CN102682670A - LED (Light Emitting Diode) dot matrix display screen - Google Patents
LED (Light Emitting Diode) dot matrix display screen Download PDFInfo
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- CN102682670A CN102682670A CN201210148661XA CN201210148661A CN102682670A CN 102682670 A CN102682670 A CN 102682670A CN 201210148661X A CN201210148661X A CN 201210148661XA CN 201210148661 A CN201210148661 A CN 201210148661A CN 102682670 A CN102682670 A CN 102682670A
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Abstract
The invention relates to an LED (Light Emitting Diode) dot matrix display screen which comprises a radiating base, uniformly arrayed LED illuminating units, an imaging controller, and layout circuit conductive layers electrically connected with the LED illuminating units, wherein each of the LED illuminating units is independently in electric connection with the imaging controller through each of the layout circuit conductive layers; the LED illuminating units are fixedly arranged on the radiating base; a radiating through hole is formed in the central position of each four adjacent LED illuminating units; each of the LED illuminating units is adjacent to the radiating through hole; the radiating through hole passes through the radiating base; and two ends of the radiating through hole are both communicated with the outside air, thereby forming a convective air radiating channel. The LED dot matrix display screen has the advantages that a large amount of heat can not be accumulated in the radiating base, so that the service life of an LED light source is not influenced and the radiating efficiency is high; the radiating through hole is conveniently and quickly processed; the manpower, material resources and financial resources are saved; and the cost of a radiating device and even the cost of the LED dot matrix display screen with the radiating device can be greatly reduced.
Description
Technical field
The present invention relates to a kind of display screen, particularly relate to a kind of LED dot matrix display screen.
Background technology
The LED light emitting diode has not leaded, mercury than conventional light source; No stroboscopic, plurality of advantages such as energy-conserving and environment-protective, long service life, response speed are fast, vibration resistance, easy care, brightness is high, energy consumption is low, few UV radiation and environmental pollution, safety in utilization height and being widely used in the display screen imaging.
The light decay of led light source is directly relevant with its junction temperature with its life-span.LED lamp, particularly high-power LED light source, heat is concentrated when luminous, if untimely the distributing of heat that led chip produces, junction temperature is just very high, the life-span is just short.According to the Jordi Arresse rule, 10 ° of C of the every reduction of temperature, the life-span will prolong twice.Show that according to research if junction temperature can be controlled at 65 ° of C, the life-span of led light source light decay to 70% just can be up to 100,000 hours.Because LED belongs to electroluminescence device, its heat can not distribute through radiation mode.Have only 15 one 25% electric energy to convert luminous energy in its photoelectric conversion process, remaining electric energy nearly all converts heat energy to, and the temperature of LED light fixture is raise.And for the integrated packaged type light source of LED wafer, because wafer is more concentrated, luminous source region heat is high, so just is easy to cause device temperature such as led chip too high.If can not in time distributing, great amount of heat can cause a series of problems: for example, can quicken device agings such as led chip, and reduction of service life, even can cause led chip to burn; Make the wavelength generation red shift of blue-ray LED, and colourity, the colour temperature of white light LEDs produced material impact,, departed from the absorption peak of fluorescent powder, will cause the fluorescent powder quantum efficiency to reduce, influence light extraction efficiency if wavelength shift is too much; Temperature also has very big influence to the radiation characteristic of fluorescent powder; Along with temperature rises, the fluorescent powder quantum efficiency reduces, and radiation wavelength also can change; The change of fluorescent powder radiation wavelength also can cause the variation of white light LEDs colour temperature, colourity, and higher temperature also can be quickened the aging of fluorescent powder.Usually, the power of the integrated packaged type light source of LED wafer is big more, and imaging effect is good more; But meanwhile, heat dissipation problem is difficult to resolve more and determines.Heat dissipation problem has finally restricted the raising of the integrated packaged type light source power of LED wafer.
Application number in my application is 201020262611.0, name is called in a kind of utility model patent of LED integrated morphology, discloses a kind of LED dot matrix display screen, comprises top cover, transparent panel and LED integrated morphology.LED integrated morphology comprises heat-radiating substrate, led chip; Lens, the plastic parts of positioning lens or molded lens is electrically connected the lead of led chip electrode and the Butut circuit conductive layer of electrical connecting wire; Imaging controller; On the plastic parts of positioning lens or molded lens, be provided with one or more first through hole, on the end face of the plastic parts of positioning lens or molded lens, extend and be provided with fixed leg, on heat-radiating substrate, be provided with second through hole that cooperates with fixed leg; Fixed leg passes second through hole of heat-radiating substrate, is provided with the blocking part in the end of fixed leg; The plastic parts of positioning lens or molded lens is fixed through fixed leg and blocking part and heat-radiating substrate; Led chip directly is fixed on the heat-radiating substrate through solid brilliant technology, and places in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and led chip of first through hole, and lead places in first through hole, and lead one end is connected with the electrode electricity of led chip, and the other end of lead and first through hole are electrically connected with Butut circuit conductive layer between the led chip; The side that heat-radiating substrate deviates from led chip directly contacts with heat radiation gas or radiator liquid.The Butut circuit conductive layer of each chip is electrically connected separately with imaging controller.Though this utility model heat-radiating substrate directly contacts with extraneous; But because the heat transmissibility of pcb board and plastic plate is very poor; The heat major part of LED luminescence unit can only distribute through the face that deviates from the LED luminescence unit of heat-radiating substrate, and it is best that radiating effect does not also reach.
