CN102682671A - LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen - Google Patents
LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen Download PDFInfo
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- CN102682671A CN102682671A CN2012101489849A CN201210148984A CN102682671A CN 102682671 A CN102682671 A CN 102682671A CN 2012101489849 A CN2012101489849 A CN 2012101489849A CN 201210148984 A CN201210148984 A CN 201210148984A CN 102682671 A CN102682671 A CN 102682671A
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- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention discloses an LED (light-emitting diode) dot matrix display screen and a combined dot matrix display screen. The dot matrix display screen comprises a heat-dissipating substrate, a PCB (printed circuit board), an uniformly-arrayed LED light-emitting unit, an imaging controller, a layout circuit conducting layer, a pervious-to-light packaging colloid for packaging LED chips, and a plastic plate forming the pervious-to-light packaging colloid for packaging the LED chips, wherein the LED light-emitting unit comprises more than one LED chips, guide lines and the pervious-to-light packaging colloid; the guide lines electrically connect the LED chips with the layout circuit conducting layer, and the pervious-to-light packaging colloid is used for packaging the LED chips; a hermetically-sealed outer cavity side wall which is hermetically connected with the plastic plate and the heat-dissipating substrate is arranged between the plastic plate and the heat-dissipating substrate; the heat-dissipating substrate, the hermetically sealed outer cavity side wall and the plastic plate defines a hermetically-sealed cavity, and the PCB is accommodated in the hermetically-sealed cavity; and the heat-dissipating substrate, the plastic plate and the pervious-to-light packaging colloid are directly contacted with the outside air. The dot matrix display screen disclosed by the invention has the advantages that of being simple in structure and low in cost and having good waterproof and heat-dissipating effects since the PCB is accommodated in the hermetically-sealed cavity formed by the heat-dissipating substrate, the hermetically sealed outer cavity side wall and the plastic plate.
Description
Technical field
The present invention relates to a kind of display screen, particularly relate to a kind of LED dot matrix display screen and combined type dot matrix display screen.
Background technology
The LED light emitting diode has not leaded, mercury than conventional light source; No stroboscopic, plurality of advantages such as energy-conserving and environment-protective, long service life, response speed are fast, vibration resistance, easy care, brightness is high, energy consumption is low, few UV radiation and environmental pollution, safety in utilization height and being widely used in the display screen imaging.
The light decay of led light source is directly relevant with its junction temperature with its life-span.LED lamp, particularly high-power LED light source, heat is concentrated when luminous, if untimely the distributing of heat that led chip produces, junction temperature is just very high, the life-span is just short.According to the Jordi Arresse rule, 10 ° of C of the every reduction of temperature, the life-span will prolong twice.Show that according to research if junction temperature can be controlled at 65 ° of C, the life-span of led light source light decay to 70% just can be up to 100,000 hours.Because LED belongs to electroluminescence device, its heat can not distribute through radiation mode.Have only 15 one 25% electric energy to convert luminous energy in its photoelectric conversion process, remaining electric energy nearly all converts heat energy to, and the temperature of LED light fixture is raise.And for the integrated packaged type light source of LED wafer, because wafer is more concentrated, luminous source region heat is high, so just is easy to cause device temperature such as led chip too high.If can not in time distributing, great amount of heat can cause a series of problems: for example, can quicken device agings such as led chip, and reduction of service life, even can cause led chip to burn; Make the wavelength generation red shift of blue-ray LED, and colourity, the colour temperature of white light LEDs produced material impact,, departed from the absorption peak of fluorescent powder, will cause the fluorescent powder quantum efficiency to reduce, influence light extraction efficiency if wavelength shift is too much; Temperature also has very big influence to the radiation characteristic of fluorescent powder; Along with temperature rises, the fluorescent powder quantum efficiency reduces, and radiation wavelength also can change; The change of fluorescent powder radiation wavelength also can cause the variation of white light LEDs colour temperature, colourity, and higher temperature also can be quickened the aging of fluorescent powder.Usually, the power of the integrated packaged type light source of LED wafer is big more, and imaging effect is good more; But meanwhile, heat dissipation problem is difficult to resolve more and determines.Heat dissipation problem has finally restricted the raising of the integrated packaged type light source power of LED wafer.
Application number in my application is 201020262611.0, name is called in a kind of utility model patent of LED integrated morphology, discloses a kind of LED dot matrix display screen, comprises top cover, transparent panel and LED integrated morphology.LED integrated morphology comprises heat-radiating substrate, led chip; Lens, the plastic parts of positioning lens or molded lens is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire; Imaging controller; On the plastic parts of positioning lens or molded lens, be provided with one or more first through hole, on the end face of the plastic parts of positioning lens or molded lens, extend and be provided with fixed leg, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg; Fixed leg passes second through hole of heat-radiating substrate, is provided with the blocking part in the end of fixed leg; The plastic parts of positioning lens or molded lens is fixed through fixed leg and blocking part and heat-radiating substrate; Led chip directly is fixed on the heat-radiating substrate through solid brilliant technology, and places in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and led chip of first through hole, and lead places in first through hole, and lead one end is connected with the electrode electricity of led chip, and the other end of lead and first through hole are electrically connected with Butut circuit conductive layer between the led chip; The side that heat-radiating substrate deviates from led chip directly contacts with heat radiation gas or radiator liquid.The Butut circuit conductive layer of each chip is electrically connected separately with imaging controller.Though this utility model heat-radiating substrate directly contacts with extraneous, the closed chamber of ccontaining pcb board is installed together by top cover, transparent panel, heat-radiating substrate and forms, complex structure, and cost is high.
