermetic coolant flow channel; The scatters, and one end that one end is directly communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board that hot clear opening deviates from pcb board is all directly communicated with outside air, the dispel the heat gas heat dissipation channel of clear opening formation convection current of hot clear opening, the first heat radiation clear opening, the second heat radiation clear opening, the 3rd that scatters being serially connected.
9. a kind of LED dot matrix display screen as claimed in claim 8, it is characterized in that: between the runner madial wall of setting, be provided with connecting wall, or set runner madial wall between, set runner lateral wall and runner madial wall between be provided with connecting wall, coolant flow channel is circulatory flow; On runner housing or cooling base, be also provided with the inlet and the liquid outlet that are communicated with coolant flow channel.
10. a combined type dot matrix display screen that comprises the LED dot matrix display screen as described in claim 1 to 4 any one, is characterized in that: combined type dot matrix display screen is combined by two above described dot matrix display screens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210148984.9A CN102682671B (en) | 2011-09-30 | 2012-05-14 | LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110303046.7 | 2011-09-30 | ||
| CN201110303046 | 2011-09-30 | ||
| CN201210148984.9A CN102682671B (en) | 2011-09-30 | 2012-05-14 | LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen |
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| Publication Number | Publication Date |
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| CN102682671A CN102682671A (en) | 2012-09-19 |
| CN102682671B true CN102682671B (en) | 2014-05-14 |
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| CN201210148984.9A Expired - Fee Related CN102682671B (en) | 2011-09-30 | 2012-05-14 | LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen |
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| WO (1) | WO2013044601A1 (en) |
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| US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
| CN103077663A (en) * | 2013-01-05 | 2013-05-01 | 王知康 | High-brightness single-chip type LED (light emitting diode) display chip suitable for all weathers |
| CN103346152A (en) * | 2013-06-24 | 2013-10-09 | 江西量一光电科技有限公司 | Adjustable 380-780nm wavelength COB packing technique |
| US9582237B2 (en) | 2013-12-31 | 2017-02-28 | Ultravision Technologies, Llc | Modular display panels with different pitches |
| US9195281B2 (en) | 2013-12-31 | 2015-11-24 | Ultravision Technologies, Llc | System and method for a modular multi-panel display |
| US9311847B2 (en) | 2014-07-16 | 2016-04-12 | Ultravision Technologies, Llc | Display system having monitoring circuit and methods thereof |
| CN105894975B (en) * | 2016-04-27 | 2018-05-15 | 宗达光电科技(上海)有限公司 | The bright LED display of water and its display methods |
| CN110120192A (en) * | 2019-06-11 | 2019-08-13 | 沈德稳 | A kind of Multifunctional LED dot matrix display screen |
| CN113437107A (en) * | 2021-05-27 | 2021-09-24 | 北京环宇蓝博科技有限公司 | Heat conduction average heat layer structure and display screen based on COB |
| CN114126355B (en) * | 2021-11-02 | 2023-02-28 | 武汉华星光电半导体显示技术有限公司 | Folding display device |
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| CN102682671A (en) | 2012-09-19 |
| WO2013044601A1 (en) | 2013-04-04 |
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