In application number is 201020620120.9 utility model patent; A kind of image system LED lamp source module is disclosed; Comprise housing, corner connector, outlet piece, LED lamp base plate, optical scattering plate and the LED lamp of aluminium alloy, housing, outlet piece fit together through corner connector, and the LED lamp is installed on LED lamp base plate; LED lamp base plate is installed in the housing, and the optical scattering plate is installed on the position of corresponding LED lamp on the shell.The outlet piece is provided with wire hole.LED lamp base plate is provided with radiating fin.Housing is provided with three mounting grooves.Mounting groove is respectively fixed installation groove, display board mounting groove and guidance panel mounting groove.Because the Butut circuit conductive layer of display and the circuit of imaging controller are very complicated, this utility model is installed on the LED lamp on the LED lamp base plate, is not provided with pcb board, and therefore circuit, difficult forming are set on base plate.Though this utility model LED lamp base plate directly contacts with extraneous; But because LED lamp base plate needs to distribute for the aluminium alloy housing again through the aluminium alloy housing through radiation towards the heat of LED lamp one side; Therefore the heat major part of LED luminescence unit can only distribute through the face that heat-radiating substrate deviates from the LED luminescence unit, and radiating effect is not very desirable.
Application number is in 200720312314.0 the utility model patent; A kind of combined type LED display screen is disclosed; The main body framework, LED light emitting module and the display driver circuit that comprise plastic cement; The side of main body framework has the lattice-like plug-in opening that matches with the LED light emitting module, is provided with the positive electrode and the negative electrode of mutually insulated in each plug-in opening, and positive electrode is connected with display driver circuit with negative electrode; The LED light emitting module is made up of LED luminotron and plug-in mounting body, on the plug-in mounting body contact electrode is arranged, and the LED light emitting module is plugged in the plug-in opening and contacts with negative electrode with positive electrode and is connected.Because main body framework adopts plastic parts, it is bad to dispel the heat.
Application number is in 200620074254.9 the utility model patent, to disclose a kind of high density global function LED display module.As carrier, the upper surface layer of printed circuit board (PCB) is provided with two-dimentional lattice point to this module with 2 one 6 layers printed circuit board (PCB), and each lattice point is provided with pad, mounts or be welded with led chips monochromatic or double-colored or three primary colours in the lattice point; The led chip outside surface scribbles silica gel perhaps with the epoxide-resin glue or the UV glue of diffusant, and it is a surface protective glue, also is the luminous lens of LED; Printed circuit board (PCB) is provided with the very thin through hole in aperture, is filled with metallic copper or other Heat Conduction Material in the through hole; The bottom surface layer of printed circuit board (PCB) is equipped with controlling and driving components and parts and web member.This display panel module directly mounts or is welded with led chips monochromatic or double-colored or three primary colours in the lattice point of printed circuit board (PCB); Be filled with metallic copper or other Heat Conduction Material heat conduction in the very thin through hole in the aperture that is provided with through printed circuit board (PCB); Heat-conducting effect is poor, complex process.
Summary of the invention
For the heat radiation that solves existing LED dot matrix not smooth; Life-span is short; The problem that luminescence efficiency is low, the technical matters that the present invention will solve are to provide that a kind of heat dissipation path is short, each LED luminescence unit equates to the path of louvre or about equally, the air in the louvre can pass through the LED dot matrix display screen of the two ends natural convection of louvre.
The LED dot matrix display screen comprises cooling base, the LED luminescence unit of uniform array, and imaging controller is provided with the Butut circuit conductive layer that is electrically connected the LED luminescence unit at cooling base towards LED luminescence unit one side; Each LED luminescence unit all electrically connects separately through Butut circuit conductive layer and imaging controller; A side that deviates from the LED luminescence unit at cooling base is provided with mechanical fixation mechanism; The LED luminescence unit is fixed on the cooling base; Be equipped with a heat radiation clear opening in every four adjacent LED luminescence unit centers, each LED luminescence unit is all adjacent with the heat radiation clear opening, and the heat radiation clear opening runs through cooling base; The two ends of heat radiation clear opening all are communicated with the gas heat dissipation channel that forms convection current with outside air.
As the improvement of scheme one, the LED luminescence unit is the lamp pearl that is fixed on the cooling base, and the both positive and negative polarity pin of lamp pearl is electrically connected with Butut circuit conductive layer.
As the improvement of such scheme, cooling base comprises the heat radiation PCB substrate of fixed light pearl, a side that deviates from the lamp pearl with the heat radiation PCB substrate fixing heat-radiating substrate of fitting; Butut circuit conductive layer is arranged on the heat radiation PCB substrate.