In application number is 201020620120.9 utility model patent; A kind of image system LED lamp source module is disclosed; Comprise housing, corner connector, outlet piece, LED lamp base plate, optical scattering plate and the LED lamp of aluminium alloy, housing, outlet piece fit together through corner connector, and the LED lamp is installed on LED lamp base plate; LED lamp base plate is installed in the housing, and the optical scattering plate is installed on the position of corresponding LED lamp on the shell.The outlet piece is provided with wire hole.LED lamp base plate is provided with radiating fin.Housing is provided with three mounting grooves.Mounting groove is respectively fixed installation groove, display board mounting groove and guidance panel mounting groove.Because the Butut circuit conductive layer of display and the circuit of imaging controller are very complicated, this utility model is installed on the LED lamp on the LED lamp base plate, is not provided with pcb board, and therefore circuit, difficult forming are set on base plate.Though this utility model LED lamp base plate directly contacts with extraneous, the closed chamber of sealing Butut circuit is installed together and is formed by housing, LED lamp base plate, owing to need housing, complex structure, cost is high.
Application number is in 200720312314.0 the utility model patent; A kind of combined type LED display screen is disclosed; The main body framework, LED light emitting module and the display driver circuit that comprise plastic cement; The side of main body framework has the lattice-like plug-in opening that matches with the LED light emitting module, is provided with the positive electrode and the negative electrode of mutually insulated in each plug-in opening, and positive electrode is connected with display driver circuit with negative electrode; The LED light emitting module is made up of LED luminotron and plug-in mounting body, on the plug-in mounting body contact electrode is arranged, and the LED light emitting module is plugged in the plug-in opening and contacts with negative electrode with positive electrode and is connected.Because main body framework adopts plastic parts, it is bad to dispel the heat.This utility model does not have the circuit of open how sealing LED light emitting module, and it is outdoor that the LED light emitting module can be used for.
Application number is in 200620074254.9 the utility model patent, to disclose a kind of high density global function LED display module.As carrier, the upper surface layer of printed circuit board (PCB) is provided with two-dimentional lattice point to this module with 2 one 6 layers printed circuit board (PCB), and each lattice point is provided with pad, mounts or be welded with led chips monochromatic or double-colored or three primary colours in the lattice point; The led chip outside surface scribbles silica gel perhaps with the epoxide-resin glue or the UV glue of diffusant, and it is a surface protective glue, also is the luminous lens of LED; Printed circuit board (PCB) is provided with the very thin through hole in aperture, is filled with metallic copper or other Heat Conduction Material in the through hole; The bottom surface layer of printed circuit board (PCB) is equipped with controlling and driving components and parts and web member.This display panel module directly mounts or is welded with led chips monochromatic or double-colored or three primary colours in the lattice point of printed circuit board (PCB); Be filled with metallic copper or other Heat Conduction Material heat conduction in the very thin through hole in the aperture that is provided with through printed circuit board (PCB); Heat-conducting effect is poor, complex process.The also not open printed circuit board (PCB) that how to seal of this utility model.
Summary of the invention
First technical matters that the present invention will solve is, the LED dot matrix display screen of a kind of plastic plate that directly utilizes moulding packaging LED chips printing opacity packing colloid and the airtight pcb board of heat-radiating substrate, simple in structure, good heat dissipation effect, good water-proof effect is provided.
Second technical matters that the present invention will solve be, the combined type dot matrix display screen of a kind of plastic plate that directly utilizes moulding packaging LED chips printing opacity packing colloid and the airtight pcb board of heat-radiating substrate, simple in structure, good heat dissipation effect, good water-proof effect is provided.
A kind of LED dot matrix display screen comprises LED luminescence unit, imaging controller, Butut circuit conductive layer, the packaging LED chips printing opacity packing colloid of cooling base, pcb board, uniform array, the plastic plate of moulding packaging LED chips printing opacity packing colloid; Butut circuit conductive layer is set directly on the pcb board; The LED luminescence unit comprises more than one led chip, electrically connects the lead of led chip and Butut circuit conductive layer, is used for the printing opacity packing colloid of packaging LED chips; Each led chip all electrically connects separately through Butut circuit conductive layer and imaging controller; Uniform array has the led chip fixing lug boss on cooling base, on each led chip fixing lug boss, all is fixed with the led chip of a LED luminescence unit through solid brilliant technology; Extend on the face of pcb board at plastic plate and to be provided with fixed leg; On plastic plate, be provided with first through hole corresponding one by one with led chip fixing lug boss number and position, moulding printing opacity packing colloid; On cooling base, be provided with second through hole that cooperates with fixed leg; On pcb board, be provided with third through-hole that cooperates with fixed leg and the fourth hole that cooperates with the led chip fixing lug boss; Fixed leg passes third through-hole, second through hole is provided with the blocking part in the end of fixed leg, and plastic plate, pcb board, cooling base are fixed together successively, and fixed leg and/or blocking part seal second through hole; The led chip fixing lug boss of cooling base is passed fourth hole and is stretched in first through hole, and the end face of led chip fixing lug boss is lower than the face that plastic plate deviates from pcb board; Butut circuit conductive layer stretches between first through hole and the fixing lug boss; Lead places in first through hole; The electrode of lead one end and led chip electrically connects, and the Butut circuit conductive layer between the other end of lead and first through hole and the led chip fixing lug boss electrically connects; Between plastic plate and cooling base, be provided with closed chamber lateral wall with plastic plate and cooling base sealing; Cooling base, closed chamber lateral wall, plastic plate form closed chamber, and pcb board is contained in the closed chamber; Cooling base, plastic plate, printing opacity packing colloid directly directly contact with outside air.
First kind of improvement as scheme one; Plastic plate also comprises first protective seam that is arranged on the plastic plate outside surface; Plastic plate directly contacts with extraneous through first protective seam; The printing opacity packing colloid also comprises second protective seam that is arranged on printing opacity packing colloid outside surface, and the printing opacity packing colloid directly contacts with extraneous through second protective seam.
As second kind of improvement of scheme one, the power interface that also comprises whole ballast device, data-interface, electrically connects with external power source; On cooling base, be provided with first containing cavity, also be provided with the cover plate of the sealing first containing cavity opening; Fairing, data-interface, the power interface that electrically connects with external power source are installed in first containing cavity; Fairing and Butut circuit conductive layer, imaging controller, external power source interface electrically connect.
First kind of improvement as scheme three convexes with the fixed mechanism that LED display is fixed on desired location at the back side of LED display.
As the 4th kind of improvement of scheme one, each LED luminescence unit comprises the led chip of single primary colours or two dual base colors or three three primary colours or four three primary colours.
First kind of common improvement as scheme one to five; Be equipped with first a heat radiation clear opening that runs through cooling base successively in the center of every adjacent four led chip fixing lug boss, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with corresponding first clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat that dispels the heat; Be provided with the closed chamber madial wall in the periphery of plastic plate the 3rd heat radiation clear opening and/or the periphery of dispelling the heat clear opening towards the face upper edge first of pcb board at cooling base towards the face upper edge of pcb board; The closed chamber madial wall passes the second heat radiation clear opening; Cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form closed chamber, and pcb board is contained in the closed chamber; A side that deviates from pcb board at cooling base is provided with radiating fin, and the first heat radiation clear opening runs through radiating fin, and adjacent radiating fin does not all connect; The end that the first heat radiation clear opening deviates from pcb board all directly is communicated with outside air through the end that the gap of radiating fin is communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board, the gap of radiating fin, first clear opening, second the dispel the heat gas heat dissipation channel of clear opening formation convection current of clear opening, the 3rd that dispels the heat that dispels the heat that is serially connected.
As second kind of scheme one to five common the improvement, a side that deviates from pcb board at cooling base is provided with radiating fin, and adjacent radiating fin does not all connect, form the side direction heat dissipation channel of convection current between radiating fin.
As the third common improvement of scheme one to five, comprise also being arranged on the runner housing that cooling base deviates from pcb board one side that between runner housing and cooling base, be provided with flow path wall, runner housing, flow path wall, cooling base form coolant flow channel; The back side of the led chip fixing lug boss runner that is cooled fully covers.
The 4th kind of common improvement the as scheme one to five comprises also being arranged on the runner housing that cooling base deviates from LED luminescence unit one side that the heat radiation clear opening runs through the runner housing; Be equipped with in the center of every adjacent four led chip fixing lug boss one run through from bottom to top successively the of runner housing scatter hot clear opening, run through cooling base the first heat radiation clear opening, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with corresponding first clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat that dispels the heat; Be provided with the closed chamber madial wall in the periphery of plastic plate the 3rd heat radiation clear opening and/or the periphery of dispelling the heat clear opening towards the face upper edge first of pcb board at cooling base towards the face upper edge of pcb board; The closed chamber madial wall passes the second heat radiation clear opening; Cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form closed chamber, and pcb board is contained in the closed chamber; Between runner housing and cooling base, be provided with runner lateral wall with runner housing and cooling base liquid sealing; Between runner housing and cooling base, along the scatter the periphery of hot clear opening and/or along the periphery of the first heat radiation clear opening, be provided with the runner madial wall; Runner housing and heat-radiating substrate are fixed together, and cooling base, runner lateral wall, runner madial wall, runner housing form the coolant flow channel of sealing fully; The scatters, and the end that an end directly is communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board that hot clear opening deviates from pcb board all directly is communicated with outside air, the dispel the heat gas heat dissipation channel of clear opening formation convection current of hot clear opening, the first heat radiation clear opening, the second heat radiation clear opening, the 3rd that scatters that is serially connected.
As the improvement of such scheme, between the runner madial wall of setting, be provided with connecting wall, or between the runner madial wall of setting, be provided with connecting wall between the runner lateral wall set and runner madial wall, coolant flow channel is a circulatory flow; On runner housing or cooling base, also be provided with the inlet and the liquid outlet that are communicated with coolant flow channel.
A kind of combined type dot matrix display screen, the combined type dot matrix display screen is combined by the dot matrix display screen more than two.