As the improvement of scheme one, also comprise the plastic parts of positioning lens; The LED luminescence unit comprises led chip, lens, the lead of electrical connection led chip and Butut circuit conductive layer; On cooling base, be provided with and the integrated one or more chip fixing lug boss of cooling base, led chip is fixed on the end face of chip fixing lug boss through solid brilliant technology; On the plastic parts of positioning lens, be provided with one or more first through hole; On the end face of the plastic parts of positioning lens, extend and be provided with fixed leg; On cooling base, be provided with second through hole that cooperates with fixed leg; Fixed leg passes second through hole of cooling base, is provided with the blocking part in the end of fixed leg; The plastic parts of positioning lens is fixed through fixed leg and blocking part and cooling base; The chip fixing lug boss places in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and chip fixing lug boss of first through hole; Lead places in first through hole; Lead one end is connected with the electrode electricity of led chip, and the other end of lead and first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss; The position of corresponding first through hole is provided with the glue injection channel of injecting the printing opacity packing colloid on plastic cement lens position part, and the Jiao Kou of glue injection channel places plastic cement lens position part to deviate from the end face of blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; The LED luminescence unit also comprises the printing opacity packing colloid that is filled between lens and led chip.
As the improvement of scheme one, the plastic parts of positioning lens is a plastic plate, and the heat radiation clear opening runs through the plastic plate of positioning lens, and first through hole all is arranged on the plastic plate.
As the improvement of scheme one, each LED luminescence unit comprises the led chip of single primary colours or two dual base colors or three three primary colours or four three primary colours.
Common improvement as scheme one to six; Also comprise and be arranged on the runner housing that cooling base deviates from LED luminescence unit one side; The heat radiation clear opening runs through the runner housing; Between runner housing and cooling base, be provided with the runner madial wall of runner lateral wall and the periphery that is arranged on the heat radiation clear opening, runner housing, runner lateral wall, runner madial wall, cooling base form coolant flow channel; The back side of the LED luminescence unit runner that is cooled fully covers.
As the common improvement of such scheme, between the runner madial wall of setting, be provided with connecting wall, or between the runner madial wall of setting, be provided with connecting wall between the runner lateral wall set and runner madial wall, coolant flow channel is a circulatory flow; On the runner housing, also be provided with inlet and liquid outlet.
Common improvement as scheme one to six; A side that deviates from the LED luminescence unit at cooling base is provided with radiating fin and heat radiation boss; Radiating fin distributes along the line of centres of LED luminescence unit; The heat radiation boss is corresponding one by one with the position of heat radiation clear opening on being arranged on radiating fin, and is corresponding one by one with LED luminescence unit position, and the clear opening that dispels the heat runs through the heat radiation boss; Mechanical fixation mechanism is arranged on the installation base that cooling base deviates from a side of LED luminescence unit, in installation base, is provided with mounting hole, and the height of installation base is higher than the height of radiating fin and heat radiation boss; The end that the heat radiation clear opening is positioned at the LED luminescence unit directly is communicated with outside air, and the sideshake that the end that the clear opening that dispels the heat deviates from the LED luminescence unit passes through installation base is communicated with outside air.
Common improvement as scheme one to six; Also comprise euphotic cover; Euphotic cover and cooling base are installed together the containing cavity that forms ccontaining LED luminescence unit, and at the heat radiation clear opening position seal boss one to one that is provided with on the euphotic cover and is arranged on the cooling base, the heat radiation clear opening runs through seal boss; Seal boss and cooling base stick together, and containing cavity is a closed cavity.
The invention has the beneficial effects as follows:
1) owing to be equipped with a heat radiation clear opening in every four adjacent LED luminescence unit centers; Each LED luminescence unit is all adjacent with the heat radiation clear opening; Reduced LED luminescence unit dense arrangement produces very high junction temperature together on the one hand; The heat that produces of each LED luminescence unit can directly distribute through the heat radiation clear opening that is adjacent on the other hand, makes the heat dissipation path of each LED luminescence unit the shortest as far as possible, and the heat dissipation path of each LED luminescence unit is equal or about equally; The radiating effect that guarantees each LED luminescence unit is all fine, has further reduced the LED luminescence unit and has produced very high junction temperature.The heat radiation clear opening runs through cooling base, and the two ends of heat radiation clear opening all are communicated with the gas heat dissipation channel that forms convection current with outside air, so be very beneficial for cross-ventilation.The heat that led light source produces in the course of the work conducts on the pedestal, and pedestal becomes the conductor and the carrier of heat.The pedestal that has a large amount of heats can carry out heat interchange with the air in the heat radiation clear opening and heat the air in the heat radiation clear opening; The interior hot-air of heat radiation clear opening is discharged, and extraneous cold air can constantly get in the heat radiation clear opening, from the hole wall absorption heat of heat radiation clear opening; Make the pedestal cooling; So circulation, thus take away the heat in the pedestal fast, therefore in pedestal, can not hoard a large amount of heats and to influence serviceable life, the radiating efficiency of led light source high.The processing of heat radiation clear opening is very convenient, quick, practices thrift human and material resources, financial resources, can reduce heat abstractor significantly and even have the cost of the LED dot matrix display screen of this heat abstractor.