The invention has the beneficial effects as follows:
1) end face of led chip fixing lug boss is lower than the face that first through hole deviates from pcb board, and led chip does not need lens after encapsulating through the printing opacity packing colloid, and is simple in structure.Between plastic plate and cooling base, be provided with lateral wall with plastic plate and cooling base sealing; Fixed leg and/or blocking part seal second through hole; Pcb board is contained in the closed chamber of cooling base, lateral wall, plastic plate formation; Avoid on the one hand external belt wetlyly to cause LED luminescence unit, lead and Butut circuit conductive layer to receive pollutions with unclean air such as harmful chemical, thermal resistance improves, causes fluorescent powder, silica gel material deterioration, the life-span of raising LED luminescence unit; On the other hand can be with the outdoor use of LED display, anti-sealings etc. get in the closed chamber, good water-proof effect; Simple in structure in addition, cost is low, and heat-radiating substrate directly contacts good heat dissipation effect with extraneous.
2) owing to be provided with plastic plate; Butut circuit conductive layer can stretch in the plastic plate; On the one hand lead can be directly and the electric connection of Butut circuit conductive layer; No longer need lead be connected with Butut circuit conductive layer or pass with Butut circuit conductive layer from the cooling base that deviates from led chip and be connected the thermal resistance that simplifies the structure He cut down the number of intermediate links to greatest extent, good heat dissipation effect through the conducting metal support through leg; No longer need weld metal support or leg and Butut circuit conductive layer to electrically connect on the other hand, do not need Reflow Soldering or wave-soldering, so packing colloid can be with resin or silica gel etc.; But also can guarantee that led chip, electric connection lead and two welding ends thereof can not be exposed in the air long-life that helps using.And when needing Reflow Soldering or wave-soldering, because the temperature of Reflow Soldering or wave-soldering is generally at 250C ° or 280C °, packing colloid just cannot use resin.Because the price of silica gel is higher than resin far away, light transmission is than resin difference, so the present invention can further save cost, the optical property of raising led chip.The advantage of this COB package design is that the electrode of each led chip all passes through the direct and Butut circuit conductive layer formation Ohmic contact of bonding lead; The formation of LED multi-path chip array is to realize electrical interconnection through the electrical connection device of cooling base and led chip; The SP of led chip can be realized, reliability of products and production qualification rate can be improved again.
3) on cooling base, be provided with and the integrated a plurality of chip fixed chip fixing lug boss of cooling base, greater than the area at chip fixing lug boss top, led chip directly is fixed on the chip fixing lug boss through solid crystal type the area of cooling base greatly.Significantly reducing heat that led chip produces so on the one hand, to distribute in heat radiation gas be airborne intermediate path distance and the contact area that has increased greatly with the gas that dispels the heat; Significantly reduced the heat built-up effect; Can improve radiating efficiency greatly and make chip remain in suitable working temperature, thereby keep long-life and effective luminescence efficiency of chip.Chip fixing lug boss and cooling base are one-body molded, so the heat that produces of chip only sees through cooling base and just directly distribute in air, so thermal resistance is little, radiating rate is fast, must not dispel the heat by other radiating piece, and radiating effect is just fairly good.Because the chip fixing lug boss arranged, make the shade of keeping out that electrically connects light that lead sends led chip drop to minimumly, be beneficial to optical secondary optimization! Save existing led support, just saved the heat radiating metal spare in the led support, and multilayer intermediate link such as electrode metal pin; Especially reduced the high thermal resistance that produces between two parts of heat radiating metal spare and cooling base; Therefore thermal resistance is little, and the fast good heat dissipation effect of heat conduction is simple and reliable for structure; Especially one-body molded design and the assembly technology that more helps light source of chip fixing lug boss and cooling base saved cost again.Therefore the present invention is simple and reliable for structure, and part is few, and thin thickness is easy to assembling, is specially adapted to the powerful occasion of light source requirements.
4) first protective seam and second protective seam generally after the printing opacity packing colloid is accomplished packaging LED chips, at plastic plate and printing opacity packing colloid spraying protective layer, reach better waterproof effect and protection effect once.
5) owing to be equipped with a heat radiation clear opening in every four adjacent LED luminescence unit centers; Each LED luminescence unit is all adjacent with the heat radiation clear opening; Reduced LED luminescence unit dense arrangement produces very high junction temperature together on the one hand; The heat that produces of each LED luminescence unit can directly distribute through the heat radiation clear opening that is adjacent on the other hand, makes the heat dissipation path of each LED luminescence unit the shortest as far as possible, and the heat dissipation path of each LED luminescence unit is equal or about equally; The radiating effect that guarantees each LED luminescence unit is all fine, has further reduced the LED luminescence unit and has produced very high junction temperature.The heat radiation clear opening runs through cooling base, and the two ends of heat radiation clear opening all are communicated with the gas heat dissipation channel that forms convection current with outside air, so be very beneficial for cross-ventilation.The heat that led light source produces in the course of the work conducts on the pedestal, and pedestal becomes the conductor and the carrier of heat.The pedestal that has a large amount of heats can be discharged with the hot-air in the heat radiation clear opening heat radiation clear opening; Extraneous cold air can constantly replenish and get in the heat radiation clear opening; The gas of formation continuous flow absorbs heat continuously from the hole wall of heat radiation clear opening, makes the pedestal cooling, so circulation; Thereby take away the heat in the pedestal fast, therefore in pedestal, can not hoard a large amount of heats and to influence serviceable life, the radiating efficiency of led light source high.The processing of heat radiation clear opening is very convenient, quick, practices thrift human and material resources, financial resources, can reduce heat abstractor significantly and even have the cost of the LED dot matrix display screen of this heat abstractor.When the LED dot matrix display screen was fixed on the wall, a side that deviates from pcb board at the runner housing convexed with the fixed mechanism that LED display is fixed on desired location, thereby guaranteed that heat-radiating substrate directly contacts with outside air.
6) be provided with radiating fin and heat radiation boss, increase area of dissipation, improve radiating effect.Form the side direction heat dissipation channel of convection current between radiating fin, also can heat on the substrate in cooling base centre position and the gap of the heat on the radiating fin through radiating fin be distributed the raising radiating effect.Particularly when display screen is fixed on the wall, distribute along vertical cooling base direction because wall has blocked heat, so the side direction heat dissipation channel of convection current is essential.
7) coolant flow channel is set, can further improve radiating effect.General filling chilled water in coolant flow channel; Because specific heat of water is high, can pass through heat loss through convection again, can make the heat of led light source be dispersed in the water rapidly; Be heated the higher water of temperature and can form convection current by lower water with the temperature at the heat radiation terminal of ingress of air; The heat radiation terminal that heat is switched to the lower ingress of air of temperature is dispersed into rapidly in the air through the heat radiation terminal, and rapid heat dissipation can effectively reduce junction temperature.Also have because the maximum temperature of water is 100 ° of C; The junction temperature that can avoid the led light source place is considerably beyond 100 ° of C; For bigger outdoor dot matrix LED display of the temperature difference etc., can reduce the suddenly cold and hot of LED dot matrix display screen, improve the working temperature environment of LED dot matrix display screen.
8) through between some runner madial wall, being provided with connecting wall; Do not establish connecting wall between some runner madial wall; Make coolant flow channel form circulatory flow, be input in the coolant flow channel, the output of the liquid in the coolant flow channel is gone through liquid outlet through the cooling liquid of inlet with the outside; Be convenient to the quick convective motion of heat eliminating medium, radiating effect is better.Through between runner lateral wall of setting between the runner madial wall, setting and runner madial wall, being provided with connecting wall; Make the first circulation coolant flow channel not have the dead angle around the runner madial wall fully; Do not have the heat-sink unit that is not covered by cold but runner, radiating effect is better, and is more even.
Description of drawings
Fig. 1 is the schematic perspective view of the embodiment of the invention 1
Fig. 2 is the cross-sectional schematic along the A-A of Fig. 1.
Fig. 3 is the perspective exploded view of the embodiment of the invention 1.
Fig. 4 is the perspective exploded view of the embodiment of the invention 1 from another direction projection.
Fig. 5 is the perspective exploded view of the embodiment of the invention 2.
Fig. 6 is the perspective exploded view of the embodiment of the invention 2 from another direction projection.
Fig. 7 is that the master of the embodiment of the invention 2 looks synoptic diagram
Fig. 8 is the cross-sectional schematic along the B-B of Fig. 7.
Fig. 9 is the perspective exploded view of the embodiment of the invention 3.
Figure 10 is the perspective exploded view of the embodiment of the invention 4.
Figure 11 is the I portion enlarged diagram of Figure 10.
Figure 12 is the perspective exploded view of the embodiment of the invention 5.
Figure 13 is the II portion enlarged diagram of Figure 12.
Figure 14 is the perspective exploded view of the embodiment of the invention 6.
Figure 15 is the III portion enlarged diagram of Figure 14.
Figure 16 is the schematic perspective view of the embodiment of the invention 7.
Figure 17 is the schematic perspective view of the embodiment of the invention 8.
Figure 18 is the perspective exploded view of the embodiment of the invention 8.
Embodiment
Extremely shown in Figure 4 like Fig. 1; A kind of LED dot matrix display screen comprises LED luminescence unit, imaging controller, the Butut circuit conductive layer (not shown) of single primary colours of plastic plate 4, the uniform array of printing opacity packing colloid 3, the moulding packaging LED chips printing opacity packing colloid 3 of cooling base 1, pcb board 2, packaging LED chips; Butut circuit conductive layer is set directly on the pcb board 2, and imaging controller is set directly at the pcb board back of the body 2 on the face of Butut circuit conductive layer.
The LED luminescence unit comprises the led chip 5 of single primary colours, electrically connects the gold thread 6 of led chip 5 and Butut circuit conductive layer, is used for the printing opacity packing colloid 3 of packaging LED chips 5; Each led chip 5 all electrically connects separately through Butut circuit conductive layer and imaging controller.