2) adopt lamp pearl structure, be convenient to standardized production, simple in structure, cost is low, is convenient in unit area, arrange more lamp pearl.Be provided with heat radiation PCB substrate, be convenient to moulding Butut circuit conductive layer and be molded on the heat radiation PCB substrate with the control circuit of being convenient to imaging controller.
3) owing to be equipped with the plastic parts of positioning lens; Butut circuit conductive layer can stretch in the plastic parts of positioning lens; Lead can directly be electrically connected with Butut circuit conductive layer on the one hand; No longer need lead be connected with Butut circuit conductive layer or pass with Butut circuit conductive layer from the cooling base that deviates from led chip and be connected the thermal resistance that simplifies the structure He cut down the number of intermediate links to greatest extent, good heat dissipation effect through the conducting metal support through leg; No longer need weld metal support or leg to be electrically connected on the other hand, do not need Reflow Soldering or wave-soldering, so packing colloid can be with resin or silica gel etc. with Butut circuit conductive layer; But also can guarantee that led chip, electrical connecting wire and two welding ends thereof can not be exposed in the air long-life that helps using.And when needing Reflow Soldering or wave-soldering, because the temperature of Reflow Soldering or wave-soldering is generally at 250C ° or 280C °, packing colloid just cannot use resin.Because the price of silica gel is higher than resin far away, light transmission is than resin difference, so the present invention can further save cost, the optical property of raising led chip.The advantage of this COB package design is that the electrode of each led chip all passes through the direct and Butut circuit conductive layer formation Ohmic contact of bonding lead; The formation of LED multi-path chip array is to realize electrical interconnection through the arrangements of electric connection of cooling base and led chip; The SP of led chip can be realized, reliability of products and production qualification rate can be improved again.
4) on cooling base, be provided with and the integrated a plurality of chip fixing lug boss of cooling base, greater than the area at chip fixing lug boss top, led chip is fixed on the chip fixing lug boss through solid crystal type the area of cooling base greatly.Significantly reducing heat that led chip produces so on the one hand, to distribute in heat radiation gas be airborne intermediate path distance and the contact area that has increased greatly with the gas that dispels the heat; Significantly reduced the heat built-up effect; Can improve radiating efficiency greatly and make chip remain in suitable working temperature, thereby keep long-life and effective luminescence efficiency of chip.Chip fixing lug boss and cooling base are one-body molded, so the heat that produces of chip only sees through cooling base and just directly distribute in air, so thermal resistance is little, radiating rate is fast, must not dispel the heat by other radiating piece, and radiating effect is just fairly good.Because the chip fixing lug boss is arranged, make the shade of keeping out of light that electrical connecting wire sends led chip drop to minimumly, be beneficial to optical secondary optimization! Save existing led support, just saved the heat radiating metal spare in the led support, and multilayer intermediate link such as electrode metal pin; Especially reduced the high thermal resistance that produces between two parts of heat radiating metal spare and cooling base; Therefore thermal resistance is little, and the fast good heat dissipation effect of heat conduction is simple and reliable for structure; Especially one-body molded design and the assembly technology that more helps light source of chip fixing lug boss and cooling base saved cost again.Therefore the present invention is simple and reliable for structure, and part is few, and thin thickness is easy to assembling, is specially adapted to the powerful occasion of light source requirements.
5) the heat radiation clear opening runs through the plastic plate of positioning lens, makes the two ends of heat radiation clear opening all be communicated with formation gaseous exchange passage with outside air, can let LED luminescence unit and heat radiation clear opening obtain the shortest heat dissipation path, obtains best radiating effect.The plastic plate of positioning lens is one, can reduce the number and the number that increases LED luminescence unit in the unit area of fixed leg.
6) coolant flow channel is set, can further improve radiating effect.General filling chilled water in coolant flow channel; Because specific heat of water is high, can pass through heat loss through convection again, can make the heat of led light source be dispersed in the water rapidly; Be heated the higher water of temperature and can form convection current by lower water with the temperature at the heat radiation terminal of ingress of air; The heat radiation terminal that heat is switched to the lower ingress of air of temperature is dispersed into rapidly in the air through the heat radiation terminal, and rapid heat dissipation can effectively reduce junction temperature.Also have because the maximum temperature of water is 100 ° of C; The junction temperature that can avoid the led light source place is considerably beyond 100 ° of C; For bigger outdoor dot matrix LED display of the temperature difference etc., can reduce the suddenly cold and hot of LED dot matrix display screen, improve the working environment of LED dot matrix display screen.
7) through between some runner madial wall, being provided with connecting wall; Do not establish connecting wall between some runner madial wall; Make coolant flow channel form circulatory flow, be input in the coolant flow channel, the output of the liquid in the coolant flow channel is gone through liquid outlet through the cooling liquid of inlet with the outside; Be convenient to the quick convective motion of heat eliminating medium, radiating effect is better.Through between runner lateral wall of setting between the runner madial wall, setting and runner madial wall, being provided with connecting wall; Make the first circulation coolant flow channel not have the dead angle around the runner madial wall fully; The heat-sink unit that does not exist the runner that is not cooled to cover, radiating effect is better, and is more even.