Uniform array has led chip fixing lug boss 7 on cooling base 1, on each led chip fixing lug boss 7, all is fixed with a led chip 5 through solid brilliant technology.Extend on the face of pcb board 2 at plastic plate 4 and to be provided with fixed leg 8.On plastic plate 4, being provided with first through hole, 9, the first through holes 9 corresponding one by one with led chip fixing lug boss 7 numbers and position, moulding printing opacity packing colloid 3 is up big and down small bellmouth.On cooling base 1, be provided with second through hole 10 that cooperates with fixed leg 8.On pcb board 2, be provided with third through-hole 11 that cooperates with fixed leg 8 and the fourth hole 12 that cooperates with led chip fixing lug boss 7.Extend on the face of heat-radiating substrate 1 at plastic plate 4 and to be provided with closed chamber lateral wall 13, cooling base 1, closed chamber lateral wall 13, plastic plate 4 form closed chamber 24, and pcb board 2 is contained in the closed chamber 24.Fixed leg 8 passes third through-hole 11, second through hole 10 and forms blocking part 14 in the end of fixed leg 8, plastic plate 4, pcb board 2, cooling base 1 is fixed together successively blocking part 14 sealings second through hole 10.The led chip fixing lug boss 7 of cooling base 1 is passed fourth hole 12 and is stretched in first through hole 9, and the end face of led chip fixing lug boss 7 is lower than the face that plastic plate 4 deviates from pcb board 2.Butut circuit conductive layer (not shown) stretches between first through hole 9 and the chip fixing lug boss; Gold thread 6 places in first through hole 9; The electrode of gold thread 6 one ends and led chip 5 electrically connects, and the Butut circuit conductive layer (not shown) between the other end of gold thread 6 and first through hole 9 and the led chip fixing lug boss 7 electrically connects.Deviate from cooling base 1 to extend on the face of pcb board 2 and be provided with flow path wall; Also comprise and be arranged on the flow passage cover plate 15 that cooling base 1 deviates from pcb board 2 one sides; Deviate from cooling base 1 to extend on the face of pcb board 2 and be provided with runner lateral wall 16, erection column 18; Deviate from plastic plate 4 to extend on the face of pcb board 2 and be provided with containing cavity sidewall 17; Flow passage cover plate 15, runner lateral wall 16, cooling base 1 form coolant flow channel 19, and flow passage cover plate 15, containing cavity sidewall 17 and cooling base 1 form airtight relatively containing cavity 20.In containing cavity 20, be provided with electric control gear 21 and data-interface 22.Be cooled fully runner 17 of the back side of led chip fixing lug boss 7 covers.On erection column 18, being provided with the installation ladder hole that runs through on the cooling base 23. cooling bases 1, plastic plate 4, printing opacity packing colloid 3, flow passage cover plate 15 directly contacts with outside air.
Extremely shown in Figure 8 like Fig. 5; A kind of LED dot matrix display screen; Different with embodiment 1 is; Be equipped with the 3rd a heat radiation clear opening 52 that runs through plastic plate 51 in every four adjacent chip fixing lug boss 50 centers, run through pcb board 53 the second heat radiation clear opening 54, run through cooling base 55 the first heat radiation clear opening 56, run through the of the flow passage cover plate 57 hot clear opening 58 that scatters, each chip fixing lug boss 50 and first clear opening 56 that dispels the heat is adjacent.Imaging controller is set directly at pcb board 2 to deviate from the face of Butut circuit conductive layer.The LED luminescence unit of uniform array is a dual base color.
Extend on the face of pcb board 53 at cooling base 55 and to be provided with closed chamber lateral wall 59, extend on the face of pcb board 53 at plastic plate 51 and be provided with closed chamber lateral wall 60.Closed chamber lateral wall 59 stretches in the closed chamber lateral wall 60, and the medial surface of the lateral surface of closed chamber lateral wall 59 and closed chamber lateral wall 60 is fitted.Periphery at plastic plate 51 the 3rd heat radiation clear opening 52 towards the face upper edge of pcb board 53 is provided with closed chamber madial wall 61; Periphery at cooling base 55 first heat radiation clear opening 56 towards the face upper edge of pcb board 53 is provided with closed chamber madial wall 62, and closed chamber madial wall 62 passes the second heat radiation clear opening 54.Closed chamber madial wall 61 stretches in the closed chamber madial wall 62, and the medial surface of the lateral surface of closed chamber madial wall 61 and closed chamber madial wall 62 is fitted.Cooling base 55, closed chamber lateral wall 59, closed chamber lateral wall 60, closed chamber madial wall 61, closed chamber madial wall 62, plastic plate 51 form closed chamber 63, and pcb board 53 is contained in the closed chamber 63.
Deviate from cooling base 55 and extend the runner lateral wall 64 that surrounds the first heat radiation clear opening 56 on the face of pcb board 53, deviate from cooling base 55 on the face of pcb board 53, extend along the periphery of the first heat radiation clear opening 56 and be provided with runner madial wall 65.Cooling base 55, runner lateral wall 64, runner madial wall 65, flow passage cover plate 57 form coolant flow channel 67.
The end that the 3rd heat radiation clear opening 52 deviates from pcb board 53 directly is communicated with outside air, and the sideshake of the scatters a end that hot clear opening 58 deviates from pcb board 53 passes through fixed leg 68 directly is communicated with outside air.The scatter hot clear opening 58, the first heat radiation clear opening 56, the second heat radiation clear opening 54, the 3rd heat radiation clear opening 52 that is serially connected forms the gas heat dissipation channel of convection current.
As shown in Figure 9, different with embodiment 2 is that a side that deviates from pcb board 81 at cooling base 80 is provided with horizontal radiating fin 82 and vertical radiating fin 83.82 of radiating fins are parallel to each other, and 83 of radiating fins are parallel to each other.The gap of radiating fin 82, radiating fin 83, the first heat radiation clear opening 84 that is serially connected, the second heat radiation clear opening 86, the 3rd heat radiation clear opening 85 form the gas heat dissipation channel of convection current.The first heat radiation clear opening 84 runs through radiating fin 82, radiating fin 83, and adjacent radiating fin does not all connect.The end that the first heat radiation clear opening 84 deviates from pcb board 81 through the gap of radiating fin 82, radiating fin 83 be communicated with outside air, the 3rd end that clear opening 85 deviates from pcb board 81 that dispels the heat all directly is communicated with outside air.Present embodiment is not provided with coolant flow channel, mainly through the radiating fin heat radiation.The LED luminescence unit of uniform array is three primary colours.
Like Figure 10, shown in Figure 11, different with embodiment 2 is that each LED luminescence unit comprises led chip 100, the led chip 101 of two two primary colours, promptly on each chip fixing lug boss 102, is fixed with led chip 100, the led chip 101 of two different colours.
Like Figure 12, shown in Figure 13, different with embodiment 2 is that each LED luminescence unit comprises led chip 110, led chip 111, the led chip 112 of three three primary colours, promptly on each chip fixing lug boss 113, is fixed with the led chip of three different colours.
Like Figure 14, shown in Figure 15; Different with embodiment 2 is; Each LED luminescence unit comprises led chip 120, led chip 121, led chip 122, the led chip 123 of four three primary colours; Wherein the color of led chip 120, led chip 121 is identical, promptly on each chip fixing lug boss 124, is fixed with led chip 120, led chip 121, led chip 122, the led chip 123 of four, three kinds different colours.
Shown in figure 16, a kind of combined type dot matrix display screen is fixed together and is combined by four dot matrix display screens 140, dot matrix display screen 141, dot matrix display screen 142, dot matrix display screen 143.What dot matrix display screen 140, dot matrix display screen 141, dot matrix display screen 142, dot matrix display screen 143 and embodiment 3 were different is; Only an angle position at dot matrix display screen is provided with fixed leg 144, on the face that dot matrix display screen fits, is provided with the fixed part (not shown) that two adjacent dot matrix display screens are fixed together.
Like Figure 17, shown in 18, different with embodiment 3 is, is connected with horizontal connecting wall 151 at a side outermost one row's 150 of horizontal runner madial walls, is provided with the first vertical connecting wall 153 at 152 of vertically disposed runner madial walls at interval; 154 of runner madial walls, runner madial wall 154 and 155 of the runner lateral walls that vertically disposed runner madial wall 152 being connected with the first vertical connecting wall 153 separates, is not connected with horizontal connecting wall 151 is provided with the second vertical connecting wall 156; Runner madial wall 152, the first vertical connecting wall 153, runner madial wall 150, horizontal connecting wall 151, runner madial wall 154, runner lateral wall 155, the second vertical connecting wall 156 form circulation passages 157, and the coolant flow channel that is provided with circulation passage is not for there is the circulatory flow at dead angle fully around the runner madial wall; On cooling base 158, also be provided with inlet 159 and liquid outlet 160, inlet 159 is connected with water receiver 162 through water pipe 161 with liquid outlet 160.
Claims (11)
1. LED dot matrix display screen comprises LED luminescence unit, imaging controller, Butut circuit conductive layer, the packaging LED chips printing opacity packing colloid of cooling base, pcb board, uniform array, the plastic plate of moulding packaging LED chips printing opacity packing colloid; Butut circuit conductive layer is set directly on the pcb board; Described LED luminescence unit comprises more than one led chip, electrically connects the lead of led chip and Butut circuit conductive layer, is used for the printing opacity packing colloid of packaging LED chips; Each led chip all electrically connects separately through Butut circuit conductive layer and imaging controller; Uniform array has the led chip fixing lug boss on cooling base, on each led chip fixing lug boss, all is fixed with the led chip of a described LED luminescence unit through solid brilliant technology; Extend on the face of pcb board at plastic plate and to be provided with fixed leg; On plastic plate, be provided with first through hole corresponding one by one with led chip fixing lug boss number and position, moulding printing opacity packing colloid; On cooling base, be provided with second through hole that cooperates with fixed leg; On pcb board, be provided with third through-hole that cooperates with fixed leg and the fourth hole that cooperates with the led chip fixing lug boss; Fixed leg passes third through-hole, second through hole is provided with the blocking part in the end of fixed leg, and plastic plate, pcb board, cooling base are fixed together successively, and fixed leg and/or blocking part seal second through hole; The led chip fixing lug boss of cooling base is passed fourth hole and is stretched in first through hole, and the end face of led chip fixing lug boss is lower than the face that plastic plate deviates from pcb board; Butut circuit conductive layer stretches between first through hole and the fixing lug boss; Lead places in first through hole; The electrode of lead one end and led chip electrically connects, and the Butut circuit conductive layer between the other end of lead and first through hole and the led chip fixing lug boss electrically connects; It is characterized in that: between plastic plate and cooling base, be provided with closed chamber lateral wall with plastic plate and cooling base sealing; Cooling base, closed chamber lateral wall, plastic plate form closed chamber, and pcb board is contained in the closed chamber; Cooling base, plastic plate, printing opacity packing colloid directly directly contact with outside air.
2. a kind of LED dot matrix display screen as claimed in claim 1; It is characterized in that: plastic plate also comprises first protective seam that is arranged on the plastic plate outside surface; Plastic plate directly contacts with extraneous through first protective seam; The printing opacity packing colloid also comprises second protective seam that is arranged on printing opacity packing colloid outside surface, and the printing opacity packing colloid directly contacts with extraneous through second protective seam.
3. a kind of LED dot matrix display screen as claimed in claim 1 is characterized in that: the power interface that also comprises whole ballast device, data-interface, electrically connects with external power source; On cooling base, be provided with first containing cavity, also be provided with the cover plate of the sealing first containing cavity opening; Fairing, data-interface, the power interface that electrically connects with external power source are installed in first containing cavity; Fairing and Butut circuit conductive layer, imaging controller, external power source interface electrically connect.