8) Butut circuit conductive layer is contained in the containing cavity of euphotic cover and cooling base formation; Avoid external belt wetlyly to cause LED luminescence unit, lead and Butut circuit conductive layer to receive pollutions with unclean air such as harmful chemical, thermal resistance improves, causes fluorescent powder, silica gel material deterioration, the life-span of raising LED luminescence unit.
Description of drawings
Fig. 1 is the schematic perspective view of the embodiment of the invention 1
Fig. 2 is the perspective exploded view of the embodiment of the invention 1.
Fig. 3 is the perspective exploded view of the embodiment of the invention 1 from another direction projection.
Fig. 4 is the perspective exploded view of the embodiment of the invention 2.
Fig. 5 is the perspective exploded view of the embodiment of the invention 2 from another direction projection.
Fig. 6 is the schematic perspective view of the embodiment of the invention 2
Fig. 7 is the schematic perspective view of the embodiment of the invention 3
Fig. 8 is the perspective exploded view of the embodiment of the invention 3.
Fig. 9 is the perspective exploded view of the embodiment of the invention 3 from another direction projection.
Figure 10 is the schematic perspective view of the embodiment of the invention 4.
Figure 11 is the I portion enlarged diagram of Figure 10.
Figure 12 is the perspective exploded view of the embodiment of the invention 5.
Figure 13 is the II portion enlarged diagram of Figure 12.
Figure 14 is the perspective exploded view of the embodiment of the invention 6.
Figure 15 is the III portion enlarged diagram of Figure 14.
Figure 16 is the schematic perspective view of the embodiment of the invention 7.
Figure 17 is the perspective exploded view of the embodiment of the invention 7.
Embodiment
Shown in Fig. 1 to 3; A kind of LED dot matrix display screen; Comprise heat radiation PCB substrate 1, heat-radiating substrate 2, the LED lamp pearl 3 of ic component (not shown), uniform array; Each 3 on LED lamp pearl comprises a led chip, is electrically connected Butut circuit conductive layer (not shown), electric control gear 9 and the data-interface 10 of LED lamp pearl 3 both positive and negative polarity pins.LED lamp pearl 3 is fixed on the heat radiation PCB substrate 1, and Butut circuit conductive layer is arranged on heat radiation PCB substrate 1 and is fixed with on the face of lamp pearl 3, and ic component is arranged on heat radiation PCB substrate 1 face opposing with being fixed with LED lamp pearl 3.It is fixing with applying that heat radiation PCB substrate 1 deviates from face and the heat-radiating substrate 2 of LED lamp pearl 3.Be equipped with a heat radiation clear opening 4 that runs through heat radiation PCB substrate 1 in every four adjacent LED lamp pearl 3 centers, run through the heat radiation clear opening 5 of heat-radiating substrate 2, each the LED lamp pearl 3 all heat radiation clear opening 4 with corresponding is adjacent.
Deviate from the face of LED lamp pearl 3 being provided with parallel radiating fin 6 at heat-radiating substrate 2, adjacent radiating fin 6 does not all connect.Be provided with lug 7 in the both sides of heat-radiating substrate 2, on lug 7, be provided with the erection column 8 that heat-radiating substrate 2 is fixed on desired location.On heat-radiating substrate 2, also be provided with the containing cavity 11 of ccontaining electric control gear 9 and data-interface 10.The end that heat radiation clear opening 4 deviates from heat-radiating substrate 2 directly is communicated with outside air, and the end that heat radiation clear opening 5 deviates from heat radiation PCB substrate 1 directly is communicated with outside air through the gap between the radiating fin 6.Gap between the heat radiation clear opening 4 of serial connection, heat radiation clear opening 5 and the radiating fin 6 forms the gas heat dissipation channel of convection current.
As shown in Figs. 4-6; A kind of LED dot matrix display screen comprises display screen housing 31, printing opacity seal pad 32, euphotic cover 33; The LED lamp pearl 34 of uniform array, heat radiation PCB substrate 35; Heat-radiating substrate 36, the ic component (not shown) of controlling and driving, Butut circuit conductive layer (not shown), electric control gear 37, the data-interface 38 of the both positive and negative polarity pin of electrical connection LED lamp pearl 34.LED lamp pearl 34 is fixed on the heat radiation PCB substrate 35, and Butut circuit conductive layer is arranged on heat radiation PCB substrate 35 and is fixed with on the face of lamp pearl 34, and ic component is arranged on heat radiation PCB substrate 35 face opposing with being fixed with LED lamp pearl 34.Heat radiation PCB substrate 35 is provided with the face and the heat-radiating substrate 36 of ic component and fits fixing.Be equipped with in every four adjacent LED lamp pearl 34 centers a heat radiation clear opening 39 that runs through euphotic cover 33, heat radiation PCB substrate 35 heat radiation clear opening 40, run through the heat radiation clear opening 41 of heat-radiating substrate 36, each the LED lamp pearl 34 all heat radiation clear opening 40 with corresponding is adjacent.