4. a kind of LED dot matrix display screen as claimed in claim 1 is characterized in that: convex with the fixed mechanism that described LED display is fixed on desired location at the back side of described LED display.
5. a kind of LED dot matrix display screen as claimed in claim 1 is characterized in that: each LED luminescence unit comprises the led chip of single primary colours or two dual base colors or three three primary colours or four three primary colours.
6. like any described a kind of LED dot matrix display screen of claim 1 to 5; It is characterized in that: be equipped with first a heat radiation clear opening that runs through cooling base successively in the center of every adjacent four led chip fixing lug boss, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with the described corresponding first heat radiation clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat; Be provided with the closed chamber madial wall in the periphery of plastic plate the 3rd heat radiation clear opening and/or the periphery of dispelling the heat clear opening towards the face upper edge first of pcb board at cooling base towards the face upper edge of pcb board; The closed chamber madial wall passes the second heat radiation clear opening; Cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form described closed chamber, and pcb board is contained in the described closed chamber; A side that deviates from pcb board at cooling base is provided with radiating fin, and the first heat radiation clear opening runs through radiating fin, and adjacent radiating fin does not all connect; The end that the first heat radiation clear opening deviates from pcb board all directly is communicated with outside air through the end that the gap of radiating fin is communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board, the gap of radiating fin, first clear opening, second the dispel the heat gas heat dissipation channel of clear opening formation convection current of clear opening, the 3rd that dispels the heat that dispels the heat that is serially connected.
7. like any described a kind of LED dot matrix display screen of claim 1 to 5, it is characterized in that: a side that deviates from pcb board at cooling base is provided with radiating fin, and adjacent radiating fin does not all connect, form the side direction heat dissipation channel of convection current between radiating fin.
8. like any described a kind of LED dot matrix display screen of claim 1 to 5; It is characterized in that: also comprise being arranged on the runner housing that cooling base deviates from pcb board one side; Between runner housing and cooling base, be provided with flow path wall, runner housing, flow path wall, cooling base form coolant flow channel; The back side of the led chip fixing lug boss runner that is cooled fully covers.
9. like any described a kind of LED dot matrix display screen of claim 1 to 5, it is characterized in that: comprise also being arranged on the runner housing that cooling base deviates from LED luminescence unit one side that the heat radiation clear opening runs through the runner housing; Be equipped with in the center of every adjacent four led chip fixing lug boss one run through from bottom to top successively the of runner housing scatter hot clear opening, run through cooling base the first heat radiation clear opening, run through pcb board the second heat radiation clear opening, run through the 3rd heat radiation clear opening of plastic plate, each LED luminescence unit is all adjacent with the described corresponding first heat radiation clear opening, second clear opening, the 3rd clear opening that dispels the heat that dispels the heat; Be provided with the closed chamber madial wall in the periphery of plastic plate the 3rd heat radiation clear opening and/or the periphery of dispelling the heat clear opening towards the face upper edge first of pcb board at cooling base towards the face upper edge of pcb board; The closed chamber madial wall passes the second heat radiation clear opening; Cooling base, closed chamber lateral wall, closed chamber madial wall, plastic plate form described closed chamber, and pcb board is contained in the described closed chamber; Between runner housing and cooling base, be provided with runner lateral wall with runner housing and cooling base liquid sealing; Between runner housing and cooling base, along the scatter the periphery of hot clear opening and/or along the periphery of the first heat radiation clear opening, be provided with the runner madial wall; Runner housing and heat-radiating substrate are fixed together, and cooling base, runner lateral wall, runner madial wall, runner housing form the coolant flow channel of sealing fully; The scatters, and the end that an end directly is communicated with outside air, the 3rd heat radiation clear opening deviates from pcb board that hot clear opening deviates from pcb board all directly is communicated with outside air, the dispel the heat gas heat dissipation channel of clear opening formation convection current of hot clear opening, the first heat radiation clear opening, the second heat radiation clear opening, the 3rd that scatters that is serially connected.
10. a kind of LED dot matrix display screen as claimed in claim 9; It is characterized in that: between the runner madial wall of setting, be provided with connecting wall; Or between the runner madial wall of setting, be provided with connecting wall between the runner lateral wall set and runner madial wall, coolant flow channel is a circulatory flow; On runner housing or cooling base, also be provided with the inlet and the liquid outlet that are communicated with coolant flow channel.
11. a combined type dot matrix display screen that comprises like any described LED dot matrix display screen of claim 1 to 5 is characterized in that: the combined type dot matrix display screen is combined by the said dot matrix display screen more than two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210148984.9A CN102682671B (en) | 2011-09-30 | 2012-05-14 | LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110303046.7 | 2011-09-30 | ||
| CN201110303046 | 2011-09-30 | ||
| CN201210148984.9A CN102682671B (en) | 2011-09-30 | 2012-05-14 | LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen |
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| Publication Number | Publication Date |
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| CN102682671A true CN102682671A (en) | 2012-09-19 |
| CN102682671B CN102682671B (en) | 2014-05-14 |
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| CN201210148984.9A Expired - Fee Related CN102682671B (en) | 2011-09-30 | 2012-05-14 | LED (light-emitting diode) dot matrix display screen and combined dot matrix display screen |
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| WO (1) | WO2013044601A1 (en) |
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| CN102682671B (en) | 2014-05-14 |
| WO2013044601A1 (en) | 2013-04-04 |
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