On euphotic cover 33, be provided with the containing cavity 43 of containing cavity 42, ccontaining electric control gear 37 and the data-interface 38 of ccontaining LED lamp pearl 34.Electric control gear 37, data-interface 38 are installed in the containing cavity 43.The periphery of each heat radiation clear opening 39 all extends the seal boss 44 that is provided with tubulose in euphotic cover 33 upper edges.Euphotic cover 33 is fixed on the heat-radiating substrate 36, and heat radiation PCB substrate 35 places in the containing cavity 42, and seal boss 44 sticks together with the face that heat radiation PCB substrate 35 is fixed with lamp pearl 34, thereby makes containing cavity 42 be sealed hollow.
On display screen housing 31, be provided with the containing cavity 45 of bottom surface opening; Be provided with the through hole 46 of covering LED lamp pearl 34 over against the position of LED lamp pearl 34 in the front of display screen housing 31; Printing opacity seal pad 32 is installed on the through hole 46; Be provided with louvre 47 at the back side of display screen housing 31 above near display screen housing 31; Also convex with the rain cover 48 that prevents rainwater entering containing cavity 45 at the back side of display screen housing 31, be provided with lug 49, on lug 49, be provided with the fixed leg 50 that display screen housing 31 is fixed on desired location in the both sides of display screen housing 31.A side that deviates from seal boss 44 at euphotic cover 33 is provided with fixed leg 51, and euphotic cover 33 is fixed on containing cavity 45 on the sidewall in front through fixed leg 51; Deviate from being provided with radiating fin 52 and fixed leg 53 on the face of LED lamp pearl 34 at heat-radiating substrate 36, adjacent radiating fin 52 does not all connect.Heat-radiating substrate 36 is fixed on containing cavity 45 on the sidewall at the back side through fixed leg 53.The end that heat radiation clear opening 39 deviates from the LED luminescence unit is communicated with outside air through gap, the bottom opening of display screen housing 31, louvre 47 between the fixed leg 51, and the end that heat radiation clear opening 41 deviates from the LED luminescence unit is communicated with outside air through gap, the bottom opening of display screen housing 31, the louvre 47 that installs and fixes between the post 53.
Extremely shown in Figure 9 like Fig. 7; A kind of LED dot matrix display screen comprises the plastic plate 61, pcb board 62, cooling base 63, flow passage cover plate 64, LED luminescence unit of euphotic cover 60, positioning lens, the Butut circuit conductive layer (not shown) that is electrically connected the LED luminescence unit, the ic component (not shown) of controlling and driving, electric control gear 65, the data-interface 66 that is electrically connected with external power source and Butut circuit conductive layer.Each LED luminescence unit comprises a led chip 67, lens 68, is electrically connected the gold thread 69 of led chip 67 and Butut circuit conductive layer.
Butut circuit conductive layer is set directly at pcb board 62 on the face of euphotic cover 60.Ic component is arranged on pcb board on the face of cooling base 63.Corresponding each chip fixing lug boss 71 is provided with fourth hole 75 that cooperates with chip fixing lug boss 71 and the third through-hole 74 that cooperates with fixed leg 72 on pcb board 62; Pcb board 62 places cooling base 63 to be provided with a side of chip fixing lug boss 71 and directly contacts with cooling base 63, and the side that pcb board 62 is provided with Butut circuit conductive layer deviates from the surface of contact that contacts cooling base 63.
The chip fixing lug boss 71 of cooling base 63 is passed the fourth hole 75 of pcb board 62; The fixed leg 72 of the plastic plate 61 of positioning lens passes the third through-hole 74 on the pcb board 62, second through hole 73 of cooling base 63; The blocking part 91 of the end through fixed leg 72 and pcb board 62, cooling base 63 are fixing, thereby the plastic plate 61 of cooling base 63, pcb board 62, positioning lens is fixed together successively.Chip fixing lug boss 71 places in first through hole 76 of plastic plate 61 of corresponding positioning lens; Butut circuit conductive layer stretches between the madial wall and chip fixing lug boss 71 lateral walls of first through hole 76; Led chip 67 is fixed on the end face of chip fixing lug boss 71 through solid brilliant technology; Gold thread 69 places in the plastic plate 61 of positioning lens, and gold thread 69 1 ends are connected with the electrode electricity of led chip 67, and the other end of gold thread 69 is electrically connected with the plastic plate that stretches into positioning lens 61 interior Butut circuit conductive layers; The plastic plate 61 that lens 68 are installed on the plastic plate 61 of positioning lens with positioning lens is tightly fixed.The position of corresponding first through hole 76 is provided with the glue injection channel 93 of injecting printing opacity packing colloid 92 on the plastic plate 61 of positioning lens; The Jiao Kou of glue injection channel 93 places the plastic plate 61 of positioning lens to deviate from the end face of blocking part 91 1 sides, and glue injection channel 93 is communicated with the madial wall of first through hole 76; The LED luminescence unit also comprises the printing opacity packing colloid 92 that is filled in 67 of lens 68 and led chips, and printing opacity packing colloid 92 is further fixing with the plastic plate 61 of positioning lens with lens 68.
Be equipped with a heat radiation clear opening 78 that runs through euphotic cover 60 in every four adjacent chip fixing lug boss 71 centers, run through the plastic plate 61 of positioning lens heat radiation clear opening 79, run through pcb board 62 heat radiation clear opening 80, run through cooling base 63 heat radiation clear opening 81, run through the heat radiation clear opening 82 of flow passage cover plate 64, each chip fixing lug boss 71 is adjacent with corresponding heat radiation clear opening 81.
On euphotic cover 60, be provided with the containing cavity 84 of containing cavity 83, ccontaining electric control gear 65 and the data-interface 66 of ccontaining LED luminescence unit.The periphery of each heat radiation clear opening 78 all extends the seal boss 85 that is provided with tubulose in euphotic cover 60 upper edges.Euphotic cover 60 is fixed on the cooling base 63; The plastic plate 61 of positioning lens, pcb board 62 lens 68, led chip 67, gold thread 69 place in the containing cavity 83; Seal boss 85 sticks together with the face that cooling base 63 is provided with chip fixing lug boss 71, thereby makes containing cavity 83 be closed cavity.
Deviate from cooling base 63 and extend the runner outer wall 86 that surrounds heat radiation clear opening 81 on the face of pcb board 62, extend along the periphery of the heat radiation clear opening 81 on the cooling base 63 and be provided with runner inner wall 87.Runner outer wall 86, runner inner wall 87 form coolant flow channel 88.Flow passage cover plate 64 and cooling base 63 fixing and with cooling base 63 on coolant flow channel 88 liquid sealings.On the face of pcb board 62, be provided with the containing cavity 92 that cooperates with containing cavity 84 at cooling base 63, electric control gear 65, data-interface 66 are installed in the containing cavity 92.Be provided with lug 89 in the both sides of cooling base 63, on lug 89, be provided with the erection column 90 that display screen housing 63 is fixed on desired location, in erection column 90, be provided with ladder hole 94.
The end that heat radiation clear opening 78 deviates from cooling base 63 directly is communicated with outside air, and the sideshake that the end that the clear opening 82 that dispels the heat deviates from euphotic cover 60 passes through fixed leg 90 directly is communicated with outside air.
Embodiment 4
Like Figure 10, shown in Figure 11, different with embodiment 3 is that each LED luminescence unit comprises led chip 100, the led chip 101 of two two primary colours, promptly on each chip fixing lug boss 102, is fixed with led chip 100, the led chip 101 of two different colours.
Embodiment 5
Like Figure 12, shown in Figure 13, different with embodiment 3 is that each LED luminescence unit comprises led chip 110, led chip 111, the led chip 112 of three three primary colours, promptly on each fixed chip fixing lug boss 113, is fixed with the led chip of three different colours.
Like Figure 14, shown in Figure 15; Different with embodiment 3 is; Each LED luminescence unit comprises led chip 120, led chip 121, led chip 122, the led chip 123 of four three primary colours; Wherein the color of led chip 120, led chip 121 is identical, promptly on each chip fixing lug boss, is fixed with led chip 120, led chip 121, led chip 122, the led chip 123 of four, three kinds different colours.
Like Figure 16, shown in 17, different with embodiment 3 is, is connected with horizontal connecting wall 131 at a side outermost one row's 130 of horizontal runner madial walls, is provided with the first vertical connecting wall 133 at 132 of vertically disposed runner madial walls at interval; 134 of runner madial walls, runner madial wall 134 and 135 of the runner lateral walls that vertically disposed runner madial wall 132 being connected with the first vertical connecting wall 133 separates, is not connected with horizontal connecting wall 131 is provided with the second vertical connecting wall 136; Runner madial wall 132, the first vertical connecting wall 133, runner madial wall 130, horizontal connecting wall 131, runner madial wall 134, runner lateral wall 135, the second vertical connecting wall 136 form circulation passages 137, and the coolant flow channel that is provided with circulation passage is not for there is the circulatory flow at dead angle fully around the runner madial wall; On cooling base 138, also be provided with inlet 139 and liquid outlet 129, inlet 139 is connected with water receiver 127 through water pipe 128 with liquid outlet 129.
Claims (10)
1.LED dot matrix display screen comprises cooling base, the LED luminescence unit of uniform array, and imaging controller is provided with the Butut circuit conductive layer that is electrically connected the LED luminescence unit at cooling base towards LED luminescence unit one side; Each LED luminescence unit all electrically connects separately through Butut circuit conductive layer and imaging controller; A side that deviates from the LED luminescence unit at cooling base is provided with mechanical fixation mechanism; The LED luminescence unit is fixed on the cooling base; It is characterized in that: be equipped with a heat radiation clear opening in every four adjacent LED luminescence unit centers, each LED luminescence unit is all adjacent with described heat radiation clear opening, and the heat radiation clear opening runs through cooling base; The two ends of heat radiation clear opening all are communicated with the gas heat dissipation channel that forms convection current with outside air.
2. a kind of LED dot matrix display screen as claimed in claim 1 is characterized in that: described LED luminescence unit is the lamp pearl that is fixed on the cooling base, and the both positive and negative polarity pin of lamp pearl is electrically connected with Butut circuit conductive layer.
3. a kind of LED dot matrix display screen as claimed in claim 2 is characterized in that: cooling base comprises the heat radiation PCB substrate of fixed light pearl, a side that deviates from the lamp pearl with the heat radiation PCB substrate fixing heat-radiating substrate of fitting; Butut circuit conductive layer is arranged on the heat radiation PCB substrate.
4. LED dot matrix display screen as claimed in claim 1 is characterized in that: the plastic parts that also comprises positioning lens; Described LED luminescence unit comprises led chip, lens, the lead of electrical connection led chip and Butut circuit conductive layer; On cooling base, be provided with and the integrated one or more chip fixing lug boss of cooling base, led chip is fixed on the end face of chip fixing lug boss through solid brilliant technology; On the plastic parts of positioning lens, be provided with one or more first through hole; On the end face of the plastic parts of positioning lens, extend and be provided with fixed leg; On cooling base, be provided with second through hole that cooperates with fixed leg; Fixed leg passes second through hole of cooling base, is provided with the blocking part in the end of fixed leg; The plastic parts of positioning lens is fixed through fixed leg and blocking part and cooling base; The chip fixing lug boss places in the first corresponding through hole; Butut circuit conductive layer stretches between the sidewall and chip fixing lug boss of first through hole; Lead places in first through hole; Lead one end is connected with the electrode electricity of led chip, and the other end of lead and first through hole are electrically connected with Butut circuit conductive layer between the chip fixing lug boss; The position of corresponding first through hole is provided with the glue injection channel of injecting the printing opacity packing colloid on plastic cement lens position part, and the Jiao Kou of glue injection channel places plastic cement lens position part to deviate from the end face of blocking part one side, and glue injection channel is communicated with the madial wall of first through hole; Described LED luminescence unit also comprises the printing opacity packing colloid that is filled between lens and led chip.
5. LED dot matrix display screen as claimed in claim 4 is characterized in that: the plastic parts of positioning lens is a plastic plate, and the heat radiation clear opening runs through the plastic plate of positioning lens, and described first through hole all is arranged on the plastic plate.
6. a kind of LED dot matrix display screen as claimed in claim 1 is characterized in that: each LED luminescence unit comprises the led chip of single primary colours or two dual base colors or three three primary colours or four three primary colours.
7. like any described LED dot matrix display screen of claim 1 to 6; It is characterized in that: also comprise being arranged on the runner housing that cooling base deviates from LED luminescence unit one side; The heat radiation clear opening runs through the runner housing; Between runner housing and cooling base, be provided with the runner madial wall of runner lateral wall and the periphery that is arranged on the heat radiation clear opening, runner housing, runner lateral wall, runner madial wall, cooling base form coolant flow channel; The back side of the LED luminescence unit runner that is cooled fully covers.
8. LED dot matrix display screen as claimed in claim 7; It is characterized in that: between the runner madial wall of setting, be provided with connecting wall; Or between the runner madial wall of setting, be provided with connecting wall between the runner lateral wall set and runner madial wall, coolant flow channel is a circulatory flow; On the runner housing, also be provided with inlet and liquid outlet.
9. like any described LED dot matrix display screen of claim 1 to 6; It is characterized in that: a side that deviates from the LED luminescence unit at cooling base is provided with radiating fin and heat radiation boss; Radiating fin distributes along the line of centres of LED luminescence unit; The heat radiation boss is corresponding one by one with the position of heat radiation clear opening on being arranged on radiating fin, and is corresponding one by one with LED luminescence unit position, and the clear opening that dispels the heat runs through the heat radiation boss; Mechanical fixation mechanism is arranged on the installation base that cooling base deviates from a side of LED luminescence unit, in installation base, is provided with mounting hole, and the height of installation base is higher than the height of radiating fin and heat radiation boss; The end that the heat radiation clear opening is positioned at the LED luminescence unit directly is communicated with outside air, and the sideshake that the end that the clear opening that dispels the heat deviates from the LED luminescence unit passes through installation base is communicated with outside air.
10. like any described LED dot matrix display screen of claim 1 to 6; It is characterized in that: also comprise euphotic cover; Euphotic cover and cooling base are installed together the containing cavity that forms ccontaining LED luminescence unit, and at the heat radiation clear opening position seal boss one to one that is provided with on the euphotic cover and is arranged on the cooling base, the heat radiation clear opening runs through seal boss; Seal boss and cooling base stick together, and containing cavity is a closed cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210148661XA CN102682670A (en) | 2011-09-30 | 2012-05-14 | LED (Light Emitting Diode) dot matrix display screen |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110300878 | 2011-09-30 | ||
| CN201110300878.3 | 2011-09-30 | ||
| CN201210148661XA CN102682670A (en) | 2011-09-30 | 2012-05-14 | LED (Light Emitting Diode) dot matrix display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102682670A true CN102682670A (en) | 2012-09-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210148661XA Pending CN102682670A (en) | 2011-09-30 | 2012-05-14 | LED (Light Emitting Diode) dot matrix display screen |
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| WO2015192423A1 (en) * | 2014-06-18 | 2015-12-23 | 黄欣 | Waterproof heat-dissipation led display screen lamp box |
| CN107444651A (en) * | 2016-05-31 | 2017-12-08 | 深圳市多尼卡电子技术有限公司 | Vehicle entertainment player |
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Application publication date: 20120919 |